TW587763U - Improved structure of CPU heat-dissipation protection board - Google Patents

Improved structure of CPU heat-dissipation protection board

Info

Publication number
TW587763U
TW587763U TW90208147U TW90208147U TW587763U TW 587763 U TW587763 U TW 587763U TW 90208147 U TW90208147 U TW 90208147U TW 90208147 U TW90208147 U TW 90208147U TW 587763 U TW587763 U TW 587763U
Authority
TW
Taiwan
Prior art keywords
improved structure
protection board
cpu heat
dissipation protection
dissipation
Prior art date
Application number
TW90208147U
Other languages
Chinese (zh)
Inventor
Neng-Chau Jang
Original Assignee
Neng-Chau Jang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neng-Chau Jang filed Critical Neng-Chau Jang
Priority to TW90208147U priority Critical patent/TW587763U/en
Publication of TW587763U publication Critical patent/TW587763U/en

Links

TW90208147U 2001-05-18 2001-05-18 Improved structure of CPU heat-dissipation protection board TW587763U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90208147U TW587763U (en) 2001-05-18 2001-05-18 Improved structure of CPU heat-dissipation protection board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90208147U TW587763U (en) 2001-05-18 2001-05-18 Improved structure of CPU heat-dissipation protection board

Publications (1)

Publication Number Publication Date
TW587763U true TW587763U (en) 2004-05-11

Family

ID=34057415

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90208147U TW587763U (en) 2001-05-18 2001-05-18 Improved structure of CPU heat-dissipation protection board

Country Status (1)

Country Link
TW (1) TW587763U (en)

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees