TW579107U - Ball grid array connector - Google Patents
Ball grid array connectorInfo
- Publication number
- TW579107U TW579107U TW091215261U TW91215261U TW579107U TW 579107 U TW579107 U TW 579107U TW 091215261 U TW091215261 U TW 091215261U TW 91215261 U TW91215261 U TW 91215261U TW 579107 U TW579107 U TW 579107U
- Authority
- TW
- Taiwan
- Prior art keywords
- grid array
- ball grid
- array connector
- connector
- ball
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Connecting Device With Holders (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001307163A JP3708470B2 (ja) | 2001-10-03 | 2001-10-03 | ボールグリッドアレーコネクタ |
Publications (1)
Publication Number | Publication Date |
---|---|
TW579107U true TW579107U (en) | 2004-03-01 |
Family
ID=19126676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW091215261U TW579107U (en) | 2001-10-03 | 2002-09-26 | Ball grid array connector |
Country Status (5)
Country | Link |
---|---|
US (1) | US6743039B2 (zh) |
JP (1) | JP3708470B2 (zh) |
CN (1) | CN1311593C (zh) |
SG (1) | SG114573A1 (zh) |
TW (1) | TW579107U (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6900389B2 (en) * | 2003-01-10 | 2005-05-31 | Fci Americas Technology, Inc. | Cover for ball-grid array connector |
TW200512988A (en) * | 2003-09-19 | 2005-04-01 | Hon Hai Prec Ind Co Ltd | Electrical connector and method for manufacturing the same |
TWM275561U (en) * | 2004-11-26 | 2005-09-11 | Hon Hai Prec Ind Co Ltd | Electrical connector |
TWM273839U (en) * | 2004-12-03 | 2005-08-21 | Hon Hai Prec Ind Co Ltd | Electrical connector |
US7255601B2 (en) * | 2004-12-21 | 2007-08-14 | Fci Americas Technology, Inc. | Cap for an electrical connector |
CN1808792B (zh) * | 2005-01-18 | 2010-04-28 | 长盛科技股份有限公司 | 电连接器及具有电连接器的散热模块 |
JP2006216835A (ja) * | 2005-02-04 | 2006-08-17 | Tyco Electronics Amp Kk | 表面実装型電気部品 |
US7056140B1 (en) * | 2005-04-15 | 2006-06-06 | Starlink Electronics Corp. | Zero-insertion-force connector structure |
US20060291180A1 (en) * | 2005-06-23 | 2006-12-28 | Inventec Corporation | PCI mezzanine card |
CN102769007B (zh) * | 2012-08-10 | 2016-03-30 | 福建闽航电子有限公司 | 一种集成电路封装的焊盘结构 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5199884A (en) * | 1991-12-02 | 1993-04-06 | Amp Incorporated | Blind mating miniature connector |
US5855489A (en) * | 1997-05-12 | 1999-01-05 | The Whitaker Corporation | Low profile actuator for ZIF socket |
US6023029A (en) * | 1998-03-19 | 2000-02-08 | International Business Machines Corporation | Use of blind vias for soldered interconnections between substrates and printed wiring boards |
US6108212A (en) * | 1998-06-05 | 2000-08-22 | Motorola, Inc. | Surface-mount device package having an integral passive component |
JP2000022032A (ja) * | 1998-06-30 | 2000-01-21 | Pfu Ltd | 電子部品およびその実装方法 |
TW433633U (en) * | 1999-04-09 | 2001-05-01 | Hon Hai Prec Ind Co Ltd | Auxiliary installation device for electrical connector |
JP2000323599A (ja) * | 1999-05-13 | 2000-11-24 | Nec Corp | Lsiのパッケージ構造 |
JP3287464B2 (ja) * | 1999-06-15 | 2002-06-04 | タイコエレクトロニクスアンプ株式会社 | Zif型ソケット |
JP3668066B2 (ja) * | 1999-09-01 | 2005-07-06 | 富士通株式会社 | 半導体パッケージ用プリント配線板およびその製造方法 |
US6388199B1 (en) * | 2000-07-31 | 2002-05-14 | Micron Technology, Inc. | Selectively adjusting surface tension of soldermask material |
-
2001
- 2001-10-03 JP JP2001307163A patent/JP3708470B2/ja not_active Expired - Fee Related
-
2002
- 2002-09-20 SG SG200205723A patent/SG114573A1/en unknown
- 2002-09-26 TW TW091215261U patent/TW579107U/zh not_active IP Right Cessation
- 2002-09-27 US US10/256,650 patent/US6743039B2/en not_active Expired - Fee Related
- 2002-09-30 CN CNB021437858A patent/CN1311593C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1409448A (zh) | 2003-04-09 |
CN1311593C (zh) | 2007-04-18 |
JP3708470B2 (ja) | 2005-10-19 |
US20030068917A1 (en) | 2003-04-10 |
SG114573A1 (en) | 2005-09-28 |
US6743039B2 (en) | 2004-06-01 |
JP2003115334A (ja) | 2003-04-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |