TWD202062S - 固態硬碟儲存裝置 - Google Patents
固態硬碟儲存裝置 Download PDFInfo
- Publication number
- TWD202062S TWD202062S TW108303212F TW108303212F TWD202062S TW D202062 S TWD202062 S TW D202062S TW 108303212 F TW108303212 F TW 108303212F TW 108303212 F TW108303212 F TW 108303212F TW D202062 S TWD202062 S TW D202062S
- Authority
- TW
- Taiwan
- Prior art keywords
- storage device
- design
- ssd storage
- item
- ssd
- Prior art date
Links
- 239000007787 solid Substances 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 1
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Abstract
【物品用途】;本設計物品是一種固態硬碟（Solid State Drive，簡稱SSD）儲存裝置，其經由使用半導體來儲存資料於其內。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。
Description
本設計物品是一種固態硬碟（Solid State Drive，簡稱SSD）儲存裝置，其經由使用半導體來儲存資料於其內。
圖式所揭露之虛線部分，為本案不主張設計之部分。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20180056411 | 2018-11-30 | ||
| KR30-2018-0056411 | 2018-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD202062S true TWD202062S (zh) | 2020-01-11 |
Family
ID=72380525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108303212F TWD202062S (zh) | 2018-11-30 | 2019-05-30 | 固態硬碟儲存裝置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD896230S1 (zh) |
| TW (1) | TWD202062S (zh) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD951937S1 (en) * | 2018-12-06 | 2022-05-17 | Samsung Electronics Co., Ltd. | Solid state drive storage device |
| JP1661340S (zh) * | 2019-05-22 | 2020-06-08 | ||
| TWD213297S (zh) * | 2020-07-09 | 2021-08-11 | 南韓商三星電子股份有限公司 | 固態硬碟儲存裝置 |
| USD1006015S1 (en) | 2021-01-26 | 2023-11-28 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
| USD950564S1 (en) * | 2021-04-08 | 2022-05-03 | Guangjun Zhou | Video capture card |
| USD986249S1 (en) * | 2021-08-30 | 2023-05-16 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
| USD986900S1 (en) * | 2021-08-30 | 2023-05-23 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
| USD986901S1 (en) * | 2021-08-30 | 2023-05-23 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
| USD986898S1 (en) * | 2021-08-30 | 2023-05-23 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
| USD986899S1 (en) * | 2021-08-30 | 2023-05-23 | Samsung Electronics Co., Ltd. | Solid state drive memory device |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7106595B2 (en) * | 2004-09-15 | 2006-09-12 | International Business Machines Corporation | Apparatus including a thermal bus on a circuit board for cooling components on a daughter card releasably attached to the circuit board |
| TWM279165U (en) * | 2005-05-31 | 2005-10-21 | Akust Technology Co Ltd | Improved cooling fins for memory |
| US7738252B2 (en) * | 2006-01-09 | 2010-06-15 | Ocz Technology, Group, Inc. | Method and apparatus for thermal management of computer memory modules |
| US20080101036A1 (en) * | 2006-10-26 | 2008-05-01 | Chiung Yi Chen | Heat-dissipating assembly structure |
| USD657756S1 (en) * | 2011-10-17 | 2012-04-17 | Corsair Memory, Inc. | Low profile heat spreader for a computer memory module |
| USD698792S1 (en) * | 2012-01-05 | 2014-02-04 | Kingston Digital, Inc. | Memory module |
| USD702689S1 (en) * | 2012-08-17 | 2014-04-15 | Kingston Digital, Inc. | Memory module |
| USD702690S1 (en) * | 2012-10-17 | 2014-04-15 | Kingston Digital, Inc. | Memory module |
| USD689829S1 (en) * | 2013-01-02 | 2013-09-17 | Comptake Technology Inc. | Heat dissipating module of memory |
| USD714789S1 (en) * | 2013-02-04 | 2014-10-07 | Comptake Technology Inc. | Housing of solid state drive |
| TWM467916U (zh) * | 2013-06-17 | 2013-12-11 | 哲亮科技有限公司 | 多重散熱組件結構 |
| USD735201S1 (en) * | 2014-07-30 | 2015-07-28 | Kingston Digital, Inc. | Memory module |
| USD793400S1 (en) * | 2016-05-09 | 2017-08-01 | Kingston Digital, Inc. | Heat sink for memory module |
| USD862402S1 (en) * | 2017-12-18 | 2019-10-08 | Kingston Digital, Inc. | Memory heat dissipation sink |
| USD842304S1 (en) * | 2017-12-21 | 2019-03-05 | Corsair Memory, Inc. | Memory module |
-
2019
- 2019-05-29 US US29/692,885 patent/USD896230S1/en active Active
- 2019-05-30 TW TW108303212F patent/TWD202062S/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| USD896230S1 (en) | 2020-09-15 |
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