TW575950B - Packaging structure and process thereof - Google Patents

Abstract

A packaging structure and a process thereof are disclosed. The packaging process utilizes two printed circuit boards to assemble quartz crystal oscillators and integrated circuit chips or printed circuits directly formed on one of the two printed circuit boards. One printed circuit board comprises two sides both having arrays of cell separately used to accommodate quartz crystal oscillators and IC chips or printed circuits. The other printed circuit board having array of holes assembles with the side used to accommodate IC chips or printed circuits of the printed circuit board. By filling the holes with a dielectric material, the IC chips or printed circuits on the cells are encapsulated.

Description

575950 V. Description of the invention (1) 5-1 Field of the invention: The present invention relates to a component packaging structure and a manufacturing process thereof, particularly a packaging structure and a manufacturing process of a crystal oscillator. 5-2 Background of the Invention: The frequency control element includes various crystal oscillators. Typical crystal oscillators include components such as piezoelectric elements, integrated circuits, capacitors, inductors, and resistors. Frequency control components are commonly found in many electronic communication devices, such as mobile phones, pagers, radios and wireless data transmission devices. Since these electronic communication devices must be continuously reduced in size and cost in response to consumer demand, the process of crystal-controlled crystal oscillators must be simplified to reduce costs. The packaging process of the crystal oscillator occupies a considerable part of the manufacturing cost. The packaging process of a crystal oscillator generally consumes more material and labor costs than the packaging process of an integrated circuit chip. The packaging process of traditional crystal oscillator components is generally ceramic packaging. The first diagram A shows the ceramic package structure of a conventional crystal oscillator. The first diagram B shows a cross-sectional view of the ceramic package structure in the first diagram A. The ceramic package structure includes ceramic substrates 102 and 104. The ceramic substrate 102 contains a crystal oscillator 108 and the ceramic substrates 102 and 104 contain a integrated circuit chip 110. This ceramic package structure is completed by combining ceramic substrates 102 and 104, and by connecting test points 106 to one test

Page 5 575950 5. Description of the Invention (2) Device for testing. Figure A shows another traditional ceramic package structure. The second diagram B shows a cross-sectional view of the ceramic package structure in the second diagram A. The ceramic package structure includes a ceramic substrate 202, which contains a crystal oscillator 202 and an integrated circuit chip 208 in two grooves, respectively. The ceramic package structure is also tested by connecting the test point 204 to a test device. Although the above two types of ceramic packaging structures have good yields, the manufacturing process is complicated and the production cost is high, especially the ceramic packaging materials are more expensive. In addition, the test of the above two ceramic package structures is too time-consuming and leads to higher test costs. This is because the tests must be performed after the packaging is completed, and they must be performed one by one. In view of the shortcomings of the above-mentioned traditional packaging structures and processes, it is necessary to develop a novel and progressive structure and process to overcome the shortcomings of the traditional structure and process. The present invention is able to meet such needs. 5-3 Object and Summary of the Invention: One object of the present invention is to provide a crystal oscillator package structure with high yield and low production cost and its manufacturing process. It is an object of the present invention to provide a crystal oscillator package structure with simplified manufacturing process and test steps and a manufacturing process thereof. An object of the present invention is to provide a water with easy design and low material cost.

575950 V. Description of the invention (3) Crystal oscillator package structure and manufacturing process. In order to achieve the above object, the present invention provides a component packaging structure including a first printed circuit board layer having a first surface and a second surface, a first component fixed on the first surface, A second component fixed on the second surface, a second printed circuit board layer having an opening, and a dielectric material filling the opening. The second printed circuit board layer is combined with the second surface of the first printed circuit board layer, wherein the opening is aligned and exposes the second component. The present invention also provides a method for forming a component packaging structure. The method for forming a component packaging structure includes the following steps. First, a plurality of first components are fixed into a first cell array on a first side of a first printed circuit board. A second unit cell array is fixed on the second surface of the first printed circuit board. The second side of the first printed circuit board is then combined with a second printed circuit board having an array of openings, wherein the array of openings is aligned and exposes the second array of elements. Then, the opening array is filled with a dielectric material, and the first element array and the second element array that have been combined are tested. Finally, the first printed circuit board and the second printed circuit board are cut to separate the first element array and the second element array that have been combined to form a single completed combination of the first element and the second element. element. The above brief description of the invention and the following detailed description are examples only

Page 7 575950 V. Description of the Invention (4) ^ ~ _________ is not a limitation. Others do not depart from the patents of the present invention that should be included; God's equivalent changes or modifications are 5-4 Detailed description of the invention: What must be explained here is that it contains the complete process. The present invention only mentions that the process steps and structures described below are not required to solve the present invention and can be implemented by various process technologies. The process technologies herein. In the following, the present invention is shown in a simple form and is not conducive to understanding the present invention. The attached diagrams are used for detailed explanation. Please note that the diagrams are drawn according to scale, and the dimensions are exaggerated ^

Referring to the third A picture, .turn — ^ ^ A road board 3. 〇Contains a "circuit board 3 °". The printed surface of the printed solar cell (C e 1 1) array q η 9 you q η / 1. The printed circuit board 3 0 0 can be -like printed Circuit board. Section: Ba; M. The surface 300 of the printed circuit board 300, and the first m @, the first one is shown in Figure B. Each cell m has four conductors. Human, 1 solid v body contact 3 1 0. The unit cell 3 0 5 is used for

Gouna. θ7. The oscillating element 5 0 0 ′ The dagger element 5 0 0 includes four conductor contacts 5 0 2. When the component 500 is combined with the unit cell 305 of the printed circuit board 300, each conductor contact 502 is aligned with the corresponding conductor contact 31 and is connected to the conductor contact 3 1 0. The third D figure shows the detailed structure of the unit cell 3 06 of the printed circuit board 3 0 2. The unit cell 3 0 6 also has four conductor contacts 3 11. Unit cell 3 0 6

Page 8 575950 V. Description of the invention (5) is used to accommodate 7L pieces, such as an integrated circuit chip 3 丨 2, an inductor 3 1 4, a capacitor 3 1 6 and a diode 3 丨 8. The unit cell 306 can also be used to hold a printed circuit formed thereon. In addition to the integrated circuit chip 3 丨 2, the inductive state 3 1 4, the capacitor 3 1 6 and the diode 3 1 8 and the printed circuit formed directly thereon, the test point 3 2 0 can also be formed directly on the printed circuit board. The circuit board 300 is on the surface 300, so as to connect all the unit cells 300 to the test equipment. When the package is complete, the test can be performed before cutting and separating. The test point 3 2 0 connects all cells 3 06 and the test equipment. Referring to FIG. 4A, a printed circuit board 4 is shown. This printed circuit board 400 includes an array of openings 402. Figures 4b and 4C show the fine structure and top view of the opening 402, respectively. There are four conductors 桎 4 0 4 next to each opening 402. When the printed circuit board 400 is combined with the printed circuit board 300, the conductors 404 are aligned with the corresponding conductor contacts 3 丨 丨 and connected to the conductor contacts 3 丨 丨. In a preferred embodiment of the present invention, the outline of the opening 4 02 is a cross shape with smooth arc-like corners. The contour of the opening 4 2 can accommodate and prevent the problem of overflow during filling. Referring to the fifth figure, the result of the combination of the printed circuit board 400 with the printed circuit board 300 and opening 402 is shown. The surface 300 of the printed circuit board 300 is connected to the printed circuit board 400, and the cell 3 06 is aligned with the corresponding opening 4 02. The integrated circuit chip 3 1 2, the inductor 3 1 4, the capacitor 3 1 6 and the diode 3 1 8 and the printed circuit formed directly on the unit cell 3 06 are sealed in the opening 4 2 after being glued. The printed circuit board 4 0 0 and the printed circuit board 3 0 0 may also include

Page 9 575950 V. Description of the invention (6) A plurality of pins are used to connect the sockets of the test equipment. The plurality of pins are connected to the test points 3 2 0 around the unit cell 3 0 6, so that all the elements on the unit cell 3 0 6 include the integrated circuit chip 3 1 2, the inductor 3 1 4, the capacitor 3 1 6 and the diode. 3 1 8 and the printed circuit can be tested by the test equipment at the same time before the packaging is completed and the cutting is separated. The present invention utilizes a printed circuit board to combine a crystal oscillator and an integrated circuit chip with a printed circuit formed directly on the printed circuit board. By using printed circuit boards instead of expensive ceramic packaging materials, the cost of packaging materials can be reduced. In addition, because the packaged components are tested by the test equipment at the same time before the packaging is completed and cut and separated, the testing process can be simplified and the cost can be reduced. . The above detailed description of the invention is merely an example and not a limitation. Other equivalent changes or modifications that do not depart from the spirit of the invention should be included in the patent scope of the invention.

Page 575950 Brief description of the drawings In order to make the other objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is described below in conjunction with the accompanying drawings, and described in detail below: Figure A shows a ceramic package structure of a conventional crystal oscillator; Figure B shows a cross-sectional view of the ceramic package structure in Figure A; Figure A shows another traditional ceramic package structure; Figure B shows A cross-sectional view of the ceramic package structure in the second diagram A; the third diagram A shows one side of a printed circuit board of the present invention; the third diagram B shows the other side of the printed circuit board; the third diagram C shows one side of the printed circuit board Detailed structure of the unit cell; Figure 3D shows the detailed structure of the unit cell on the other side of the printed circuit board

Figure 4A shows another printed circuit board of the present invention; Figure 4B shows the detailed structure of the opening;

Page 575950 The diagram briefly illustrates the top view of the fourth C diagram showing the opening; and the fifth diagram shows the representative symbols of the main part of the result of the bonding and pouring of two printed circuit boards 1 0 2 ceramic substrate 1 0 4 ceramic substrate 1 0 8 Crystal oscillator 1 1 0 Integrated circuit chip 2 0 2 Ceramic substrate 2 0 4 Test points 2 0 6 Crystal oscillator 2 0 8 Integrated circuit chip 3 0 0 Printed circuit board 3 0 2 surface m 3 0 4 surface 3 0 5 unit cell 3 0 6 unit cell 3 10 conductor contact 31 1 conductor contact 3 1 2 integrated circuit chip 3 1 4 inductor 31 6 capacitor

Page 12 575950 Simple illustration of the diagram 3 1 8 Diode 3 2 0 Test points 4 0 0 Printed circuit board 4 0 2 Opening 4 0 4 Conductor post 5 0 0 Component 5 0 2 Conductor contact

Page 13

Claims (1)

575950 VI. Scope of patent application 1. A component packaging structure comprising: a first printed circuit board layer, the first printed circuit board layer having a first surface and a second surface; A first element on one side; a second element fixed on the second side; a second printed circuit board layer having an opening; the second printed circuit board layer and the first printed circuit board layer; Two-sided bonding, wherein the opening is aligned and exposed to the second element; and a dielectric material filling the opening. 2. The component packaging structure described in item 1 of the scope of patent application, wherein the first component described above includes a crystal oscillator. 3. The component packaging structure according to item 1 of the scope of patent application, wherein the second component described above includes an integrated circuit chip and a printed circuit. 4. The component packaging structure described in item 1 of the scope of patent application, wherein the second component described above includes an inductor, a capacitor, and a diode. 5. The component packaging structure according to item 1 of the scope of patent application, wherein the outline of the opening is a cross shape with smooth arc-shaped corners. 6. —A component packaging structure comprising: a first printed circuit board, the first printed circuit board layer having a first Page 14 575950 6. The scope of the patent application and a second side, the first side and the second side respectively have a unit cell array and a plurality of first elements of the unit cell array fixed on the first side; A second element of the cell array fixed on the second side; a second printed circuit board layer having an array of openings, the second printed circuit board layer and the second printed circuit board layer of the second Surface bonding, wherein the opening array is aligned and exposes the second element array; a test circuit printed on the first printed circuit board, the test circuit is connected to all the second elements; and a filling the opening array Dielectric materials. 7. The component packaging structure described in item 6 of the scope of patent application, wherein the first component described above includes a crystal oscillator. 8. The component packaging structure according to item 6 of the scope of the patent application, wherein the second component described above includes an integrated circuit chip, an inductor, a capacitor, and a diode. 9. The component packaging structure according to item 6 of the scope of patent application, wherein the second component described above includes a printed circuit. 1 0. A method for forming a component packaging structure, the method for forming a component packaging structure includes: fixing a plurality of first components into a first printed circuit board; Page 15 575950 VI. A first unit cell array on the patent application side; a second unit cell array on which a plurality of second elements are fixed on a second side of the first printed circuit board; combined with the first printing The second side of the circuit board and a second printed circuit board having an opening array, wherein the opening array is aligned and exposes the second element array; filling the opening array with a dielectric material; testing has completed the bonding The first element array and the second element array; and cutting the first printed circuit board and the second printed circuit board to separate the first element array and the second element array that have been combined to form a single unit. The combination of the first element and the second element has been completed. 11. The method for forming a device package structure as described in item 10 of the scope of patent application, wherein the first component array and the second component array that have been combined as described above are connected to be printed on the first printed circuit. The test circuit on the board goes to a test device for testing.