TWD188042S - 發光二極體封裝體之部分 - Google Patents
發光二極體封裝體之部分Info
- Publication number
- TWD188042S TWD188042S TW105305755F TW105305755F TWD188042S TW D188042 S TWD188042 S TW D188042S TW 105305755 F TW105305755 F TW 105305755F TW 105305755 F TW105305755 F TW 105305755F TW D188042 S TWD188042 S TW D188042S
- Authority
- TW
- Taiwan
- Prior art keywords
- design
- emitting diode
- diode package
- light emitting
- packaging colloid
- Prior art date
Links
- 239000000084 colloidal system Substances 0.000 abstract 3
- 238000004806 packaging method and process Methods 0.000 abstract 3
- 238000010586 diagram Methods 0.000 abstract 1
- 239000008393 encapsulating agent Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 1
Abstract
【物品用途】;本設計是一種用於照明設備的發光二極體封裝體。;【設計說明】;本設計之設計特點在於物品之部分的形狀。圖式所揭露之虛線部分,為本案不主張設計之部分。;本設計的發光二極體封裝體包括晶粒以及封裝膠體,其中所述封裝膠體呈現外圍隆起而中央平坦的造型,所述晶粒配置於所述封裝膠體的平坦區域。
Description
本設計是一種用於照明設備的發光二極體封裝體。
本設計之設計特點在於物品之部分的形狀。圖式所揭露之虛線部分,為本案不主張設計之部分。
本設計的發光二極體封裝體包括晶粒以及封裝膠體,其中所述封裝膠體呈現外圍隆起而中央平坦的造型,所述晶粒配置於所述封裝膠體的平坦區域。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105305755F TWD188042S (zh) | 2016-09-29 | 2016-09-29 | 發光二極體封裝體之部分 |
| US29/598,780 USD854195S1 (en) | 2016-09-29 | 2017-03-29 | Light emitting diode package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105305755F TWD188042S (zh) | 2016-09-29 | 2016-09-29 | 發光二極體封裝體之部分 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD188042S true TWD188042S (zh) | 2018-01-21 |
Family
ID=67184103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105305755F TWD188042S (zh) | 2016-09-29 | 2016-09-29 | 發光二極體封裝體之部分 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD854195S1 (zh) |
| TW (1) | TWD188042S (zh) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD889026S1 (en) * | 2018-07-31 | 2020-06-30 | Lumenpulse Group Inc./Group Lumenpulse Inc. | Luminaire |
| USD889027S1 (en) * | 2018-07-31 | 2020-06-30 | Lumenpulse Group Inc/Groupe Lumenpulse Inc. | Luminaire |
| USD889028S1 (en) * | 2018-07-31 | 2020-06-30 | Lumenpulse Group Inc./Groupe Lumenpulse Inc. | Luminaire |
| US11713873B2 (en) | 2019-04-15 | 2023-08-01 | Project Light, Llc | Lighted mirror assembly |
| USD1018071S1 (en) * | 2019-12-23 | 2024-03-19 | Project Light Inc. | Lighted mirror assembly |
| USD954320S1 (en) * | 2020-11-05 | 2022-06-07 | Siser NA | Heated light pad |
| USD1052791S1 (en) * | 2021-12-31 | 2024-11-26 | Foshan Nationstar Optoelectronics Co., Ltd. | Light emitting diode lead-frame |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD522466S1 (en) | 2003-09-09 | 2006-06-06 | Nichia Corporation | Light emitting diode |
Family Cites Families (36)
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| US20060131600A1 (en) | 2004-03-05 | 2006-06-22 | Junichi Nakaoka | Light transmitting window member, semiconductor package provided with light transmitting window member and method for manufacturing light transmitting window member |
| JP4547569B2 (ja) | 2004-08-31 | 2010-09-22 | スタンレー電気株式会社 | 表面実装型led |
| USD570506S1 (en) | 2006-06-20 | 2008-06-03 | Matsushita Electric Industrial Co., Ltd. | Lighting apparatus |
| USD575245S1 (en) | 2007-04-24 | 2008-08-19 | Edison Opto Corporation | Matrix type light emitting diode assembly |
| TWM327545U (en) | 2007-07-09 | 2008-02-21 | Everlight Electronics Co Ltd | Improved light-emitting diode packaging structure |
| USD634863S1 (en) * | 2008-01-10 | 2011-03-22 | Cree Hong Kong Limited | Light source of light emitting diode |
| US8531126B2 (en) | 2008-02-13 | 2013-09-10 | Canon Components, Inc. | White light emitting apparatus and line illuminator using the same in image reading apparatus |
| USD619975S1 (en) | 2009-04-08 | 2010-07-20 | Nichia Corporation | Light emitting diode module |
| TWD139848S1 (zh) | 2009-07-14 | 2011-04-01 | 東芝照明技術股份有限公司 | 照明用發光二極體模組 |
| USD611436S1 (en) | 2009-08-16 | 2010-03-09 | Edison Opto Corporation | Planar illuminating LED module |
| TWD140184S1 (zh) | 2010-01-21 | 2011-04-21 | 億光電子工業股份有限公司 | 發光二極體裝置 |
| US20110186874A1 (en) | 2010-02-03 | 2011-08-04 | Soraa, Inc. | White Light Apparatus and Method |
| JP2011204376A (ja) | 2010-03-24 | 2011-10-13 | Stanley Electric Co Ltd | 半導体発光装置 |
| USD665519S1 (en) | 2010-06-22 | 2012-08-14 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
| TWD141207S1 (zh) | 2010-07-30 | 2011-06-21 | 億光電子工業股份有限公司 | 發光二極體 |
| TWD141208S1 (zh) | 2010-07-30 | 2011-06-21 | 億光電子工業股份有限公司 | 發光二極體 |
| TWD141210S1 (zh) | 2010-07-30 | 2011-06-21 | 億光電子工業股份有限公司 | 發光二極體 |
| TWD141209S1 (zh) | 2010-07-30 | 2011-06-21 | 億光電子工業股份有限公司 | 發光二極體 |
| USD647492S1 (en) | 2010-08-19 | 2011-10-25 | Citizen Electronics Co., Ltd. | Light-emitting diode |
| EP2447595B1 (en) | 2010-10-27 | 2017-08-02 | LG Innotek Co., Ltd. | Light emitting module |
| EP2448028B1 (en) | 2010-10-29 | 2017-05-31 | Nichia Corporation | Light emitting apparatus and production method thereof |
| CN102468375B (zh) | 2010-11-15 | 2015-06-17 | 光宝电子(广州)有限公司 | 发光二极管封装结构及其制造方法 |
| US8878221B2 (en) | 2011-08-19 | 2014-11-04 | Lg Innotex Co., Ltd. | Light emitting module |
| USD667145S1 (en) * | 2011-09-27 | 2012-09-11 | Koninklijke Philips Electronics N.V. | LED module |
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| USD749051S1 (en) | 2012-05-31 | 2016-02-09 | Cree, Inc. | Light emitting diode (LED) package |
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| USD733670S1 (en) | 2014-05-22 | 2015-07-07 | Prolight Opto Technology Corporation | LED module |
| TWI657597B (zh) | 2015-03-18 | 2019-04-21 | 新世紀光電股份有限公司 | 側照式發光二極體結構及其製造方法 |
| USD761213S1 (en) | 2015-04-02 | 2016-07-12 | Genesis Photonics Inc. | Light emitting diode module |
| USD772181S1 (en) | 2015-04-02 | 2016-11-22 | Genesis Photonics Inc. | Light emitting diode package substrate |
| USD761214S1 (en) | 2015-04-02 | 2016-07-12 | Genesis Photonics Inc. | Light emitting diode package |
| USD762596S1 (en) | 2015-04-02 | 2016-08-02 | Genesis Photonics Inc. | Light emitting diode package substrate |
| TWD188043S (zh) | 2016-09-29 | 2018-01-21 | 新世紀光電股份有限公司 | 發光二極體封裝 |
| CN108269899B (zh) | 2016-12-30 | 2020-06-05 | 光宝光电(常州)有限公司 | 发光二极管封装结构及其制造方法 |
-
2016
- 2016-09-29 TW TW105305755F patent/TWD188042S/zh unknown
-
2017
- 2017-03-29 US US29/598,780 patent/USD854195S1/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD522466S1 (en) | 2003-09-09 | 2006-06-06 | Nichia Corporation | Light emitting diode |
Also Published As
| Publication number | Publication date |
|---|---|
| USD854195S1 (en) | 2019-07-16 |
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