玖、發明說明： [技術領域] 此申請案與2001年12月21日所申請之序號！ 〇/〇265145有 關。 本發明係關於電腦系統内之排熱。更特定言之，本發明 係有關用於與基板平行安裝的彳政電子元件之雙面散熱片。 [先前技術] 由於現代微電子元件的速度及組件密度持續增加，其所 產生的熱量亦通常會增加。因此需要可更好地將熱量從微 電子元件中排出之技術，尤其是針對高效能元件之技術。 本發明中所用的術語「微電子元件」具有廣泛的涵義，包 括（但不限於）電子及光電元件，如微處理器、專用積體電路 (specific integrated cnxuits ; ASIC)、晶片組以及類似物。 儘管為清楚起見’術語「微電子元件」採用單數形式，但 其亦可包括複數個單獨元件。 事實上’在所有使用電子組件的系統中，都將微電子元 件安裝在一基板上，該基板有助於該等微電子元件與其他 系統組件之間電子信號及電源、接地點的分佈。但是，該 基板通常並非由導熱性較佳之材料製成。此類基板的實例 包栝有機基板柵格陣列（OLGA)、塑膠基板柵格陣列（pLC}A) 以及印刷電路板（PCB)。但本發明並非限於使用任何特定基 板材料或元件安裝組態之具體實施例。 當去除該基板的大熱阻障時，需要在該元件的兩側提供 冷卻。 84395 591366 [發明内容]‘ 本發明揭示一種用以平行於一基板安裝一微電子元件的 方法以及裝置，該基板具有一插入物（interp〇ser)及二散熱片 (heat sink)，該等二散熱片分別位於該基板兩侧。 本發明允許雙面散熱片在具有微處理器之系統中與基板 平订女衣，使其散熱程度提升至先前技術之散熱程度的兩 倍。基板通常導熱性較差，熱量不能順著基板的方向順利 政毛圖1所示的係一組態2的斷面圖，該組態將一微電子 一牛士衣在基板6上。通常使用插座（s〇cket) 8將微電子元 件4 μ基板6電、機械性耦合。由於基板6的導熱性較差，因 此很容易明白，組態2中微電子元件1〇所產生的大部分熱量 都舲也過散熱片丨2散發。熟悉技術人士應暸解散熱片的雙 计，如散熱片12的設計，本發明並非限於任何特定散熱片 之設計細節，如（但不限於）該散熱片之材料或幾何結 夕本發明使用一用以安裝該微電子元件的插入元件（接下來 知進-步討論），且基板上的—開口使—第二散熱 該微電子元件的基板面上。 括在 安裝微電子元件之技術近期的發展係使用位 Λ φ 、1成电予兀 /、丄板6之間的插入物。出於本發明的目，/ 、 曰、J ，十if*言^厂； 入物」採用最廣義之意義：一插入或位早一 板6+ - μ 、从兒子兀件4與基 〜間的兀件。在此意義上，圖丨中的插 式之一~ 8疋插入物的形 。在本發明的使用中，該插入物最 拇，甘+ 丁你具有高導執 “、：由將在下文闡述。應注意’出於本發明之目的 '凌~走插入物的内部設計細節並不重。 、 女此外，本發明 84395 2 2限於任何特定的插入物設計，只要其可導熱即可。插 ^ 、 十並非本發明之主題，本發明只不過使用廣義定 義的插人你/ : " 77 。在此基礎上，本發明將功能性說明許多 可能的插入物A、 ^ 物叹叶中义一邵分，以便更好地瞭解本發明之 、 l /夬非希望將本發明之範轉限於使用所說明的插 入物。 [實施方式] 、丨=允許雙面散熱片在具有微處理器之系統中與基板 =丁安衣使其散熱程度提升至先前技術之散熱程度的兩 t ,基板遇常導熱性較差，熱量不能順著基板的方向順利 散發。二1所示的係-組態2的斷面圖，該組態將一微電子 凡件4安裝在基板6上。通常使用插座(s〇cket“將微電子元 牛”基板6電、機械性搞合。由於基板6的導熱性較差，因 ft容易明白，紐態2中微電子元件10所產生的大部:熱量 /將透過散熱片12散發。熟悉技術人士應暸解散熱片的設 、、政片1 2的设计’本發明並非限於任何特定散熱片 Κ細節，如（但不限該散熱片之材料 ，本發明使用-用以安裝該微電予元件的插入元件;二來 將進一步討論），且基板上的一開口使一 該微電子元件的基板面上。 U片包括在 安裝微電予元件之技術近期的發展係使用 件4與基板6之間的插入物。出於本發明的目的，：：了： 入物」採用最廣義之意義：―位於微電子 板之間的元件。在此意義上，圖1中的插座8是插入物的形 84395 591366 、、 在本&明的使用中，該插入物最好係具有高導熱 性’其中理由將在女 命、、六 ^ 、 〜—在下又1^逑。應、/王思，出於本發明之目的 :該特定插入物的内部設計細節並不重要。此外，本發明 並非限於任何特定的插入物設計，只要其可導熱即可。插 入物之設計並非本於明$古 — |喉月之王碭本發明只不過使用廣義定 我的插入物而已。力士I枯u 士父 在此基％上，本發明將功能性說明許多 可能的插入物設計中之一部& ’以便更好地瞭解本發明之 上下文，而;夬非希望將本發明之範疇限於使用戶斤說明的插 入物〇 、長期以來，用插座8將微電子元件4與基板6連接起來的作 法較為晋遍。但是’傳統上插座8只是機械和電連接的一構 件’其並非可在其中處理或轉化電子信號或電源的組件， 信號只是從此處「經過」*已。當微電子元件4的速度和總 體處理能力提升時，儘f在低電壓下運作，更好地控制電 源品質及微電子元件4的輸入/輸出（1/〇)信號的需要變得更 為：顯。例如，在高電流、低電壓的環境下(具體而言 南万信號的情況下），並不需要以下降，因其會降低處理器 之效能。先前技術中針對此類「電源問題」的解決方法通 常採用電源解耦技術，如將側板電容器直接裝於基板6上。 一種可改善提供給處理器之電源信號品質的電源解決方 式係提供直接與微電子元件4耦合的一插入物，其中包括一 電壓調整（voltage regUlatlon ; VR)系統。以此方式，相對較 南的電壓可供給緊靠該處理器的插入元件，且在該插入物 中將電壓調低，並將其分佈至微電子元件4。 84395 591366 圖2所不的係一配置，其中一薄插入物“安裝於微電子元 件4與基板6之間，以及散熱片12。儘管圖2中所示的:電子 元件4與插入物16的大小接近，但這並非意味著兩者大I必 須相等。應在插入物16的平面内或「水平」（圖2)發送基板6 與微電子元件4之間所傳送的信號，如「至」或「自」&電懕 碉整系統以及「垂直」通過插入物16中的通道。 本發明利用了插入物16在其平面内發送電子信號之能力 j並在基板6上形成一開口，其亦有助於一第二散熱片的散 熱。圖3所示的係本發明的一項具體實施例，其中—第二散 熱片18透過基板6内的開σ2()安裝。在此項具體實施例/ 有兩條王要熱量傳送路徑通向二散熱片12及18，從而大幅 提高微電子元件4的散熱能力。散熱片12與18可以是類似: 亦可使用不同的材料及/或組態。插入物丨6藉由為微電子 元件4與基板6之間的電子信號提供路徑以及為微電子元件 4提供機械支撐’可在基板6内形成開口2Q ’當作穿過基板6 的第二熱傳送路徑。因此，本發明可使用插入物16來解決 「電源問題」以及Γ散熱問題」。 圖4所示的係本發明的另一項具體實施例，其中微電子元 件4係安裝於插入物1 6下方，並通過基板6的開口 20，二散 熱片12及〗8分別位於基板6兩侧。基板6與插入物16之間的 電連接22最好為鍍金銅焊墊，銅對銅連接24位於微電子元 件4與插入物16之間。此項具體實施例中使用彈簧板26以及 連接棒28提供了 —無插座壓力配對組件組合，同時提供可 靠的電連接。散熱片12以及18與微電子元件4及插入物丨6接 84395 -10 - 591366 觸之表面最好係採用高導熱介面材料（TIM)，如以聚合物為 基礎、以焊料為基礎或鑽石糊。熟悉技術人士應熟知此麵 高導熱介面材料（™)。應注意，圖4中所示之具體奮施例 只是微電子元件4以及插入物16之眾多可能的配置(允許散 熱片分別位於基板6的兩側）之„，本發明並非限於任何特定 之設計細節。 ^ 插入物1 6的設計並非限於協助電壓調整及機械性橋接開 口 20。本發明的其他具體實施例亦可包含記憶元件、光學 信號傳播元件’以及諸如位於插入物16内的電容器及電： 器之類的組件。圖5所示的係本發明的一項具體實施例，： 中f :曰θ粒3〇及32係嵌入插入物16内。所I入的石夕晶㈣ 及32最好係藉由核心38内的封裝材料34包圍並固定於適當 的位置插入物1 6微電子元件4面上的表面積層％與電源及 輸入/輸出信號在插入物16内及連接22與24間進行接觸。微 …㈣相對大小、嵌於插入物内的晶粒30及32皆可發 欠且一可對其進行選擇以使插入物的電子及熱效能最 佳圖5所不的係基板6與插入物^間接點Μ的兩個不同詛 態(：接針與接點烊塾)’以說明與該兩個組件電輕合的眾多 2万式中的兩種。但是，本發明並非限於任何特定的電 k要或任何其他的設計細節，除申請專利 限制者以外。 间〜k认所 二同：非活動插座8 ’有活動組件的插入物16能產生熱量 :太官f產生的熱量通常大大少於微電子元件4所產生的孰 里纟明中雙面散熱片。2與丨8)所提供的教熱裝置不僅為 84395 -11 - 插入物1 6的熱4 口 …、貝載提供散熱路徑，而且通常會將微電子元 1干 T所產生的_ 二—部分熱量透過插入物16散發至第二散熱 片。針對微電+ - # ” 特的熱負載广：:：及插入物16而使用120瓦特及30瓦 σΧ ’分別顯不了微電子元件4約40%的熱量都 係透過附於拖 顯著降低微電子的散熱片排出。該第二熱傳導路徑可 ,,,.^凡件4及插入物1 6的運作溫度，從而提升兩 嘗的？文成。 儘管以上、曰 每·^示出於說明之目的，提供了本發明的各種 具骨豆貝施例以总々々 乾例’但此等具體實施例以及範例不可作 為本發明所古1 h ΰ能之實施方案的詳盡清單，亦不可理解為 限制本發明。* ^ t心技術人士應瞭解，由於本發明的效益， 本無明在實施過中，匕合 τ 了此3對本發明的具體細節作許多 修改及變化。n接> 卜 冋彳永地，為免混淆本發明，並未說明熟悉技 ::斤么的所有具體細節、熟知之結構、元件及技術。 然而’本發明希望涵蓋廣泛的技術、元件以及熟知之結構。 因此發明希望只限於隨附之中請專利範圍的範田壽内。 [圖式簡單說明] 圖1所示的係-微電子元件及散熱片的斷面圖，該散熱片 係使用一插座連接安裝於基板上的。 圖2所示的係一微電子元件以及使用—插入物安裝於— 基板上的散熱片。 圖3所示的係一微電子元件以及安裝於一基板上的插入 物，該基板具有根據本發明之一项具體實施例的二散熱片。 圖4所示的係根據本發明之一項具的 /、 rm 84395 -12 - 591366 散熱片組合。 圖5所示的係根據本發明之一項具體實施例的一第三雙 面散熱片組合。 [圖式代表符號說明] 2 組態 4 微電子元件 6 基板 8 插座 10 微電子元件 12 散熱片 16 插入物 18 第二散熱片 20 開口 22 電連接 24 銅對銅連接 26 彈簧板 28 連接棒 30 > 32 碎晶粒 34 封裝材料 36 表面積層 38 核心 13 - 84395发明 Description of the invention: [Technical Field] This application is related to the serial number applied on December 21, 2001! 〇 / 〇265145 related. The present invention relates to heat removal in computer systems. More specifically, the present invention relates to a double-sided heat sink for a government electronic component mounted in parallel with a substrate. [Previous Technology] As the speed and component density of modern microelectronic components continue to increase, the heat generated by them will also generally increase. Therefore, there is a need for technologies that can better remove heat from microelectronic components, especially for high-performance components. The term "microelectronic component" used in the present invention has a broad meaning and includes, but is not limited to, electronic and optoelectronic components such as microprocessors, specific integrated cnxuits (ASICs), chip sets, and the like. Although the term "microelectronic component" is used in the singular for the sake of clarity, it may also include a plurality of individual components. In fact, in all systems using electronic components, microelectronic components are mounted on a substrate, which helps to distribute electronic signals, power, and ground points between these microelectronic components and other system components. However, the substrate is usually not made of a material with better thermal conductivity. Examples of such substrates include organic substrate grid arrays (OLGA), plastic substrate grid arrays (pLC) A), and printed circuit boards (PCBs). However, the present invention is not limited to a specific embodiment using any particular substrate material or component mounting configuration. When the large thermal barrier of the substrate is removed, cooling needs to be provided on both sides of the element. 84395 591366 [Summary of the Invention] 'The present invention discloses a method and device for mounting a microelectronic component parallel to a substrate, the substrate having an interposer and two heat sinks. The two The heat sinks are respectively located on two sides of the substrate. The present invention allows a double-sided heat sink to align a woman's clothing with a substrate in a system with a microprocessor, so that the degree of heat dissipation is increased to twice that of the prior art. The substrate usually has poor thermal conductivity, and the heat cannot go smoothly in the direction of the substrate. A cross-sectional view of a configuration 2 shown in FIG. 1 is a configuration in which a microelectronic and a cowboy are coated on the substrate 6. A socket 8 is usually used to electrically and mechanically couple the microelectronic element 4 μ substrate 6. Since the thermal conductivity of the substrate 6 is poor, it is easy to understand that most of the heat generated by the microelectronic component 10 in the configuration 2 is also dissipated through the heat sink 丨 2. Those skilled in the art should understand the dual design of the heat sink, such as the design of the heat sink 12, the present invention is not limited to the design details of any specific heat sink, such as (but not limited to) the material or geometry of the heat sink. The microelectronic component is mounted with an inserting component (the next step is further discussed), and the opening on the substrate allows a second heat dissipation on the substrate surface of the microelectronic component. The recent developments in the technology for mounting microelectronic components are using an insert between the bit Λ φ, 10% of the electricity, and the plate 6. For the purposes of the present invention, /, J, J, ten if * language, factory; "incorporating" is used in the broadest sense: an insert or bit earlier than a plate 6+-μ, from the son element 4 and the base ~ Of the pieces. In this sense, one of the inserts in Figure 丨 the shape of the insert. In the use of the present invention, the insert is the most prominent, Gan + Ding You have a high guidance ",: will be explained below. It should be noted 'for the purposes of the present invention' Ling ~ take the internal design details of the insert and No., female. In addition, the present invention is limited to any particular insert design, as long as it can conduct heat. Inserts ^, 10 are not the subject of the present invention, and the present invention merely uses a broadly defined insert you /: " 77. On the basis of this, the present invention will functionally explain many possible inserts A, ^, and ^, so as to better understand the present invention. Limited to the use of the illustrated insert. [Embodiment], 丨 = Allows a double-sided heat sink to be used in a system with a microprocessor and a substrate = Ding Anyi to increase the heat dissipation to two t, the substrate of the prior art. In the case of poor thermal conductivity, the heat cannot be smoothly dissipated in the direction of the substrate. The cross-section of the system 2 shown in Figure 1 is a configuration in which a microelectronic component 4 is mounted on the substrate 6. Usually a socket is used. (s〇cket "will microelectronics "The substrate 6 is electrically and mechanically combined. Because the thermal conductivity of the substrate 6 is poor, it is easy to understand because of ft. Most of the microelectronic components 10 generated in the button 2: heat / will be dissipated through the heat sink 12. Those familiar with the technology should Understand the design of the heat sink, and the design of the government film 12. The present invention is not limited to any specific details of the heat sink, such as (but not limited to the material of the heat sink, the present invention is used to insert the micro-electrical element. The second aspect will be further discussed), and an opening in the substrate enables a microelectronic component substrate surface. U-chips are included in the recent development of the technology for mounting microelectronic components using the component 4 and the substrate 6 Inserts. For the purposes of the present invention, the ": in" is used in the broadest sense:-an element located between microelectronic boards. In this sense, the socket 8 in Fig. 1 is the shape of the insert 84395 591366, In the use of this & Ming, the insert is best to have a high thermal conductivity 'Where the reason will be in the female life ,, six ^, ~-in the next 1 ^ 逑. Ying, / Wang Si, out of Purpose of the invention: The internal design of the specific insert The details are not important. In addition, the present invention is not limited to any specific insert design, as long as it can conduct heat. The design of the insert is not based on the ancient Ming Dynasty | My inserts only. On this basis, Master Lux, this invention will functionally illustrate one of the many possible insert designs & 'in order to better understand the context of this invention, and; 夬It is not desirable to limit the scope of the present invention to the inserts described by the user. For a long time, the method of connecting the microelectronic component 4 and the substrate 6 with the socket 8 has been improved. A component 'is not a component in which an electronic signal or power source can be processed or converted, the signal just "passes through" * here. As the speed and overall processing capacity of the microelectronic component 4 increase, the need to operate at low voltages to better control the quality of the power supply and the input / output (1/0) signal of the microelectronic component 4 becomes even more: Show. For example, under high-current, low-voltage environments (specifically, in the case of Nanwan Signal), there is no need to decrease, because it will reduce the performance of the processor. In the prior art, a solution to such a “power problem” usually uses a power supply decoupling technology, such as mounting a side plate capacitor directly on the substrate 6. A power solution that can improve the quality of the power signal provided to the processor provides an insert that is directly coupled to the microelectronic component 4, including a voltage regUlatlon (VR) system. In this way, a relatively southerly voltage can be supplied to the insert element immediately adjacent to the processor, and the voltage is lowered in the insert and distributed to the microelectronic element 4. 84395 591366 A configuration not shown in FIG. 2 in which a thin insert is “mounted between the microelectronic component 4 and the substrate 6 and the heat sink 12. Although shown in FIG. 2: the electronic component 4 and the insert 16 The size is close, but this does not mean that the two large I must be equal. The signal transmitted between the substrate 6 and the microelectronic component 4 should be sent in the plane of the insert 16 or "horizontally" (Figure 2), such as "to" Or "auto" & electrical trimming system and "vertical" through the channel in the insert 16. The present invention utilizes the ability of the insert 16 to send electronic signals in its plane j and forms an opening in the substrate 6, which also contributes to the heat dissipation of a second heat sink. A specific embodiment of the present invention is shown in FIG. 3, in which the second heat sink 18 is mounted through the opening σ2 () in the substrate 6. In this specific embodiment, there are two kings that the heat transfer path leads to the two heat sinks 12 and 18, thereby greatly improving the heat dissipation capability of the microelectronic component 4. The heat sinks 12 and 18 can be similar: different materials and / or configurations can also be used. The insert 6 provides a path for the electronic signals between the microelectronic element 4 and the substrate 6 and provides mechanical support for the microelectronic element 4 'the opening 2Q can be formed in the substrate 6' as the second heat passing through the substrate 6 Transmission path. Therefore, the present invention can use the insert 16 to solve the "power problem" and the "heat dissipation problem". FIG. 4 shows another embodiment of the present invention, in which the microelectronic component 4 is installed below the insert 16 and passes through the opening 20 of the substrate 6. The two heat sinks 12 and 8 are located on the substrate 6 respectively. side. The electrical connection 22 between the substrate 6 and the interposer 16 is preferably a gold-plated copper pad. The copper-to-copper connection 24 is located between the microelectronic element 4 and the interposer 16. The use of the spring plate 26 and the connecting rod 28 in this embodiment provides a combination of a non-socket pressure mating assembly, while providing a reliable electrical connection. The heat sinks 12 and 18 are connected to the microelectronic components 4 and the inserts. The contact surface is preferably 84395 -10-591366. The contact surface is preferably made of a high thermal interface material (TIM), such as polymer-based, solder-based or diamond paste. . Those skilled in the art should be familiar with this surface High Thermal Interface Material (™). It should be noted that the specific embodiment shown in FIG. 4 is only one of many possible configurations of the microelectronic component 4 and the insert 16 (allowing the heat sink to be located on both sides of the substrate 6 respectively). The present invention is not limited to any specific design Details. ^ The design of the insert 16 is not limited to assist in voltage adjustment and mechanical bridging openings 20. Other specific embodiments of the present invention may also include memory elements, optical signal propagation elements, and capacitors and electrical components such as those located in the insert 16. : A device such as a device. Fig. 5 shows a specific embodiment of the present invention, where: f: said θ grains 30 and 32 are embedded in the insert 16. The inserted stone eve crystals and 32 It is best to be surrounded and fixed in place by the encapsulation material 34 in the core 38. The surface area layer on the surface of the microelectronic component 4 and the power and input / output signals in the insert 16 and the connections 22 and 24. Contact between the micro ..... the relative size, the grains 30 and 32 embedded in the insert can be owed and one can be selected to optimize the electronic and thermal performance of the insert. 6Indirect points with insert ^ Two different curses (: pins and contacts 烊 塾) 'to illustrate two of the many 20,000 types that are electrically coupled with the two components. However, the present invention is not limited to any particular electrical requirements or any Other design details, except for those who apply for patent restrictions. The two are the same: inactive sockets 8 'inserts with movable components 16 can generate heat: Taiguan f usually generates much less heat than microelectronic components 4 The double-sided heat sinks produced by 孰 里 纟 明 中. 2 and 丨 8) provide heat teaching devices not only for the heat of 84395 -11-inserts 16 of 4 ..., the shell contains a heat dissipation path, and usually will _ 2-Part of the heat generated by the dry T of the microelectronic unit 1 is dissipated to the second heat sink through the insert 16. For the special heat load of the micro + + # ”:: and the insert 16 use 120 watts and 30 Watt σ × 'can not show that about 40% of the heat of the microelectronic component 4 is discharged through the heat sink attached to the drag to significantly reduce the microelectronics. The second heat conduction path can increase the operating temperature of the pieces 4 and the inserts 16 so as to improve both. Wen Cheng. Although the above and the above are shown for the purpose of explanation, various examples of boned pea shells of the present invention are provided as examples. However, these specific embodiments and examples cannot be used as examples of the present invention. The exhaustive list of possible implementations should not be construed as limiting the invention. * ^ Those skilled in the art should understand that due to the benefits of the present invention, this ignorance has been implemented, and it has made many modifications and changes to the specific details of the present invention. n> Permanently, in order not to confuse the present invention, not all the specific details, familiar structures, components, and techniques of the familiar technology are described. However, the present invention is intended to cover a wide range of technologies, elements and well-known structures. Therefore, it is hoped that the invention is limited to Fan Tianshou, the scope of which is included in the patent. [Brief Description of the Drawings] A cross-sectional view of the system-microelectronic component and the heat sink shown in FIG. 1, which is connected to the substrate using a socket. The microelectronic component shown in FIG. 2 and the heat sink using the—insert mounted on—the substrate. FIG. 3 shows a microelectronic component and an insert mounted on a substrate having two heat sinks according to a specific embodiment of the present invention. The rm 84395 -12-591366 heat sink combination according to one embodiment of the present invention is shown in FIG. 4. FIG. 5 shows a third double-sided heat sink combination according to a specific embodiment of the present invention. [Explanation of Symbols of Drawings] 2 Configuration 4 Microelectronic components 6 Substrate 8 Socket 10 Microelectronic components 12 Heat sink 16 Insert 18 Second heat sink 20 Opening 22 Electrical connection 24 Copper-to-copper connection 26 Spring plate 28 Connecting rod 30 > 32 shreds 34 encapsulation material 36 surface area layer 38 core 13-84395