TW591734B - IC tester system for eliminating electrostatic discharge damage - Google Patents

Abstract

An IC tester system for eliminating electrostatic discharge damage is provided. The IC tester system includes a temperature control oven and an IC test board. The IC test board contains a dummy conducting wire and a grounding interface for grounding out the electrostatic discharge (ESD) generated during the loading and unloading of the test board through a thermal-insulated rubber installed in the door of the oven.

Description

591734 V. Description of the invention (l) The technical field to which the invention belongs The present invention provides an IC component test system, and more particularly, an IC power component test system capable of preventing electrostatic damage. Prior Technology In the IC chip manufacturing process, the "reliability" of a product is one of the most important considerations. Reliability can be simply described as the life span of a product under normal use conditions. In order to know the service life of a product in a short time, IC manufacturers usually use the "Accelerated 1 i feti me test" to predict the average service life of the product by using more than normal working conditions. Strict working environment, such as product life test under high ambient temperature, voltage, current or pressure, to determine the life of the product under deteriorating conditions, and then use the Lifetime Model to calculate the product under normal use conditions Life. The reliability test of general IC factories can be divided into "Wafer-Level Reliability (WLR)" and "Package-Level Reliability (PLR)" according to their test methods. The former is to directly place the wafer The test is performed on a test machine on a general production line, and the latter first cuts and packages the wafer into test samples, then inserts these samples into the test board, and then places them in a special high temperature for testing. Its_ "packaging level" life test experiment strip for reliability test

591734 V. Description of the invention (2) " " Pieces (stress c〇nditi〇n) are closer to the normal working conditions of the product, and the results are more acceptable to the industry. ^ Head A 1 C chip factory's most commonly used package level IC chip electrical test, shown in Figure 1, Figure 1 shows the appearance of conventional test equipment i 0 丄 1 C chip test equipment 10 includes a temperature-controlling furnace body 12 and a temperature-resistant material 16 such as rubber, which are fixedly arranged on the inner and outer sides of the furnace door 14. South temperature resistant material 丨 6 is used to isolate the temperature inside and outside the temperature control furnace. There are several slits 18 which are cut open for the test board (DUT b〇ard) 30 to pass through and insert on the furnace door i 4. The test board 3 includes a socket 34 for testing a component, such as a test IC, a test lead 36, and a test interface (also referred to as a gold finger) 38. , Used to connect a port (not shown) of a test unit. During the test, a device under test (dev 丨 ceundertest (DUT)) 32 is mounted on the test element slot 34, and the test board 30 is manually inserted into the furnace door 14 to withstand the test. The slender opening of the high-temperature material is 18, then the furnace is turned off, and the temperature control furnace is used to provide the high-temperature environment required for reliability testing. The test circuit provides current and voltage for testing. However, the design of the conventional IC chip electrical test equipment 10 cannot prevent static electricity from damaging the component under test: when the operator inserts the test board 3 0 through the slender opening of the high temperature resistant material 1 8 into the furnace door 1 4 (1 oad i ng DUT boards), the test interface 38 on the test board 30 and the conductive surface of the board and the high temperature resistant material 16 will rub against each other to generate static electricity, which will destroy the test.

591734

V. Description of the invention (3) The component has caused that the component has been damaged by static electricity and lost its normal function before the electrical test has been formally tested. Similarly, "after the test is completed," when the operator unloads the test board 30 from the furnace door 14, the element is destroyed by static electricity due to friction, which causes a great loss. The current remedy for the lack of conventional IC chip electrical test equipment is generally to use a special fixture provided by the original test equipment factory. When placing the test sample in the test component slot, each special fixture is first used to close each An IC to be tested, so that the operator will not generate static electricity when inserting the test board on the furnace door, and then before conducting the electrical test,

Remove the fixture on the component to be tested before testing; after the test is completed, the operator must also install the anti-static fixture attached to the factory before removing the test board. Although this method using a fixture can prevent the generation of static electricity, it must take a lot of time to set up and remove the fixture when performing electrical tests, and the steps are very cumbersome. Even when the operator sets up the fixture, the steps may be complicated. The stringent man-made negligence has damaged the device under test, and it still cannot effectively improve the cost and effect of electrical testing. Therefore, an IC chip electrical test equipment with simple anti-static damage operation steps is an urgent need for current c manufacturers.

SUMMARY OF THE INVENTION The main object of the present invention is to provide an Ic which can prevent electrostatic damage.

591734 V. Description of the invention (4) Component testing system In the scope of the patent application of the present invention, an antistatic-damaged IC test system is disclosed. The IC test system includes a temperature control furnace and at least one IC component test board. The temperature test furnace includes a temperature-controlled furnace body, a furnace door, and a high-temperature resistant material disposed on the furnace door. The IC component test board includes a circuit board body, at least one slot for a component under test, a test interface, a ground interface, a test lead, and a dummy lead. During the loading / unloading process of the IC component test board, the static electricity generated by the test lead and the high temperature resistant material due to friction can be connected to the ground interface through the dummy lead to be grounded. The anti-static destruction IC test system of the present invention is provided with a dummy wire and a ground interface, which can pre-earth the static electricity generated by the friction between the test wire and the high temperature resistant material before the test, so as to prevent the static electricity from damaging the IC test component, which is effective. Improve the defects of the conventional equipment, and then improve the accuracy of the IC electrical power test. The collection of the special appendix and the explanation of the use of Mingming to explain the details, step by step into the book with 1 invention is more relevant and able to have an examiner under the commission for review. Illustration. The affiliate made Rongsuo's internal and limited skills to be technical skills. Plus

Page 8 591734

Please refer to FIG. 2, which is a schematic diagram of the IC component test system 50 of the present invention. As shown in FIG. 2, the c-component test system 50 of the present invention includes two temperature control furnaces 60 and a 1C-component test board 70. The temperature-controlling furnace 60 includes a temperature-controlling furnace body 62 for providing an appropriate test temperature for the κ component to be tested, a furnace door 64 connected to the temperature-controlling furnace body, and a high-temperature resistant material 66, such as rubber, It is fixed on the furnace door 64 to isolate and control the temperature inside and outside the furnace. The IC component test board 70 includes a circuit board body 71, and a socket 72 to be tested is provided on the circuit board body 71 for mounting an IC to be tested, and a test interface 73 for connecting a test unit. A connection port (not shown), a grounding interface 74 for connecting a grounding connection port 80, a test lead 75 for connecting the component under test socket 72 and the test interface 73, and a dummy The lead 76 is used to connect the test lead 75 and the ground interface 74. In this embodiment, in order to simplify the description, the IC component test system 50 only includes an IC component test board 70, and the IC component test board 70 only includes an IC test component slot 72. However, according to the actual situation, the jc test system 50 of the present invention may include a plurality of ic component test boards 70, and each of the κ test boards 70 may include a plurality of test component slots 72, which may accommodate a plurality of 1C. The device under test 78 is tested. When testing, first insert the pins of the 1C device under test 78 into the corresponding holes in the socket 7 2 of the device to be tested, fix the jc device under test on the device socket 72, and then connect the ground interface 74 and a grounded port

591734 V. Description of the invention (6) | Connect 80, and manually load the test board 70 of the device under test into the slender openings 68, 70 of the refractory material 66 from the side, and fix it on the furnace door 64. Bull: Then the test plate and the high-temperature resistant material 66 are combined to produce <static electrostatic pf, shell, &quot; type wires 75. The ground interface is imaginary == bt is connected. = The furnace door 64 is closed and the test interface 73 Electrically connected to a test port (not shown) for early electrical testing. V. When Yu Zi finished the test, first unplug the test unit's port (not shown) from the test interface 73, then open the furnace door 64 and connect the ground interface 74 to a ground, port 80, and then Test the component manually by manual method | The board 70 is carried by the high temperature resistant material 66. At this time, the static electricity generated by friction will be grounded through the dummy wire 76 through the grounding port 80 connected to the grounding interface 74. Export, and finally unplug the grounded port 〇! c The component to be tested 78 is removed from the component to be tested socket 72, and the test of the 1C component is completed. Compared with the conventional IC component test equipment, the IC component test system of the present invention is designed with a dummy wire and a ground interface on the IC component test board. The static electricity generated by the friction of the high heat-resistant material is directly grounded to avoid static electricity | destroying the IC test component ', so it can effectively improve the shortcomings of the conventional equipment and improve the accuracy of the electrical test of the IC. 1 ^ · Page 10 591734 V. Description of the invention (7) The above description is only a preferred embodiment of the present invention. Any equivalent changes and modifications made in accordance with the scope of the patent application for the present invention shall be covered by the patent of the present invention. range.

Page 11 591734 Brief description of the drawings Brief description of the drawings Figure 1 is a schematic diagram of a conventional IC component test equipment. FIG. 2 is a schematic diagram of the IC component testing system of the present invention. Schematic symbol description

Page 12 10 1C component testing equipment 12 Temperature control furnace body 14 Furnace door 16 Nannan material 18 Slender opening on high temperature material 30 IC test board 32 im Test element 34 1C Test element slot 36 Test lead 38 Test interface 50 1C component test system 60 Temperature control furnace 62 Temperature control furnace body 64 Furnace door 66 South temperature resistant material 68 And the moxibustion on South temperature material 3 Long open α 70 IC test board 71 Circuit board body 72 1C component under test Slot 73 Test interface 74 Ground interface 75 Test lead 76 Dummy lead 78 1C DUT 80 Ground connection port

Claims (1)

591734 VI. Application Patent Scope 1 · An anti-static destruction 1C component test board (DUT Board) is used to test the electrical capacity of an IC # test device (device under test (DUT)). The IC component test board includes: A circuit board body; an IC component to be tested slot disposed on the circuit board body for mounting the IC component to be tested; a test interface located at a protruding position of an edge of the circuit board body; a ground interface located at A protruding position of the other edge of the circuit board body; a test lead is arranged on the circuit board body, one end of which is electrically connected to the slot of the device under test, and the other end is connected to the test interface; and a dummy (Dummy) A lead is arranged on the circuit board body, the dummy lead is electrically connected to the test lead, and one end is connected to the ground interface; wherein the dummy lead is used to load / load a temperature of the IC component test board The static electricity generated during the operation of controlling the furnace door is grounded through the ground interface in advance to avoid the static electricity from damaging the IC test component installed in the test component slot. 2 · The IC component test board as described in item 1 of the scope of patent application, wherein the temperature control furnace door is rotatably connected to a temperature control furnace body ', and the temperature control furnace door is provided with a high temperature resistant material, The high-temperature material has at least all elongated openings penetrating the temperature-controlled furnace door, and the opening is just sized to allow the IC component test board to pass. Page 13 591734 VI. Patent Application Range 3 · The IC component test board described in item 1 of the patent application range, wherein a plurality of holes are provided in the slot of the ΪC component to be tested to provide corresponding information on the component to be tested. Pin (P in) is inserted. 4 · The IC component test board as described in item 1 of the patent application scope, wherein the test interface is electrically connected to a port on a test unit. 5 · The IC component test board as described in item 1 of the scope of the patent application, wherein the ground interface is electrically connected to a ground connection before testing, and then the IC component test board is loaded into the temperature-controlled furnace door, The dummy wire is used to advance the static electricity generated when the IC component test board is loaded into the temperature-controlled furnace door through the ground interface, and then the grounding port is removed, the furnace door is closed, and the test interface is electrically connected to Connections on a test unit. 6 · The IC component test board as described in item 1 of the scope of patent application, wherein after the test is completed, the test unit's port is first unplugged, then the furnace door is opened to electrically connect the ground interface to a grounded port, and then The Ic component test board carries the temperature control furnace door, so that the dummy wire leads the static electricity generated when the Ic component test board is carried out of the temperature control furnace door to the ground through the ground interface, and finally unplugs the ground connection port. 7. An IC component test system including: A temperature controlled furnace including: Page 14 591734 VI. Scope of patent application-a temperature-controlled furnace body for accommodating an IC component test board and providing the appropriate test temperature for the IC component test board; a switchable furnace door connected to the temperature-controlled furnace body, A high-temperature-resistant material is provided thereon, and the high-temperature material has at least all slender openings; an IC component test board capable of preventing static electricity damage includes: a circuit board body; an IC component to be tested is provided in the slot; The circuit board body is used to install an IC component to be tested; a test interface is located at a protruding position of one edge of the circuit board body; a ground interface is located at a protruding position of the other edge of the circuit board body; a test lead is arranged One end of the circuit board body is electrically connected to the slot of the device under test, and the other end is connected to the test interface; a dummy wire is arranged on the circuit board body, and is electrically connected to the test wire, and one end is Connected to the ground interface; and a test unit connected to the test interface on the circuit board for testing a device under test on the circuit board; When an electrical power I C test element, the test of the I C-based interface of the device test board refractory material through the elongated opening of the door. 8 · The IC device test system as described in item 7 of the scope of the patent application, wherein the south temperature resistant material is a rubber victory. Page 15 591734 VI. Application for Patent Scope 9 · The IC component test system described in item 7 of the scope of patent application, in which a plurality of holes are provided in the slot of the IC under test component to provide corresponding correspondence on the I c under test component. Pin (pi η) is inserted. 10. The IC device test system according to item 7 of the scope of patent application, wherein the test interface is connected to a port on the test unit. 1 1 · The IC component test system described in item 7 of the scope of patent application, wherein the ground interface is electrically connected to a grounded port before testing, and then the IC component test board is loaded into the temperature-controlled furnace The door, so that the dummy wire leads to the static electricity generated when the IC component test board is loaded into the temperature-controlled furnace door in advance through the ground interface, and then unplug the grounded port, close the furnace door and re-energize the test interface Connect to the port of a test unit. . 1 2 · The IC component test system described in item 7 of the scope of patent application, wherein after the test is completed, the test unit's port is first unplugged, and then the furnace door is opened to electrically connect the ground interface to a grounded port, and then The temperature control furnace door is carried on the IC component test board, and the dummy wire is used to conduct the static electricity generated when the IC component test board is carried out of the temperature control oven door to ground through the ground interface, and finally the grounded connection port is unplugged . 1 3 · —I C component test equipment for anti-static destruction Page 16 591734 6. The scope of the patent application testing component, the IC component testing equipment includes: a temperature control furnace, including: a temperature control furnace body to provide the appropriate test temperature of the IC test components; a switchable furnace door Is connected to the temperature control furnace body, and a high temperature resistant material is arranged on the high temperature resistant material, the high temperature resistant material has at least all elongated openings; an IC test component test board is inserted through the elongated openings of the high temperature resistant material. The furnace door includes: a circuit board body, which can be divided into a first part and a second part, wherein the first part is located in the temperature control furnace and the second part is located at the temperature when the test is performed Control the furnace body; an IC test component slot is arranged on the first part of the circuit board body to install an IC test component; a test interface is located at an edge protruding position of the second part of the circuit board body; A ground interface is located at a protruding position of an edge of the first part of the circuit board body; a test lead is arranged on the circuit board body, and one end thereof is electrically connected The other end of the IC component under test is connected to the test interface; a dummy wire is laid on the circuit board body, which is electrically connected to the test lead, and one end is connected to the ground interface; and a test unit, It is connected to the test interface on the IC test board to test the IC device under test. Page 17 591734 VI. Scope of patent application 1 4 The IC device testing equipment described in item 13 of the scope of patent application, wherein the pair of high-temperature materials is a rubber. 1 5 · The IC component test equipment as described in item No. 丨 3 of the scope of patent application, wherein a plurality of holes are provided in the 1 C test component slot to provide corresponding pins (pi η) on the IC # test component. insert. 16 · The c-component test equipment as described in item 丨 3 of the patent application scope, wherein the delta test interface is connected to a port on the test unit. 1 7 · According to the c component test equipment described in item 3 of the patent application scope, before the test, the ground interface is electrically connected to a grounded port, and then the IC component test board is loaded into the temperature control. Furnace door, the static electricity generated when the dummy wire is loaded into the temperature control furnace door of the IC component test board is led out through the ground interface, and then the grounded port is unplugged, the furnace door is closed, and the test interface is Electrically connected to a port on a test unit. 18 · The IC component test equipment as described in item 13 of the scope of patent application, wherein after the test is completed, the test unit's port is first unplugged, and then the oven door is opened to electrically connect the ground interface to a grounded port, Then carry the I c component test board out of the temperature control furnace door, so that the dummy wire will pass the static electricity generated when the ^ J c component test board is carried out of the temperature control furnace door through the connection. 591734 6. Scope of patent application The ground interface is grounded, and finally the grounded port is unplugged. 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