TW574335B - Curable hybrid electron donor compounds containing vinyl ether - Google Patents
Curable hybrid electron donor compounds containing vinyl ether Download PDFInfo
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- TW574335B TW574335B TW90112029A TW90112029A TW574335B TW 574335 B TW574335 B TW 574335B TW 90112029 A TW90112029 A TW 90112029A TW 90112029 A TW90112029 A TW 90112029A TW 574335 B TW574335 B TW 574335B
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- 150000001875 compounds Chemical class 0.000 title claims abstract description 50
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 title abstract description 15
- 239000000853 adhesive Substances 0.000 claims abstract description 21
- 230000001070 adhesive effect Effects 0.000 claims abstract description 21
- 125000003118 aryl group Chemical group 0.000 claims abstract description 17
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 8
- 239000000203 mixture Substances 0.000 claims description 30
- 238000011049 filling Methods 0.000 claims description 26
- -1 polysiloxane Polymers 0.000 claims description 20
- 125000004432 carbon atom Chemical group C* 0.000 claims description 16
- 125000000217 alkyl group Chemical group 0.000 claims description 13
- 230000002079 cooperative effect Effects 0.000 claims description 13
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 12
- 239000001257 hydrogen Substances 0.000 claims description 12
- 229910052739 hydrogen Inorganic materials 0.000 claims description 12
- 229920001296 polysiloxane Polymers 0.000 claims description 11
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 7
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical class [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 125000001072 heteroaryl group Chemical group 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- 239000011231 conductive filler Substances 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 5
- 150000002431 hydrogen Chemical class 0.000 claims description 5
- 229920000728 polyester Polymers 0.000 claims description 5
- 229920000570 polyether Polymers 0.000 claims description 5
- 229920002635 polyurethane Polymers 0.000 claims description 5
- 239000004814 polyurethane Substances 0.000 claims description 5
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Natural products OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 claims description 4
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 4
- 125000005842 heteroatom Chemical group 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 3
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 2
- 229910052717 sulfur Inorganic materials 0.000 claims description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 2
- 239000011976 maleic acid Substances 0.000 claims 2
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- 125000006615 aromatic heterocyclic group Chemical group 0.000 claims 1
- 239000001530 fumaric acid Substances 0.000 claims 1
- 150000002466 imines Chemical class 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 24
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 20
- 238000006243 chemical reaction Methods 0.000 description 19
- 239000000243 solution Substances 0.000 description 12
- 125000000524 functional group Chemical group 0.000 description 11
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 10
- 229910052757 nitrogen Inorganic materials 0.000 description 10
- 238000001723 curing Methods 0.000 description 9
- 239000002904 solvent Substances 0.000 description 8
- 239000007858 starting material Substances 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 125000003396 thiol group Chemical class [H]S* 0.000 description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 150000001412 amines Chemical class 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 239000012044 organic layer Substances 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 5
- 235000019341 magnesium sulphate Nutrition 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- TVWTZAGVNBPXHU-FOCLMDBBSA-N dioctyl (e)-but-2-enedioate Chemical compound CCCCCCCCOC(=O)\C=C\C(=O)OCCCCCCCC TVWTZAGVNBPXHU-FOCLMDBBSA-N 0.000 description 4
- 239000012153 distilled water Substances 0.000 description 4
- 235000019441 ethanol Nutrition 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- 239000012948 isocyanate Substances 0.000 description 4
- 150000002513 isocyanates Chemical class 0.000 description 4
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 3
- JPVNTYZOJCDQBK-UHFFFAOYSA-N 3-ethenoxypropan-1-amine Chemical compound NCCCOC=C JPVNTYZOJCDQBK-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000003085 diluting agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920003192 poly(bis maleimide) Polymers 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 2
- OOCCDEMITAIZTP-QPJJXVBHSA-N (E)-cinnamyl alcohol Chemical compound OC\C=C\C1=CC=CC=C1 OOCCDEMITAIZTP-QPJJXVBHSA-N 0.000 description 2
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 2
- HMBNQNDUEFFFNZ-UHFFFAOYSA-N 4-ethenoxybutan-1-ol Chemical compound OCCCCOC=C HMBNQNDUEFFFNZ-UHFFFAOYSA-N 0.000 description 2
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- BJIOGJUNALELMI-ONEGZZNKSA-N Isoeugenol Natural products COC1=CC(\C=C\C)=CC=C1O BJIOGJUNALELMI-ONEGZZNKSA-N 0.000 description 2
- OYHQOLUKZRVURQ-HZJYTTRNSA-N Linoleic acid Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(O)=O OYHQOLUKZRVURQ-HZJYTTRNSA-N 0.000 description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000005642 Oleic acid Substances 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- BJIOGJUNALELMI-ARJAWSKDSA-N cis-isoeugenol Chemical compound COC1=CC(\C=C/C)=CC=C1O BJIOGJUNALELMI-ARJAWSKDSA-N 0.000 description 2
- 238000004440 column chromatography Methods 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000012043 crude product Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- JBSLOWBPDRZSMB-FPLPWBNLSA-N dibutyl (z)-but-2-enedioate Chemical compound CCCCOC(=O)\C=C/C(=O)OCCCC JBSLOWBPDRZSMB-FPLPWBNLSA-N 0.000 description 2
- 239000012975 dibutyltin dilaurate Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 2
- 125000005647 linker group Chemical group 0.000 description 2
- OYHQOLUKZRVURQ-IXWMQOLASA-N linoleic acid Natural products CCCCC\C=C/C\C=C\CCCCCCCC(O)=O OYHQOLUKZRVURQ-IXWMQOLASA-N 0.000 description 2
- 235000020778 linoleic acid Nutrition 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000909 polytetrahydrofuran Polymers 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- BJIOGJUNALELMI-UHFFFAOYSA-N trans-isoeugenol Natural products COC1=CC(C=CC)=CC=C1O BJIOGJUNALELMI-UHFFFAOYSA-N 0.000 description 2
- MIZLGWKEZAPEFJ-UHFFFAOYSA-N 1,1,2-trifluoroethene Chemical group FC=C(F)F MIZLGWKEZAPEFJ-UHFFFAOYSA-N 0.000 description 1
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- ZVEMLYIXBCTVOF-UHFFFAOYSA-N 1-(2-isocyanatopropan-2-yl)-3-prop-1-en-2-ylbenzene Chemical compound CC(=C)C1=CC=CC(C(C)(C)N=C=O)=C1 ZVEMLYIXBCTVOF-UHFFFAOYSA-N 0.000 description 1
- ZOZNCAMOIPYYIK-UHFFFAOYSA-N 1-aminoethylideneazanium;acetate Chemical compound CC(N)=N.CC(O)=O ZOZNCAMOIPYYIK-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- VBZBISQOWJYWCC-UHFFFAOYSA-N 2-(2-carboxypropan-2-yldiazenyl)-2-methylpropanoic acid Chemical compound OC(=O)C(C)(C)N=NC(C)(C)C(O)=O VBZBISQOWJYWCC-UHFFFAOYSA-N 0.000 description 1
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- LRWZZZWJMFNZIK-UHFFFAOYSA-N 2-chloro-3-methyloxirane Chemical compound CC1OC1Cl LRWZZZWJMFNZIK-UHFFFAOYSA-N 0.000 description 1
- ZPSNFVVCGMSWID-UHFFFAOYSA-N 2-isocyanatopropan-2-ylbenzene Chemical compound O=C=NC(C)(C)C1=CC=CC=C1 ZPSNFVVCGMSWID-UHFFFAOYSA-N 0.000 description 1
- VJJZJBUCDWKPLC-UHFFFAOYSA-N 3-methoxyapigenin Chemical compound O1C2=CC(O)=CC(O)=C2C(=O)C(OC)=C1C1=CC=C(O)C=C1 VJJZJBUCDWKPLC-UHFFFAOYSA-N 0.000 description 1
- QXLCHCXKWFFWEB-UHFFFAOYSA-N CCCCCCCCCCCC(O)=O.CCCCCCCCCCCC(O)=O.CCCCCCCCCCCC(O)=O.N Chemical compound CCCCCCCCCCCC(O)=O.CCCCCCCCCCCC(O)=O.CCCCCCCCCCCC(O)=O.N QXLCHCXKWFFWEB-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- 241000723347 Cinnamomum Species 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
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- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- IWTYTFSSTWXZFU-QPJJXVBHSA-N [(e)-3-chloroprop-1-enyl]benzene Chemical compound ClC\C=C\C1=CC=CC=C1 IWTYTFSSTWXZFU-QPJJXVBHSA-N 0.000 description 1
- MOOIXEMFUKBQLJ-UHFFFAOYSA-N [1-(ethenoxymethyl)cyclohexyl]methanol Chemical compound C=COCC1(CO)CCCCC1 MOOIXEMFUKBQLJ-UHFFFAOYSA-N 0.000 description 1
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- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
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- 125000003545 alkoxy group Chemical group 0.000 description 1
- OOCCDEMITAIZTP-UHFFFAOYSA-N allylic benzylic alcohol Natural products OCC=CC1=CC=CC=C1 OOCCDEMITAIZTP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001409 amidines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- BIGPRXCJEDHCLP-UHFFFAOYSA-N ammonium bisulfate Chemical compound [NH4+].OS([O-])(=O)=O BIGPRXCJEDHCLP-UHFFFAOYSA-N 0.000 description 1
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- 230000000712 assembly Effects 0.000 description 1
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- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000012267 brine Substances 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- KVNRLNFWIYMESJ-UHFFFAOYSA-N butyronitrile Chemical compound CCCC#N KVNRLNFWIYMESJ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
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- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
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- JCCNYMKQOSZNPW-UHFFFAOYSA-N loratadine Chemical compound C1CN(C(=O)OCC)CCC1=C1C2=NC=CC=C2CCC2=CC(Cl)=CC=C21 JCCNYMKQOSZNPW-UHFFFAOYSA-N 0.000 description 1
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- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
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- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
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- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
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- 230000008569 process Effects 0.000 description 1
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- BOLDJAUMGUJJKM-LSDHHAIUSA-N renifolin D Natural products CC(=C)[C@@H]1Cc2c(O)c(O)ccc2[C@H]1CC(=O)c3ccc(O)cc3O BOLDJAUMGUJJKM-LSDHHAIUSA-N 0.000 description 1
- 150000003282 rhenium compounds Chemical class 0.000 description 1
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- 238000010008 shearing Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
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- 125000004149 thio group Chemical group *S* 0.000 description 1
- 229940098465 tincture Drugs 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000005829 trimerization reaction Methods 0.000 description 1
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Classifications
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- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C333/00—Derivatives of thiocarbamic acids, i.e. compounds containing any of the groups, the nitrogen atom not being part of nitro or nitroso groups
- C07C333/02—Monothiocarbamic acids; Derivatives thereof
- C07C333/04—Monothiocarbamic acids; Derivatives thereof having nitrogen atoms of thiocarbamic groups bound to hydrogen atoms or to acyclic carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F15/00—Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic Table
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C217/00—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton
- C07C217/02—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton
- C07C217/04—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated
- C07C217/06—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated having only one etherified hydroxy group and one amino group bound to the carbon skeleton, which is not further substituted
- C07C217/08—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated having only one etherified hydroxy group and one amino group bound to the carbon skeleton, which is not further substituted the oxygen atom of the etherified hydroxy group being further bound to an acyclic carbon atom
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C271/00—Derivatives of carbamic acids, i.e. compounds containing any of the groups, the nitrogen atom not being part of nitro or nitroso groups
- C07C271/06—Esters of carbamic acids
- C07C271/08—Esters of carbamic acids having oxygen atoms of carbamate groups bound to acyclic carbon atoms
- C07C271/10—Esters of carbamic acids having oxygen atoms of carbamate groups bound to acyclic carbon atoms with the nitrogen atoms of the carbamate groups bound to hydrogen atoms or to acyclic carbon atoms
- C07C271/12—Esters of carbamic acids having oxygen atoms of carbamate groups bound to acyclic carbon atoms with the nitrogen atoms of the carbamate groups bound to hydrogen atoms or to acyclic carbon atoms to hydrogen atoms or to carbon atoms of unsubstituted hydrocarbon radicals
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C275/00—Derivatives of urea, i.e. compounds containing any of the groups, the nitrogen atoms not being part of nitro or nitroso groups
- C07C275/04—Derivatives of urea, i.e. compounds containing any of the groups, the nitrogen atoms not being part of nitro or nitroso groups having nitrogen atoms of urea groups bound to acyclic carbon atoms
- C07C275/20—Derivatives of urea, i.e. compounds containing any of the groups, the nitrogen atoms not being part of nitro or nitroso groups having nitrogen atoms of urea groups bound to acyclic carbon atoms of an unsaturated carbon skeleton
- C07C275/24—Derivatives of urea, i.e. compounds containing any of the groups, the nitrogen atoms not being part of nitro or nitroso groups having nitrogen atoms of urea groups bound to acyclic carbon atoms of an unsaturated carbon skeleton containing six-membered aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C309/00—Sulfonic acids; Halides, esters, or anhydrides thereof
- C07C309/63—Esters of sulfonic acids
- C07C309/72—Esters of sulfonic acids having sulfur atoms of esterified sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton
- C07C309/73—Esters of sulfonic acids having sulfur atoms of esterified sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton to carbon atoms of non-condensed six-membered aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C323/00—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups
- C07C323/10—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and singly-bound oxygen atoms bound to the same carbon skeleton
- C07C323/11—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and singly-bound oxygen atoms bound to the same carbon skeleton having the sulfur atoms of the thio groups bound to acyclic carbon atoms of the carbon skeleton
- C07C323/12—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and singly-bound oxygen atoms bound to the same carbon skeleton having the sulfur atoms of the thio groups bound to acyclic carbon atoms of the carbon skeleton the carbon skeleton being acyclic and saturated
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C43/00—Ethers; Compounds having groups, groups or groups
- C07C43/02—Ethers
- C07C43/03—Ethers having all ether-oxygen atoms bound to acyclic carbon atoms
- C07C43/14—Unsaturated ethers
- C07C43/164—Unsaturated ethers containing six-membered aromatic rings
- C07C43/166—Unsaturated ethers containing six-membered aromatic rings having unsaturation outside the aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C43/00—Ethers; Compounds having groups, groups or groups
- C07C43/02—Ethers
- C07C43/20—Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring
- C07C43/23—Ethers having an ether-oxygen atom bound to a carbon atom of a six-membered aromatic ring containing hydroxy or O-metal groups
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/612—Esters of carboxylic acids having a carboxyl group bound to an acyclic carbon atom and having a six-membered aromatic ring in the acid moiety
- C07C69/618—Esters of carboxylic acids having a carboxyl group bound to an acyclic carbon atom and having a six-membered aromatic ring in the acid moiety having unsaturation outside the six-membered aromatic ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/6715—Unsaturated monofunctional alcohols or amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/81—Unsaturated isocyanates or isothiocyanates
- C08G18/8108—Unsaturated isocyanates or isothiocyanates having only one isocyanate or isothiocyanate group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2601/00—Systems containing only non-condensed rings
- C07C2601/12—Systems containing only non-condensed rings with a six-membered ring
- C07C2601/14—The ring being saturated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12033—Gunn diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Die Bonding (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Description
574335 A7 B7 五、發明說明(” (請先閱讀背面之注意事項再填寫本頁) 本發明有關各種含有一乙烯醚基團之電子供體化合物 ,以及含有該等電子供體化合物之可固化黏著劑組合物0 黏著劑組合物,尤其傳導性黏著劑,係在半導體封裝 及微電子元件之製作及組裝中用於各種目的〇較突顯之用 法爲將積體電路晶片黏合於引線框或其他基質,及將電路 封裝或總成黏合於印刷線路板〇 現存有供用於低模數黏著劑尤其.用於晶片黏附應用之 迅速固化黏著劑之電子受體/供體黏著劑,其中乙烯醚爲 電子供體〇然而,作爲供體之合宜乙烯醚數目因其等之低 沸點、高揮發性、及製備困難而受到限制〇因此?有需要 開發適用於黏著劑應用之新穎電子供體〇 經濟部智慧財產局員工消費合作社印製 本發明有關各種混合型電子供體化合物,包含一乙烯 醚及一在一芳香族環外部並與該芳香族環內不飽和現象共 軛之附接於一分子(小分子)或聚合物基團之碳對碳雙鍵 〇乙烯醚基團之存在對此等化合物提供較諸不具有乙烯醚 基團之電子供體化合物爲低之黏滯度;使用例如雙官能混 合型電子供體化合物,該混合型將具有較諸具有相同於各 官能基之電子供體基團之對應雙官能電子供體化合物〇 乙烯醚基團以外之電子供體官能基之活性可藉由在該 芳香族環上添加電子供應用取代基團予以增加,或藉添加 電子撤出取代基團予以減小〇活性亦因位阻交作現象而改 變〇碳對碳雙鍵上烷基取代基團數量或大小之增加將降低 反應性〇碳對碳雙鍵上之任何取代基團較佳爲氫,或爲帶 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297 j 574335 A7 - _ B7___ 五、發明說明(2) 有一甲基團作爲唯一之他種取代基團之氫〇 該混合型之每一電子供體基團係經由一鍵接基團鍵接 於該分子或聚合體,該鍵接基團係該電子供體上之一官能 基與該分子或聚合物基團上之一共同反應性官能劑之反應 產物〇另法,該電子供體基團可經由一耦合反應附接於該 分子或聚合物基團,其中在(該電子供體之)芳香族環外 部之碳對碳雙鍵於反應期間內形成〇 該分子或聚合物基團可爲一環狀、有支鏈或線性烷基 、矽氧烷、聚矽氧烷、(^至(:4烷氧基端接之矽氧烷或聚矽 氧烷、聚醚、聚酯、聚胺基甲酸乙酯、聚(丁二烯,),或 者一芳香族、聚芳香族、或雜芳香族基團〇 本發明亦爲一種包含一或更多本發明電子供體化合物 以及一隨意之固化劑與一或更多填料之可固化組合物。 本發明亦爲一種包含一或更多本發明電子供體化合物 及一或更多可共聚電子受體化合物之可固化組合物,且可 含有一固化劑及一或更多之填料〇合宜之共聚反應用電子 受體化合物爲反丁烯二酸酯及順丁烯二酸酯,例如順丁嫌 二酸二辛酯、順丁烯二酸二丁酯、反丁烯二酸二辛酯、反 丁烯二酸二丁酯。含有丙烯酸酯及馬來_亞胺官能基之樹 脂或化合物乃其他合宜之電子受體物質〇
(請先閱讀背面之注意事項再填寫本頁) 本發明之電子供體化合物具有以下繪出結構中之一: 結構 Ι:「 Π·— —. 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297兮 574335 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明(3) 結構n : G 0,1.2--Ar[_ R; 式中m及η均爲1至6 ,較佳爲1至3,而更佳爲1; Ar爲一環內具有3至10個碳原子之芳香族或雜芳香族 環,其中雜原子可爲Ν 、0或S; RhR2、及R3獨自爲氫、上述之Ar、或具有1至12個 碳原子之烷基團;R1、^2、及R3較佳爲氫或具有1至4個 碳原子之烷基,而更佳爲全爲氫; 、 R4、R5、及R6獨自爲氫、甲基團或乙基團,且較佳爲 R4、以、及R6中有二個爲氫而一個爲甲基,而更佳爲全爲 氫; G 爲- OR?、-SR7、-N(RM(R2)、上述之 Ar、或具有 1 至12個碳原子之烷基,其中R7爲上述之Ar或具有1至12個 碳原子且較佳爲1至4個碳原子之烷基團,而R1及R2均如 上述; Q爲具有1至12個碳原子之烷基團; X爲 R1 I II 〇 I 0 II \〇人〆 I R1
R5 -Z- -〇 乂 e R4
本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297 j (請先閱讀背面之注意事項再填寫本頁)
— — — — — — — ^ · I I I I 574335 A7 B7 五、發明說明(4) 0
U------------------ r 噴貧面W主意事項再嗔寫本頁) 經濟部智慧財產局員工消費合作社印製 — S— Q- 一 .
I z爲一烷基團、矽氧烷、聚矽氧烷、(^至(;4烷氧基端 接之矽氧烷或聚矽氧烷、聚醚、聚酯、聚胺基甲酸乙酯、 聚(丁二烯),或者一芳香族、聚芳香族、或雜芳香族基 團〇此等化合物中Z基團之製備用物質可在市面上由許多 來源購得;例如芳香族及聚芳香族物質可得自BASF公司; 矽氧院及聚矽氧烷得自Gelest公司;聚醚得自BASF公司; 聚酯得自Uniqema或Bayer公司;聚(丁二烯)得自Elf_ 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297 574335 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(5)
Atochem公司;聚胺基甲酸乙酯得自Bayer或BASF公司; 而烷烴得自Uniqema公司。此等來源中有些會使可利用之 Z物質已予官能化,供與乙烯醚或其他電子供體起始物質 上之一共同反應性官能基反應;在其他情況下,實作者將 需使準備中之物質官能化,供與電子供體起始物質反應〇 Z基團可含有環狀部份或雜原子,且取決於製成電子 供體化合物之合成路徑而可含有懸垂之羥基或硫醇基團; 舉例言之,若起始化合物中有一含有一與環氧基官能基團 反應之羥基或硫醇官能基,則Z基團將含有一懸垂之羥基 或硫醇基團〇 、 Z之確實組成或分子量對本發明並非關鍵,且視對該 混合型電子供體化合物之最終用途之要求而定可有寬廣之 範圍〇 Z之組成可選擇以於最終配方內提供特定之物性, 譬如流變性、親水性或疏水性、韌性、强度、或撓性〇舉 例言之,低位準之交聯及圍繞聚合物鍵之自由旋轉將對化 合物賦與撓性,而存在矽氧烷部份將賦與疏水性及撓性。 分子量及鏈長度將影響黏滯度,分子量愈高且鏈愈長,則 黏滯度愈高〇 如本文中所用,芳香族意指符合傳統芳香族化合物定 義之化合物,亦即在分子平面之上方及下方含有離域化7T 電子之環狀雲,且7T雲共有(4n + 2)個電子〇 在需要較小之反應性時,該芳香族基團可含有一電子 撒出基團譬如硝基團,但一般而言,具有較大反應性之化 合物將在最終使用之應用上具有更實際之用途。 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公赛) " (請先閱讀背面之注意事項再填寫本頁) -i I I I I I I ^ · I I I I I ! 574335 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(6) 此等混合型電子供體化合物可經由含有該電子供體基 團之起始物質上之一官能基與含有該分子或聚合物基團及 該乙烯醚官能基之起始物質上之一共同反應性官能基間之 標準加成或縮合反應,或者經由使用標準Wittig氏、Heck 氏、或Stille氏方法之耦合反應予以製備。舉例言之,對 電子供體基團(乙烯醚除外)有用之起始化合物爲肉桂醇 或肉桂醯氯及3-異丙烯基- α,α -二甲基苯甲基異氰酸鹽 〇雖然業界熟練人士可藉官能基之選擇及置放設計出合宜 之反應變化,但在實作中,各種變化將由起始物質之商業 上可用性或合成路徑之簡易度加以導引。 , 代表性之合成路徑包括: 1· 異氰酸鹽官能基與(i)羥基;或(Η)胺;或(ΠΠ硫 醇官能基反應以分別產生一胺基甲酸鹽、尿素或硫代胺基 甲酸鹽鍵合; 2 · 用(i )羥基;或(i i )胺;或(Π i )硫醇官能取代鹵素 以分別產生一醚、胺或硫醚鍵合; 3 · 環氧基官能基與(i)羥基;或(i i )胺;或(i i i )硫醇 官能基反應以分別產生一醚、胺或硫醚鍵合0 此等混合型電子供體化合物可與電子受體化合物譬如 反丁烯二酸酯、順丁烯二酸酯、丙烯酸酯、及馬來醯亞胺 攙合進行共聚反應,以形成固化之黏著劑組合物供用於廣 泛之應用上〇合宜之反丁烯二酸酯及順丁烯二酸酯例如爲 順丁烯二酸二辛酯、順丁烯二酸二丁酯、反丁烯二酸二辛 酯、反丁烯二酸二丁酯0合宜之丙烯酸酯爲數多種且可在 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297免 — — — — — — — — — — — — — — — — — — — — — — — — · (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 574335 A7 B7 五、發明說明(7) 市面上自例如Sarto me r公司購得〇合宜之馬來醯亞胺係例 如依據頒給Dershem之美國專利第6,034,194號及6,034, 195號中所述步驟輕易予以製備〇 電子供體化合物可配製成適用於電子應用之黏著、塗 覆、封裝或囊封組合物〇此等配方較佳爲含有一或更多固 化劑及傳導或非傳導性填料,且亦可含有安定用化合物、 黏性促進劑或賴合劑〇 例示性固化劑爲熱啓發劑及光啓發劑,以電子供體化 合物重量之〇·1 %至10%而較佳爲0.1 %至3.0 %之量存 在〇較佳之熱啓發劑包括過氧化物譬如過辛酸丁酯與過氧 化二異丙苯、以及偶氮化合物譬如2 , 2 ’ -偶氮雙(2-甲基 丙睛)與2,2’-偶氮雙(2_甲基丁腈)〇 —較佳之光啓發 劑系列爲Ciba專業化學公司以Irgacure商標銷售者〇在一 些配方中熱啓發及光啓發二者可能均皆合宜,例如,固化 程序可藉照射起始,而在稍後之處理步驟中,可藉加熱完 成熱固化而予完成〇 一般而言,此等組合物將在至2 50 °C之溫度範圍內 固化,而固化作用將於一溫度在1〇秒鐘至3小時之範圍內 完成〇每一配方之時間及溫度固化輪廓將隨特定電子供體 化合物及配方之其他成份變化,但固化輪廓之各參數可由 業界熟練執業人士予以確定而無需過當之實驗。 合宜之傳導性填料爲碳黑、石墨、金、銀、銅、鉑、 鈀、鎳、鋁、碳化矽、硝化硼、鑽石、及氧化鋁〇合宜之 非傳導性填料爲蛭石、雲石、矽灰石、碳酸鈣、氧化鈦、 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297含&〉_ (請先閱讀背面之注意事項再填寫本頁) ---------—線. 574335 A7 B7 五、發明說明(8) (請先閱讀背面之注意事項再填寫本頁) 砂、玻璃、熔矽石、燻矽石、硫酸鋇、及齒化乙烯聚合物 ,譬如四氟乙烯、三氟乙烯、二氟化亞乙烯、氟乙烯、二 氯化亞乙烯、及氯乙烯◦當存在時,填料之量將爲配方重 量之20%至90 % 〇 合宜之黏性促進劑或耦合劑爲矽烷、矽酸酯、金屬丙 烯酸鹽或甲丙烯酸鹽、鈦酸鹽、以及含有一螯合配位體之 化合物譬如瞵、硫醇、及乙醯乙酸鹽〇當存在時,耦合劑 之量將達該混合型電子供體化合物重量之10 %,而較佳之 量爲0.1至3.0 % 〇 此外,該等配方可含有將額外撓性及韌性給予所得已 固化物質之化合物。此等化合物可爲任何Tg爲150 或更 小之熱固或熱塑物質,而典型上將爲聚合物物質,譬如聚 丙烯酸酯、聚(丁二烯)、聚THF (聚合四氫呋喃)、羧 基端接之丁腈橡膠及聚丙二醇。當存在時,此等化合物之 量約可達該混合型電子供體化合物重量之15% 〇 經濟部智慧財產局員工消費合作社印製 以下實例顯示代表性混合型電子供體化合物及其等之 製備反應。電子供體反應產物係由1H-NMR及FT-IR分光術 加以定性〇此等實例係本發明之例示,故無意作爲限制。 在此等實例中,fnC-C36-fnC代表由油酸與亞油酸之 二聚反應繼以轉化成適當官能基所產生異構物之混合物, 式中fnc爲醇之-0H 、胺之-NH2、及異氰酸鹽之-NC0 ;而 f n c
I f nc — C5 1
I fnc 代表由油酸與亞油酸之三聚反應繼以轉化 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297 574335 A7 B7 五、發明說明(9) 成適當官能基所產生異構物之混合物,式中fnc爲竣基團 之-COOH、醇之-CH2 0H 〇 實例1
NCO _1)
,甲芩/40C
rif先閲讀背面之注意事項再填寫本頁> 經濟部智慧財產局員工消費合作社印製 3-異丙烯基-〇 > 克,0·517摩爾)媒合於配備以機械攪拌器、添加用漏斗 及氮氣入口 /出口之1000毫升裝三頸燒瓶內之甲苯(15〇 毫升)中。將反應置於氮氣下,而在溶液加熱至4〇°C時添 加二丁錫二月桂酸酯(0.0 33克)並攪拌〇將溶於甲苯( 5〇毫升)中之I,4-丁二醇乙烯醚(60克,0·517摩爾)注 入添加用漏斗內〇以10分鐘時間將此溶液添加於該異氰酸 鹽溶液,且所得混合物於4〇°C額外加熱三小時〇讓反應冷 卻至室溫後,用蒸餾水沖洗混合物三次〇分離之有機層於 硫酸鎂上乾燥,過濾並於眞空移除溶劑,以產生94%收率 之生成物〇 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297 ------1— -------j 574335 A7 B7 五、發明說明(10)
實例L
NCO + H0 31(11)
甲革/40C
經濟部智慧財產局員工消費合作社印製 克,〇· 及氮氣 毫升) 加二丁 50毫升 )注入 m酸鹽 應冷卻 層於硫 收率之 實例3 異丙烯 189摩 入口 / 中。將 錫二月 )中之 添加用 溶液, 至室溫 酸鎂上 生成物 基-α , α - 二甲 爾)媒合於配備 出口之500毫升 反應置於氮氣下 桂酸酯(0 · 0 3 3 1,6-己二醇乙烯 漏斗內〇以10分 且所得混合物於 後,用蒸餾水沖 乾燥,過濾並於 基苯甲基異m酸鹽 以機械攪拌器、添 裝三頸燒瓶內之甲 ,而在溶液加熱至 克)並攪拌〇將溶 醚(27.27 克,0· 鐘時間將此溶液添 4 〇 eC額外加熱三小 洗混合物三次〇分 眞空移除溶劑,以 (38.06 加用漏斗 苯(1 00 40°C時添 於甲苯( 1 89摩爾 加於該異 時〇讓反 離之有機 產生95% 〇 (請先閱讀背面之注意事項再填寫本頁)
本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297 574335 A7 B7 五、發明說明(U) +
Bu4NH904/ ▼莘 50% NaOH
將1,4-丁二醇乙烯醚(40·4克,0.34 4摩爾)、50¾ 以011(300毫升)、硫酸氫銨四丁鹽(50.8克,0.148摩 爾)、及肉桂醯氯(52·56克,〇· 344摩爾)在甲苯中之 溶液於53°C攪拌五小時,然後於75 °C攪拌15小時。讓反應 冷卻至室溫,並萃取有機層且用鹽水沖洗三次〇分離之有 機層於硫酸鎂上乾燥,過濾並於眞空移除溶劑,以獲得95 %收率之生成物〇 實例4
V C請先闓讀背面之江意事項再填寫本頁} -------訂----------線- 經濟部智慧財產局員工消費合作社印製 v_,
-異丙烯基-α , α 苯甲基異氰酸鹽(59·11
本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297 574335 A7 B7 五、發明說明(1 2) 克,0.294摩爾)媒合於配備以機械攪拌器、添加用漏斗 及氮氣入口 /出口之500毫升裝三頸燒瓶內之甲苯(10〇 毫升)中。將反應置於氮氣下,而在溶液加熱至4〇。〇時添 加二丁錫二月桂酸酯(0.033克)並攪拌〇將溶於甲苯( 5〇毫升)中之環己烷二甲醇一乙烯醚(5〇·0克,0·294摩 爾)注入添加用漏斗內。以1〇分鐘時間將此溶液添加於該 異氰酸鹽溶液,且所得混合物於40°C額外加熱三小時〇 _ 反應冷卻至室溫後,用蒸餾水沖洗混合物三次。分離之有 機層於硫酸鎂上乾燥,過濾並於眞空移除溶劑,以產生97 %收率之生成物〇 、 實例5
NCO
(請先閱讀背面之注意事項再填寫本頁) --------訂·丨丨—線▲ 經濟部智慧財產局員工消費合作社印製 八 將一摩爾當量之3-異丙烯基- α,α -二甲基苯甲基異 氰酸鹽媒合於配備以機械攪拌器、添加用漏斗及氮氣入口 /出口之三頸燒瓶內之甲苯中。將反應置於氮氣下,並將 溶於甲苯中之一摩爾當量3-胺基-1-丙醇乙烯醚注入添加 用漏斗內〇以1〇分鐘時間將此溶液添加於該異氰酸鹽溶液 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297 經濟部智慧財產局員工消費合作社印製 574335 A7 ___ B7 五、發明說明(13) ’且所得混合物於4(TC額外加熱三小時。讓反應冷卻至室 溫後,用蒸餾水沖洗混合物三次〇分離之有機層於硫酸鎂 上乾燥,過濾並於眞空移除溶劑獲得生成物。 實例6
於室溫將一摩爾當量之3-胺基-1-丙醇乙烯醚及一摩 爾當量之三乙胺混合於無水二氯乙烷內,而對其添加溶於 無水二氯甲烷內之一摩爾當量4_乙烯基苯甲基氯。讓該混 合物反應七小時〇將溶劑蒸發並以使用己烷/乙酸乙酯梯 度之柱層析術將粗產物純化〇 實例7
於室溫將一摩爾當量之3-胺基-1-丙醇乙烯醚及一摩 爾當量之三乙胺混合於無水二氯乙烷內,而對其添加溶於 無水二氯甲烷內之一摩爾當量肉桂_氯〇讓該混合物反應 $^艮尺度適用中國國家標準(CNS)A4規格(210x 297 (請先閲讀背面之注意事項再填寫本頁)
574335 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(14) 七小時〇將溶劑蒸發並以使用己烷/乙酸乙酯梯度之柱層 析術將粗產物純化。
〇 將異丁香酚(20克,〇·12摩爾)、環氧氯丙烷(33.8 克,0.24 4摩爾)媒合於配備以機械攪拌器、添加用漏斗 及氮氣入口 /出口之500毫升裝三頸燒瓶內之甲基乙基酿 (ΜΕΚ) (100毫升)中〇將反應置於氮氣下,並於90°C加熱 五小時。譲反應冷卻至室溫後,將鹽過濾並用10%硫酸鈉 沖洗濾液三次。分離之有機層於硫酸鎂上乾燥,過濾,並 於眞空移除溶劑獲得生成物。 I I I I I I I I I I I I ills— — ί靖先閱讀背面之注意事項再填寫本頁}
本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公 574335 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(15) 將一摩爾當量之異丁香酚/環氧氯丙烷加成物、一摩 爾當量之1,4-丁二醇乙烯醚及催化量之Amber lyst A-21離 子交換樹脂於90 eC —起加熱20小時〇將該Amber ly st樹脂 與反應混合物分離獲得生成物。 實例9
其他混合型電子供體化合物可依據類似之步驟製成〇 下列反應架構顯示其他芳香族環起始化合物與含有乙烯醚 之化合物,及所得之混合型電子供體化合物〇 實例9-A
實例9-B 本紙張尺度適用中國國家標準(CNS)A4規格(210 x 297公n) (請先閱讀背面之注$項再填寫本頁)
574335 A7 B7 五、發明說明(16) \ \
+ H0
CI
實例9-C (請先閱讀背面之注意i項再填寫本頁) -〇CHq 、〇
HO -► 〇 經濟部智慧財產局員工消費合作社印製
OCH, 〇 Ο.
實例9-D 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297 574335 A7 ___B7
本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297 五、發明說明(17) (請先閱讀背面之注意事項再填寫本頁)
574335 A7 B7 五、發明說明(1 8)
HS
實例9-H .OCH,
HS + 〇 〇 OCHa
S
實例9-I 經濟部智慧財產局員工消費合作社印製
NC〇 + HS"
A
(請先閱讀背面之注意事項再填寫本頁)
本紙張尺度適用中國國家標準(CNS)A4規格(210 x 297 574335 A7 B7 五、發明說明(19)
實例9-J + h2n^^〇^
實例9-K 〇 〇 CIS〇2〇H -^ Η Η
S〇CI2 s〇2〇h 〇
Η,0 一 Cl + 〜 6
〇 H
〇 II s—〇 II 〇
〇 CH3P(OEt)2 - NaOEt / EtOH
經濟部智慧財產局員工消費合作社印製 〇 II S—0. II 〇
實例9-L
+ HO.
(請先閱讀背面之注意事項再填寫本頁)
本紙張尺度適用中國國家標準(CNS)A4規格(210 x 297 574335 A7 B7 五、發明說明(2G)
實例9-M
實例9-N
II ΒΓ . ?〜.^ …· Pd(〇Ac)2 + (〇2Η5)3Ν 4 eq P(C6H5)3
〇,CH3 + 〜
(請先閱讀背面之注意i項再填寫本頁)
Br AICI,
.OH
OH n ϋ ϋ I I n ·1 · I 1_1 ϋ - 經濟部智慧財產局員工消費合作社印製
SOCI2 OH -^ ★
O o
本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297 574335 A7 B7 五、發明說明(21) 實例9-0
〇 (請先閱讀背面之注意事項再填寫本頁)
經濟部智慧財產局員工消費合作社印製 實例10 黏著劑配方 用一種雙馬來醢亞胺作爲電子受體將三種得自實例1 、2及3之混合型電子供體化合物配製成黏著劑組合物〇 該雙馬來醯亞胺係依據美國專利第4 , 745 , 1 97號中所列步 驟,使用USP-MD (Witco公司)作爲啓發劑而由胺基端接 之聚氧基丁稀(Versalink P650,Air Products 公司)及 順丁烯二酸酐予以衍生〇 用DSC將此等黏著劑組合物固化(電子供體與電子受 體之共聚反應)〇每一此等樹脂之放熱曲線在尖峰以及尖 峰至起始點特性方面似乎爲定性上類似0各項結果示於下 表: • I I 訂·— l·! -
本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297含AL 574335 A7 B7 五、發明說明(22) 之體劑 例供糊 實子附 自電黏 得型片 有合晶 具混之 始 起
點。C 峰度、 尖溫(1 III! (ί/g) 實例 1 97·22 1 12.14 14.92 286 . 2 實例 2 97 · 97 1 07.1 5 14.8 254 · 5 實例 3 103.04 126.88 23.84 325 . 8 將該三電子供體配製成晶片黏附黏著劑組合物並測試 晶片剪力强度〇將各黏著劑置於一引線框(鈀、銀、或銅 )與一 120 X 120密耳矽晶片之間,並於200 eC熱板上固化 約60秒鐘。於室溫將壓力施加於晶片側邊(而此時將晶片 及引線框總成加熱至240 eC )直到出現剪斷爲止。各配方 及結果報告於以下各表內〇 晶片黏附配方1 ^__^_ 質量(克) (請先閱讀背面之注意事項再填寫本頁)
訂il·---- 經濟部智慧財產局員工消費合作社印製 雙馬來醯亞胺(Versal ink P650 )(電子受體) 1·65 得自實例1之混合型電子供體 0.50 順丁烯二酸酐8%(Ricon 131)(反應性稀釋劑) 〇·25 啓發劑 0.05 黏性促進劑之攙合物 0.05 銀薄片 5.51 奈漶晶片剪力(千克) 銀 銅 _jLj24(TC )晶片剪力(千」U 引線框 鈀 銀 銅 18.0 12 . 17.0 2. .4 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297兮|5)_ 574335 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明(23) 晶片黏附配方2 成 份___質量 雙馬來醯亞胺(Versali nk P650 )(電子受體) 0.68 得自實例2之混合型電子供體 〇 .50 順丁烯二酸酐8% (Rico η 131)(反應性稀釋劑) 〇 · 14 啓發劑 0,028 黏性促進劑之攙合物 0.028 銀薄片 4.13 室溫晶片剪力(千克) 熱(24〇eC )晶片剪力(千吉1 鈀銀銅 引線框 钯 銀 銅 16.0 19.0 16.0 3 . 2 1.8 〇 · 8 晶片黏附配方3 成份 . 雙馬來醯亞胺(Versali nk P650 )(電子受體) 2 .26 得自實例3之混合型電子供體 0 .50 順丁烯二酸酐8% (Rico η 131)(反應性稀釋劑) 0 .32 啓發劑 0 .064 黏性促進劑之攙合物 0.064 銀薄片 9.63 室溫晶片剪力(千克) _熱( 240 °C )晶片剪力(千克) 鈀 銀 銅 引線框 _M_ _M 7.4 5·6 2·2 1·6 1·4 (請先閱讀背面之注意事項再填寫本頁) -¾ 訂·!------ 本紙張尺度適用中國國家標準(CNS)A4規格(210 χ 297
Claims (1)
- 574335 矣木 888β ABCD1·-種化合物,具有下列結構: R3 Rl RV^ArQ〇,1、x 一Z- -〇\R5 R2 i b 0, 1, 2 m R6 式中m及η獨自爲1至6 ; Ar爲一環內具有3至10個碳原子之芳香族或雜芳香族 環,其中雜原子可爲N 、0或S ; RhR2、及R3獨自爲氫、上述之Ar、或具有1至12個 碳原子之烷基團; , R4、P、及R6獨自爲氫、甲基團或乙基團; G 爲- OR7、-SR7、-N(Ri)(R2)、上述之 Ar、或具有 1 至12個碳原子之烷基,其中R7爲上述之Ar或具有1至12個 碳原子之烷基團,而R1及R2均如上述; Q爲具有1至12個碳原子之烷基團; (請先閱讀背面之注意事項再填寫本頁) --------訂· — —---— II 爲 X 經濟部智慧財產局員工消費合作社印製本紙張尺度適用中國國家標準(CNS)A4規格(2】0 X 297 574335 A8 B8 C8 D8 六、申請專利範圍 〇 II •N/C、S^ I R1 Μ s s II〇〆 γ R1 〇 II -s- II 〇 t,/ R1 (請先閱讀背面之注意事項再填寫本頁) II 〇 -S- 而 Z爲一院基團、矽氧烷、聚矽氧烷、(^至“烷氧基端 接之矽氧烷或聚矽氧烷、聚醚、聚酯、聚胺基甲酸乙酯、 聚(丁二烯),或者一芳香族、聚芳香族、或雜芳香族基 團0 2 ·如申請專利範圍第1項之化合物,係由具有下列結 _ \ ^ 1111111· 經濟部智慧財產局員工消費合作社印製574335 A8 R8 C8 D8 六、申請專利範圍〇 / (請先閱讀背面之注意事項再填寫本頁) LWW 〇 〇人 N —— H N —— H 訂---r------. 經濟部智慧財產局員工消費合作社印製 A \丨 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297 574335 A8 B8 C8 D8 六、申請專利範圍 3 _ —種化合物,具有下列結構:式中m及η獨自爲1至6 ; Ar爲一環內具有3至10個碳原子之芳香族或雜芳香族 環,其中雜原子可爲Ν 、〇或S ; R1及R2獨自爲氫、上述之Ar、或具有1至12個碳原子 之烷基團; R4、R5、及R6獨自爲氫、甲基團或乙基團; G 爲-OR7、-SR7、一N(Ri ) (R2 )、上述之 Ar、或具有 1 至12個碳原子之烷基,其中R7爲上述之Ar或具有1至12個 碳原子之烷基團,而R1及R2均如上述; Q爲具有1至12個碳原子之烷基團; X爲 (請先閱讀背面之注意事項再填寫本頁) * * V --------IT----------Awwi 經濟部智慧財產局員工消費合作社印製 c/"〇 R1丨:/ Li V /Γ 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297 574335 Α8 Β8 C8 D8 六、申請專利範圍 〇—3—* 〇· (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 ' 而 Ζ爲一烷基團、矽氧烷、聚矽氧烷、1至(]4烷氧基端 接之矽氧烷或聚矽氧烷、聚醚、聚酯、聚胺基甲酸乙酯、 聚(丁二烯),或者一芳香族、聚芳香族、或雜芳香族基 團0 4 .如申請專利範圍第3項之化合物,具有下列結構:本紙張尺度適用中國國家標準(CNS)A4規格χ 297 574335申請專利範圍續頁 5.—種可固化黏著劑組合物’包含申請專利範圍第1 至4項中任一項之化合物〇 6. —種可固化黏著劑組合物,包含申請專利範圍第1 至4項中任一項之化合物以及一傳導性或非傳導性填料, 其中該填料係以20重量%至90重量%之量存在。7. —種可固化黏著劑組合物,包含申請專利範圍第1 至4項中任一項之化合物與至少一由反丁烯二酸酯、順丁 烯二酸酯、丙烯酸酯及馬來醯亞胺所組成集團中選出之可 共聚電子受體化合物,其中該申請專利範圍第1至4項中 任一項之化合物與該可共聚電子受體化合物之比例範圍爲 1 : 1 . 3至1 : 4 · 5 ;以及一傳導性或非傳導性填料,其中該 填料係以20重量%至90重量%之量存在。 -32-
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US6803406B2 (en) | 2002-03-29 | 2004-10-12 | National Starch And Chemical Investmnet Holding Corporation | Electron donors, electron acceptors and adhesion promoters containing disulfide |
US20030232926A1 (en) * | 2002-05-14 | 2003-12-18 | Nikolic Nikola A. | Thermoset adhesive films |
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JP4810875B2 (ja) * | 2004-06-09 | 2011-11-09 | 三菱瓦斯化学株式会社 | 硬化性樹脂組成物 |
US8586650B2 (en) * | 2007-09-14 | 2013-11-19 | Henkel US IP LLC | Thermally conductive composition |
US8324319B2 (en) * | 2007-11-20 | 2012-12-04 | Sridhar Laxmisha M | Redox-induced cationically polymerizable compositions with low cure temperature |
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US4486582A (en) | 1983-01-27 | 1984-12-04 | The Dow Chemical Company | Reactive monomers and thermosettable compositions containing same |
JPS6079076A (ja) * | 1983-10-05 | 1985-05-04 | Toyo Soda Mfg Co Ltd | 2液型接着剤 |
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US5633411A (en) | 1995-06-07 | 1997-05-27 | Loctite Corporation | Method for production of allyloxystyrene compounds |
-
2000
- 2000-05-18 US US09/573,376 patent/US6307001B1/en not_active Expired - Fee Related
-
2001
- 2001-05-16 KR KR1020010026800A patent/KR100794634B1/ko not_active IP Right Cessation
- 2001-05-16 CA CA002347901A patent/CA2347901A1/en not_active Abandoned
- 2001-05-16 DE DE60135062T patent/DE60135062D1/de not_active Expired - Lifetime
- 2001-05-16 EP EP01111273A patent/EP1158008B1/en not_active Expired - Lifetime
- 2001-05-16 SG SG200102953A patent/SG96221A1/en unknown
- 2001-05-16 MY MYPI20012319A patent/MY117708A/en unknown
- 2001-05-17 CN CN01119527A patent/CN1325845A/zh active Pending
- 2001-05-17 TW TW90112029A patent/TW574335B/zh not_active IP Right Cessation
- 2001-05-17 JP JP2001147728A patent/JP4216490B2/ja not_active Expired - Fee Related
- 2001-05-17 CN CNA2007101693252A patent/CN101200620A/zh active Pending
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2002
- 2002-06-04 HK HK02104240.8A patent/HK1042471A1/zh unknown
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CN101200620A (zh) | 2008-06-18 |
SG96221A1 (en) | 2003-05-23 |
KR100794634B1 (ko) | 2008-01-14 |
EP1158008A2 (en) | 2001-11-28 |
MY117708A (en) | 2004-07-31 |
EP1158008A3 (en) | 2003-07-02 |
KR20020002201A (ko) | 2002-01-09 |
HK1042471A1 (zh) | 2002-08-16 |
CA2347901A1 (en) | 2001-11-18 |
EP1158008B1 (en) | 2008-07-30 |
CN1325845A (zh) | 2001-12-12 |
JP4216490B2 (ja) | 2009-01-28 |
JP2002037752A (ja) | 2002-02-06 |
DE60135062D1 (de) | 2008-09-11 |
US6307001B1 (en) | 2001-10-23 |
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