TWD201607S - 記憶體模組 - Google Patents

記憶體模組

Info

Publication number
TWD201607S
TWD201607S TW107307212F TW107307212F TWD201607S TW D201607 S TWD201607 S TW D201607S TW 107307212 F TW107307212 F TW 107307212F TW 107307212 F TW107307212 F TW 107307212F TW D201607 S TWD201607 S TW D201607S
Authority
TW
Taiwan
Prior art keywords
memory module
creation
design
computers
item
Prior art date
Application number
TW107307212F
Other languages
English (en)
Inventor
Dean Depay
Chun Ye
Original Assignee
美商海盜船記憶體股份有限&#x5
Corsair Memory Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商海盜船記憶體股份有限&#x5, Corsair Memory Inc filed Critical 美商海盜船記憶體股份有限&#x5
Publication of TWD201607S publication Critical patent/TWD201607S/zh

Links

Abstract

【物品用途】;本創作係為一種電腦元件，特別是指一種使用於電腦中之記憶體模組。;【設計說明】;本創作的設計要點在於該記憶體模組的外觀。
TW107307212F 2018-06-26 2018-12-10 記憶體模組 TWD201607S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/654,698 USD863311S1 (en) 2018-06-26 2018-06-26 Memory module

Publications (1)

Publication Number Publication Date
TWD201607S true TWD201607S (zh) 2019-12-21

Family

ID=68137098

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107307212F TWD201607S (zh) 2018-06-26 2018-12-10 記憶體模組

Country Status (2)

Country Link
US (1) USD863311S1 (zh)
TW (1) TWD201607S (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1585741S (zh) * 2017-04-13 2017-09-11
JP1585742S (zh) * 2017-04-13 2017-09-11
USD954061S1 (en) * 2018-12-07 2022-06-07 Sung-Yu Chen Double-data-rate SDRAM card
USD897345S1 (en) * 2018-12-07 2020-09-29 Sung-Yu Chen Double-data-rate SDRAM card

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD261644S (en) * 1979-03-22 1981-11-03 Atari, Inc. Memory module housing
US7547213B2 (en) * 2004-08-26 2009-06-16 Micron Technology, Inc. Memory modules and methods for manufacturing memory modules
US7215551B2 (en) * 2004-09-29 2007-05-08 Super Talent Electronics, Inc. Memory module assembly including heat sink attached to integrated circuits by adhesive
US20070070607A1 (en) * 2005-09-23 2007-03-29 Staktek Group, L.P. Applied heat spreader with cooling fin
US7738252B2 (en) * 2006-01-09 2010-06-15 Ocz Technology, Group, Inc. Method and apparatus for thermal management of computer memory modules
US7663888B2 (en) * 2006-07-17 2010-02-16 Alcatel Lucent Printed circuit board thickness adaptors
US20100081237A1 (en) * 2008-09-30 2010-04-01 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Integrated Circuit Assemblies and Methods for Encapsulating a Semiconductor Device
CN101997194B (zh) * 2009-08-11 2013-11-13 冯林 一种内存防护装置和计算机
USD717251S1 (en) * 2012-07-18 2014-11-11 Corsair Memory, Inc. Heat spreader with fins and top bar on a memory module
USD702689S1 (en) * 2012-08-17 2014-04-15 Kingston Digital, Inc. Memory module
USD702690S1 (en) * 2012-10-17 2014-04-15 Kingston Digital, Inc. Memory module
CN103901966A (zh) * 2012-12-26 2014-07-02 鸿富锦精密工业（深圳）有限公司 内存固定装置
USD717744S1 (en) * 2013-08-30 2014-11-18 Corsair Memory, Inc. Heat spreader on a memory module
USD842304S1 (en) * 2017-12-21 2019-03-05 Corsair Memory, Inc. Memory module

Also Published As

Publication number Publication date
USD863311S1 (en) 2019-10-15

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