TW577624U - Package structure of small-sized card - Google Patents

Package structure of small-sized card

Info

Publication number
TW577624U
TW577624U TW092204023U TW92204023U TW577624U TW 577624 U TW577624 U TW 577624U TW 092204023 U TW092204023 U TW 092204023U TW 92204023 U TW92204023 U TW 92204023U TW 577624 U TW577624 U TW 577624U
Authority
TW
Taiwan
Prior art keywords
small
package structure
sized card
sized
card
Prior art date
Application number
TW092204023U
Other languages
English (en)
Chinese (zh)
Inventor
Jiue-Hung Wang
Original Assignee
View Technology Co Ltd 3
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by View Technology Co Ltd 3 filed Critical View Technology Co Ltd 3
Priority to TW092204023U priority Critical patent/TW577624U/zh
Priority to KR20-2003-0018618U priority patent/KR200326618Y1/ko
Priority to US10/657,122 priority patent/US20040178277A1/en
Priority to JP2003271864U priority patent/JP3101070U/ja
Publication of TW577624U publication Critical patent/TW577624U/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • B29C45/14221—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure by tools, e.g. cutting means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
TW092204023U 2003-03-14 2003-03-14 Package structure of small-sized card TW577624U (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW092204023U TW577624U (en) 2003-03-14 2003-03-14 Package structure of small-sized card
KR20-2003-0018618U KR200326618Y1 (ko) 2003-03-14 2003-06-13 소형 카드의 패킹구조
US10/657,122 US20040178277A1 (en) 2003-03-14 2003-09-09 Automatic package process for a card and package for a small card
JP2003271864U JP3101070U (ja) 2003-03-14 2003-10-17 小型カードのパッケージ構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092204023U TW577624U (en) 2003-03-14 2003-03-14 Package structure of small-sized card

Publications (1)

Publication Number Publication Date
TW577624U true TW577624U (en) 2004-02-21

Family

ID=32848076

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092204023U TW577624U (en) 2003-03-14 2003-03-14 Package structure of small-sized card

Country Status (4)

Country Link
US (1) US20040178277A1 (ja)
JP (1) JP3101070U (ja)
KR (1) KR200326618Y1 (ja)
TW (1) TW577624U (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT503966B1 (de) * 2006-07-06 2009-07-15 Stanzbiegetechnik Gmbh Verfahren zur herstellung von umspritzten formteilen
FR2913808B1 (fr) * 2007-03-16 2009-04-24 Siemens Vdo Automotive Sas Procede d'entancheisation d'un capteur electronique de forme complexe par injection basse pression de resine reactive
US20110304554A1 (en) * 2010-06-10 2011-12-15 Research In Motion Limited Keypad stiffener and method of manufacture
CN104483332B (zh) * 2014-12-21 2017-03-15 广州明森科技股份有限公司 一种智能卡的烫印及字码检测装置和检测方法
CN109121287A (zh) * 2017-06-26 2019-01-01 马培中 一种用注塑制成的由塑料做绝缘载体的电路板
CN113021748B (zh) * 2021-03-08 2021-12-24 浙江能兴电气科技有限公司 一种智能电表壳体的成型装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4337571A (en) * 1979-04-06 1982-07-06 The United States Of America As Represented By The United States Department Of Energy Method for producing a fuel cell manifold seal
US5397857A (en) * 1993-07-15 1995-03-14 Dual Systems PCMCIA standard memory card frame
US6051781A (en) * 1997-09-24 2000-04-18 Autosplice, Inc. Surface mount electromagnetic frequency interference shield clip
US6166324A (en) * 1998-08-06 2000-12-26 Methode Electronics, Inc. PC card housing with insulative cover and ground feature
US6634561B1 (en) * 1999-06-24 2003-10-21 Sandisk Corporation Memory card electrical contact structure
US6269537B1 (en) * 1999-07-28 2001-08-07 Methode Electronics, Inc. Method of assembling a peripheral device printed circuit board package

Also Published As

Publication number Publication date
JP3101070U (ja) 2004-06-03
US20040178277A1 (en) 2004-09-16
KR200326618Y1 (ko) 2003-09-17

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees