TWD164826S - 晶圓邊緣密封環之部分 - Google Patents

晶圓邊緣密封環之部分

Info

Publication number
TWD164826S
TWD164826S TW103300165F TW103300165F TWD164826S TW D164826 S TWD164826 S TW D164826S TW 103300165 F TW103300165 F TW 103300165F TW 103300165 F TW103300165 F TW 103300165F TW D164826 S TWD164826 S TW D164826S
Authority
TW
Taiwan
Prior art keywords
design
wafer
view
sealing ring
edge sealing
Prior art date
Application number
TW103300165F
Other languages
English (en)
Inventor
Masaaki Kimura
Mitsutoshi Yahagi
Jumpei Fujikata
Original Assignee
荏原製作所股份有限公司
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荏原製作所股份有限公司, Ebara Corp filed Critical 荏原製作所股份有限公司
Publication of TWD164826S publication Critical patent/TWD164826S/zh

Links

Abstract

【物品用途】;本設計的物品是晶圓邊緣密封環,為一種被覆於保持在基板電鍍裝置等之基板夾具的支持面之晶圓的周端部的構件,用以防止當晶圓浸泡在液體時,除了進行電鍍之面以外的邊緣部、缺口部及背面接觸到液體。;【設計說明】;左側視圖與右側視圖相對稱,左側視圖省略。;圖中以實線所示為「主張設計」之部分,虛線所示為「不主張設計」之部分,一點鏈線為界定部分設計之邊界線。;在「部分設計範圍之放大立體圖」及「部分設計範圍之放大俯視圖」中,呈現在輪廓部分的水平、垂直及傾斜狀的細線,皆為用來指定立體表面之形狀的陰影線。
TW103300165F 2013-07-11 2014-01-10 晶圓邊緣密封環之部分 TWD164826S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/460,477 USD705280S1 (en) 2013-07-11 2013-07-11 Sealing ring

Publications (1)

Publication Number Publication Date
TWD164826S true TWD164826S (zh) 2014-12-11

Family

ID=50692764

Family Applications (2)

Application Number Title Priority Date Filing Date
TW103300165F TWD164826S (zh) 2013-07-11 2014-01-10 晶圓邊緣密封環之部分
TW103300165D01F TWD164827S (zh) 2013-07-11 2014-01-10 晶圓邊緣密封環之部分

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW103300165D01F TWD164827S (zh) 2013-07-11 2014-01-10 晶圓邊緣密封環之部分

Country Status (2)

Country Link
US (1) USD705280S1 (zh)
TW (2) TWD164826S (zh)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD821552S1 (en) 2016-11-29 2018-06-26 Nippon Valqua Industries, Ltd. Composite seal
USD822181S1 (en) 2016-11-29 2018-07-03 Nippon Valqua Industries, Ltd. Composite seal
USD864361S1 (en) 2017-07-21 2019-10-22 Valqua, Ltd. Seal
USD871561S1 (en) 2017-11-17 2019-12-31 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD877865S1 (en) 2016-11-29 2020-03-10 Valqua, Ltd. Seal
USD885444S1 (en) 2017-12-19 2020-05-26 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD897504S1 (en) 2017-11-17 2020-09-29 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD898171S1 (en) 2017-12-19 2020-10-06 Valqua, Ltd. Seal members for use in semiconductor production apparatuses
USD905761S1 (en) 2018-07-24 2020-12-22 Valqua, Ltd. Seal member for semiconductor production apparatus
USD909323S1 (en) 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD927656S1 (en) 2018-09-11 2021-08-10 Valqua, Ltd. Seal for vacuum gate valve

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD802723S1 (en) 2015-11-27 2017-11-14 Ebara Corporation Sealing ring
USD834690S1 (en) * 2017-06-16 2018-11-27 Mcwane, Inc. Gasket locking segment having single spigot tooth
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD983940S1 (en) * 2020-04-09 2023-04-18 Valqua, Ltd. Sealing ring
USD983941S1 (en) * 2020-04-10 2023-04-18 Valqua, Ltd. Sealing ring
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD821552S1 (en) 2016-11-29 2018-06-26 Nippon Valqua Industries, Ltd. Composite seal
USD822181S1 (en) 2016-11-29 2018-07-03 Nippon Valqua Industries, Ltd. Composite seal
USD877865S1 (en) 2016-11-29 2020-03-10 Valqua, Ltd. Seal
USD864361S1 (en) 2017-07-21 2019-10-22 Valqua, Ltd. Seal
USD871561S1 (en) 2017-11-17 2019-12-31 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD923158S1 (en) 2017-11-17 2021-06-22 Valqua, Ltd. Seal members for use in semiconductor production apparatus
USD897504S1 (en) 2017-11-17 2020-09-29 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD923159S1 (en) 2017-11-17 2021-06-22 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD922545S1 (en) 2017-11-17 2021-06-15 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD922547S1 (en) 2017-12-19 2021-06-15 Valqua, Ltd. Seal members for use in semiconductor production apparatuses
USD898171S1 (en) 2017-12-19 2020-10-06 Valqua, Ltd. Seal members for use in semiconductor production apparatuses
USD885444S1 (en) 2017-12-19 2020-05-26 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD919670S1 (en) 2018-07-24 2021-05-18 Valqua, Ltd. Seal member for semiconductor production apparatus
USD919669S1 (en) 2018-07-24 2021-05-18 Valqua, Ltd. Seal member for semiconductor production apparatus
USD905761S1 (en) 2018-07-24 2020-12-22 Valqua, Ltd. Seal member for semiconductor production apparatus
USD927656S1 (en) 2018-09-11 2021-08-10 Valqua, Ltd. Seal for vacuum gate valve
USD909323S1 (en) 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD933033S1 (en) 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD933619S1 (en) 2018-10-12 2021-10-19 Valqua, Ltd. Seal member for semiconductor production apparatus

Also Published As

Publication number Publication date
USD705280S1 (en) 2014-05-20
TWD164827S (zh) 2014-12-11

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