TWD165762S - 發光二極體封裝之部分 - Google Patents
發光二極體封裝之部分Info
- Publication number
- TWD165762S TWD165762S TW102308472F TW102308472F TWD165762S TW D165762 S TWD165762 S TW D165762S TW 102308472 F TW102308472 F TW 102308472F TW 102308472 F TW102308472 F TW 102308472F TW D165762 S TWD165762 S TW D165762S
- Authority
- TW
- Taiwan
- Prior art keywords
- design
- view
- light
- emitting diode
- rectangular
- Prior art date
Links
- 238000010586 diagram Methods 0.000 abstract 1
Abstract
【物品用途】;一種用以封裝發光二極體之發光二極體封裝之設計。;【設計說明】;本設計之發光二極體封裝的外觀係呈矩形結構,矩形體之基座下方形成有扁平長方形接腳,其中一接腳形成有角形缺口,呈矩形覆蓋體形成於基座上方。後視圖與前視圖相同,左側視圖與右側視圖相同,故省略後視圖及左側視圖。圖式所揭露之虛線部分,為本案不主張設計之部分。;本設計之發光二極體封裝如附圖所示,其整體外形式樣新穎美觀,為根據使用機能所作之最佳與最合理之設計,申請前未見於刊物亦未公開使用,符合設計專利要件。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/431,064 USD718258S1 (en) | 2012-09-02 | 2012-09-02 | LED package |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD165762S true TWD165762S (zh) | 2015-02-01 |
Family
ID=51902178
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102308472F TWD165762S (zh) | 2012-09-02 | 2013-03-01 | 發光二極體封裝之部分 |
TW102301478F TWD159498S (zh) | 2012-09-02 | 2013-03-01 | 發光二極體之封裝體 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102301478F TWD159498S (zh) | 2012-09-02 | 2013-03-01 | 發光二極體之封裝體 |
Country Status (2)
Country | Link |
---|---|
US (1) | USD718258S1 (zh) |
TW (2) | TWD165762S (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9780268B2 (en) | 2006-04-04 | 2017-10-03 | Cree, Inc. | Submount based surface mount device (SMD) light emitter components and methods |
USD738832S1 (en) * | 2006-04-04 | 2015-09-15 | Cree, Inc. | Light emitting diode (LED) package |
US9735198B2 (en) | 2012-03-30 | 2017-08-15 | Cree, Inc. | Substrate based light emitter devices, components, and related methods |
US10134961B2 (en) | 2012-03-30 | 2018-11-20 | Cree, Inc. | Submount based surface mount device (SMD) light emitter components and methods |
US10222032B2 (en) | 2012-03-30 | 2019-03-05 | Cree, Inc. | Light emitter components and methods having improved electrical contacts |
USD731302S1 (en) * | 2013-10-29 | 2015-06-09 | Ice Ip S.A. | Package |
USD739231S1 (en) * | 2014-09-16 | 2015-09-22 | Direct Pack, Inc. | Container |
USD1022930S1 (en) * | 2020-03-30 | 2024-04-16 | Quanzhou San'an Semiconductor Technology Co., Ltd. | LED chip |
JP1682751S (zh) * | 2020-04-01 | 2021-04-05 | ||
USD1000400S1 (en) | 2021-04-16 | 2023-10-03 | Creeled, Inc. | Light emitting diode package |
USD996377S1 (en) | 2022-02-17 | 2023-08-22 | Creeled, Inc. | Light-emitting diode package |
USD996378S1 (en) * | 2022-03-09 | 2023-08-22 | Creeled, Inc. | Light-emitting diode package |
-
2012
- 2012-09-02 US US29/431,064 patent/USD718258S1/en active Active
-
2013
- 2013-03-01 TW TW102308472F patent/TWD165762S/zh unknown
- 2013-03-01 TW TW102301478F patent/TWD159498S/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TWD159498S (zh) | 2014-03-21 |
USD718258S1 (en) | 2014-11-25 |
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