TWD173868S - 軟性印刷電路板 - Google Patents
軟性印刷電路板Info
- Publication number
- TWD173868S TWD173868S TW104301720F TW104301720F TWD173868S TW D173868 S TWD173868 S TW D173868S TW 104301720 F TW104301720 F TW 104301720F TW 104301720 F TW104301720 F TW 104301720F TW D173868 S TWD173868 S TW D173868S
- Authority
- TW
- Taiwan
- Prior art keywords
- flexible printed
- printed circuits
- article
- design
- circuit board
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2014-23142F JP1529446S (cs) | 2014-10-16 | 2014-10-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD173868S true TWD173868S (zh) | 2016-02-21 |
Family
ID=53766259
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104301720F TWD173868S (zh) | 2014-10-16 | 2015-04-01 | 軟性印刷電路板 |
Country Status (3)
Country | Link |
---|---|
US (1) | USD757666S1 (cs) |
JP (1) | JP1529446S (cs) |
TW (1) | TWD173868S (cs) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD233449S (zh) | 2024-04-10 | 2024-09-01 | 康揚企業股份有限公司 新北市汐止區環河街187號 (中華民國) | 提把件 |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD794641S1 (en) * | 2009-01-07 | 2017-08-15 | Samsung Electronics Co., Ltd. | Memory device |
USD794642S1 (en) * | 2009-01-07 | 2017-08-15 | Samsung Electronics Co., Ltd. | Memory device |
USD794644S1 (en) * | 2009-01-07 | 2017-08-15 | Samsung Electronics Co., Ltd. | Memory device |
USD795262S1 (en) * | 2009-01-07 | 2017-08-22 | Samsung Electronics Co., Ltd. | Memory device |
USD794643S1 (en) * | 2009-01-07 | 2017-08-15 | Samsung Electronics Co., Ltd. | Memory device |
USD794034S1 (en) * | 2009-01-07 | 2017-08-08 | Samsung Electronics Co., Ltd. | Memory device |
USD795261S1 (en) * | 2009-01-07 | 2017-08-22 | Samsung Electronics Co., Ltd. | Memory device |
USD764424S1 (en) * | 2014-05-15 | 2016-08-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD784936S1 (en) * | 2014-05-28 | 2017-04-25 | Sumitomo Electric Industries, Ltd. | Flexible printed wiring board with device |
USD785575S1 (en) | 2014-05-28 | 2017-05-02 | Sumitomo Electric Industries, Ltd. | Flexible printed wiring board |
USD774478S1 (en) * | 2015-02-04 | 2016-12-20 | Xiaofeng Li | Flame-shaped printed circuit board for electronic candle or other electronic light |
USD788723S1 (en) | 2015-03-04 | 2017-06-06 | Osram Sylvania Inc. | Serrated light engine and circuit board |
CA169446S (en) * | 2016-01-22 | 2017-02-21 | Shenzhen Longsys Electronics Co Ltd | Ssd storage module |
JP1564043S (cs) * | 2016-04-27 | 2017-11-13 | ||
JP1564455S (cs) * | 2016-05-11 | 2017-11-13 | ||
USD786419S1 (en) * | 2016-05-16 | 2017-05-09 | Kewaunee Scientific Corporation | Baffle for fume hoods |
USD798251S1 (en) * | 2016-11-07 | 2017-09-26 | Transcend Information, Inc. | Printed circuit board of solid-state memory |
USD877099S1 (en) * | 2017-03-15 | 2020-03-03 | Sumitomo Electric Industries, Ltd. | Flexible printed wiring board for a module |
USD875056S1 (en) * | 2017-06-08 | 2020-02-11 | Jie Qi | Flexible printed circuit board |
JP1618491S (cs) * | 2017-11-21 | 2018-11-19 | ||
USD886073S1 (en) * | 2018-01-29 | 2020-06-02 | Gigalane Co., Ltd. | Flexible printed circuit board |
USD936139S1 (en) * | 2018-02-28 | 2021-11-16 | Sato Holdings Kabushiki Kaisha | Thermal head for a printer |
USD855577S1 (en) * | 2018-04-12 | 2019-08-06 | Telebox Industries Corp. | Circuit board for electrical connector |
JP1628923S (cs) * | 2018-04-26 | 2019-04-08 | ||
USD910746S1 (en) | 2018-08-09 | 2021-02-16 | Sato Holdings Kabushiki Kaisha | Thermal head for a printer |
USD864133S1 (en) * | 2018-10-17 | 2019-10-22 | KG Squared LLC | Circuit board |
USD915310S1 (en) * | 2019-02-12 | 2021-04-06 | Analog Devices, Inc. | Circuit board |
USD947801S1 (en) * | 2019-11-07 | 2022-04-05 | Phoenix Contact Gmbh & Co. Kg | Printed circuit board |
USD941786S1 (en) * | 2019-11-22 | 2022-01-25 | T-Worx Holdings, LLC | Circuit board |
USD1044751S1 (en) * | 2021-01-19 | 2024-10-01 | Johnstech International Corporation | Compliant ground block and testing system for testing integrated circuits |
USD992538S1 (en) * | 2021-11-09 | 2023-07-18 | Avery Dennison Retail Information Services Llc | Antenna |
USD1050059S1 (en) * | 2022-06-17 | 2024-11-05 | Seiko Epson Corporation | Circuit board for computer printers |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3372310A (en) * | 1965-04-30 | 1968-03-05 | Radiation Inc | Universal modular packages for integrated circuits |
US3646399A (en) * | 1970-03-04 | 1972-02-29 | Gen Electric | Printed circuit board construction |
US3777221A (en) * | 1972-12-18 | 1973-12-04 | Ibm | Multi-layer circuit package |
USD363920S (en) * | 1992-12-02 | 1995-11-07 | K. W. Muth Company, Inc. | Electrical circuit board |
USD397093S (en) * | 1997-07-30 | 1998-08-18 | Il Kim | Printed circuit board with mounted components |
USD465772S1 (en) * | 2001-04-20 | 2002-11-19 | 3Com Corporation | Printed circuit board |
USD466093S1 (en) * | 2001-04-27 | 2002-11-26 | Taiyo Yuden Co., Ltd. | Hybird integrated circuit board |
USD459706S1 (en) * | 2001-04-27 | 2002-07-02 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit device |
DE20108758U1 (de) * | 2001-05-25 | 2001-08-09 | Infineon Technologies AG, 81669 München | Anordnung von Speicherchipgehäusen auf DIMM-Platine |
JP2003059297A (ja) * | 2001-08-08 | 2003-02-28 | Mitsubishi Electric Corp | 半導体記憶装置およびそれを用いた半導体モジュール |
US6674644B2 (en) * | 2001-11-01 | 2004-01-06 | Sun Microsystems, Inc. | Module and connector having multiple contact rows |
USD493152S1 (en) * | 2002-11-27 | 2004-07-20 | International Business Machines Corporation | Server blade chassis midplane printed circuit board with cover |
USD529031S1 (en) * | 2004-07-27 | 2006-09-26 | Siliconware Precision Industries Co., Ltd. | IC card type circuit module |
US7579687B2 (en) * | 2004-09-03 | 2009-08-25 | Entorian Technologies, Lp | Circuit module turbulence enhancement systems and methods |
US7616452B2 (en) * | 2004-09-03 | 2009-11-10 | Entorian Technologies, Lp | Flex circuit constructions for high capacity circuit module systems and methods |
USD612347S1 (en) * | 2005-01-14 | 2010-03-23 | Panasonic Corporation | Electric circuit board |
USD601520S1 (en) * | 2005-01-14 | 2009-10-06 | Panasonic Corporation | Electric circuit board |
USD556158S1 (en) * | 2005-11-18 | 2007-11-27 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board |
USD548201S1 (en) * | 2006-01-31 | 2007-08-07 | Smart Parts, Inc. | Ion solenoid circuit board |
USD601978S1 (en) * | 2008-01-09 | 2009-10-13 | Panasonic Corporation | Printed circuit board |
AU323139S (en) * | 2008-05-15 | 2008-12-11 | Tyco Electronics Services Gmbh | Printed circuit board |
USD615506S1 (en) * | 2009-06-23 | 2010-05-11 | Dbg Group Investments, Llc | Integrated energy management system |
USD656111S1 (en) * | 2010-05-19 | 2012-03-20 | Nippon Mektron, Ltd. | Flexible printed circuit board |
USD661265S1 (en) * | 2010-05-19 | 2012-06-05 | Nippon Mektron, Ltd. | Flexible printed circuit board |
USD656112S1 (en) * | 2010-05-19 | 2012-03-20 | Nippon Mektron, Ltd. | Flexible printed circuit board |
USD639756S1 (en) * | 2010-07-16 | 2011-06-14 | Dbg Group Investments, Llc | Circuit board for integrated ozone laundry system |
USD642546S1 (en) * | 2010-07-16 | 2011-08-02 | Dbg Group Investments, Llc | Circuit board with LEDS for an integrated ozone laundry system |
USD637566S1 (en) * | 2010-08-10 | 2011-05-10 | Taymac Corporation | Electrical receptacle circuit board |
USD647072S1 (en) * | 2010-12-21 | 2011-10-18 | Arthur Lane Bentley | Circuit board |
USD673921S1 (en) * | 2011-04-21 | 2013-01-08 | Kabushiki Kaisha Toshiba | Portion of a substrate for an electronic circuit |
USD673922S1 (en) * | 2011-04-21 | 2013-01-08 | Kabushiki Kaisha Toshiba | Portion of a substrate for an electronic circuit |
TWD149025S (zh) * | 2011-11-08 | 2012-09-01 | 精工愛普生股份有限公司 | 墨匣用電路基板 |
USD699201S1 (en) * | 2012-10-01 | 2014-02-11 | Gemalto M2M Gmbh | Pad arrangement of a circuit module |
-
2014
- 2014-10-16 JP JPD2014-23142F patent/JP1529446S/ja active Active
-
2015
- 2015-04-01 US US29/522,610 patent/USD757666S1/en active Active
- 2015-04-01 TW TW104301720F patent/TWD173868S/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWD233449S (zh) | 2024-04-10 | 2024-09-01 | 康揚企業股份有限公司 新北市汐止區環河街187號 (中華民國) | 提把件 |
Also Published As
Publication number | Publication date |
---|---|
USD757666S1 (en) | 2016-05-31 |
JP1529446S (cs) | 2015-07-21 |
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