TWD146471S - Chip - Google Patents

Chip

Info

Publication number
TWD146471S
TWD146471S TW100302534F TW100302534F TWD146471S TW D146471 S TWD146471 S TW D146471S TW 100302534 F TW100302534 F TW 100302534F TW 100302534 F TW100302534 F TW 100302534F TW D146471 S TWD146471 S TW D146471S
Authority
TW
Taiwan
Prior art keywords
rectangular wire
wire frame
segment
creation
center
Prior art date
Application number
TW100302534F
Other languages
Chinese (zh)
Original Assignee
隆達電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 隆達電子股份有限公司 filed Critical 隆達電子股份有限公司
Priority to TW100302534F priority Critical patent/TWD146471S/en
Priority to US29/406,576 priority patent/USD680976S1/en
Publication of TWD146471S publication Critical patent/TWD146471S/en

Links

Abstract

【物品用途】;本創作係關於一種半導體晶片。;【創作特點】;如各圖所示，本創作之晶片包括有大致呈矩形之基板，於該基板上具有可導電的電極線路，包含有兩個分離的電極線路；其中一電極線路具有下方形成有一段缺口的矩形線框，於矩形線框上方的左右兩轉角處分別形成有一圓餅造形，同時在矩形線框上端的橫向線段中央連接一條向下延伸的線段，以及在向下延伸之線段下緣接連著下方形成有一段缺口的小矩形線框。另一電極線則位在前述兩個矩形線框之間，且上方形成有一段缺口的矩形線框，在矩形線框左右兩側的垂直線段與上端的水平線段交接處分別具有一內凹弧形線段；此外，在矩形線框下端的橫向線段中央具有兩個圓餅造形，並且在橫向線段上兩個圓餅造形中央具有一條向上延伸的線段，該延伸線段具有部分較寬之棒狀結構。;本創作尚未揭露於申請日前之公開物品，符合新穎性及創作性之新式樣專利要件，爰依法提出新式樣專利申請。[Article Use];This creation is about a semiconductor chip.; [Creation Features];As shown in the figures, the chip of this creation includes a roughly rectangular substrate, on which there is a conductive electrode circuit, including two separated electrode circuits; one of the electrode circuits has a rectangular wire frame with a gap formed at the bottom, and a round shape is formed at the left and right corners above the rectangular wire frame, and at the same time, a line segment extending downward is connected to the center of the horizontal line segment at the upper end of the rectangular wire frame, and a small rectangular wire frame with a gap formed at the bottom is connected to the lower edge of the downwardly extending line segment. The other electrode line is located between the two rectangular wire frames, and a rectangular wire frame with a gap is formed on the top. There are two concave arc segments at the intersection of the vertical segments on the left and right sides of the rectangular wire frame and the horizontal segment at the top. In addition, there are two round cake shapes in the center of the horizontal segment at the bottom of the rectangular wire frame, and there is an upwardly extending segment in the center of the two round cake shapes on the horizontal segment. The extended segment has a partially wider rod-shaped structure. This creation has not yet disclosed the public articles before the application date, and meets the new patent requirements of novelty and creativity. Therefore, a new patent application is filed in accordance with the law.

TW100302534F 2011-05-24 2011-05-24 Chip TWD146471S (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW100302534F TWD146471S (en) 2011-05-24 2011-05-24 Chip
US29/406,576 USD680976S1 (en) 2011-05-24 2011-11-16 LED chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100302534F TWD146471S (en) 2011-05-24 2011-05-24 Chip

Publications (1)

Publication Number Publication Date
TWD146471S true TWD146471S (en) 2012-04-11

Family

ID=48146440

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100302534F TWD146471S (en) 2011-05-24 2011-05-24 Chip

Country Status (2)

Country Link
US (1) USD680976S1 (en)
TW (1) TWD146471S (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD152512S (en) * 2012-01-19 2013-03-21 晶元光電股份有限公司 Light-emitting diode
USD725051S1 (en) * 2014-03-31 2015-03-24 Epistar Corporation Light emitting device
USD899384S1 (en) 2019-11-04 2020-10-20 Putco, Inc. Surface-mount device

Family Cites Families (23)

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Publication number Priority date Publication date Assignee Title
US6307218B1 (en) * 1998-11-20 2001-10-23 Lumileds Lighting, U.S., Llc Electrode structures for light emitting devices
WO2003107443A2 (en) * 2002-06-17 2003-12-24 Kopin Corporation Bonding pad for gallium nitride-based light-emitting device
KR100576853B1 (en) * 2003-12-18 2006-05-10 삼성전기주식회사 Nitride semiconductor light emitting device
KR100631969B1 (en) * 2005-02-28 2006-10-11 삼성전기주식회사 Nitride semiconductor light emitting device
KR100706944B1 (en) * 2005-10-17 2007-04-12 삼성전기주식회사 Nitride semiconductor light emitting device
KR100833309B1 (en) * 2006-04-04 2008-05-28 삼성전기주식회사 Nitride semiconductor light emitting device
USD566056S1 (en) * 2006-12-20 2008-04-08 Cree, Inc. LED chip
KR100833311B1 (en) * 2007-01-03 2008-05-28 삼성전기주식회사 Nitride semiconductor light emitting device
USD578536S1 (en) * 2007-08-27 2008-10-14 Podium Photonics (Guangzhou) Ltd. Chip
USD583338S1 (en) * 2007-09-07 2008-12-23 Cree, Inc. LED chip
TWI376817B (en) * 2007-11-23 2012-11-11 Epistar Corp Light emitting device, light source apparatus and backlight module
KR100930195B1 (en) * 2007-12-20 2009-12-07 삼성전기주식회사 Nitride Semiconductor Light Emitting Diode with Electrode Pattern
KR100988041B1 (en) * 2008-05-15 2010-10-18 주식회사 에피밸리 Semiconductor light emitting device
US8384115B2 (en) * 2008-08-01 2013-02-26 Cree, Inc. Bond pad design for enhancing light extraction from LED chips
USD619976S1 (en) * 2009-10-12 2010-07-20 Tekcore Co., Ltd. Light-emitting diode
USD633876S1 (en) * 2009-10-30 2011-03-08 Semi LEDs Optoelectronics Co., Ltd. Light emitting diode device
USD627747S1 (en) * 2010-03-18 2010-11-23 Semi LEDs Optoelectronics Co., Ltd. Light emitting diode device
USD638377S1 (en) * 2010-03-23 2011-05-24 Liang-Jyi Yan High-power light emitting diode chip
KR101110937B1 (en) * 2010-05-17 2012-03-05 엘지이노텍 주식회사 Nitride semiconductor light emitting diode
KR101039609B1 (en) * 2010-05-24 2011-06-09 엘지이노텍 주식회사 Light emitting device, manufacturing method and light emitting device package
TWD140991S1 (en) * 2010-07-16 2011-06-11 宏齊科技股份有限公司 LED base
USD648287S1 (en) * 2011-03-30 2011-11-08 Epistar Corporation Light-emitting diode
USD656908S1 (en) * 2011-07-05 2012-04-03 Epistar Corporation Light emitting device

Also Published As

Publication number Publication date
USD680976S1 (en) 2013-04-30

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