595305 五、發明說明（1 ) 【技術領域】 本發明係關於使用於如電子機器、及組裝電子機 器之資訊機器中之附鰭片鋁擠出成形材料製的散熱 座。 在本說明書中，所謂鋁係指除純鋁之外，亦包含 鋁合金的涵義。 【發明背景】 一般在電子機器、及組裝電子機器之資訊機器 中，爲閘流器或電晶體等散熱元件的冷卻，而採用鋁 擠出成形材料製的散熱座。但是，因爲隨電子機器或 資訊機器框體內組件的散熱量急遽增加，散熱元件的 散熱密度有增加的傾向，相關要求增加散熱座的散熱 性能亦有提高的趨勢。此外，因爲框體本身的小型 化，因此框體本身內整體的散熱密度亦將增加。因 此，框體內的溫度將增加，隨此亦要求提昇框體內之 散熱座的散熱性能。另外，爲減輕鰭片的噪音，便期 望通氣阻抗較小的散熱座。此外，爲求電子機器或資 訊機器整體的輕量化，散熱座亦最好屬於輕量者。此 外，隨上述框體的小型化，散熱座外觀尺寸將受限， 而期待出現更高性能之小型散熱座。 但是，在使附鰭片鋁擠出成形材料製散熱座的散 熱性能增加上，增加夾鉗比（鰭片高度/鰭片間隔的比） 乃屬有效手段。惟，就附鰭片鋁擠出成形材料之製造 595305 五、發明說明（2) 尺寸強度觀點等方面，夾鉗比的增加亦有極限。 本發明之目的乃在於應合上述要求，隨提供一種 藉由將鰭片厚度依既定範圍進行削薄，而減少通氣阻 抗，並提昇散熱性能，同時可達輕量化，連帶可獲得 電子機器、及組裝電子機器之資訊機器的小型化與輕 量化之功效的高性能散熱座。 【發明揭示】 本發明之散熱座係具備有：板狀基部，及設置於其 單面上之並排狀鰭片；板狀基部的寬度25~400mm， 板狀基部的長度 25〜400mm，，及板狀基部的厚度 2~5mm，而_片高度1〜30mm、_片間隔（即鰭片間的 間隔）1〜1.9mm、及鰭片厚度0.1〜0.8mm。 依照本發明之散熱座，將鰭片厚度依既定範圍進 行削薄，便可達降低通氣阻抗的效果，同時板狀基部 設置鰭片端的平均單位面積鰭片數將增加，藉此便可 達增加鰭片效率之功效。當將其使用於如電子機器、 及組裝電子機器之資訊機器等散熱座的情況時，散熱 性能將非常優越屬於高性能，同時可達電子機器或資 訊機器之框體小型化、及電子機器或資訊機器整體輕 量化的效果。 在本發明之散熱座中，鰭片間導入風的前面端板 狀基部寬度爲25〜400mm，最好爲50〜200mm。板狀基 部寬度之所以限定在25〜400mm的理由，乃板狀基部 595305 五、發明說明（3) 寬度若低於25mm的話，結果因爲散熱座的前面面積 將變小，鰭片間隔將變得過窄，因此通氣阻抗將增 力口，而有損散熱性能。反之，若超越400mm的話，則 無法符合小型化傾向之電子機器、及組裝電子機器之 資訊機器的框體尺寸，同時板狀基部的擴散熱阻抗將 增加，而損及散熱性能，並增加板狀基部的重量。此 外，散熱座深度方向的板狀基部長度爲25~400mm， 最好爲25~200mm。板狀基部長度之所以限定在 25~400mm的理由，乃若板狀基部長度低於25mm的 話，鰭片熱傳面積將變小，且散熱性能亦將降低。反 之，若超過400mm的話，通氣阻抗將增加，將損及散 熱性能，並增加散熱座重量，同時亦無法符合小型化 傾向之電子機器、及組裝電子機器之資訊機器的框體 尺寸。 再者，板狀基部厚度爲2~5mm，最好爲2〜3mm。 板狀基部厚度之所以限定在2〜5mm的理由，乃若板狀 基部厚度低於2mm的話，板狀基部的擴散阻抗將增 加；而若超過5mm的話，散熱座重量將變得過大。 再者，IS片尚度爲1〜30mm，最好爲5〜30mm，尤 以5〜25mm爲佳。鰭片高度之所以限定在1〜30mm的 理由，乃若鑛片高度低於1 mm的話，因爲鑛片面積將 減少，因此將明顯的損及散熱性能，而若超過30mm 的話，鰭片高度方向的溫降將明顯增加，而損及散熱 595305 五、發明說明（4) 性能。 鰭片間隔爲l~1.9mm，最好爲1.5~1.9mm，尤以 1· 6〜1.8mm爲佳。鰭片間隔之所以限定在1〜1.9mm的 理由，乃若鰭片間隔低於1mm，鰭片間的通氣阻抗將 明顯增加，將損及散熱性能；若超過1.9mm，鰭片張 數將減少，而減少散熱面積，將損及散熱性能。 鰭片厚度爲〇.l~〇.8mm，最好爲0.2〜0.49mm。鑛 片厚度之所以限定在0.1~0.8mm的理由，乃若鰭片厚 度低於0.1mm，擠出成形將較爲困難，同時強度亦將 降低；反之，若超過〇.8mm，鰭片間隔將變狹窄，通 氣阻抗將增加，而損及散熱性能，且增加散熱座的重 量。 再者，上述散熱座之夾鉗比（H/L=鰭片高度/鰭片 間隔之比）爲0.53~30，最好爲2.7〜24。其中，若散熱 座的夾鉗比低於〇·53的話，因爲相對鰭片間隔的鰭片 高度偏低，因此散熱性能將不足；而若夾鉗比超過30 的話，因爲擠出成形時，模具內材料的流動將惡化， 因此將造成厚度不均現象。換句話說，材料無法橫渡 模具整體空間，而無法獲得具有既定設計高度的鰭 片，且成形後的鰭片將產生波浪現象，同時在擠出成 形時，將引起對模具擠壓力不均勻現象，因此模具 中，特別對鰭片形成部將有遭受破壞的虞慮。 但是，鰭片厚度所關聯的散熱座性能，可舉例如： 595305 五、發明說明（5) 散熱座之輕量化、通氣阻抗之降低、及鰭片效率之提 昇。其中，相關散熱座的輕量化，譬如對行動機器等 而言，輕量乃屬優點·，而且亦將直接關聯於材料費的 削減。就此點而言，鰭片盡可能越薄越佳。即便相關 散熱座的通氣阻抗，導入風的散熱座前面之通氣阻抗 係鰭片越薄的話越小。結果，因爲所獲得風量將增 加，且散熱性能亦將增加，因此就此點而言，鰭片係 屬於較薄者爲佳。此外，鰭片厚度薄化將引起鰭片高 度方向的溫降，即引起所謂的鰭片效率降低，而造成 散熱性能惡化。所以，散熱座的散熱性能，便兼顧由 隨鰭片厚度薄化的通氣阻抗減少，與鰭片效率降低等 因素而決定。 【圖式簡單說明】 第1圖係本發明附鰭片鋁擠出成形材料製散熱座之 部分立體示意圖。 第2圖係本發明實施例1之散熱座的鰭片間隔、鰭 片厚度、及熱阻抗間之關係圖。 第3圖係本發明實施例2之散熱座的鰭片間隔、鰭 片厚度、及熱阻抗間之關係圖。 第4圖係本發明實施例、比較例及參考例之散熱座 的鰭片間隔與鰭片厚度間之關係圖。 【實施發明較佳態樣】 以下，參照圖式說明本發明實施態樣。 595305 五、發明說明（Ο 首先，參照第1圖，電子機器、及組裝電子機器之 資訊機器等所採用之本發明附鰭片鋁擠出成形材料製 的散熱座（1 )，係具備有：板狀基部（2 )、及設置於其單 面上並排狀鰭片（3)。在板狀基部（2)另一面上，安裝著 閘流體或電晶體等電子零件（散熱元件）。另外，附鰭 片鋁擠出成形材料製散熱座（1)的素材，就擠出性及機 械強度之觀點而言，最好採用如A6061及A6063等 Al-Mg_Si系合金。 其次，針對本發明實施例、比較例及參考例一倂進 行說明。 實施例1 具有第1圖所示形狀的本發明附鰭片鋁擠出成形材 料製散熱座（1)，將板狀基部（2)寬度（W)設定爲 100mm、將板狀基部（2)長度設定爲100mm、將板狀基 部（2)厚度（T)設定爲2mm、將散熱座（1)重量設定爲 96.lg。此外，將鰭片（3)厚度（t)設定爲0.4mm、將鰭 片（3)間隔（L)設定爲1.4mm、將鰭片（3)間距設定爲 1.8mm、將鰭片（3)高度（H)設定爲8mm、將夾鉗比設定 爲 5.7。此實施例1之散熱座（1)的熱阻抗爲 0.48(K/W)。另外，電子機器、及組裝電子機器之資訊 機器的冷卻，所採用之典型風扇動力設定0.1W爲邊 界條件。 比較例 595305 五、發明說明（7) 相對於此，爲求比較，將附鰭片鋁擠出成形材料製 散熱座的板狀基部（2)寬度設定爲100mm'將板狀基部 (2) 厚度（T)設定爲2mm、將散熱座（1)重量設定爲 132.5g。此外，將鰭片（3)厚度設定爲0.9mm、將鰭片 (3) 間隔設定爲1.4mm、將鰭片（3)間距設定爲2.3mm、 將鰭片（3)高度設定爲8mm、將夾鉗比設定爲5.7。此 比較例之散熱座（1)的熱阻抗爲0.55(K/W)。 上述比較實驗結果，依照本發明實施例1之散熱 座，相較於比較例之散熱座，前者的鰭片面積約提昇 30%。此外，將散熱座（1)之前面風速設定爲1〜5m/s， 而減少通氣阻抗20〜30%，散熱性能最大提昇約20%。 另外，散熱座的重量減少約30%。 實施例2 其次，針對本發明之附鰭片鋁擠出成形材料製散熱 座（1)，將板狀基部（2)寬度（W)設定爲100mm、將板狀 基部（2)長度設定爲100mm、將板狀基部（2)厚度（T)設 定爲2mm、將散熱座（1)重量設定爲188g。此外，將 鰭片（3)厚度⑴設定爲0.4mm、將鰭片（3)間隔（L)設定 爲1.6mm、將鰭片（3)間距設定爲2.0mm、將繪片（3)高 度（H)設定爲24mm、將夾鉗比設定爲15。此實施例2 之散熱座（1)的熱阻抗爲〇·27(K/W)。另外，電子機 器、及組裝電子機器之資訊機器的冷卻，所採用之典 型風扇動力設定0.1W爲邊界條件。 五、發明說明（8) 參考例 相對於此，爲求比較，將附鰭片鋁擠出成形材料製 散熱座的板狀基部（2)寬度設定爲100mm、將板狀基部 (2)厚度（T)設定爲2mm、將散熱座（1)重量設定爲 326g。此外，將鰭片（3)厚度設定爲1.2mm、將鰭片（3) 間隔設定爲1.6mm、將鰭片（3)間距設定爲2.8mm、將 _片（3)高度設定爲2 4 mm、將夾鉗比設定爲15。此參 考例之散熱座（1)的熱阻抗爲〇.29(K/W)。 上述比較實驗結果，依照本發明實施例2之散熱座 的話，相較於參考例之散熱座，前者的鰭片面積約提 昇40%。此外，將散熱座（1)之前面風速設定爲 1〜5m/s，而減少通氣阻抗20~30%，散熱性能最大提昇 約20%。另外，散熱座的重量減少約14%。 其次，第2圖所示係針對本發明之由附鰭片鋁擠出 成形材料所構成散熱座（1)，就當鰭片（3)高度（H)設定 爲14mm之情況下，鰭片（3)間隔（L)、鰭片（3)厚度 (t)、及熱阻抗（K/W)間之散熱性能關係。另外，電子 機器或資訊機器的冷卻所採用之典型風扇動力設定 0.1W爲邊界條件。 由上述第2圖與第3圖結果得知，熱阻抗偏低（即散 熱性能較高）的鰭片形狀係鰭片（3)厚度（t)爲 0.1~0.8mm、鰭片（3)間隔（L)爲 1 〜l，9mm。 此外，針對各種不同鰭片（3)高度（H)的散熱座’進 -10- 595305 五、發明說明（9) 行同樣的實驗，結果鰭片（3)高度（H)在1〜30mm範圍 內，鰭片（3)間隔（L)與鰭片（3)厚度⑴之最佳値範圍不 變。所以，得知鰭片（3)高度在30mm以下（詳言之，在 1~30mm範圍內），將存在如第4圖所示的最佳鰭片間 隔與鰭片厚度。 如此依照本發明物品，藉由將鰭片（3)厚度依既定範 圍進行削薄，便可降低通氣阻抗，提昇散熱性能，並 達輕量化的效果。所以，得知當將其使用爲如電子機 器、及組裝電子機器之資訊機器等之散熱座（1)的情況 時，散熱性能將非常優越，而且亦將具有電子機器或 資訊機器的框體小型化、及機器輕量化的功效。 【圖示符號說明】 1 散熱座 2 板狀基部 3 鰭片 -11-595305 V. Description of the Invention (1) [Technical Field] The present invention relates to a heat sink made of an extruded aluminum material with fins used in electronic equipment and information equipment for assembling electronic equipment. In this specification, the term "aluminum" means the meaning of aluminum alloy in addition to pure aluminum. [Background of the Invention] Generally, in electronic equipment and information equipment for assembling electronic equipment, a heat sink made of aluminum extrusion molding material is used for cooling of heat dissipation elements such as thyristors or transistors. However, as the heat dissipation of components inside the enclosure of electronic or information equipment increases sharply, the heat dissipation density of heat dissipation components tends to increase, and related requirements to increase the heat dissipation performance of the heat sink also tend to improve. In addition, because the frame itself is miniaturized, the overall heat dissipation density in the frame itself will also increase. Therefore, the temperature in the frame will increase, and it is also required to improve the heat dissipation performance of the heat sink in the frame. In addition, in order to reduce the noise of the fins, a heat sink with a small ventilation resistance is expected. In addition, in order to reduce the weight of the entire electronic or information equipment, the heat sink should preferably be lightweight. In addition, with the miniaturization of the above-mentioned housing, the external size of the heat sink will be limited, and a smaller heat sink with higher performance is expected. However, in order to increase the heat dissipation performance of the heat sink made of an aluminum extrusion-molded material with fins, it is effective to increase the clamp ratio (the ratio of the fin height to the fin interval). However, in terms of the manufacture of aluminum extruded materials with fins 595305 V. Description of the invention (2) Dimensional strength and other aspects, there is also a limit to the increase of the clamp ratio. The object of the present invention is to meet the above requirements, and to provide a method for reducing the ventilation resistance and improving the heat dissipation performance by reducing the thickness of the fins according to a predetermined range, and at the same time, achieving lightweight, electronic equipment, and High-performance heat sink for miniaturization and weight reduction of information equipment assembled electronic equipment. [Disclosure of the invention] The heat sink of the present invention is provided with: a plate-shaped base, and side-by-side fins provided on one side thereof; the width of the plate-shaped base is 25 to 400 mm, and the length of the plate-shaped base is 25 to 400 mm, and The thickness of the plate-shaped base is 2 to 5 mm, and the height of the fins is 1 to 30 mm, the spacing between the fins (that is, the interval between the fins) is 1 to 1.9 mm, and the thickness of the fins is 0.1 to 0.8 mm. According to the heat sink of the present invention, the thickness of the fins can be reduced according to a predetermined range to reduce the ventilation resistance. At the same time, the average number of fins per unit area of the plate-shaped base provided with fin ends will increase, thereby increasing the number of fins. The effectiveness of fin efficiency. When it is used in the case of heat sinks such as electronic equipment and information equipment assembled with electronic equipment, the heat dissipation performance will be very superior and belong to high performance. At the same time, it can reach the miniaturization of the frame of electronic equipment or information equipment, and electronic equipment or The overall weight reduction effect of information equipment. In the heat sink according to the present invention, the width of the front end plate-like base portion leading to the wind between the fins is 25 to 400 mm, preferably 50 to 200 mm. The reason why the width of the plate-like base is limited to 25 ~ 400mm is the plate-like base 595305 V. Description of the invention (3) If the width is less than 25mm, the front area of the heat sink will become smaller, and the fin interval will become smaller. Too narrow, so the ventilation resistance will increase the mouth, which will impair the heat dissipation performance. Conversely, if it exceeds 400mm, it will not be able to meet the frame size of electronic equipment and information equipment assembled with electronic equipment, and the diffusion thermal resistance of the plate-shaped base will increase, which will damage the heat dissipation performance and increase the plate shape. The weight of the base. In addition, the length of the plate-like base in the depth direction of the heat sink is 25 to 400 mm, preferably 25 to 200 mm. The reason why the length of the plate-shaped base is limited to 25 to 400 mm is that if the length of the plate-shaped base is less than 25 mm, the heat transfer area of the fins will be reduced, and the heat dissipation performance will be reduced. Conversely, if it exceeds 400mm, the ventilation resistance will increase, which will impair the heat dissipation performance and increase the weight of the heat sink. At the same time, it will not be able to meet the size of the housing of electronic equipment and electronic equipment that tend to be compact. Furthermore, the thickness of the plate-like base is 2 to 5 mm, preferably 2 to 3 mm. The reason why the thickness of the plate-like base is limited to 2 to 5 mm is that if the thickness of the plate-like base is less than 2 mm, the diffusion resistance of the plate-like base will increase; and if it exceeds 5 mm, the weight of the heat sink will become excessive. In addition, the IS sheet has a degree of 1 to 30 mm, preferably 5 to 30 mm, and more preferably 5 to 25 mm. The reason why the fin height is limited to 1 ~ 30mm is that if the ore height is less than 1 mm, the area of the ore will decrease, so the heat dissipation performance will be significantly impaired. If it exceeds 30mm, the fin height direction The temperature drop will increase significantly, which will damage the heat dissipation 595305. 5. Description of the invention (4) Performance. The fin interval is 1 to 1.9 mm, preferably 1.5 to 1.9 mm, and particularly preferably 1.6 to 1.8 mm. The reason why the fin interval is limited to 1 ~ 1.9mm is that if the fin interval is less than 1mm, the ventilation resistance between fins will increase significantly, which will damage the heat dissipation performance; if it exceeds 1.9mm, the number of fins will decrease , And reducing the heat dissipation area will damage the heat dissipation performance. The thickness of the fins is 0.1 to 0.8 mm, preferably 0.2 to 0.49 mm. The reason why the thickness of the ore sheet is limited to 0.1 ~ 0.8mm is that if the thickness of the fin is less than 0.1mm, extrusion molding will be difficult and the strength will be reduced; on the contrary, if it exceeds 0.8mm, the fin interval will be Narrowing, the ventilation resistance will increase, which will impair the heat dissipation performance, and increase the weight of the heat sink. Furthermore, the clamp ratio (H / L = fin height / fin interval) ratio of the heat sink is 0.53 ~ 30, preferably 2.7 ~ 24. Among them, if the clamp ratio of the heat sink is lower than 0.53, the heat dissipation performance will be insufficient because the fin height relative to the fin interval is low; and if the clamp ratio exceeds 30, because of the mold during extrusion molding, The internal material flow will worsen, which will cause uneven thickness. In other words, the material cannot cross the entire space of the mold, and fins with a predetermined design height cannot be obtained. The formed fins will have a wave phenomenon. At the same time, during extrusion molding, it will cause uneven pressure on the mold. Therefore, in the mold, there is a concern that the fin forming portion may be damaged. However, the performance of the heat sink related to the thickness of the fin can be exemplified by: 595305 V. Description of the invention (5) The weight of the heat sink is reduced, the ventilation resistance is reduced, and the efficiency of the fin is improved. Among them, the weight reduction of related heat sinks, for example, for mobile devices, is light weight, which is also an advantage, and it will also be directly related to the reduction of material costs. In this regard, the thinner the fins, the better. Even with the ventilation resistance of the related heat sink, the airflow resistance in front of the heat sink that introduces wind is smaller as the fins become thinner. As a result, because the amount of air obtained will increase and the heat dissipation performance will also increase, it is better in this regard for the fins to be thinner. In addition, thinning the thickness of the fins will cause a temperature drop in the height direction of the fins, that is, the so-called fin efficiency will be reduced, and the heat dissipation performance will be deteriorated. Therefore, the heat dissipation performance of the heat sink is determined by taking into consideration factors such as a decrease in the ventilation resistance as the thickness of the fins becomes thinner and a decrease in the efficiency of the fins. [Brief description of the drawings] FIG. 1 is a partial three-dimensional schematic view of the heat sink made of aluminum extruded material with fins of the present invention. Fig. 2 is a graph showing the relationship between the fin interval, the fin thickness, and the thermal resistance of the heat sink of the first embodiment of the present invention. Fig. 3 is a graph showing the relationship between the fin interval, the fin thickness, and the thermal resistance of the heat sink in Embodiment 2 of the present invention. Fig. 4 is a graph showing the relationship between the fin interval and the fin thickness of the heat sinks in the examples, comparative examples, and reference examples of the present invention. [Preferred Aspects of Implementing the Invention] Hereinafter, embodiments of the present invention will be described with reference to the drawings. 595305 V. Description of the invention (0) First, referring to FIG. 1, the radiating base (1) made of aluminum extrusion-molded material with fins of the present invention used in electronic equipment and information equipment for assembling electronic equipment is provided with: A plate-like base (2) and side-by-side fins (3) provided on one side thereof. On the other side of the plate-like base (2), electronic components (radiating elements) such as a brake fluid or a transistor are mounted. In addition, From the standpoint of extrudability and mechanical strength, it is preferable to use Al-Mg_Si-based alloys such as A6061 and A6063 as the material of the heat sink (1) made of aluminum with fins. A comparative example and a reference example are described below. Example 1 The heat sink (1) made of an aluminum extruded material with fins according to the present invention having the shape shown in Fig. 1 has a width (W) of a plate-like base (2). Set the length of the plate-shaped base (2) to 100mm, the thickness of the plate-shaped base (2) to 2mm, and the weight of the heat sink (1) to 96.lg. In addition, the fins ( 3) Set the thickness (t) to 0.4mm, set the fin (3) interval (L) to 1.4mm, and set the fins The distance between the fins (3) is set to 1.8 mm, the height (H) of the fins (3) is set to 8 mm, and the clamp ratio is set to 5.7. The thermal resistance of the heat sink (1) in this embodiment is 0.48 (K / W). In addition, for the cooling of electronic equipment and information equipment assembled with electronic equipment, the typical fan power used is set to 0.1W as a boundary condition. Comparative Example 595305 V. Description of Invention (7) In contrast, for comparison, The width of the plate-shaped base (2) of the heat sink made of aluminum extruded material with fins is set to 100 mm ', the thickness (T) of the plate-like base (2) is set to 2 mm, and the weight of the heat sink (1) is set to 132.5 g. In addition, the thickness of the fins (3) is set to 0.9 mm, the interval of the fins (3) is set to 1.4 mm, the pitch of the fins (3) is set to 2.3 mm, the height of the fins (3) is set to 8 mm, and The clamp ratio is set to 5.7. The thermal resistance of the heat sink (1) of this comparative example is 0.55 (K / W). As a result of the above comparative experiment, the heat sink according to Example 1 of the present invention is compared with the heat sink of the comparative example. The former's fin area is increased by about 30%. In addition, the wind speed in front of the heat sink (1) is set to 1 ~ 5m / s, thereby reducing the ventilation resistance 20 ~ 30%, the maximum heat dissipation performance is increased by about 20%. In addition, the weight of the heat sink is reduced by about 30%. Example 2 Secondly, according to the heat sink (1) made of aluminum extruded material with fins of the present invention, the board is The base (2) width (W) is set to 100mm, the length of the base plate (2) is set to 100mm, the thickness of the base plate (2) is set to 2mm, and the weight of the heat sink (1) is set to 188g In addition, the thickness ⑴ of the fins (3) is set to 0.4 mm, the interval (L) of the fins (3) is set to 1.6 mm, the pitch of the fins (3) is set to 2.0 mm, and the height of the drawing (3) is set. (H) is set to 24 mm, and the clamp ratio is set to 15. The thermal resistance of the heat sink (1) in this embodiment is 0.27 (K / W). In addition, for the cooling of electronic equipment and information equipment incorporating electronic equipment, a typical fan power setting of 0.1 W is used as a boundary condition. V. Description of the invention (8) For reference, for comparison, the width of the plate-shaped base (2) of the heat sink made of aluminum extruded material with fins is set to 100 mm, and the thickness of the plate-shaped base (2) ( T) was set to 2 mm, and the weight of the heat sink (1) was set to 326 g. In addition, the thickness of the fins (3) is set to 1.2 mm, the interval of the fins (3) is set to 1.6 mm, the pitch of the fins (3) is set to 2.8 mm, and the height of the fins (3) is set to 2 4 mm. Set the clamp ratio to 15. The thermal impedance of the heat sink (1) of this reference example is 0.29 (K / W). As a result of the above comparison experiment, according to the heat sink of Example 2 of the present invention, the fin area of the former is increased by about 40% compared to the heat sink of the reference example. In addition, the wind speed in front of the heat sink (1) is set to 1 ~ 5m / s, the ventilation resistance is reduced by 20 ~ 30%, and the heat dissipation performance is improved by about 20%. In addition, the weight of the heat sink is reduced by about 14%. Secondly, as shown in FIG. 2, the heat sink (1) made of the extruded aluminum material with fins according to the present invention is provided. When the height (H) of the fins (3) is set to 14 mm, the fins ( 3) The heat dissipation performance relationship between the interval (L), the thickness (t) of the fins (3), and the thermal resistance (K / W). In addition, the typical fan power setting for cooling electronic or information equipment is 0.1W as the boundary condition. According to the results of the above Figures 2 and 3, it is known that the fin-shaped fins (3) with a low thermal impedance (ie, high heat dissipation performance) have a thickness (t) of 0.1 to 0.8 mm, and the fins (3) are spaced apart. (L) is 1 to 1, 9 mm. In addition, for various heat sinks with different fins (3) height (H) -10- 595305 V. Description of the invention (9) The same experiment was performed. As a result, the fin (3) height (H) was in the range of 1 ~ 30mm. The optimum range of the interval (L) between the fins (3) and the thickness (3) of the fins (3) remains unchanged. Therefore, it is known that the height of the fins (3) is less than 30 mm (more specifically, in the range of 1 to 30 mm), there will be an optimal fin interval and fin thickness as shown in FIG. 4. In this way, according to the article of the present invention, by reducing the thickness of the fins (3) within a predetermined range, the ventilation resistance can be reduced, the heat dissipation performance can be improved, and the effect of weight reduction can be achieved. Therefore, it is known that when it is used as a heat sink (1) such as an electronic device and an information device that assembles an electronic device, the heat dissipation performance will be very excellent, and the housing of the electronic device or the information device will be small. And lightweight machine. [Illustration of Symbols] 1 Heat sink 2 Plate base 3 Fins -11-