TWD202061S - Ssd storage device - Google Patents

Ssd storage device Download PDF

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Publication number
TWD202061S
TWD202061S TW108303211F TW108303211F TWD202061S TW D202061 S TWD202061 S TW D202061S TW 108303211 F TW108303211 F TW 108303211F TW 108303211 F TW108303211 F TW 108303211F TW D202061 S TWD202061 S TW D202061S
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TW
Taiwan
Prior art keywords
storage device
view
design
case
chain line
Prior art date
Application number
TW108303211F
Other languages
Chinese (zh)
Inventor
全桂辰
Original Assignee
南韓商三星電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商三星電子股份有限公司 filed Critical 南韓商三星電子股份有限公司
Publication of TWD202061S publication Critical patent/TWD202061S/en

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Abstract

【物品用途】;本設計物品是一種固態硬碟（Solid State Drive，簡稱SSD）儲存裝置，其經由使用半導體來儲存資料於其內。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。圖式中一點鏈線所圍繞者，係界定所欲放大之範圍，該一點鏈線本身為本案不主張設計之部分。A部放大立體圖是對應於後視圖的A部範圍的部位之後視立體放大圖。[Use of item]; This design item is a solid state drive (SSD) storage device that uses semiconductors to store data in it. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design. What is surrounded by a one-point chain line in the diagram defines the range to be enlarged. The one-point chain line itself is a part of the case that is not intended to be designed. The enlarged perspective view of Part A is a rear view enlarged perspective view of a part of the Part A range corresponding to the rear view.

Description

固態硬碟儲存裝置Solid State Drive Storage Device

本設計物品是一種固態硬碟（Solid State Drive，簡稱SSD）儲存裝置，其經由使用半導體來儲存資料於其內。This design item is a solid state drive (Solid State Drive, SSD for short) storage device, which uses semiconductors to store data in it.

圖式所揭露之虛線部分，為本案不主張設計之部分。圖式中一點鏈線所圍繞者，係界定所欲放大之範圍，該一點鏈線本身為本案不主張設計之部分。A部放大立體圖是對應於後視圖的A部範圍的部位之後視立體放大圖。The dotted line exposed in the diagram is the part that does not advocate design in this case. The one-point chain line in the figure defines the scope of enlargement, and the one-point chain line itself is the part that does not claim design in this case. The enlarged perspective view of the part A is a rear perspective enlarged view of a portion corresponding to the range of the part A in the rear view.

TW108303211F 2018-11-30 2019-05-30 Ssd storage device TWD202061S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20180056412 2018-11-30
KR30-2018-0056412 2018-11-30

Publications (1)

Publication Number Publication Date
TWD202061S true TWD202061S (en) 2020-01-11

Family

ID=72380548

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108303211F TWD202061S (en) 2018-11-30 2019-05-30 Ssd storage device

Country Status (2)

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US (1) USD896231S1 (en)
TW (1) TWD202061S (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD202065S (en) * 2018-12-06 2020-01-11 南韓商三星電子股份有限公司 Ssd storage device
JP1661340S (en) * 2019-05-22 2020-06-08

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7106595B2 (en) * 2004-09-15 2006-09-12 International Business Machines Corporation Apparatus including a thermal bus on a circuit board for cooling components on a daughter card releasably attached to the circuit board
TWM279165U (en) * 2005-05-31 2005-10-21 Akust Technology Co Ltd Improved cooling fins for memory
US7738252B2 (en) * 2006-01-09 2010-06-15 Ocz Technology, Group, Inc. Method and apparatus for thermal management of computer memory modules
US20080101036A1 (en) * 2006-10-26 2008-05-01 Chiung Yi Chen Heat-dissipating assembly structure
USD657756S1 (en) * 2011-10-17 2012-04-17 Corsair Memory, Inc. Low profile heat spreader for a computer memory module
USD698792S1 (en) * 2012-01-05 2014-02-04 Kingston Digital, Inc. Memory module
USD702689S1 (en) * 2012-08-17 2014-04-15 Kingston Digital, Inc. Memory module
USD702690S1 (en) * 2012-10-17 2014-04-15 Kingston Digital, Inc. Memory module
USD689829S1 (en) * 2013-01-02 2013-09-17 Comptake Technology Inc. Heat dissipating module of memory
USD714789S1 (en) * 2013-02-04 2014-10-07 Comptake Technology Inc. Housing of solid state drive
TWM467916U (en) * 2013-06-17 2013-12-11 Giant Technology Co Ltd Component structure with multiple heat dissipation effects
USD735201S1 (en) * 2014-07-30 2015-07-28 Kingston Digital, Inc. Memory module
USD793400S1 (en) * 2016-05-09 2017-08-01 Kingston Digital, Inc. Heat sink for memory module
USD862402S1 (en) * 2017-12-18 2019-10-08 Kingston Digital, Inc. Memory heat dissipation sink
USD842304S1 (en) * 2017-12-21 2019-03-05 Corsair Memory, Inc. Memory module

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Publication number Publication date
USD896231S1 (en) 2020-09-15

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