TW585014B - Methods for depositing films comprising one or more metals or metal oxides with embedded nanoparticles and forming patterned films comprising the same - Google Patents

Methods for depositing films comprising one or more metals or metal oxides with embedded nanoparticles and forming patterned films comprising the same Download PDF

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Publication number
TW585014B
TW585014B TW090118636A TW90118636A TW585014B TW 585014 B TW585014 B TW 585014B TW 090118636 A TW090118636 A TW 090118636A TW 90118636 A TW90118636 A TW 90118636A TW 585014 B TW585014 B TW 585014B
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Taiwan
Prior art keywords
metal
substrate
precursor solution
film
item
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TW090118636A
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English (en)
Inventor
Ross H Hill
Juan Pablo Bravo-Vasquez
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Univ Fraser Simon
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G11/00—Compounds of cadmium
    • C01G11/02—Sulfides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/06—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1262—Process of deposition of the inorganic material involving particles, e.g. carbon nanotubes [CNT], flakes
    • C23C18/127—Preformed particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1283—Control of temperature, e.g. gradual temperature increase, modulation of temperature
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C23C18/145—Radiation by charged particles, e.g. electron beams or ion irradiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C8/02—Pretreatment of the material to be coated
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
    • H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
    • H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
    • H01L21/02194—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing more than one metal element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02345—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light
    • H01L21/02348—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light treatment by exposure to UV light
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/314—Inorganic layers
    • H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
    • H01L21/31695—Deposition of porous oxides or porous glassy oxides or oxide based porous glass
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam

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  • Chemical & Material Sciences (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
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  • Nanotechnology (AREA)
  • Chemically Coating (AREA)
  • Compounds Of Iron (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Formation Of Insulating Films (AREA)
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經濟部中央樣準局員工消費合作社印製 585014 A 7 ----------B7^__— 五、發明説明（2 ) 揭示於Pirzada等人之美國專利第5,85 1,507號中，在此提出 ’其中係使用連續製程，藉由在轉化-分叉膨脹喷嘴中蒸發 材料且使蒸發相驟冷，自不同類前驅物材料製造奈米粉末 °然而，’ 507專利並未揭示將前驅物材料轉化成具有埋入 之奈米顆粒材料之金屬或金屬氧化物薄膜之光解技術。而 且 ’ M. Cahay 等人之 Quantum Confinement:奈米材料、 裝置及系統，電化學s〇c Pr〇ceedings，97-1 i册，第35_ 46頁’ 1997(在此提出供參考）敘述熱溶膠基質中埋入之奈 米顆粒材料，但亦未揭示自前驅物薄膜沈積之轉化或圖 案化薄膜。 被動元件中使用奈米顆粒材料及奈米規格之顆粒發現有 利。例如，Yadav等人之美國專利第5,952,040號（在此提出 供參考）揭示用於形成被動電子元件陶瓷層之奈米尺寸粉末 。該陶瓷層含奈米規格之粉末，且沈積在電極間，形成電 極/陶瓷/電極構造。陶瓷層在低溫下烘乾，以避免奈米規格 粉末之内部擴散問題。然而，，〇4〇專利並未揭示將奈米規 格粉末直接分布在金屬或金屬氧化物薄膜中，，04Q專利亦 未揭示將前驅物材料轉化成金屬或金屬氧化物薄膜之光解 技術。 本發明爲~此等技術之延伸，且揭示一種將奈米顆粒材料 埋在各種微影應用之金屬或金屬氧化物薄膜中之方法。 發明概f 本發明係揭示一種將奈米顆粒材料沈積在薄膜中之方法 。咸奈米顆粒材料评分散在前驅物溶液中，將其沈積在某 (請先閲讀背面之注意事項再填寫本頁)
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585014 A7 B7 經濟部中央標準局員工消費合作社印裝 五、發明説明（3 ) 材上，且轉化成金屬或金屬氧化物 仏‘ 以以各種方法沈積在表面上。棘 辱腠了 卜一 轉化成金屬或金屬氧化物签 月吴可藉由光解或藉由離子或電子 / % 丁笊《擊達成。所得合凰七 金屬氧化物薄膜因此含埋入之奈米顆粒材料 _ 罩或直接之束，可使金屬或金屬氧化物薄膜形成圖案: 由改變形成圖案之氣體，可改變 " , 又所侍金屬或金屬氧化物薄 膜之組合物及/或性質。 寻 該薄膜可㈣各種應时，如擴散遮蔽、電容器 '導體 私阻、6秀導态、介電之電極或磁性材料。所得薄膜可爲 無定型或結晶，依應用爲準。奈米顆粒材料可以依特殊之 應用爲準由熟習本技藝者選擇。 败圖之簡要敘沭 圖1顯示一於錳（11)2-己酸乙酯膜之CdS顆粒潛影。 發明詳诫 本發明揭示一種合併前驅物溶液及奈米顆粒材料，接著 將其沈積在基材上，且光解形成圖案之方法。 埋入奈米顆粒材身之目的之一爲得到特殊材料中之區域 性差異。材料中埋入之奈米顆粒可具有許多實際之應用， 包含（但不限）用作擴散遮蔽、電容器、導體、電阻、謗導器 、介電之電..極及磁性材料。此等材料之另一種應用爲使用 奈米顆粒材料之光學性質製備光纖。類似之應用可使用光 學顯示應用之適當基質中之電化學奈米材料。另外，使用 在基質中電（或光）發光之奈米材料亦可提供此等材料組裝及 形成圖案之低溫路徑。 6- 本紙張尺度適用中國國家標準（CNS) A4規格（210><297公釐） --------衣-- (請先閲讀背面之注意事項再填寫本頁}
1T jo 丄叶 五 、發明説明f A7 B7 經濟部中央標準局員工消費合作社印製 t備奈米顆粒材料之材斜储 由〜， 材枓種類爻其應用之限制。例如， :早-顆粒組成之磁性材料可依此方法形安 記憶體應用中。該夺米果g r Θ π，用於 u τ、未顆缸材料一般爲稀土磁礦。夺米顆 材料或材料源可由熟及本技 ^ πh 擇。 仅π有A k的油特殊之應用選 中=元件如鐵電可充分的應用。此可爲 中所用之圖案。 * 口口 本：錢用具有奈米顆粒材料之金屬錯合物形成液晶薄 人〃可猎由各種万法轉化成金屬或金屬氧化物薄膜，包 3(但不限）Hill等人之美國專利第5,534,3 12號中所述之方法 ，在此提出供參考。 二般之薄膜可沈積在各種基材上。此等材料包含廣泛之 簡單風如caF2，至半導體表面如矽。製程之基材性質並 沒有限制，雖然其可能會影響前驅物薄膜之沈積方法(及若 使用之沈積用之溶劑）。最常用之基材爲發晶圓。晶圓可以 與其他層接觸，如介電層、綠或聚酿亞胺、金屬氧化物 4氧化物、導電材料、絕緣材料、鐵電#料、或其他電 子裝置構造中所用之材料。此等包含矽單晶晶圓。 前驅物薄膜可藉由各種方法沈積在表面上，其一爲自溶 劑旋轉塗佈分子。該程序中，前驅物及奈米顆粒材料均分 散在溶劑中，形成前驅物溶液。基士表面接著置於可旋轉 (表面上。基材可以以眞空夾固定，如市售旋轉塗佈器（亦 即4自Headway或Laurell公司）。將該前驅物在旋轉開始前 或基材旋轉之同時，分配在基材之表面上。在使基材旋轉 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁)
IT Μ5014 五、 經濟部中央橾準局員工消費合作社印製 發明説明（ ，使前驅物之薄膜沈積在基材上。 塗：:：:：以其他方法形成，包含(但不限)噴霧、浸潰 至及各種油墨法。 光解時，該薄膜經過化學反應，使金屬 入太*鹏上Λ丄 臂錯合物轉化成埋 π未顆粒材料之金屬或金屬氧化物。 赍、w + 田於孩万法可在低 皿U &或以下）下進行，因此可限制奈米Μ材料在基質中 足内郅擴散。在較高溫度下進行反應，會 丑 、 a 1更一材枓又間擴 一，而流失其奈米構造。控制製程之溫度可完全的達到中 間狀態。此爲該系統之優點，因爲藉由光化學轉化，可控 制形成基質之反應，而與熱之内部擴散無關。 通常薄膜可經由用於界定表面上影像之光罩直接曝曬在 光線下。光罩由透明及吸光區組成。光罩亦可包含光學提 昇特性如相轉移技術。以光線曝曬該薄膜會在薄膜間形= 化學反應，將薄膜自前驅物轉變成產物。此類轉化係與美 國專利第5,534,312號中之敛述一致。 光線並不需直接經過光罩。例如，若不需使材料形成圖 案，則可使用批示曝曬。另外，若需要圖'案，則可使用直 接架線法。一般之直接架線法中，係以連續方式將雷射 束直接照射到表面上，在雷射束直接曝曬之區域曝曬。 另外，附近領域之光學系統可使表面之部分區域選擇性 的曝曬。 ， 一般曝曬所用之氣體爲S氣。基於各種理由，較好改 變曝曬過程中存在之氣體組成。其一理由爲因爲使用备 因空氣而變稀之短波長光線’因此增加曝曬光線之傳輸 。其亦需要改變氣體之組成，以改變製品薄膜之組合物 -8- 本紙張尺度適用( CNS )八4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁)
585014 A7 B7 五、發明説明（6 ) 或性質。 曝曬亦可以離子或電子束達成。其一般係以連續架線法 達成。離子或電子束導到前驅物薄膜上，造成反應，在曝 B麗之區域上產生產物薄膜。離子及電子束之曝曬系統性質 係使得此等一般在眞空中進行。該方法之沈積依其條件可 爲曝曬於空氣中時形成氧化氧化物之金屬。 實例1 奈米規格之CdS點係藉由可逆之膠質法，接著以 Steigerwald等人所列之一般方法製備。一般之實驗中，等 體積之微乳液係在氮氣下，自CdCl〇4(〇.72毫升之〇·4 M水溶 液）及含雙（2-乙基己基）硫基丁二酸鈉、（AOT)(0.2 M)之庚境 (50毫升）製備，且Na2S(0.72毫升之〇·3 Μ水溶液）及含 (ΑΟΤ)(0·2 Μ)之庚烷（5〇毫升）結合务瓶中，且在氮氣下攪掉 2小時。接著減壓移除溶劑，且使產物再懸浮於石油酸中 。製備2-乙基己酸Μη(ΙΙ)之分離石油醚溶液，且合併該二 溶液。 將所得溶液旋轉塗佈在矽晶圓上，且曝曬於254 nm之光 線下，使2-乙基己酸Mn(II)轉化成氧化錳。將奈米顆粒材料 分散於氧化龜材料中。 藉由經過·光罩照射，可依該方法，形成形成圖案之薄膜。 圖1顯示由CdS顆粒在2-乙基己酸Mn(II)薄膜中形成潛在之 影像。 實例2 如jr例1類似之貫驗’藉由Dona及Herrero之改良方法製
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585014 A7 B7 五、發明説明（ 備微米規格之CdS顆粒。製備含硫代尿素（1〇毫莫耳）、乙酸 鈣（10毫莫耳）及乙二醇（0.4毫升）之150毫升氯化胺水溶液/氨 緩衝（pH 1 〇)溶液。將玻璃基材插入溶液中，且使該溶液在 8〇°C下加熱過夜。使溶液冷卻，且在自溶液移開之玻璃基 材上收集附著之Cds顆粒。將此等顆粒懸浮在石油醚中，且 與含2-乙基己酸“^⑴之石油醚溶液合併。將該溶液旋轉塗 佈在碎表面且光解，形成埋在薄氧化錳薄膜中之奈米顆粒 材料。 沾習本技藝者應了解上述之方法均可改變，但均不離本 發明之範圍。因此，本發明並不受特殊具體例或上面之詳 細敘述限制。 (請先閲讀背面之注意事項再填寫本頁} 衣 訂 經濟部中央標準局員工消费合作社印製 -10- 本紙張尺度適用中國國家標準（CNS ) Μ規格（210X297公釐） 4: 士期一 「 \ 案 號 -- ----1-Γ-~1--—-- / _ 090118636 別 以上各攔由本局填註 修正说7· 1^1 ^ ^ η η\薄充 Α4 C4 中文說明書替換頁(92年7月）585014 u專利説明書 名稱 發明 人 申請人 中 文 沈積包含一或多種具有埋入奈米顆粒材料之金屬或金屬氧化 物之薄膜之方法及用於形成含該金屬或金屬氧化物之圖案薄 膜之方法 英 文 姓 名 國 籍 住、居所 姓 名 (名稱） 國 籍 £表会
METHODS FOR DEPOSITING FILMS COMPRISING ONE OR MORE METALS OR METAL OXIDES WITH EMBEDDED NANOPARTICLES AND FORMING PATTERNED FILMS COMPRISING THE SAME 1·羅斯 H·希爾 ROSS H. HILL 2.瓊安帕布羅布瑞夫-瓦昆斯 JUAN PABLO BRAVO-VASQUEZ 1·加拿大 2.智利 1.加拿大英屬哥倫比亞省康啼蘭市哈特路294號 2·加拿大英屬哥倫比亞省布納比市柏那特路1037191號
加拿大塞門夫拉則河大學 SIMON FRASER UNIVERSITY 加拿大 加拿大英屬哥倫比亞省伯納畢市8888號 E·真特瑞斯克E. JEAN TRASK 本紙張尺度適用中國國^^7見格(21〇X297公菱) 裝 線 585014 第〇9〇l 18636號專利申請案 敗m 中文說明書替換頁(92年7月） Aj：： _ Bf7 五、發明説明（1 ) —~~一~— 月領域 本發明係關於自金屬錯合物或前驅物溶液沈積具有埋入 奈米顆粒材料之金屬或金屬氧化物薄膜之方法。本發明亦 關於該薄膜在各種用途（包含但不限微電子製造）中之應用。 iL關技藝之敘沭 通常無機材料薄膜係以化學或物理蒸氣沈積，但某些情 況下亦可使用溶膠或金屬有機物沈積。 然而，沒有任一種方法可使材料薄膜形成圖案，且因此 必須使用其他方法形成通常用於微電子設備及電路構造中 之圖案構造。 光化學沈積法與上述二方法不同之地方為驅除有機成分 之反應為光化學活化。混合方法通常使用光當作能源，但 使用光除光化學反應外亦會產生熱。
Hill等人之美國專利第5,534,3 12號中揭示一種使用光化 學沈積方式以沈積各種金屬及金屬氧化物系統之方法。該 万法係基於可建構前驅物材料之光學品質薄膜，以得到微 影製私·中之（顯微）光學均勻度。 形成不同材料之奈米顆粒在技藝中為已知。例如，
Bickmore等人之美國專利第5,984,997號（在此提出供參考成 由將包括混合期望之粉末組合物之所有成分之乳液及可燃 燃料，接著燃燒該乳液形成粉末。.，977專利方法揭示多類 粉末《製造，包含簡單、摻雜之顆粒及狹窄細絲，及多金 屬粉末。 應用前驅物材料形成具有埋人之奈米顆粒材料之材料係
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Claims (1)

  1. 申蹲專利範園 -—4一*沈積包含-或多種具有埋入4米顆粒材料、 金屬氧化物之薄膜之方法； 、 I龛Αί 、其中<奈米顆粒材料為沈積在基材表面上 之金屬配位前驅物溶液。 解轉化 2. Π請專利範園第1項之方法，其中該薄膜係光解形成圖 3· ^中請專利㈣第1项之方法，其中該薄膜係熱形成圖 4. ^種沈積包含—或多種具有埋人之奈米顆粒 或金屬氧化物之薄膜之方法，該方法包括： 、飞 將^米顆粒材科分配在金屬錯合物之前驅物溶液中； 將前驅物溶液沈積在基材上；及 將沈積在基材上之前驅物溶液光解轉化成具有埋入奈 、顆粒材料之金屬或金屬氧化物薄膜。 5·如申睛專利範圍第4項之方法，其中該分配在基材上之前 驅物溶液最後會在基材表面上形成薄膜。 6·如申叫專利範圍第4項之方法，其中該分配係以旋轉塗佈 進行。 如申，專利氣圍第4項之方法，其中該分配係以噴霧進 行。 8 ·如 、申叫專利範圍第4項之方法，其中該分配係以浸潰塗佈 進行。 申清專利‘範圍第4項之方法，其中該分配係以加油墨進
    1〇· :T=j範圍第4項之方法，其中以轉化步驟形成之金 ，至屬氧化物薄膜為形成圖案。 L tut利範圍第4項之方法，其中奈米顆粒材料與金屬 5 i屬乳化斗务間之絲可變發生轉化之溫度控 制。 如申#專利圍第4項之方法，其中該薄膜之組成或性質 係由於發生轉化之氣體組成而改變。 13· —種使包含一或多種具有埋入之奈米顆粒材料之金屬或 金屬氧化物薄膜形成圖案之方法，該方法包括： 將奈米顆粒材料分配在包括金屬錯合物之前驅物溶液 中； 將前驅物溶液分布在基材上；及 將沈積在基材上之前驅物溶液^化成具有埋入奈 米顆粒材料之金屬或金屬氧化物薄膜。 L 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐）
TW090118636A 2000-07-28 2001-07-31 Methods for depositing films comprising one or more metals or metal oxides with embedded nanoparticles and forming patterned films comprising the same TW585014B (en)

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