TW594056B - Manufacturing method of focusing and photosensitive micro-lens array - Google Patents

Manufacturing method of focusing and photosensitive micro-lens array Download PDF

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TW594056B
TW594056B TW92107224A TW92107224A TW594056B TW 594056 B TW594056 B TW 594056B TW 92107224 A TW92107224 A TW 92107224A TW 92107224 A TW92107224 A TW 92107224A TW 594056 B TW594056 B TW 594056B
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micro
photoresist layer
mold
focusing
manufacturing
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TW92107224A
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TW200419188A (en
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Hsiharng Yang
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Univ Nat Chunghsing
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Abstract

The manufacturing method of focusing and photosensitive micro-lens array mainly includes the followings: (1) preparation step; (2) exposure formation step; (3) conduction layer formation step; (4) duplicating and reproducing mold step; (5) micro-lens formation step; and (6) product step. In the invention, near-approaching exposure method of optical lithography is used such that a predetermined gap is formed between the mask and the photoresist layer, and the micro-lens array is formed after exposure and development. After that, electroforming is conducted to form mold for mass production. The invention is capable of providing high precision and low production cost. In addition, the manufacturing process is stable and its application range is wide. In particular, by using different separation portions to make UV light source generate different diffraction phenomena, and using different separation distances to irradiate photoresist layer to generate micro-lens array with specific geometrical, the invention can be applied in various scientific products of micro-meter domain.

Description

594056 五、發明說明(1) 【發明所屬之技術領域】 本發明係有關一種聚焦與感光式微透鏡陣列之製法, 特別是指一種聚焦與感光式微透鏡陣列之製法,其兼具精 密度高且生產成本低、製程穩定及應用範圍廣之優點及功 效;尤其’以不同的間隔部讓紫外線光源產生不同的繞射 現象,並以不同的間距照射於光阻層而產生特定幾何外形 之微透鏡陣列,可應用於各式微米領域的科技產品中。 【先前技術】 、,習用微透鏡陣列製法之一,如第十二及十三圖所示, 百先經微影(lithography)技術,在一模體1〇〇上形成至少 一個粗坏柱狀的模型101,每一概呈圓柱狀之模型ι〇ι 徑可能只有1 2 0微来,夕尨^、凑、A 丄如 — 之後再透過一加溫設備102對該模型 仃”、、熔(thermal ref i〇w)過程,如此即因表面張力 型101形成所需要的圓弧狀。惟,利用此加 難以控制該模型101在熱炫後的圓弧狀 缺點,:入h、: ’,導致不良率高以及製程不穩定等嚴重 蜗點凡全無法達到業界的要求。 惟兮運用鑽石尖刀之刻模法製作出微透鏡者, 限该法成型之微透鏡精密度差,盔 :以,另一種習知技術為具半導體;程設備== 具備較夕基型微透鏡陣列者,,,此法雖 是不符業界:要::但、製作成本過高且過程複雜’故仍 因此,有必要研發新技術,以解決上述缺點。 第5頁 594056 五、發明說明(2) 【發明内容】 本發明之主要目的,在於提供一種聚焦與感 鏡陣列之製法,精密度高且生產成本低,革除習 雜之缺失。 本發明之次一目的,在於提供一種聚焦與感 鏡陣列之製法,其製程穩定,革除習用模具易因 不易控制,無法明確控制微透鏡成品之精確尺寸 本發明之再一目的,在於提供一種聚焦與感 鏡陣列之製法,應用範圍廣泛。可運用於顯示器 、製作光學鏡片、提昇光纖的光訊號聚焦、光學 統、醫學生技用之内視鏡及各式微米領域相關應 【實施方式】 本發明係為一種聚焦與感光式微透鏡陣列之 請參閱第二至三圖所示,其製法所配合之設 括:一光罩20、一間隔部30、一光阻層4〇、一基 紫外線光源60 (配合參閱第四圖)、一導電膜7〇 閱第九圖)、一模體80及一模具90。其中: 該光罩2 0 ’係設於各元件頂部,主要遮蔽紫 6〇以防直接照射各元件者,該光罩2〇上具有複數 列之透光孔21 ’其貫穿該光罩2〇並彼此呈等邊正 佈; 該間隔部3 0,係設於該光罩2 〇與光阻層4 〇間 定厚度之間隔部30,可設定光罩2〇與光阻層4〇之 該光阻層4 0,主係接受紫外線光源6 〇穿過透 光式微透 用製模複 光式微透 熱熔過程 的缺失。 光式微透 之導光板 式對準系 用。 製法。 備主要包 部50、一 (配合參 外線光源 個規則排 三角形分 ,藉由預 間距d ; 光孔2 1照594056 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a method for manufacturing a focusing and photosensitive microlens array, in particular to a method for manufacturing a focusing and photosensitive microlens array, which has both high precision and production The advantages and effects of low cost, stable process and wide range of applications; especially 'different diffraction of ultraviolet light sources with different intervals, and irradiation of photoresist layers with different intervals to produce microlens arrays with specific geometric shapes , Can be applied to a variety of micron technology products. [Previous technology], As one of the micro lens array manufacturing methods, as shown in Figures 12 and 13, one hundred lithography (lithography) technology is used to form at least one rough columnar shape on a phantom 100. Model 101, the diameter of each approximately cylindrical model may only be 120 micrometers, Xi 尨 ^, Minato, A 丄 such as-and then through a heating device 102 to the model 仃 ", fused ( thermal ref i〇w) process, so that the arc-like shape required by the surface tension type 101 is formed. However, it is difficult to control the arc-like shortcomings of the model 101 after thermal dazzling by using this: As a result, serious snail points such as high defect rate and unstable process cannot meet the requirements of the industry. However, those who use micro-lens to make micro-lenses are limited to the precision of micro-lenses formed by this method. Another known technology is semiconductors; process equipment == those with newer-type micro-lens arrays, although this method is not in line with the industry: To :: However, the production cost is too high and the process is complicated. It is necessary to develop new technologies to address these shortcomings. Page 5 59 4056 V. Description of the invention (2) [Summary of the invention] The main purpose of the present invention is to provide a method for manufacturing a focusing and sensor lens array, which has high precision and low production cost, and eliminates the lack of miscellaneous problems. The purpose is to provide a manufacturing method of focusing and sensing lens array, which has a stable manufacturing process and is difficult to control conventional molds. It is not easy to control the precise size of the finished micro lens. Another object of the present invention is to provide a manufacturing method of focusing and sensing lens array. Wide range of applications. It can be used in displays, making optical lenses, improving optical signal focusing of optical fibers, optical systems, endoscopes for medical biotechnology, and various micron applications. Please refer to the second to third figures of the microlens array of the above-mentioned type, and the manufacturing methods are as follows: a photomask 20, a spacer 30, a photoresist layer 40, and a base ultraviolet light source 60 (see the fourth figure for cooperation) ), A conductive film 70 (see the ninth figure), a mold body 80 and a mold 90. Among them: the photomask 2 0 'is located on the top of each element, mainly shielding purple 6 In order to prevent direct exposure to each element, the photomask 20 has a plurality of rows of light-transmitting holes 21 ′ which penetrate the photomask 20 and are equilaterally distributed to each other; the spacer 30 is provided on the photomask The photoresist layer 40 having a predetermined thickness between the photoresist layer 40 and the photoresist layer 40 can be set to the photoresist layer 40 of the photomask 20 and the photoresist layer 40, and the main system receives an ultraviolet light source 6 to pass through the transmissive micro-transmission. The lack of mold-making multi-light micro-transparent hot-melt process. The light-micro-transparent light guide plate alignment system is used. Manufacturing method. Prepare the main package 50, one (coordinate with the regular external light source in a regular row of triangles, with a pre-spacing d; Light hole 2 1 photo

第6頁 594056 五、發明說明(3) 射’並因照射紫外線光源6 0而於表面成形凹部ο· 該基部50,係設於光阻層40底面而強化光阻層4〇結構 者; 該導電膜70,係設於該光阻層40其形成凹部41的上端 表面(請參閱第六圖);Page 6 594056 V. Explanation of the invention (3) The recess 50 is formed on the surface by irradiating the ultraviolet light source 60. The base 50 is provided on the bottom surface of the photoresist layer 40 to strengthen the structure of the photoresist layer 40. The The conductive film 70 is disposed on the upper end surface of the photoresist layer 40 and forms the recess 41 (see the sixth figure);

一該,體8〇,係成型於該導電膜70上(請參閱第八圖所 示)’藉由模體80提高導電膜70的結構強度;並於模體8〇 設置完成後,去除光阻層40與基部50。當然,一旦該導電 膜70與模體80成型,則以導電膜70相異模體8〇的端面成型 該模具9 〇,即為業界知悉者,恕不贅述; 又以兩模具9〇上下相對使用時(請參閱第十圖所示), 即可一體成型射出製作一高精度之微透鏡91(請參閱第十 一圖所示)。 而關於製法方面’以第一實施例而言,如第一圖所示 ’其係包括下列步驟:一 ·預備步驟11、二·曝光成型步 驟12、三·導電層成型步驟13、四·複製翻模步驟14、五 、微透鏡成型步驟15及六·成品16,茲分別詳述如下:The body 80 is formed on the conductive film 70 (see FIG. 8). The structural strength of the conductive film 70 is improved by the mold body 80. After the mold body 80 is set, the light is removed. Resist layer 40 and base portion 50. Of course, once the conductive film 70 and the mold body 80 are formed, the mold 90 is formed on the end surface of the conductive film 70 which is different from the mold body 80, which is known in the industry and will not be described in detail; When in use (see Figure 10), it can be integrally molded to produce a high-precision microlens 91 (see Figure 11). Regarding the manufacturing method, in the first embodiment, as shown in the first figure, it includes the following steps: 1. Preparatory step 11, 2. Exposure molding step 12, 3. Conductive layer molding step 13, 4. Copy Steps 14, 5 and 5 of the micro-lens forming step 6 and the finished product 16 are detailed as follows:

一、預備步驟11 :準備一光罩20,以該光罩2〇遮蔽而 防止紫外線光源6 0直接照射各元件,並藉由該光罩2 〇的透 光孔21供紫外線光源60穿射於該光阻層40 (參閱第四及第 五圖); 二、曝光成型步驟12 :調整光罩20與光阻層40的曝光 間距d (亦即調整該間隔部3 0 ),俾當紫外線光源6 0由透 光孔21經間隔部30照射於該光阻層40時,因設有該間隔部I. Preparatory step 11: Prepare a photomask 20, which is shielded by the photomask 20 to prevent the ultraviolet light source 60 from directly irradiating each component, and the ultraviolet light source 60 is transmitted through the light transmission hole 21 of the photomask 20 The photoresist layer 40 (see the fourth and fifth figures); 2. Exposure molding step 12: Adjust the exposure distance d between the photomask 20 and the photoresist layer 40 (that is, adjust the interval portion 30), and act as an ultraviolet light source. 60 When the light-transmitting hole 21 is irradiated to the photoresist layer 40 through the spacer 30, the spacer is provided.

594056 五、發明說明(4) 30而使紫外線光源產生"繞射現象”,該繞射現象的光束並 呈現中心點較強、而周圍逐漸較弱的強度分佈狀態,而光 阻層40受此"繞射現象"的紫外線光源60照射,即於其受照 處形成一中間較深而周圍較淺的半圓曲面狀之凹部4 1,且 該凹部41係由甫成型的小圓曲面el逐漸加大,最後成型為 半圓曲面e2,並呈極光滑的表面; 三、導電層成型步驟13 :該光阻層4〇之凹部41形成後 ’移除該紫外線光源60及光罩20 (參閱第六圖),並於該 光阻層40形成凹部41的表面成型一預定厚度之導電膜7〇 ( φ 參閱第七及第八圖); ^ ψ )後; ,而實 理可再 ,此係 :以兩 塑膠射 當然也 型後, 十一圖 關預備 四、 複製翻模步驟1 4 : 80 (參閱第七及第八圖所示 ^去除(請參閱第九圖所示) 體80即可成型一模具9〇,同 之模具9 0,而成為一模具組 五、 微透鏡成型步驟15 v —塑膠射出成型機,即可以 畺產(請參閱第十圖所示), 六、 成品步驟16 :於成 該微透鏡91之成品(參閱第 當然,本發明在製法上,有 電膜70表面電鑄一模體 即將光阻層40、基部50 務上以導電模70配合模 翻製出另一相對應合模 業界悉知,恕不贅述; 模具90上下相對並配合 出法進行一微透鏡91的 可用熱壓模法來製造; 開啟模具9 0,即可取出 所示)。 步驟11的部分又再包括 角 ,該光罩20的透光孔21係如 形之分佈樣態,且其各透光 圖所示,係呈等邊正三 的圓心至圓心位距係被594056 V. Description of the invention (4) 30 causes the "diffraction phenomenon" of the ultraviolet light source. The light beam of this diffraction phenomenon presents an intensity distribution state with a strong central point and gradually weakening surroundings, and the photoresist layer 40 is affected by This " diffraction phenomenon " is irradiated by the ultraviolet light source 60, that is, a semicircular curved surface recess 41 having a deep middle and a light surrounding is formed at the place where it is illuminated, and the recess 41 is a small circular curved surface formed by El is gradually enlarged, finally formed into a semicircular curved surface e2, and has an extremely smooth surface. 3. Conductive layer forming step 13: After the concave portion 41 of the photoresist layer 40 is formed, the ultraviolet light source 60 and the photomask 20 are removed ( (Refer to the sixth figure), and after forming a conductive film 70 with a predetermined thickness on the surface of the photoresist layer 40 forming the recess 41 (φ refer to the seventh and eighth figures); ^ ψ); This series: after shooting with two plastics, of course, the eleventh figure is ready. The fourth step is to copy the mold. 4: 80 (see the seventh and eighth figures) ^ Remove (see the ninth figure). Body 80 You can form a mold 90, the same mold 90, and become a mold group. Micro lens forming step 15 v — plastic injection molding machine, which can be produced (see the tenth figure), 6. Finished product step 16: Yu Cheng finished the micro lens 91 finished product (refer to the course, the present invention is in the manufacturing method A mold body with an electro-membrane 70 is electroformed on the surface of the photoresist layer 40 and the base 50. Another corresponding mold-clamping industry knows the details of the corresponding mold-clamping industry. A micro-lens 91 can be manufactured by hot-pressing molding method. Open the mold 90, and you can take it out.) The part of step 11 includes the angle again. The light-transmitting hole 21 of the mask 20 is shaped like this. The distribution pattern, as shown in the light transmission diagrams, shows the center-to-center center distance of the equilateral regular three.

第8頁 594056Page 594 056

定義為P ,而孔徑皆為D ,為 該間隔部3 0的間距必須符人^ 的微透鏡91 ’並且,藉由調整 對生產各式不同領域所適用的 是以,本發明在實施上, 部30中不同的間距d ,使光阻 外線光源60照射,實務上,光 的間距d愈遠,代表光線中央 60在光阻層40上形成的凹部41 八、圖(:、圖£、圖0為紫外 分別為240、360、720及840微 陣列放大俯視圖,而圖B、圖 至圖A、圖C、圖E、圖G為 透光孔21的規則分佈;又, -2 P之關係,即生產較佳 d與P間的相對位距,乃相 微透鏡91。 乃運用繞射原理,藉由間隔 層40受不同”繞射狀態”的紫 阻層40受紫外線光源60照射 部份愈弱,相對紫外線光源 也愈淺,如附件一所示,圖 線光源6 0穿透不同間距d( 米)的光罩20而產生的透鏡 D、圖F、圖Η則依序對應 其表面外形圖。It is defined as P, and the apertures are both D. The distance between the spacers 30 must match the microlenses 91 ', and the adjustment is applicable to the production of various different fields. Therefore, the present invention is implemented in practice. The different distance d in the portion 30 irradiates the photoresistive external light source 60. In practice, the farther the distance d of light is, it represents the recess 41 formed by the light center 60 on the photoresist layer 40. Figure (:, Figure £, Figure 0 is an enlarged plan view of the 240, 360, 720, and 840 microarrays, and Figures B, A to A, C, E, and G are regular distributions of the light transmitting holes 21; That is, to produce a better relative distance between d and P, it is a phase microlens 91. The principle of diffraction is used, and the spacer layer 40 is subjected to a different "diffraction state" of the purple resist layer 40 and the ultraviolet light source 60 is irradiated. The weaker the light source is, the shallower the relative ultraviolet light source is. As shown in Annex 1, the lens D, F, and Η generated by the line light source 60 penetrating the mask 20 with different distances d (meters) correspond to the surface in order. Outline.

以圖Α相對圖Β為例,圖Α為紫外線光源60以基本d 一 2 P(2xl20微米= 240微米)的位距關係所成型在光阻層 4 0上的透鏡陣列(清參閱附件^一)’而圖B明顯示意該凹部 41呈現大半徑的半圓曲面狀,再以圖g相對圖Η為例,圖 G為紫外線光源60在d = 7 P(7xl20微米= 840微米)的位 距關係下照射光阻層4 〇而形成的透鏡陣列。以圖η與圖B 相較,則圖Η的凹部41其半徑明顯小於圖Β ;故本發明之 曝光成型步驟12的過程中,可藉由該間隔部30的調整,而 改變光罩2 0與光阻層4 0間的間距d,藉由這樣的調節機制 ,可製作出特定幾何外形與焦聚的微透鏡,供產業上利用Take Figure A and Figure B as an example. Figure A is a lens array formed by the ultraviolet light source 60 on the photoresist layer 40 with a basic d-2P (2xl20 microns = 240 microns) pitch relationship (see attachment ^ 1 for details). ) 'And Figure B clearly shows that the recess 41 has a semi-circular curved surface with a large radius, and then take Figure g as an example, and Figure G is the pitch relationship of the ultraviolet light source 60 at d = 7 P (7xl20 microns = 840 microns). A lens array formed by irradiating the photoresist layer 40 underneath. Comparing figure η with figure B, the radius of the recess 41 of figure Η is significantly smaller than that of figure B; therefore, during the exposure molding step 12 of the present invention, the mask 20 can be changed by adjusting the spacer 30 With the distance d from the photoresist layer 40, by using such an adjustment mechanism, microlenses with a specific geometric shape and focus can be manufactured for industrial use.

第9頁 594056Page 594 056

五、發明說明(6) 綜上所述,本發明之優點及功效可歸納為: [1]精密度高且生產成本低。本發明利用聚焦及感光 原理’充份運用光的繞射原理,以便在光阻層上形成特定 之凹部,精確成形後,再加上電鑄法的模具成型,而可^ 產,即革除習用熱熔技術無法精確控制微鏡片外形之問里 題。又,本發明係以”近接式曝光"方式接受光線而於^阻 層表面形成凹部,故相對可藉由精確的數字計算光罩至光 阻層間的距離、穿透孔之大小及分佈等,精準控制凹部的 形成’進而達到精密度高且生產成本低。 、 [2 ]製程穩定。本發明配合紫外線光源穿過光罩其細 密的透光孔照射而於光阻層表面逐漸形成凹部,其凹^ ^ 呈光滑樣悲並可被精確控制,之後,再電鑄及翻製出可大 量熱壓或射出用之模具組,故此微鏡片可量產且製程穩定 [3 ]應用範圍廣。而由於本創作以”近接式曝光,,明 控制製作微透鏡的尺寸,可應用之範圍極廣,故凡顯示器 的導光板、光纖元件甚或生技醫學用之内視鏡等精 :V. Description of the invention (6) In summary, the advantages and effects of the present invention can be summarized as follows: [1] High precision and low production cost. The present invention uses the principle of focusing and light sensing to fully use the principle of diffraction of light, so as to form specific recessed portions on the photoresist layer, and after precise forming, coupled with the mold forming of the electroforming method, it can be produced, that is, the conventional use is eliminated The problem of hot-melt technology cannot precisely control the shape of micro-lenses. In addition, the present invention accepts light in a "close-to-close exposure" manner to form a recess on the surface of the resist layer, so the distance between the photomask and the resist layer, the size and distribution of the penetration holes, etc. can be relatively accurately calculated by accurate numbers. The precise control of the formation of the recessed portions further achieves high precision and low production costs. [2] The process is stable. The present invention cooperates with an ultraviolet light source to irradiate through the photoresist through its fine transparent holes to gradually form a recessed portion on the surface of the photoresist layer. The concave ^ ^ is smooth and can be accurately controlled. After that, electroforming and refining a large number of mold sets for hot pressing or injection, so the microlenses can be mass-produced and the process is stable. [3] Wide application range. And because this creation uses "close-up exposure" to control the size of the microlenses, it can be used in a wide range of applications. Therefore, the light guide plate of the display, fiber optic components, or endoscopes for biomedicine and other fines:

領域皆可適用,尤其,此技術成型之微透鏡陣列別具聚焦 性功能,故,I運用於影象與視覺的光學鏡片領域。、“、、 以上僅是藉由較佳實施例詳細說明本發明, 所做的任何簡單修改與變化皆不脫離本發明之精 以亡詳細說明,可使熟知本項技藝者明瞭本發明的 可達成W述目的,實已符合專利法之規定,麦提出發明It can be used in various fields. In particular, the micro lens array formed by this technology has a focusing function. Therefore, I is used in the field of optical lenses for imaging and vision. The above, ",,, and above are only a detailed description of the present invention through the preferred embodiments. Any simple modifications and changes made will not depart from the essence of the present invention. The detailed description will enable those skilled in the art to understand the possibilities of the present invention. Reaching the stated purpose, it has indeed met the provisions of the Patent Law, Mai proposed an invention

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同間距的光罩產生的透鏡陣 圖 間距的光罩產生的透鏡陣 594056 五、發明說明(7) 專利申請。 【附件一】 圖A係紫外線光源穿透不 列放大俯視圖一 圖B係圖A之透鏡表面外形 圖C係紫外線光源穿透不同 列放大俯視圖二 圖D係圖C之透鏡表面外形圖 圖E係紫外線光源穿透不同間距的光罩產生的透鏡陣 列放大俯視圖三 圖F係圖E之透鏡表面外形圖 圖G係紫外線光源穿透不同間距的光罩產 透鏡陣 列放大俯視圖四 圖Η係圖g之透鏡表面外形圖 【附件二] 掃描電子顯微鏡下之以240微米之間距所製成之微透 鏡陣列外形照片Lens Array Generated by Photomasks with the Same Pitch Figure 594056 Lens Array Generated by the Photomask with Pitches 5. Description of Invention (7) Patent Application. [Attachment 1] Figure A is an enlarged top view of a UV light source penetrating through a column. Figure B is an external plan view of a lens surface of Figure A. C is an enlarged top view of a UV light source penetrating through different columns. Enlarged top view of lens array generated by ultraviolet light source penetrating through reticle with different pitches. Fig. 3 is F. Figure E is a lens surface outline drawing. Fig. G is an enlarged plan view of lens array produced by ultraviolet light source penetrating reticle with different pitches. Lens surface outline drawing [Annex 2] Scanning electron microscope outline photo of micro lens array made with 240 micron pitch

第11頁 j^4〇56Page 11 j ^ 4〇56

【圖式簡單說明】 第一圖係本發明之製造方法之流程圖 第二圖係本發明之製造裝置示意圖一 第二圖係第二圖部分裝置放大俯視圖 第四圖係本發明之製造過程示意圖一 第五圖係本發明之製造過程示意圖二 第六圖係本發明之製造過程示意圖三 第七圖係本發明之製造過程示意圖四 第八圖係本發明之製造過程示意圖五 第九圖係本發明之製造過程示意圖五 第十圖係本發明之製造過程示意圖六 第十一圖係本發明微透鏡之成型顯微示意圖 第十二圖係習用微透鏡製法之一示意圖 第十三圖係習用微透鏡製法之二示意圖 預備步驟11 曝光成型步驟12 導電層成型步驟13 複製翻模步驟14 微透鏡成型步驟15 成品16 光罩20 透光孔21 光阻層4 0 基部50 導電膜70 模具90 模體100 加溫設備1 0 2 間隔部30 凹部41 紫外線光源60 模體80 #透鏡91 模梨101[Brief description of the drawings] The first diagram is a flowchart of the manufacturing method of the present invention, the second diagram is a schematic diagram of the manufacturing apparatus of the present invention, the second diagram is an enlarged top view of a part of the second diagram, and the fourth diagram is a schematic diagram of the manufacturing process of the present invention. A fifth diagram is a schematic diagram of the manufacturing process of the present invention. A second sixth diagram is a schematic diagram of the manufacturing process of the present invention. A third seventh diagram is a schematic diagram of the manufacturing process of the present invention. A fourth and eighth diagram are schematic diagrams of the manufacturing process of the present invention. Schematic diagram of the manufacturing process of the invention. The tenth diagram is a diagram of the manufacturing process of the present invention. The sixth and eleventh diagrams are microscopic diagrams of the microlenses of the present invention. The twelfth diagram is a schematic diagram of a conventional microlens manufacturing method. The thirteenth diagram is a conventional diagram. Schematic diagram of micro lens manufacturing method 2 Preparatory steps 11 Exposure molding step 12 Conductive layer molding step 13 Copy and flip step 14 Micro lens molding step 15 Finished product 16 Photomask 20 Light transmission hole 21 Photoresist layer 4 0 Base 50 Conductive film 70 Mold 90 Mold Body 100 Heating equipment 1 0 2 Spacer 30 Recess 41 UV light source 60 Phantom 80 #Lens 91 Mould 101

594056 圖式簡單說明 位距P 間距d 半圓曲面e: 孔徑D 小圓曲面e 1594056 Brief description of the diagram P pitch P Pitch d Semicircular surface e: Aperture D Small circular surface e 1

第13頁Page 13

Claims (1)

W4056 六、申請專利範圍 一種聚焦與感光式微透鏡陣列之製法,其包括 驟: 下列步 一、預備步驟:準備—光罩,以該 外線光源的完全照射,該光罩具有複數穿透紫 丄用以供該紫外線光源穿透而照射於一光阻屛先孔 光罩與光阻層之間設一間隔部,其中,該間二^,該 距; 成等倍的該透光孔其圓心至圓心的位 一、曝光成型步驟:經透光孔所引入的紫外 源照射於該光阻層,即於光 ^卜= 凹部; 預定的 ^ 導電層成型步驟··該光阻層之凹部成带德 源及先罩,並於該先阻層形=的 *,二應;:導電膜上電緯形成-模 ,、微透鏡成型步驟:以兩模具上 熱壓或射出之方式而形成一微透鏡; 再以 2 可4該=驟:於微透鏡成型後,開啟模具,即 鏡圍ΐ1項所述之一種聚焦與感光式微透 上 ’八中,該光罩的複數個透光孔於光罩 ΐίί ί角型樣態分佈。 月專引範圍第1項所述之一種聚焦與感光式微透 第14頁 594056 六、申請專利範圍 層間的曝光間距,以製作各式微透鏡尺寸。 4·如申請專利範圍第1項所述之聚焦與感光式微透鏡陣 列之製法,其中,於該導電膜表面電鑄一模體後,即 將該光阻層、基部去除,以形成一模具’再製出另一 相對應合模之模具而成為一模具組。 5 ·如申請專利範圍第1項所述之聚焦與感光式微透鏡陣 列之製法,該光阻層底面設一提高結構強度之基部。W4056 6. Scope of patent application A method for manufacturing a focusing and photosensitive microlens array, including the following steps: The following steps a. Preparatory steps: preparation-a photomask, which is completely illuminated by the external light source, the photomask has a plurality of penetrating cyanosis A space is provided between the photoresist layer and the photoresist layer for the ultraviolet light source to penetrate and irradiate, wherein the space is two, the distance is equal to the center of the light transmission hole, Position of the center of the circle 1. Exposure molding step: The photoresist layer is irradiated with an ultraviolet source introduced through the light-transmissive hole, that is, the light ^ = the concave portion; the predetermined ^ conductive layer forming step · The concave portion of the photoresist layer is formed into a band Deyuan and the first cover, and the first resistance layer shape = *, two should ;: electrical weft formation on the conductive film-mold, microlens forming step: forming a micro by hot pressing or injection on the two molds Lens; then 2 can 4 this = step: after the micro lens is formed, open the mold, that is, one of the focusing and photosensitive micro-transmitters described in item 1 of the lens enclosure, and the plurality of light-transmitting holes of the mask are used for light. Hood ΐ ί Angular type distribution. One of the focusing and photosensitive micro-transmissions described in item 1 of the monthly reference page 14 594056 6. Patent application scope The exposure interval between layers to make various microlens sizes. 4. The manufacturing method of the focusing and photosensitive microlens array according to item 1 of the scope of patent application, wherein after a mold body is electroformed on the surface of the conductive film, the photoresist layer and the base are removed to form a mold. A mold corresponding to the corresponding mold is produced to form a mold group. 5 · According to the manufacturing method of the focusing and photosensitive microlens array described in item 1 of the scope of patent application, the bottom surface of the photoresist layer is provided with a base for improving the structural strength. 第15頁Page 15
TW92107224A 2003-03-27 2003-03-27 Manufacturing method of focusing and photosensitive micro-lens array TW594056B (en)

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