TW592031B - Electronic apparatus with natural convection structure - Google Patents
Electronic apparatus with natural convection structure Download PDFInfo
- Publication number
- TW592031B TW592031B TW092116586A TW92116586A TW592031B TW 592031 B TW592031 B TW 592031B TW 092116586 A TW092116586 A TW 092116586A TW 92116586 A TW92116586 A TW 92116586A TW 592031 B TW592031 B TW 592031B
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic device
- natural convection
- heat dissipation
- patent application
- scope
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0234—Feet; Stands; Pedestals, e.g. wheels for moving casing on floor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
592031
裝置之整體溫度,達成散熱的效果。更重要的,由於 孔洞2 2係為貝牙之結構,還會進一步增加電子裝置之整體 表面積使得散熱面積得以增加,如此更可進一步加強气 熱效果三當然,在本案的實施例中,殼體結構21内部更^ ^ έ 第一笔路板(未圖示),其係亦可平行且相對第一電 路板2 3地置於第-孔洞2 2之另-側,當電源供應器於使用 狀態時,第一孔洞22中所產生之散熱氣流亦可同時帶 一電路板23以及第二電路板(未圖示)所產生之熱量。 此外,為避免當電源供應器不甚翻倒時,第一 無法提供空氣自然對流空間之情形,本案之電子裝置更可 i二一第”?1洞25,其係可相對應地貫穿殼體結構21之侧 二213、214,亚且與第一孔洞22之方向相同且實質上平 二t此一來’當本案之電子裝置倒塌或傾斜時,支撐元 :心=構t1壁2?外延伸之實質上大於3_的特 免ί : ^ 2提供空氣自然對流之空㈤,那麼就可避 免電子袭置因不甚翻倒而導致無法散熱之 定,裝置内可配置之電路=並無限 ^且孔洞的數ΐ、大小及形狀亦不限定。 南散熱效率,第一孔:因$楚-7丨、 #抓於雷+裝=i洞以及/或第一孔洞安排的最佳位置 係,又於電子凌置本體的中間位置,以使得 或第二孔洞到殼體結構任一周圍的距離實質上^, 可使散熱效率較為平均,當然接近内部之電 熱源的位置亦為較佳的選擇。一般來說 2 便,第一孔洞以及/或第二孔洞大多盥、、衣王、 八少/、电子裝置之殼體結
Claims (1)
- 592031六、申請專利範圍 一種具自然對流散熱結構之電子裝置 一般體結構; 修正_ 其至少包含: 一第一孔洞,其係貫穿該殼體結構之頂面與底面; 一第一電路板,其係置於該殼體結構之内部,並且實 質上平行地置於該第一孔洞之一側;以及 一 至少一支撐元件,其係置於該殼體結構之該底面,且 該支撐元件係具有至少一特定高度; 藉以使空氣得以流動於該電子裝置之底部。2.如申請專利範圍第丨項所述之具自然對流-散熱結構之電 子裝置’其中該電子裝置係為應用於行動電腦(DeskT 〇p) 之電源供應器(p〇wer Supply)。 3 ·如申請專利範圍第1項所述之具自然對流散熱結構之電 子裝置,其中更包含一第二電路板置於該殼體結構之内 部,且該第二電路板係實質上平行地置於該第一孔洞之另 一側04 ·如申請專利範圍第1項所述之具自然對流散熱結構之電 子裝置,其中該電子裝置更包含一第二孔洞,其係貫穿該 殼體結構之一相對侧面,旅與該第一孔洞以及該印刷電路 板實質上平行。 5 ·如申請專利範圍第丨項所述之具自然對流散熱結構之電 子裝置,其中該特定高度實質上大於等於3mm。 6 ·如申請專利範圍第1項戶斤述之具自然對流散熱結構之電 子裝置,其中該支撐元许自該殼體結構側壁向外延伸一特 定寬度,且該特定寬度實質上大於專於3mm。592031 _案號92116586_U年丨月 日 修正_ 六、申請專利範圍 ^ 7. 如申請專利範圍第1項所述之具自然對流散熱結構之電 子裝置,其中該第一孔洞至該殼體結構周圍之距離實質上 相等。 8. 如申請專利範圍第1項所述之具自然對流散熱結構之電 子裝置,其中該殼體結構與該第一孔洞係為一體成型。 9. 如申請專利範圍第1項所述之具自然對流散熱結構之電 子裝置,其中該第一孔洞係為長條型。 1 0.如申請專利範圍第1項所述之具自然對流散熱結構之電 子裝置,其中具自然對流散熱結構之電子裝置更包含一輸 入元件,且該輸入元件可為插頭、插座與電源線等其中之 · — 〇 11.如申請專利範圍第1項所述之具自然對流散熱結構之電 子裝置,其中具自然對流散熱結構之電子裝置更包含一輸 出元件,且該輸出元件可為自插頭、插座與電源線等其中 之一 -- 〇第16頁
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092116586A TW592031B (en) | 2003-06-18 | 2003-06-18 | Electronic apparatus with natural convection structure |
US10/661,676 US6961241B2 (en) | 2003-06-18 | 2003-09-15 | Electronic apparatus with natural convection structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092116586A TW592031B (en) | 2003-06-18 | 2003-06-18 | Electronic apparatus with natural convection structure |
Publications (1)
Publication Number | Publication Date |
---|---|
TW592031B true TW592031B (en) | 2004-06-11 |
Family
ID=33516554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092116586A TW592031B (en) | 2003-06-18 | 2003-06-18 | Electronic apparatus with natural convection structure |
Country Status (2)
Country | Link |
---|---|
US (1) | US6961241B2 (zh) |
TW (1) | TW592031B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8253076B2 (en) * | 2007-10-29 | 2012-08-28 | Smiths Medical Asd, Inc. | Respiratory system heater unit |
US20100177478A1 (en) * | 2009-01-09 | 2010-07-15 | Lucius Chidi Akalanne | Cooling arrangement for an equipment assembly |
US7903405B1 (en) * | 2009-09-18 | 2011-03-08 | Fisher-Rosemount Systems, Inc. | Electronic device enclosures having improved ventilation to dissipate heat |
US8611088B2 (en) * | 2011-11-16 | 2013-12-17 | Cooper Technologies Company | Mechanical heat pump for an electrical housing |
JP5440599B2 (ja) * | 2011-12-28 | 2014-03-12 | 株式会社デンソー | 電子装置 |
FR2988978B1 (fr) * | 2012-03-28 | 2014-06-27 | Safran | Support boitier fadec en materiau composite |
US9612633B2 (en) | 2015-02-19 | 2017-04-04 | Compulab Ltd. | Passively cooled serviceable device |
EP4124189A1 (en) * | 2021-07-21 | 2023-01-25 | HENSOLDT Sensors GmbH | Closed housing for an electronic component |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5592366A (en) * | 1994-09-29 | 1997-01-07 | Goldman; Jacob | Front loading computer/bus extender |
US6144556A (en) * | 1999-03-30 | 2000-11-07 | Lanclos; Kenneth W. | Heat dissipating housing for electronic components |
US6430044B2 (en) * | 2000-02-10 | 2002-08-06 | Special Product Company | Telecommunications enclosure with individual, separated card holders |
US6535382B2 (en) * | 2001-04-12 | 2003-03-18 | Johnson Controls Technology Company | Cooling system for electronic equipment cabinets |
US6459577B1 (en) * | 2001-07-06 | 2002-10-01 | Apple Computer, Inc. | Thermal chimney for a computer |
US6650539B1 (en) * | 2002-06-19 | 2003-11-18 | Handsome Electronics Ltd. | Modular backup power housing |
-
2003
- 2003-06-18 TW TW092116586A patent/TW592031B/zh not_active IP Right Cessation
- 2003-09-15 US US10/661,676 patent/US6961241B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6961241B2 (en) | 2005-11-01 |
US20040257778A1 (en) | 2004-12-23 |
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