TW592031B - Electronic apparatus with natural convection structure - Google Patents

Electronic apparatus with natural convection structure Download PDF

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Publication number
TW592031B
TW592031B TW092116586A TW92116586A TW592031B TW 592031 B TW592031 B TW 592031B TW 092116586 A TW092116586 A TW 092116586A TW 92116586 A TW92116586 A TW 92116586A TW 592031 B TW592031 B TW 592031B
Authority
TW
Taiwan
Prior art keywords
electronic device
natural convection
heat dissipation
patent application
scope
Prior art date
Application number
TW092116586A
Other languages
English (en)
Inventor
Kuo-Liang Lee
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to TW092116586A priority Critical patent/TW592031B/zh
Priority to US10/661,676 priority patent/US6961241B2/en
Application granted granted Critical
Publication of TW592031B publication Critical patent/TW592031B/zh

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127Natural convection
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings
    • H05K5/0234Feet; Stands; Pedestals, e.g. wheels for moving casing on floor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

592031
裝置之整體溫度,達成散熱的效果。更重要的,由於 孔洞2 2係為貝牙之結構,還會進一步增加電子裝置之整體 表面積使得散熱面積得以增加,如此更可進一步加強气 熱效果三當然,在本案的實施例中,殼體結構21内部更^ ^ έ 第一笔路板(未圖示),其係亦可平行且相對第一電 路板2 3地置於第-孔洞2 2之另-側,當電源供應器於使用 狀態時,第一孔洞22中所產生之散熱氣流亦可同時帶 一電路板23以及第二電路板(未圖示)所產生之熱量。 此外,為避免當電源供應器不甚翻倒時,第一 無法提供空氣自然對流空間之情形,本案之電子裝置更可 i二一第”?1洞25,其係可相對應地貫穿殼體結構21之侧 二213、214,亚且與第一孔洞22之方向相同且實質上平 二t此一來’當本案之電子裝置倒塌或傾斜時,支撐元 :心=構t1壁2?外延伸之實質上大於3_的特 免ί : ^ 2提供空氣自然對流之空㈤,那麼就可避 免電子袭置因不甚翻倒而導致無法散熱之 定,裝置内可配置之電路=並無限 ^且孔洞的數ΐ、大小及形狀亦不限定。 南散熱效率,第一孔:因$楚-7丨、 #抓於雷+裝=i洞以及/或第一孔洞安排的最佳位置 係,又於電子凌置本體的中間位置,以使得 或第二孔洞到殼體結構任一周圍的距離實質上^, 可使散熱效率較為平均,當然接近内部之電 熱源的位置亦為較佳的選擇。一般來說 2 便,第一孔洞以及/或第二孔洞大多盥、、衣王、 八少/、电子裝置之殼體結

Claims (1)

  1. 592031
    六、申請專利範圍 一種具自然對流散熱結構之電子裝置 一般體結構; 修正_ 其至少包含: 一第一孔洞,其係貫穿該殼體結構之頂面與底面; 一第一電路板,其係置於該殼體結構之内部,並且實 質上平行地置於該第一孔洞之一側;以及 一 至少一支撐元件,其係置於該殼體結構之該底面,且 該支撐元件係具有至少一特定高度; 藉以使空氣得以流動於該電子裝置之底部。
    2.如申請專利範圍第丨項所述之具自然對流-散熱結構之電 子裝置’其中該電子裝置係為應用於行動電腦(DeskT 〇p) 之電源供應器(p〇wer Supply)。 3 ·如申請專利範圍第1項所述之具自然對流散熱結構之電 子裝置,其中更包含一第二電路板置於該殼體結構之内 部,且該第二電路板係實質上平行地置於該第一孔洞之另 一側0
    4 ·如申請專利範圍第1項所述之具自然對流散熱結構之電 子裝置,其中該電子裝置更包含一第二孔洞,其係貫穿該 殼體結構之一相對侧面,旅與該第一孔洞以及該印刷電路 板實質上平行。 5 ·如申請專利範圍第丨項所述之具自然對流散熱結構之電 子裝置,其中該特定高度實質上大於等於3mm。 6 ·如申請專利範圍第1項戶斤述之具自然對流散熱結構之電 子裝置,其中該支撐元许自該殼體結構側壁向外延伸一特 定寬度,且該特定寬度實質上大於專於3mm。
    592031 _案號92116586_U年丨月 日 修正_ 六、申請專利範圍 ^ 7. 如申請專利範圍第1項所述之具自然對流散熱結構之電 子裝置,其中該第一孔洞至該殼體結構周圍之距離實質上 相等。 8. 如申請專利範圍第1項所述之具自然對流散熱結構之電 子裝置,其中該殼體結構與該第一孔洞係為一體成型。 9. 如申請專利範圍第1項所述之具自然對流散熱結構之電 子裝置,其中該第一孔洞係為長條型。 1 0.如申請專利範圍第1項所述之具自然對流散熱結構之電 子裝置,其中具自然對流散熱結構之電子裝置更包含一輸 入元件,且該輸入元件可為插頭、插座與電源線等其中之 · — 〇 11.如申請專利範圍第1項所述之具自然對流散熱結構之電 子裝置,其中具自然對流散熱結構之電子裝置更包含一輸 出元件,且該輸出元件可為自插頭、插座與電源線等其中 之一 -- 〇
    第16頁
TW092116586A 2003-06-18 2003-06-18 Electronic apparatus with natural convection structure TW592031B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW092116586A TW592031B (en) 2003-06-18 2003-06-18 Electronic apparatus with natural convection structure
US10/661,676 US6961241B2 (en) 2003-06-18 2003-09-15 Electronic apparatus with natural convection structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092116586A TW592031B (en) 2003-06-18 2003-06-18 Electronic apparatus with natural convection structure

Publications (1)

Publication Number Publication Date
TW592031B true TW592031B (en) 2004-06-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW092116586A TW592031B (en) 2003-06-18 2003-06-18 Electronic apparatus with natural convection structure

Country Status (2)

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US (1) US6961241B2 (zh)
TW (1) TW592031B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8253076B2 (en) * 2007-10-29 2012-08-28 Smiths Medical Asd, Inc. Respiratory system heater unit
US20100177478A1 (en) * 2009-01-09 2010-07-15 Lucius Chidi Akalanne Cooling arrangement for an equipment assembly
US7903405B1 (en) * 2009-09-18 2011-03-08 Fisher-Rosemount Systems, Inc. Electronic device enclosures having improved ventilation to dissipate heat
US8611088B2 (en) * 2011-11-16 2013-12-17 Cooper Technologies Company Mechanical heat pump for an electrical housing
JP5440599B2 (ja) * 2011-12-28 2014-03-12 株式会社デンソー 電子装置
FR2988978B1 (fr) * 2012-03-28 2014-06-27 Safran Support boitier fadec en materiau composite
US9612633B2 (en) 2015-02-19 2017-04-04 Compulab Ltd. Passively cooled serviceable device
EP4124189A1 (en) * 2021-07-21 2023-01-25 HENSOLDT Sensors GmbH Closed housing for an electronic component

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5592366A (en) * 1994-09-29 1997-01-07 Goldman; Jacob Front loading computer/bus extender
US6144556A (en) * 1999-03-30 2000-11-07 Lanclos; Kenneth W. Heat dissipating housing for electronic components
US6430044B2 (en) * 2000-02-10 2002-08-06 Special Product Company Telecommunications enclosure with individual, separated card holders
US6535382B2 (en) * 2001-04-12 2003-03-18 Johnson Controls Technology Company Cooling system for electronic equipment cabinets
US6459577B1 (en) * 2001-07-06 2002-10-01 Apple Computer, Inc. Thermal chimney for a computer
US6650539B1 (en) * 2002-06-19 2003-11-18 Handsome Electronics Ltd. Modular backup power housing

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US6961241B2 (en) 2005-11-01
US20040257778A1 (en) 2004-12-23

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