USD877099S1 - Flexible printed wiring board for a module - Google Patents

Flexible printed wiring board for a module Download PDF

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Publication number
USD877099S1
USD877099S1 US29/617,547 US201729617547F USD877099S US D877099 S1 USD877099 S1 US D877099S1 US 201729617547 F US201729617547 F US 201729617547F US D877099 S USD877099 S US D877099S
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US
United States
Prior art keywords
module
wiring board
printed wiring
flexible printed
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/617,547
Inventor
Kazumasa Toya
Kenji Saito
Youichi Nagai
Takashi Iwasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JPD2017-5253F external-priority patent/JP1585796S/ja
Priority claimed from JPD2017-5254F external-priority patent/JP1585797S/ja
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD. reassignment SUMITOMO ELECTRIC INDUSTRIES, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NAGAI, YOUICHI, IWASAKI, TAKASHI, SAITO, KENJI, TOYA, Kazumasa
Application granted granted Critical
Publication of USD877099S1 publication Critical patent/USD877099S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front view of a flexible printed wiring board for a module showing our new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a perspective view thereof;
FIG. 8 is an enlarged front view of a portion taken along line 8-8 of FIG. 1;
FIG. 9 is an enlarged rear view of FIG. 8;
FIG. 10 is an enlarged top view of FIG. 8;
FIG. 11 is an enlarged bottom view of FIG. 8;
FIG. 12 is an enlarged right side view of FIG. 8;
FIG. 13 is an enlarged left side view of FIG. 8;
FIG. 14 is an enlarged perspective view of FIG. 8; and,
FIG. 15 is another perspective view thereof, shown in a used condition with a device in broken lines.
The broken lines shown in the drawings represent portions of the flexible printed wiring board for a module that form no part of the claimed design. The dashed-dot-dashed lines indicate a boundary between the claimed and unclaimed portions of the design.

Claims (1)

    CLAIM
  1. The ornamental design for a flexible printed wiring board for a module, as shown and described.
US29/617,547 2017-03-15 2017-09-14 Flexible printed wiring board for a module Active USD877099S1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPD2017-5253F JP1585796S (en) 2017-03-15 2017-03-15
JP2017-005253 2017-03-15
JP2017-005254 2017-03-15
JPD2017-5254F JP1585797S (en) 2017-03-15 2017-03-15

Publications (1)

Publication Number Publication Date
USD877099S1 true USD877099S1 (en) 2020-03-03

Family

ID=69629246

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/617,547 Active USD877099S1 (en) 2017-03-15 2017-09-14 Flexible printed wiring board for a module

Country Status (1)

Country Link
US (1) USD877099S1 (en)

Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5799392A (en) * 1995-11-17 1998-09-01 Fujitsu Limited Method of manufacturing a connecting structure of printed wiring boards
US6324067B1 (en) * 1995-11-16 2001-11-27 Matsushita Electric Industrial Co., Ltd. Printed wiring board and assembly of the same
US20020007961A1 (en) * 2000-06-08 2002-01-24 Takeshi Yamato Wired circuit board
US20050217895A1 (en) * 2004-04-01 2005-10-06 Arie Maharshak Flexible printed circuits with many tiny holes
US7067912B2 (en) * 2003-06-04 2006-06-27 Nitto Denko Corporation Wired circuit board
US20060169485A1 (en) * 2003-04-18 2006-08-03 Katsuo Kawaguchi Rigid-flex wiring board
US20060281343A1 (en) * 2003-04-30 2006-12-14 Shinji Uchida Printed wiring board connection structure
US20070281505A1 (en) * 2004-04-09 2007-12-06 Atsushi Kobayashi Rigid-Flexible Board and Method for Manufacturing the Same
US20080014768A1 (en) * 2006-07-13 2008-01-17 Samsung Electro-Mechanics Co., Ltd. Rigid-flexible printed circuit board and method of manufacturing the same
US7338290B2 (en) * 2005-10-25 2008-03-04 Ricoh Company, Ltd. Printed wiring board with a plurality of pads and a plurality of conductive layers offset from the pads
US20080093118A1 (en) * 2006-10-23 2008-04-24 Ibiden Co., Ltd Flex-rigid wiring board and method of manufacturing the same
US20080099230A1 (en) * 2006-10-30 2008-05-01 Ibiden Co., Ltd. Flex-rigid wiring board and method of manufacturing the same
US20080289859A1 (en) * 2004-06-10 2008-11-27 Ibiden Co., Ltd. Flex-Rigid Wiring Board and Manufacturing Method Thereof
US7466519B2 (en) * 2003-06-03 2008-12-16 Nitto Denko Corporation Wired circuit board for controlling characteristic impedances of a connection terminal
US20090229876A1 (en) * 2008-03-10 2009-09-17 Ibiden Co., Ltd. Flexible wiring board and method of manufacturing same
US20090255111A1 (en) * 2005-07-07 2009-10-15 Ibiden Co., Ltd. Multilayer printed wiring board
US7660126B2 (en) * 2004-04-21 2010-02-09 Samsung Electronics Co., Ltd. Flexible printed circuit board
US8035983B2 (en) * 2007-07-17 2011-10-11 Ibiden Co., Ltd. Wiring board and method of manufacturing wiring board
US8238109B2 (en) * 2008-07-16 2012-08-07 Ibiden Co., Ltd. Flex-rigid wiring board and electronic device
USD687397S1 (en) * 2010-05-19 2013-08-06 Nippon Mektron, Ltd. Flexible printed circuit board
US8866027B2 (en) * 2007-01-19 2014-10-21 Sumitomo Electric Industries, Ltd. Printed wiring board and method for manufacturing the same
USD757666S1 (en) * 2014-10-16 2016-05-31 Japan Aviation Electronics Industry, Limited Flexible printed circuit
USD784936S1 (en) * 2014-05-28 2017-04-25 Sumitomo Electric Industries, Ltd. Flexible printed wiring board with device
USD785575S1 (en) * 2014-05-28 2017-05-02 Sumitomo Electric Industries, Ltd. Flexible printed wiring board

Patent Citations (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6324067B1 (en) * 1995-11-16 2001-11-27 Matsushita Electric Industrial Co., Ltd. Printed wiring board and assembly of the same
US5799392A (en) * 1995-11-17 1998-09-01 Fujitsu Limited Method of manufacturing a connecting structure of printed wiring boards
US20020007961A1 (en) * 2000-06-08 2002-01-24 Takeshi Yamato Wired circuit board
US20060169485A1 (en) * 2003-04-18 2006-08-03 Katsuo Kawaguchi Rigid-flex wiring board
US20060281343A1 (en) * 2003-04-30 2006-12-14 Shinji Uchida Printed wiring board connection structure
US7466519B2 (en) * 2003-06-03 2008-12-16 Nitto Denko Corporation Wired circuit board for controlling characteristic impedances of a connection terminal
US7067912B2 (en) * 2003-06-04 2006-06-27 Nitto Denko Corporation Wired circuit board
US20050217895A1 (en) * 2004-04-01 2005-10-06 Arie Maharshak Flexible printed circuits with many tiny holes
US20070281505A1 (en) * 2004-04-09 2007-12-06 Atsushi Kobayashi Rigid-Flexible Board and Method for Manufacturing the Same
US7660126B2 (en) * 2004-04-21 2010-02-09 Samsung Electronics Co., Ltd. Flexible printed circuit board
US20080289859A1 (en) * 2004-06-10 2008-11-27 Ibiden Co., Ltd. Flex-Rigid Wiring Board and Manufacturing Method Thereof
US20090255111A1 (en) * 2005-07-07 2009-10-15 Ibiden Co., Ltd. Multilayer printed wiring board
US7338290B2 (en) * 2005-10-25 2008-03-04 Ricoh Company, Ltd. Printed wiring board with a plurality of pads and a plurality of conductive layers offset from the pads
US20080014768A1 (en) * 2006-07-13 2008-01-17 Samsung Electro-Mechanics Co., Ltd. Rigid-flexible printed circuit board and method of manufacturing the same
US20080093118A1 (en) * 2006-10-23 2008-04-24 Ibiden Co., Ltd Flex-rigid wiring board and method of manufacturing the same
US20080099230A1 (en) * 2006-10-30 2008-05-01 Ibiden Co., Ltd. Flex-rigid wiring board and method of manufacturing the same
US8866027B2 (en) * 2007-01-19 2014-10-21 Sumitomo Electric Industries, Ltd. Printed wiring board and method for manufacturing the same
US8035983B2 (en) * 2007-07-17 2011-10-11 Ibiden Co., Ltd. Wiring board and method of manufacturing wiring board
US20090229876A1 (en) * 2008-03-10 2009-09-17 Ibiden Co., Ltd. Flexible wiring board and method of manufacturing same
US8238109B2 (en) * 2008-07-16 2012-08-07 Ibiden Co., Ltd. Flex-rigid wiring board and electronic device
USD687397S1 (en) * 2010-05-19 2013-08-06 Nippon Mektron, Ltd. Flexible printed circuit board
USD784936S1 (en) * 2014-05-28 2017-04-25 Sumitomo Electric Industries, Ltd. Flexible printed wiring board with device
USD785575S1 (en) * 2014-05-28 2017-05-02 Sumitomo Electric Industries, Ltd. Flexible printed wiring board
USD803172S1 (en) * 2014-05-28 2017-11-21 Sumitomo Electric Industries, Ltd. Flexible printed wiring board
USD803803S1 (en) * 2014-05-28 2017-11-28 Sumitomo Electric Industries, Ltd. Flexible printed wiring board
USD805045S1 (en) * 2014-05-28 2017-12-12 Sumitomo Electric Industries, Ltd. Flexible printed wiring board
USD810707S1 (en) * 2014-05-28 2018-02-20 Sumitomo Electric Industries, Ltd. Flexible printed wiring board with device
USD812023S1 (en) * 2014-05-28 2018-03-06 Sumitomo Electric Industries, Ltd. Flexible printed wiring board
USD831594S1 (en) * 2014-05-28 2018-10-23 Sumitomo Electric Industries, Ltd. Flexible printed wiring board
USD757666S1 (en) * 2014-10-16 2016-05-31 Japan Aviation Electronics Industry, Limited Flexible printed circuit

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