TW584926B - Integrated circuit test device - Google Patents

Abstract

The invention discloses an integrated circuit test device, which includes a flexible rubber and a fixing device. The flexible rubber includes plural conductive holes and an insulating area for isolating the plural conductive holes. The fixing device includes a pressing board and a fixing post. The fixing post is used to lock the pressing board on the flexible rubber, so that the pins of the integrated circuit are tightly and electrically connected to the conductive area. The flexible rubber of the inventive integrated circuit test device also includes an insulating area and plural conductive areas exposed out of the surface of the flexible rubber, and thus it is particularly suitable for small-profile packaged integrated circuit.

Description

V. Description of the invention (1) Field of the invention The present invention relates to a test device for integrated circuits, and more particularly to a test foot for integrated circuits. 1 Bright background The packaging method of Bai Zhi's planar, high-pin integrated circuit is mainly a rectangular planar package with different forms of pin structure. This packaging method can distribute the pins closely adjacent to the space on the four sides of the planar package. However, even if the distance between the pins is very small, the number of pins in this packaging method is still limited by the limited edge length of the planar package. In order to meet the demand of the south pin, the packaging method of the ball grid array is widely used. This method is to distribute the electronic contacts on the bottom of the entire package to overcome the limitation caused by insufficient space on the edges of the rectangular flat package. Compared with the rectangular planar packaging method, when the array is packaged with more contacts on a limited area, the space between the contacts can be larger. In addition, since the contacts of the packaging method of the ball grid array are solder balls, it is beneficial to be soldered to the test circuit board. Therefore, the packaging method of the ball array has become a common packaging method for high pin count chips. When testing the ball grid array integrated circuit or rectangular planar packaged integrated circuit, a foot socket is required to match its pin position. For example: Figure 丨 is a conventional ball grid array integrated circuit test feet 10-in-horizontal pattern (not shown in the figure ... the flat plate 16 to the right support hole 14 to make the ball grid array integrated circuit solder ball 22 is lowered into the through hole Η. Except for the force i, the plate 16 will be pushed back to the left by a spring (not shown in figure i), and the electronic pin 12 will lower the pressure of the solder ball 22 into H : \ Hu \ Hyg \ Liyi Technology \ 80937 \ 80937. (| 'S ^ This paper size is applicable to the TSS Home Standard (CNS) City grid (21GX297 public love) ------- 584926 5. Description of the invention (access The Φ, T of the hole 14 fixes the ball grid array integrated circuit. Secondly, this conventional integrated circuit test device has the following disadvantages: 1 As each solder ball of the ball grid array integrated circuit receives electronic pins The jacking universal is the same direction, and the other side of the solder ball is jacked against the edge of the through hole. If the jacking positions are not consistent, the entire ball grid array integrated circuit '^ fresh ball will be unevenly stressed, It is easy to cause the damage of the solder ball pin of the integrated circuit. 2 · Because the electronic pin is in pressing contact with the solder ball system, the pressing point is vulnerable to damage under long-term use. Expensive cost to buy new feet. 3 · For integrated circuits with different packaging methods or different specifications, you must spend 叩 S < cost and time, specially customize a foot to match the integrated circuit's feet As the conventional integrated circuit test device has the above-mentioned shortcomings and cannot meet the < requirements in the market, there is a need for further improvement. Brief description of the invention The main purpose of the present invention is to provide a solution to the lack of conventional technology. The integrated circuit testing device is particularly suitable for the testing of integrated circuit of surface-adhesive package type. ^ The present invention discloses an integrated circuit testing device including an elastic rubber and a fixing device. The elastic rubber includes a plurality of conductive holes. And an insulation area for isolating a plurality of conductive holes. The fixing device includes a pressure plate and a solid 'cut solid' post for locking the pressure plate to the elastic rubber to make the pins of the integrated circuit tight The ground is connected to this conductive area. H: \ Hu \ Hyg \ Leadtek Technology \ 8093 7 \ 80937.doc Silver scale is suitable for China's Secret Butterfly S Α4 size (21〇 × 297 Male f binding 584 926

Description of the invention (The elastic edge land rubber of the integrated circuit test device of the present invention may also include an insulating region and a plurality of conductive sub-electric regions exposed on the surface of the elastic rubber, which is particularly suitable for small-profile package-type integrated products. Compared with the conventional technology, the integrated circuit test device of the present invention has the following advantages because it uses an elastic rubber with a conductive region to electrically connect the pins of the integrated circuit and the circuit pad of the circuit board. Need to buy special feet, so the production cost can be reduced and no need to spend time to customize the feet. 2. Due to the elasticity of the elasticity, it can be applied to integrated circuits of different types and sizes, which has the advantage of diversification. 3.Since no soldering is required, it is easy to use and has the function of preventing the pins from being damaged. Simple description of the formula The present invention will be described in accordance with the following drawings, where ... Figure 1 is a conventional integrated circuit test device Schematic diagram; Figure 2 is a top view of the present invention applied to a ball grid array type integrated circuit; Figure 3 is a front view of the present invention applied to a ball grid array type integrated circuit; Figure 4 is the present invention Figure 3 is a perspective view of a ball grid array integrated circuit; Figure 5 is a top tSI diagram of the present invention applied to a small outline packaged integrated circuit; Figure 6 is a front view of the present invention applied to a small outline packaged integrated circuit; And Figure 7 is a partial enlarged view of Figure 6. 1 symbol description H: \ Hu \ Hyg \ Litai Technology \ 8〇937 \ 8〇937 (1〇 (; _ 7 copies. The Zhang scale is applicable to the T 圏 national standard ( CNS) A4 size (⑽297 mm) gutter

584926 A7 ----- _______B7 V. Invention ^ ~~-10 Ball grid array integrated circuit test device 12 Electronic pin 14 Through hole 16 Flat plate 22 Solder ball 40 '60 Integrated circuit test device 41' 61 Test circuit Plate 42 " 62 Integrated circuit 44 '64 Elastic rubber 46' 66 Pressure plate 48, 68 Spring 50 '70 Fixing post 51' 71 Fixing device 52 Solder ball 72 Pin 54 ~ 74 Insulation area 56 Conductive hole 58 '78 Circuit integration * 76 Description of the preferred embodiment of the conductive plutonium region. FIG. 2 is a top view of the integrated circuit test device of the present invention applied to a ball grid array integrated circuit, and FIG. 3 is a front view thereof. The integrated circuit test device 40 of the present invention includes a test circuit board 41, an elastic rubber 44 and a fixing device 51. The fixing device 51 includes a pressure plate 46, a fixing post 50, and a spring 48. The pressure plate 46 is elastically adjusted by the fixing post 50 and the spring 48 to lock the test circuit board 41. The pressure plate 4 6 presses a integrated circuit 4 2 to be tested against the elastic rubber 44. FIG. 4 is a perspective view of the integrated circuit test device of the present invention applied to a ball grid array integrated circuit. The elastic rubber 4 4 includes a plurality of cylindrical conductive holes 5 6 and an insulating region 5 4. Yu to isolate the plurality of conductive holes 5 6. When the pressure plate 4 6 presses the integrated circuit 4 2 to be tested against the elastic rubber 4 4, the solder ball 5 2 of the integrated circuit 42 is tightly and electrically connected to the conductive hole 56 of the elastic rubber 4 4. The corresponding circuit pad 5 8 of the test circuit board 4 1 is also H: \ Hu \ Hyg \ Litai Technology \ 80937 \ 80937. Such as <: -8-This paper size applies to China National Standard (CNS) A4 specifications ( 210X297 mm)

Pretend

k 584926

DESCRIPTION OF THE INVENTION A conductive, ground connection is connected to the conductive region 56. Since carbon powder or metal powder is added in the manufacturing process of rubber or plastic, the conductivity can be improved to become a conductive material. Therefore, the method for forming the elastic rubber 44 of the present invention can be formed in the process of manufacturing a rubber material. Carbon powder is added to a predetermined area of the conductive hole 56 to make the predetermined area a conductive material. To test the integrated circuit 42, first loosen the fixing device 5, and then slightly contact the pin 52 of the integrated circuit 42 with the conductive hole 56 of the elastic rubber 44. Then, the pressure plate 46 is locked to the test circuit board 41 by the fixing post 50, and the pressure plate 46 presses the integrated circuit 42 toward the elastic rubber 44 so that at least the solder ball 52 of the integrated circuit is tightly and electrically connected to the elasticity. The conductive hole 56 of the rubber 44 and the circuit pad 58 of the test circuit board 41 are also closely and electrically connected to the conductive hole 56 to form an electrical path. Due to the elasticity provided by the elastic rubber 44 and the spring 48 of the fixing device 51, the solder ball 52 of the integrated circuit is tightly and electrically connected to the conductive hole 56 with a specific pressure without subjecting the solder ball to " Damage can be avoided to prevent damage to the integrated circuit 42. FIG. 5 is a top view of the present invention applied to a small outline package (Smau) package type circuit, FIG. 6 is a front view thereof, and FIG. 6 is a part of FIG. 6 Enlarged view. As shown in FIGS. 5 and 6, the integrated circuit test device 60 of the present invention includes a test circuit board 61, two elastic rubber cymbals, and a fixing device 71. The fixing device 71 includes a pressure plate 66 and a fixing device. Column 70 and a spring 68. The fixing plate 70 locks the pressing plate 66 to the test circuit board 61, and the pressing plate 66 presses a integrated circuit 62 to be tested against the elastic rubber 64, so that the pin 72 of the integrated circuit 62 It is tightly and electrically connected to the conductive area 76, and the spring 6 8 is used to elastically adjust the pressure of the pressure plate 66. As shown in 7-hole garden 7, H: \ Hu \ Hyg \ 丽台 科技 \ 80937 \ 80937. (1 ( ^-0-This paper size applies to China National Standard (CNS) A4 (210X297 mm)

Binding

k 584926

The elastic rubber 64 includes a plurality of strip-shaped conductive regions 76 and a plurality of insulating regions 7 4, and the insulating regions 74 are isolated from the conductive regions 7 6, and the test circuit board 61 has a circuit pad 78. When testing the integrated circuit 62, first loosen the fixing device, and then place the integrated circuit 62 in the predetermined position of the elastic rubber 64 (that is, the pin 7 2 of the integrated circuit 62 can be used with the elastic rubber). 6 4 conductive area 7 6 contact), and then the pressure plate 66 is locked to the test circuit board 71 by the fixing post 70, and the pressure plate "presses the integrated circuit 62 to the elastic rubber 64, so that at least one of the integrated circuit pins 72 is tightly electrically connected to the conductive area 66 of the elastic rubber 64 (in this embodiment, the pin 72 is electrically connected to the three conductive areas 66, as shown in FIG. 7), and the circuit pad 78 of the circuit board 71 is tested It is also tightly electrically connected to the conductive area 66 to form an electrical path. Because of the elasticity provided by the elastic rubber and the spring of the fixing device, the pins of the integrated circuit are tightly and electrically connected to the conductive area with a specific pressure without the need for The pins are soldered to the test circuit board to avoid damage to the integrated circuit and the test device can be used repeatedly. In addition, due to the cut-off nature of the elastic rubber, it is only necessary to cut it after production, and it is no longer necessary Customized plastic mold can diversify product specifications, Significantly reduce production costs. Furthermore, when the present invention is used for research and development, it can allow developers to cut their products or integrated circuit parts to be tested with time and place, and cut them with scissors or blades, which can greatly improve their use. Convenient. Because it does not need to spend time and cost to customize the feet, it also reduces the time and cost of research and development. Compared with the conventional technology, the integrated circuit test device of the present invention has a conductive area Body circuit pins and test circuits

Binding

k H: \ Hu \ Hyg \ Litai Technology \ 80937 \ 80937. (1 (-10- 584926 A7-______ ^ B7__ 5. Description of the invention (7) The circuit pad of the board, therefore, has the following advantages: 1 Need to buy special feet, so the production cost is reduced, and no need to spend time to customize the feet. 2. Because of the elasticity of the elasticity, it can be applied to integrated circuits of different types and sizes, which has the advantages of diversification 3. Since it does not require welding, it is easy to use and has the function of avoiding pin damage. The technical content and technical features of the present invention are disclosed above, but those familiar with this technology may still be based on the teaching and disclosure of the present invention. Various substitutions and modifications do not depart from the spirit of the present invention. Therefore, the protection scope of the present invention should not be limited to those disclosed in the embodiments, but should include various substitutions and modifications that do not depart from the present invention, and are covered by the scope of the following patent applications. Covered. -11- H: \ Hu \ Hyg \ Leadtek \ 8〇93 7 \ 80937.doc This paper size is applicable to China National Standard (CNS) A4 (210X297 mm)

Claims (1)

Printed by M4926 A8 __ CB88 _ /, and patent application scope of the Intellectual Property Bureau of the Ministry of Economic Affairs of the People's Republic of China • A kind of integrated circuit test device, including: an elastic rubber containing a plurality of conductive holes and a plurality of conductive holes for isolation The insulating area of the hole; and a fixing device for fixing the integrated circuit on the elastic rubber so that the pins of the integrated circuit can be electrically connected to the conductive hole. 2 'As in the integrated circuit test device for item 丨 of the patent application scope, wherein the fixing device includes: a pressure plate; and a fixing post for locking the pressure plate to the elastic rubber to make the pins of the integrated circuit Tightly and electrically connected to the conductive hole. 3. The integrated circuit test device according to item 2 of the patent application range, wherein the fixing device further includes a spring for elastically adjusting the pressure of the pressure plate. 4. The integrated circuit test device according to item 1 of the patent application scope, wherein the integrated circuit is a ball grid array packaged integrated circuit. 5_ An integrated circuit test device, comprising: an elastic rubber including an insulating region and a plurality of conductive areas exposed on the surface of the elastic rubber; and a fixing device for fixing the integrated circuit to the elastic rubber, As a result, the pins of the integrated circuit can be electrically connected to the conductive region. 6 · The integrated circuit test device of item 5 of the patent application park, wherein the conductive area is a long strip. 7. The integrated circuit test device according to item 5 of the scope of patent application, wherein the integrated circuit is a small outline packaged integrated circuit. 8. If the integrated circuit test device for item 5 of the scope of the application for a patent, wherein the solid H: \ Hu \ Hyg \ Litai Technology \ 8937 \ 80937. CNb) A4 specification ⑽X 297 male Chu) ------- I I ----- 1 --------- order --------- (Please read the precautions on the back before (Fill in this page) 584926 A8 B8 C8 D8 6. The scope of patent application includes: a pressure plate; and a fixing post for locking the pressure plate to the elastic rubber, so that the pins of the integrated circuit are tightly electrically connected. Connected to the conductive region. 9. The integrated circuit test device according to item 8 of the patent application scope, wherein the fixing device further comprises a spring for elastically adjusting the pressure of the pressure plate. (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs H: \ Hu \ Hyg \ Litai Technology \ 80937 \ 80937. £ 10.00 This paper ruler is suitable for China Standard (CNS) A4 (210 X 297 mm)