TWD197855S - 記憶體模組 - Google Patents

記憶體模組

Info

Publication number
TWD197855S
TWD197855S TW107301763F TW107301763F TWD197855S TW D197855 S TWD197855 S TW D197855S TW 107301763 F TW107301763 F TW 107301763F TW 107301763 F TW107301763 F TW 107301763F TW D197855 S TWD197855 S TW D197855S
Authority
TW
Taiwan
Prior art keywords
memory module
creation
design
item
appearance
Prior art date
Application number
TW107301763F
Other languages
English (en)
Inventor
Dean Depay
Chun Ye
Original Assignee
美商海盜船記憶體股份有限公司
Corsair Memory, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商海盜船記憶體股份有限公司, Corsair Memory, Inc. filed Critical 美商海盜船記憶體股份有限公司
Publication of TWD197855S publication Critical patent/TWD197855S/zh

Links

Abstract

【物品用途】;本創作係為一種電腦設備,特別是指一種記憶體模組。;【設計說明】;本創作的設計要點在於該記憶體模組的外觀。
TW107301763F 2017-12-21 2018-03-28 記憶體模組 TWD197855S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/630,637 USD842304S1 (en) 2017-12-21 2017-12-21 Memory module

Publications (1)

Publication Number Publication Date
TWD197855S true TWD197855S (zh) 2019-06-01

Family

ID=65495632

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107301763F TWD197855S (zh) 2017-12-21 2018-03-28 記憶體模組

Country Status (2)

Country Link
US (1) USD842304S1 (zh)
TW (1) TWD197855S (zh)

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USD964947S1 (en) * 2021-06-03 2022-09-27 Kingston Digital, Inc. Heat sink for memory module
TWD220530S (zh) * 2021-11-30 2022-08-11 芝奇國際實業股份有限公司 記憶體模組(一)
USD989066S1 (en) * 2022-03-16 2023-06-13 Tao Wang Mini personal computer
USD1035597S1 (en) * 2022-12-15 2024-07-16 Kingston Digital, Inc. Heat sink for memory module

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USD793400S1 (en) * 2016-05-09 2017-08-01 Kingston Digital, Inc. Heat sink for memory module

Also Published As

Publication number Publication date
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