TW573208B - Positive acting photoresist composition and imageable element - Google Patents

Positive acting photoresist composition and imageable element Download PDF

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Publication number
TW573208B
TW573208B TW89126927A TW89126927A TW573208B TW 573208 B TW573208 B TW 573208B TW 89126927 A TW89126927 A TW 89126927A TW 89126927 A TW89126927 A TW 89126927A TW 573208 B TW573208 B TW 573208B
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Taiwan
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positive
acetal
group
acting
patent application
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TW89126927A
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Chinese (zh)
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Moshe Levanon
Emmanuel Lurie
Larisa Postel
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Creo Il Ltd
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Priority claimed from US09/365,279 external-priority patent/US6255033B1/en
Priority claimed from IL140299A external-priority patent/IL140299A/en
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Publication of TW573208B publication Critical patent/TW573208B/en

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573208 五、發明説明 1明背景 1 ·發明領域 本發明係有關成像領域,特別抗蝕劑成像,更特別抗 熱蝕劑成像,及又更特別雷射導引成像領域。本發明說明 新正作用抗熱餘劑組合物、抗熱餘結構、抗熱餘方法以及 抗熱蝕系統,以及用於形成抗蝕劑材料之新穎合成程序。 2·發明背景 雷射導引成像(LDI)的效果用於印刷業界製造平版印 刷板以及用於印刷電路板(PCB)的製造上長時間為人們所 確知。LDI提供較佳線品質、恰即時處理、改良製造良率 、消除薄膜成本、以及其它已認知的優點等效果。於直接 成像法中,藉適當能量效應聚焦來源僅曝光於熱敏材料的 選擇區需要改變塗布組合物。例如參考美國專利第 4,724,465號’美國專利第5,641,608號(McDermid),美國專 利第5,713,287號(Gelbert),其教示併述於此以供參考。 熱敏成像元件被歸類為回應於曝露於以及吸收適量 熱能進行化學轉變之組合物。熱誘發化學轉變性質可消蝕 該組合物,或改變組合物於特定顯像劑的溶解度,或改變 表面沾黏性,或改變熱敏層表面之親水性或疏水性。如此 由熱敏組合物形成的薄膜或薄層之預定區選擇性曝露於熱 (如影像分布熱能)具可直接或間接製造組合物適當成像圖 樣之能力,該組合物可用於PCB製造作為抗蝕劑圖樣,或 用於製造光刻術印刷板。 以類似使用抗光蝕劑之方式,熱敏組合物可為正作用 本紙張尺度適用中國國家標準(CNS) A4规格(210X297公釐) f請先閱讀背面之注意事項再填寫本頁) .訂丨 ;r 4 573208 A7 ^___B7_ 五、發明説明(2 ) 或負作用性。使用正作用熱敏組合物,薄膜選擇性曝露於 可產生所需熱能之適當聚焦射束將(a)消蝕如此曝露的組 合物,該種情況下可直接製造預定圖樣,以及圖樣係藉未 曝露於聚焦熱量且未被消蝕的剩餘薄膜部分成像;或(b) 造成曝露的組合物變成於適當溶劑内具有差異性更高的溶 解度,該種情況下,於薄膜主要係產生潛像。潛像讓薄膜 溶解於熱曝露區,而於非熱曝露區則保持不溶而留在其中 ,獲得所需圖樣。使用負作用熱敏組合物,薄膜選擇性曝 露於具有所需熱能之適當聚焦射束,造成曝露區變成差異 地較不溶於適當顯像劑,故接觸顯像劑時溶解去除未曝露 於熱之區域,而留下熱曝露區作為所需圖樣。 經由使用熱敏成像元件,未使用光學工具藉由直接成 像而於基材表面上製造圖樣的能力大為提升,原因在於成 像射束僅需為具有所需熱能之聚焦來源,例如由低成本的 固態的雷射製成,而與抗光蝕劑直接成像所需的具有特定 波長之窄帶輻射聚焦來源相反。聚焦熱能來源例如紅外雷 射束,就成本、壽命以及可靠性等方面而言皆比紫外光更 適合用於商業規模操作,紫外光為多種光敏組合物直接成 像所需。此外,僅進行熱誘生組合物變化而非光誘發組件 或組合物改變之熱敏組合物比較用於直接成像處理之光敏 組合物較不複雜。如此,不僅熱敏組合物可以產業應用例 如PCB製造所需之具有成本效益方式調配,同時其較為簡 單的操作機構也可於室内燈光或白晝光線之下操作,以及 傾向於獲得概略較佳之儲存壽命。 本紙張尺度適用中國國家標準(CNS) A4規袼(230X297公楚) (請先閱讀背面之注意事項再磺寫本頁〕 .!訂----------- ♦ 573208 A7 --—-------_____— 五、發明説明(3 ) 甲階酚醛清漆-疊氮醌樹脂之正作用光敏組合物為電 腦晶片業界的主要成像材料,(例如參考RR. Dammei,Γ 基於疊氮萘醌之抗蝕劑」,教學文件第丨丨期,SPIE出版社 ,華盛頓州,伯林罕,1993年)。 光敏甲階盼駿清漆-疊氮g昆樹脂組合物也廣用於印刷 板的製造。光敏疊萘醌衍生物(DNq)添加至甲階酚醛清漆 樹脂(酚-甲階酚醛縮合聚合物)可減慢樹脂之溶解,曝光薄 膜(帶有DNQ之光誘生分解產物)之溶解速率甚至比純甲階 酚醛清漆樹脂薄膜更快速。晚近公開甲階酚醛清漆_DNq 成像材料之分子機構(A. Reiser,成像科學與技術期刊,第 42卷,第1期,1998年1月/2月,15-22頁)以及教示於甲階 酚醛清漆·疊氮醌組合物之成像現象基本特色為觀察到(樹 脂)的溶解抑制,該項抑制係基於經由強力氫接受者(作為 溶解度抑制劑)與樹脂OH基作用形成酚系串。當曝露時, 酚系串藉熱效應亦即臥扶(Wolff)重排反應而由其錨碇割 裂’接著光解抑制劑分子之疊氮酿i部分。此種重排不僅極 為快速’同時也高度放熱(△ H。至少-66千卡/莫耳)。於溶 解度抑制劑所在位置突然出現熱脈衝其幅度造成溫度奇峰 不低於約220°C。於產生的高溫,酚系串由其kDNq之錨 碇割裂而變成無活性(分散),由於其不再由溶解度抑制劑 之誘生效果結合在一起。 可說明基於結合不同類型抑制劑之甲階酚醛清漆樹 脂的寬廣範圍之熱敏組合物出現於專利參考文獻以及於商 業發佈的事實。例如說明基於對紫外光、可見光及/或紅外 本紙張尺度適用中國國家標準(CNS)A4规格(230X297公釐)573208 V. Description of the invention 1 Bright background 1 · Field of the invention The present invention relates to the field of imaging, particularly resist imaging, more specifically anti-corrosive imaging, and more particularly laser guided imaging. The present invention illustrates a new positive action anti-heat residue composition, a heat resistance structure, a heat resistance method, and a thermal erosion resistance system, as well as a novel synthetic procedure for forming a resist material. 2. Background of the Invention The effects of laser-directed imaging (LDI) have been known for a long time in the printing industry for the manufacture of lithographic printing boards and for the manufacture of printed circuit boards (PCBs). LDI provides better line quality, just-in-time processing, improved manufacturing yields, elimination of film costs, and other recognized benefits. In the direct imaging method, only a selected area of the heat-sensitive material is exposed by an appropriate energy effect focusing source, and the coating composition needs to be changed. See, for example, U.S. Patent No. 4,724,465 'U.S. Patent No. 5,641,608 (McDermid) and U.S. Patent No. 5,713,287 (Gelbert), the teachings of which are incorporated herein by reference. Thermal imaging elements are classified as compositions that undergo chemical transformation in response to exposure to and absorption of an appropriate amount of thermal energy. Thermally induced chemical transformation properties can erode the composition, or change the solubility of the composition in a particular developer, or change the surface adhesion, or change the hydrophilicity or hydrophobicity of the surface of the heat-sensitive layer. The selective exposure of a predetermined area of a thin film or thin layer formed by such a heat-sensitive composition to heat (such as image distribution thermal energy) has the ability to directly or indirectly produce a suitable imaging pattern of the composition, which can be used in PCB manufacturing as a resist Pattern, or used to make photolithographic printing plates. In a similar way to using photoresist, the heat-sensitive composition can be positive-acting. The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm). F Please read the precautions on the back before filling this page.)丨; r 4 573208 A7 ^ ___ B7_ 5. Description of the invention (2) or negative effect. Using a positive-acting heat-sensitive composition, the film is selectively exposed to an appropriately focused beam that produces the required thermal energy to (a) ablate the composition so exposed, in which case a predetermined pattern can be made directly, and the pattern is borrowed. Part of the remaining film that is exposed to focused heat and not etched is imaged; or (b) the exposed composition becomes more differentially soluble in a suitable solvent, in which case a latent image is mainly generated in the film. The latent image allows the film to dissolve in the heat-exposed area, and remains insoluble in the non-heat-exposed area and remains in it to obtain the desired pattern. Using a negative-acting heat-sensitive composition, the film is selectively exposed to an appropriately focused beam with the required thermal energy, causing the exposed area to become differentially less soluble in a suitable developer, so it is dissolved and removed when exposed to heat when exposed to the developer. Area, leaving the heat-exposed area as the desired pattern. Through the use of thermal imaging elements, the ability to produce patterns on the surface of a substrate by direct imaging without using optical tools has been greatly enhanced because the imaging beam only needs to be a focused source with the required thermal energy, such as from a low cost Lasers are made in a solid state, as opposed to a narrow-wavelength focused source of specific wavelengths required for direct photoresist imaging. Focused thermal energy sources such as infrared laser beams are more suitable for commercial scale operations than UV light in terms of cost, life, and reliability. UV light is required for direct imaging of a variety of photosensitive compositions. In addition, heat-sensitive compositions that undergo only thermally induced composition changes, rather than light-induced components or composition changes, are less complex than photosensitive compositions used for direct imaging processes. In this way, not only the heat-sensitive composition can be formulated in a cost-effective manner required for industrial applications such as PCB manufacturing, but its simpler operating mechanism can also be operated under indoor or daylight, and tends to obtain roughly better storage life. . This paper size applies Chinese National Standard (CNS) A4 Regulations (230X297). (Please read the precautions on the back before writing this page].! Order ----------- ♦ 573208 A7- -—-------_____— V. Description of the invention (3) The positive-acting photosensitive composition of resole novolac-azidoquinone resin is the main imaging material in the computer chip industry, (for example, see RR. Dammei, Γ "Azinaphthoquinone-based resists", teaching paper No. 丨 丨, SPIE Press, Burlingham, WA, 1993). Photosensitive A-step Panjun varnish-azide g-Kun resin composition is also widely used Used in the manufacture of printed boards. Photosensitized naphthoquinone derivatives (DNq) can be added to resole novolac resins (phenol-cresol novolac condensation polymers) to slow down the dissolution of the resin and expose the film (with light-induced decomposition of DNQ) Product) even faster than the pure resol novolac resin film. The molecular mechanism of resol novolac_DNq imaging materials was recently revealed (A. Reiser, Journal of Imaging Science and Technology, Vol. 42, No. 1, 1998 (January / February, pages 15-22) and teaching on resols and azides The basic feature of the imaging phenomenon of the composition is the observation of (resin) dissolution inhibition, which is based on the formation of phenolic strings through the interaction of a strong hydrogen acceptor (as a solubility inhibitor) with the OH groups of the resin. When exposed, the phenolic strings The thermal effect is the Wolff rearrangement reaction, which is cleaved by its anchors and then the azide portion of the photolysis inhibitor molecule. This rearrangement is not only extremely fast, but also highly exothermic (△ H. At least- 66 kcal / mol). A sudden thermal pulse appears at the location of the solubility inhibitor, and its amplitude causes the temperature peak to be not less than about 220 ° C. At the generated high temperature, the phenolic string is cleaved by its kDNq anchor to become inactive. (Dispersion) because it is no longer combined by the inducing effects of solubility inhibitors. It can be explained that a wide range of thermosensitive compositions based on resole novolac resins that combine different types of inhibitors appear in patent references and in commercial Published facts, such as explanations based on the application of the Chinese National Standard (CNS) A4 specification (230X297 mm) to the paper standards for ultraviolet, visible and / or infrared

-*可 . (tf先閱讀背面之注意事項再填寫本頁) -6 - 573208 A7 ---— B7_ 五、發明説明(4 ) 光輻射敏感之酚系樹脂之正工作直接雷射可定址印刷形式 前驅物(例如參考美國專利4,7〇8,925(Newman,3M);美國 專利5,372,907(Haley等人,柯達公司);美國專利5,491,〇46 (DeBoer等人,柯達公司)。於美國專利4,7〇8,925中,酚系 樹脂溶解於鹼性溶液係藉由輻射敏感性氧鑽鹽替代D N Q 而下降,當光分解氧鏘鹽時樹脂的天然溶解度回復。氧鑕 鹽組合物之特性對紫外輻射敏感,此外對紅外輻射敏感。 美國專利5,372,907及5,491,064利用基於輻射誘發潛伏布 朗司德酸分解而提高樹脂基體於逐影像曝光時的溶解度的 直接正作用系統。所述全部種組合物皆額外利用作為負作 用系統’於成像及前顯像後接受額外處理。 WO 97/39894(Horsell)說明一種熱敏組合物以及藉雷 射導引成像(LDI)製造光刻術印刷板之方法。組合物係基於 盼系樹脂與含有強氫接受者之某一範圍的抑制劑之複體, 例如含氮雜環以及包含至少一個氮原子經過第四化之化合 物也發現一系列廣泛已知作為紫外光敏感酚系樹脂組合物 抑制劑之含幾基化合物可作為熱敏組合物抑制劑。就前述 模式(A. Reiser)而言,此點並不令人意外。WO 97/39894 (Horsell)所述組合物相信對紫外光及可見光敏感,而與前 述基於氧錆鹽或布朗司德酸分解組合物相反。 W0 97/39894說明可吸收入射輻射且將其轉成熱能之 輻射吸收性組合物。Horsell之參考文獻例如使用選自下列 類別之染料··角鯊烯鐵、花青、布花青、噚英鐵(pyrylium) 以及其它業界人士已知類別。有機及無機顏料例如碳黑或 本紙張尺度適用中國國家標準(CNS) A4规格(210X297公釐) (請先閱讀背面之注意寧項再磺寫本頁)-* Yes. (Tf read the precautions on the back before filling this page) -6-573208 A7 ----- B7_ V. Description of the invention (4) Direct work of direct radiation laser-addressable phenol resin for printing Form precursors (see, for example, U.S. Patent 4,708,925 (Newman, 3M); U.S. Patent 5,372,907 (Haley et al., Kodak Company); U.S. Patent 5,491,040 (DeBoer et al., Kodak Company). In U.S. Patent 4 In 708,925, phenol-based resins are dissolved in alkaline solutions and replaced by radiation-sensitive oxygen-drilling salts instead of DNQ. The natural solubility of the resin is restored when the oxonium salt is photo-decomposed. The characteristics of the oxonium salt composition against UV Radiation sensitive, and also sensitive to infrared radiation. U.S. Patent Nos. 5,372,907 and 5,491,064 utilize a direct positive action system based on radiation-induced latent Bronsted acid decomposition to increase the solubility of the resin matrix upon image-by-image exposure. All of these compositions are Additional use as a negative-acting system 'to undergo additional processing after imaging and pre-imaging. WO 97/39894 (Horsell) describes a thermosensitive composition and the use of laser-guided imaging (LDI) to make lithography Method for printing plate. The composition is based on a complex of a hope resin and a range of inhibitors containing a strong hydrogen acceptor, such as a nitrogen-containing heterocyclic ring and a compound containing at least one nitrogen atom undergoing fourth chemistry. Several groups of compounds that are widely known as inhibitors of UV-sensitive phenolic resin compositions can be used as inhibitors of heat-sensitive compositions. This is not surprising in terms of the aforementioned mode (A. Reiser). WO 97 / The composition described in 39894 (Horsell) is believed to be sensitive to ultraviolet and visible light, as opposed to the aforementioned oxonium salt or Bronsted acid decomposition composition. W0 97/39894 states that it can absorb incident radiation and convert it into thermal energy. Absorptive compositions. Horsell's references use, for example, dyes selected from the following categories: squalene iron, cyanine, cloth cyanine, pyrylium, and other known categories in the industry. Organic and inorganic pigments such as Carbon black or this paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the note on the back before writing this page)

-7 - 573208 A7 B7 五、發明説明(5 ) 吲花青顏料也可用作為將吸收的入射光轉成熱之輻射吸收 材料。 WO99/08879(Horsell)說明輻射敏感組合物塗布用於 製造印刷板及其電子部件以及用於製造罩蓋。此等塗層係 基於酚系樹脂,該類型樹脂典型之機械性質不良。 WO99/01795(Horsell)說明一種製造預定抗蝕劑圖樣 例如於印刷板、電路板或罩蓋之方法。該方法之特徵為使 用藉官能基官能化而變成不可溶於顯像劑但具有曝光於輕 射而變成可溶於顯像劑性質的新穎聚合物料。該等基團非 如習知系統為疊氮陰離子基,反而為曝光於輻射時不會釋 放出氮’且具有氫鍵結能力的基。此等基例如為2·萘基續 醯氧基,2_°塞吩基%醯氧基,丹斯基氧基(danSyl〇Xy),對_ 曱苯磺醯氧基,苄氧基以及正丁基續醯氧基。 W099/21725(H〇rsell)說明基於曱階酚醛清漆樹脂之 組合物用於製造光刻術印刷板。組合物於水性顯像劑之溶 解度於加熱區提高。組合物含有一種可於熱敏組合物之非 加熱區提高對於水性顯像劑中顯像(溶解)抗性之化合物。 該組合物包含多種化合物包括A)聚(環烷氧)單位;B)矽烷 單位;以及C)多元醇之酯類、醚類及醯胺類。 WO 98/42507(柯達多色圖形公司)揭示一種正作用熱 敏組合物,其可使用紅外輻射雷射成像而無需後曝光烘烤 步驟且無需任何溢流曝光步驟。此種組合物包括酚系樹脂 、紅外輻射吸收性化合物、以及為非光敏性之溶解抑制劑 ,該溶解抑制劑可提供與黏結劑樹脂之酚系位置進行氫鍵 本紙張尺度適用中國國家標华⑽)顺格 裝 (請先閱讀背面之注意事項再填寫本頁) 訂— :線· 573208 A7 £7_ 五、發明説明(6 ) 結的位置。 WO 99/08157(柯達多色圖形公司)提供一種紅外線成 像組合物含有兩種主要成分:非鹼性紅外輻射吸收性材料( 例如碳黑)以及酚系樹脂,酚系樹脂係混合或反應疊氮萘酉昆 衍生物。此等組合物如於光刻術印刷板可用於正作用或負 作用成像模式。 WO 99/11458(柯達多色圖形公司)也說明一種以酚系 為主的樹脂(或其它具有旁出經基、竣酸、醯胺、硝酸或其 組合於其上之聚合物)以及一種紅外光吸收性化合物。成像 層也含有聚合物其帶有鍵結的旁出基,旁出基團為丨,2_萘 醌二疊氮、羥基、羧酸、磺醯胺、腈等。成像層也含有溶 解度抑制劑、可見光染料或二者。 寬廣多種可用作為熱繪圖記錄材料之熱感應組合物 揭示於GB l,245,924(Agfa),故可成像層之任何指定區域之 指定溶劑之溶解度可經由加熱該層而予增高,加熱方式係 經由間接曝露於短時間高強度可見光及/或紅外輻射,該可 見光或紅外輻射係由與記錄材料接觸的圖形原本背景區透 射或反射而來。所述系統可改變且可藉多種不同機構操作 ,以及使用由水至氯化有機溶劑的不同顯像材料操作。包 括於所揭示之可藉水性顯像之組合物範圍者為包括甲階酚 醛清漆樹脂之組合物。該專利案說明此種樹脂之塗膜於加 熱時顯不溶解度增高。組合物含有吸熱化合物例如碳黑或 密洛利藍(Milori Blue)(C.I.顏料藍27),此等材料可額外著 色顏色而用作為記錄媒體。 (請先閱讀背面之注意事項再填寫本I)-7-573208 A7 B7 5. Description of the invention (5) Indigocyanine pigments can also be used as radiation absorbing materials that convert absorbed incident light into heat. WO99 / 08879 (Horsell) describes the application of radiation-sensitive compositions for the manufacture of printed boards and their electronic components and for the manufacture of covers. These coatings are based on phenolic resins, which are typically poor in mechanical properties. WO99 / 01795 (Horsell) describes a method for manufacturing a predetermined resist pattern such as a printed board, a circuit board or a cover. This method is characterized by the use of a novel polymeric material that becomes functionally functionalized to become insoluble in the developer but has the property of being exposed to light and becoming soluble in the developer. These groups are not azide anion groups as in the conventional system, but are groups that do not release nitrogen when exposed to radiation and have hydrogen bonding capabilities. Such groups are, for example, 2 · naphthyl fluorenyloxy, 2 ° secenyl% fluorenyloxy, danSyloxy, dansylsulfonyloxy, benzyloxy and n-butyl The group continues with fluorenyloxy. W099 / 21725 (Horsell) describes a composition based on a novolac novolac resin for use in the manufacture of photolithographic printing plates. The solubility of the composition in the aqueous developer is increased in the heating zone. The composition contains a compound which increases the resistance to development (dissolution) in an aqueous developer in a non-heated zone of the heat-sensitive composition. The composition includes a variety of compounds including A) poly (cycloalkoxy) units; B) silane units; and C) esters, ethers, and amines of polyols. WO 98/42507 (Kodak Multicolor Graphics Corporation) discloses a positive-acting thermal composition that can be imaged using infrared radiation lasers without a post-exposure baking step and without any overflow exposure step. This composition includes a phenol-based resin, an infrared radiation absorbing compound, and a non-photosensitive dissolution inhibitor. The dissolution inhibitor can provide hydrogen bonding with the phenolic position of the binder resin. ⑽) Shun grid (please read the notes on the back before filling out this page) Order —: Line · 573208 A7 £ 7_ V. Description of the invention (6) Knot position. WO 99/08157 (Kodak Multicolor Graphics Corporation) provides an infrared imaging composition containing two main components: a non-basic infrared radiation absorbing material (such as carbon black) and a phenol-based resin, a phenol-based resin mixture or a reactive azide Naphthol derivatives. These compositions can be used in positive- or negative-acting imaging modes such as photolithographic printing plates. WO 99/11458 (Kodak Multicolor Graphics Corporation) also describes a phenol-based resin (or other polymers with bypass groups, acid, ammonium, nitric acid, or a combination thereof) and an infrared Light absorbing compound. The imaging layer also contains a polymer with a bypass group with a bond, and the bypass group is 2-naphthoquinonediazide, a hydroxyl group, a carboxylic acid, a sulfonamide, a nitrile, and the like. The imaging layer also contains a solubility inhibitor, a visible light dye, or both. A wide variety of thermal sensing compositions that can be used as thermal mapping recording materials are disclosed in GB 1,245,924 (Agfa), so the solubility of a specified solvent in any specified area of the imageable layer can be increased by heating the layer. The heating method is indirectly Exposure to high-intensity visible light and / or infrared radiation for a short period of time, the visible light or infrared radiation is transmitted or reflected from the original background area of the pattern in contact with the recording material. The system can be modified and operated by a number of different mechanisms, as well as using different imaging materials from water to chlorinated organic solvents. Included within the scope of the disclosed compositions that can be developed by water are compositions that include resole novolac resins. The patent shows that the coating film of this resin shows increased insolubility when heated. The composition contains an endothermic compound such as carbon black or Milori Blue (C.I. Pigment Blue 27), which can be used as a recording medium in addition to coloring. (Please read the notes on the back before filling in this I)

J-T 線· 本紙張尺度適用中國國家標华(CNS) 八4规格(2]〇\297公漦) 573208 A7 _ B7_ 五、發明説明(7 ) 就發明人所知,極少有正作用熱敏組合物直接與使用 LDI製造印刷電路板有關且係述於專利參考文獻。若干此 類型組合物敘述於美國專利5,641,608(McDermid),但於印 刷電路板之銅表面上之塗布組合物事先使用紫外光雷射, 且在之後再藉由紅外光雷射掃瞄。該專利案之另一例正作 用熱抗姓劑不含任何可將紅外光轉成熱的輻射吸收材料, 故未明確了解如何可透過紫外光之組合物可改變其化學( 保護作用之第三丁氧羰基之進行酸性水解)而於顯像劑溶 液内提供差異。有關負作用組合物曝露於紅外光束亦未明 ,此處負作用組合物於銅上方對紫外光為透光的塗膜不含 有輻射吸收材料。 施用作為單層乾膜之正作用抗光蝕劑相對於負作用 乾抗餘劑用於製造印刷電路板之優點述於Ep 0848290(Morton)及Τ·Α· Koes及S.H. Wheeler,IPC Expo 98 議事錄,S12-3-1。 熱敏負作用抗姓劑組合物例如呈現於美國專利 5,512,418 (Ma,杜邦公司),聚合成像區所需能量係在6〇〇 亳焦/平方厘米之範圍,而成像所需時間極長,無法解決印 刷電路板業界需要高產出量的要求。 聚乙烯基縮醛聚合物,特別聚乙烯基丁醛類用於寬廣 多種產物作為黏結劑,原因在於其具有絕佳膜形成性質以 及傑出機械特性,此等聚合物也已知為對化學攻擊具有極 佳抗性的材料。此等聚合物之用途之一作應用於輻射敏感 組合物’此處其係作為負作用印刷板製造之黏結劑,以及 本紙張尺度適财關家鮮(CNS) A4規格⑵ϋχ297公幻 — -10 - -------------------:…裝! (請先閱讀背面之注意事項再填寫本頁) 訂 :線丨 573208 A7 B7_ 五、發明説明(8 ) 製造印刷電路板業界的抗光蝕劑。聚乙烯基丁醛類或聚乙 烯基甲醛類述於不溶於印刷板或印刷電路板製造時使用的 水性顯像劑的材料。曾經提出多種不同聚合物可用於負作 用紫外光敏感組合物作為黏結劑而提供所需的水性溶解度 〇 對縮醛部分含有羥基或羧基之聚合物達成特殊優點。 此等黏結劑聚合物述於美國專利4,665,124;4,940,646 ;5,169,898 ; 5,169,897 ; 5,700,619。含有樹脂黏結劑之光 敏材料,包括具有酚系羥基之乙烯系聚合物以及僅具有單 一重氮基之芳族族重氮鏘鹽揭示於美國專利第4,374,193 號含有對-羥苄醛部分之聚合物也述於美第5,792,823號作 為於微影術之化學放大正作用抗蝕劑的聚合物前驅物,但 羥苄醛縮醛聚合物本身未用於正作用抗蝕劑層作為組合物 。JP 09,328,519教示類似的乙烯基縮醛用作為氧抑制劑。 發明概述 本發明提供新穎正作用可熱成像組合物及元件。正作 用可熱活化組合物包含熱吸收成分、黏著促進劑以及特殊 類別之熱敏縮醛聚合物作為樹脂黏結劑成分。較佳本發明 之成像元件為基於此等聚合物之熱敏組合物,其當使用藉 雷射成像裝置施用的近紅外光波長照射時,進行熱减廣、而 改變其於弱鹼溶液之溶解度。 因此根據第一具體實施例,本發明包含一種縮酸聚合 物載有下列重複單位於聚合物主鏈·· 本紙張尺度適用中國國家標準(CNS) A4规格(2]0X297公箭) (請先閱讀背面之注意事項再4寫本頁) *tr· :r 11 573208 A7 __ B7 五、發明説明(9 ) 一,广—咖广”十卜一卜一 、/ 、/° 〇\ /0 { 从 r r > c 1 2 *1 其中JT line · This paper size is applicable to China National Standards (CNS) 8 4 specifications (2] 〇 \ 297 public 漦) 573208 A7 _ B7_ V. Description of the invention (7) As far as the inventors know, there are very few positive-acting thermosensitive combinations The objects are directly related to the manufacture of printed circuit boards using LDI and are described in patent references. Several compositions of this type are described in U.S. Patent No. 5,641,608 (McDermid), but the coating composition on the copper surface of the printed circuit board uses an ultraviolet laser beforehand, and is then scanned by an infrared laser. Another example of this patent is that the positive-acting thermal anti-agent does not contain any radiation-absorbing material that can convert infrared light into heat, so it is not clear how the composition that can transmit ultraviolet light can change its chemistry. The oxycarbonyl group undergoes acidic hydrolysis) and provides a difference in the developer solution. The exposure of the negative-acting composition to the infrared beam is also unknown. Here, the negative-acting composition does not contain a radiation-absorbing material on the coating film that is transparent to ultraviolet light over copper. The advantages of using a positive-acting photoresist over a negative-acting dry reactant as a single-layer dry film for the manufacture of printed circuit boards are described in Ep 0848290 (Morton) and ΤΑ · Koes and SH Wheeler, IPC Expo 98. Record, S12-3-1. The heat-sensitive negative-acting anti-surname agent composition is presented in, for example, US Patent No. 5,512,418 (Ma, DuPont). The energy required for the polymerization imaging area is in the range of 600 μJ / cm2, and the time required for imaging is extremely long. Addressing the need for high throughput in the printed circuit board industry. Polyvinyl acetal polymers, particularly polyvinyl butyrals, are used in a wide variety of products as adhesives because of their excellent film-forming properties and outstanding mechanical properties. These polymers are also known to have a chemical attack resistance. Very resistant material. One of the uses of these polymers is in the application of radiation-sensitive compositions' here they are used as binders for the manufacture of negative-acting printing plates, and the paper size is suitable for financial and domestic use (CNS) A4 specifications ⑵ϋχ297 公 幻 — -10- -------------------: ... fit! (Please read the precautions on the back before filling this page) Order: Line 573208 A7 B7_ V. Description of the invention (8) Manufacture of photoresist in the printed circuit board industry. Polyvinyl butyraldehydes or polyvinyl formaldehydes are described as materials that are insoluble in water-based developers used in the manufacture of printed boards or printed circuit boards. It has been proposed that a number of different polymers can be used for negative effects. The UV-sensitive composition can be used as a binder to provide the required aqueous solubility. 〇 Special advantages are achieved for polymers containing hydroxyl or carboxyl groups in the acetal moiety. These binder polymers are described in U.S. Patents 4,665,124; 4,940,646; 5,169,898; 5,169,897; 5,700,619. Photosensitive materials containing a resin binder, including an ethylene polymer having a phenolic hydroxyl group and an aromatic diazonium salt having only a single diazo group are disclosed in U.S. Patent No. 4,374,193, a polymer containing a p-hydroxybenzaldehyde moiety It is also described in U.S. Patent No. 5,792,823 as a polymer precursor of a chemically amplified positive-acting resist in lithography, but the hydroxybenzaldehyde acetal polymer itself is not used for the positive-acting resist layer as a composition. JP 09,328,519 teaches similar vinyl acetals for use as oxygen inhibitors. SUMMARY OF THE INVENTION The present invention provides novel positive-acting thermal imaging compositions and components. The positive-acting heat-activatable composition contains a heat-absorbing component, an adhesion promoter, and a special type of heat-sensitive acetal polymer as a resin binder component. It is preferable that the imaging element of the present invention is a heat-sensitive composition based on these polymers, and when it is irradiated with a wavelength of near-infrared light applied by a laser imaging device, it is thermally broadened to change its solubility in a weak alkaline solution. . Therefore, according to the first specific embodiment, the present invention includes an acidic polymer containing the following repeating units in the polymer main chain. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (2) 0X297 male arrow. (Please first Read the notes on the back and then write this page again) * tr ·: r 11 573208 A7 __ B7 V. Description of the invention (9) I. Canton-Ca Canton "Shibuyibuyi, /, / ° 〇 \ / 0 { From rr > c 1 2 * 1 where

Ri為-CnH2n+i此處n=M2 ; R2為酚基,其不含取代基或含有丨(較佳至多至3個)額 外取代基選自-HO ’ -OCH3,Br-及-N02或_c〇CH組成的組 群;其至少部分可以下式表示:Ri is -CnH2n + i where n = M2; R2 is a phenol group, which contains no substituents or contains (preferably up to 3) additional substituents selected from -HO'-OCH3, Br- and -N02 or a group of _c〇CH; at least part of it can be expressed by the following formula:

其中 R4=-〇H ; R5=-OH 或-OCH3 或 Br-或-〇-CH2-C=CH ;AR6=Br或N〇2 R3=-(CH2)2-COOH,-C三CH,或 此處 r7=cooh,-(CH2)3-COOH,-〇-(CH2)2-COOH, 以及m=5-40 %莫耳比,較佳15至35 %莫耳比 n=10-60 %莫耳比,較佳20至40 %莫耳比 〇=0-20 %莫耳比,較佳〇至1〇 %莫耳比 p=l-20 %莫耳比,較佳isio %莫耳比 q=5-50 %莫耳比,較佳15至4〇 %莫耳比 如上結構式指示,本發明之縮醛聚合物可為四元體, 其中重複單位包括一乙酸乙烯酯部分以及一乙烯醇部分, 以及一第一及第二環狀縮醛基;或為五元體其中重複單位 本紙張尺度Where R4 = -〇H; R5 = -OH or -OCH3 or Br- or -〇-CH2-C = CH; AR6 = Br or No 2 R3 =-(CH2) 2-COOH, -C tri-CH, or Here r7 = cooh,-(CH2) 3-COOH, -〇- (CH2) 2-COOH, and m = 5-40% mole ratio, preferably 15 to 35% mole ratio n = 10-60% Molar ratio, preferably 20 to 40% Molar ratio = 0 = 0-20% Molar ratio, preferably 0 to 10% Molar ratio p = 1-20% Molar ratio, preferably isio% Molar ratio q = 5-50% mole ratio, preferably 15 to 40% mole. As indicated in the above structural formula, the acetal polymer of the present invention may be a quaternary, wherein the repeating unit includes a vinyl acetate moiety and an ethylene An alcohol moiety, and a first and a second cyclic acetal group; or a pentad in which the repeating unit is the paper size

-12 - 573208 A7 ____B7__ 五、發明説明(10 ) 包含一乙烯醇部分,一乙酸乙烯酯部分,以及一第一、第 二及第三環狀縮醛基。全部三環狀縮醛基皆為六員環狀縮 醛基,其中一者以烷基取代,而另一者以取代有羥基_或經 基-及烧氧基-、或羥基-及瑞基-及溴-基之芳族基取代;以 及第三者係以酸基、酸取代烧基或酸取代芳基取代。當 R5=-C = CH時,可獲得於銅表面特別有利的優點。該特定 基(容後詳述)可提供對銅面的良好黏著性。於聚合物本身 内部提供基可進一步減少用於本發明組合物之混料需求。 發明之詳細說明 實施本發明之一主要組成係選擇可用於正作用抗蝕 劑層之熱敏聚合物成分。概略如前述,縮醛聚合物須包含 至少約5至至多約60%莫耳比盼系基(或於聚合物鏈之單位 數目百分比): 其中: V。 ▽。、夕 i。心 r r r ^ 111為-(:1^211+1 此處n=l-12 ; R2為齡基’其不含取代基或含有1(較佳至多至3個)額 外取代基選自-HO ’ -0CH3,Br-及·Ν02或-C0CH組成的組 群;其至少部分可以下式表示: 本紙張尺度適用中國國家標準(CNS) Α4规格(2]0Χ297公釐) ------------------------裝—— (請先閱讀背面之注意事項再填寫本頁) •訂· ..線丨 13 573208 A7 ^__B7_ 五、發明説明(11 ) 其中 R4=-OH ; R5=-〇h 或-〇ch3 或 Br-或·O-CHrOCH ;&R6=Br或 N〇2 R3=-(CH2)2-CO〇H,-C^CH,或 香, 此處r7=cooh,-(CH2)3-COOH,·0·((:Η2)2<00Η, 以及約5-40 〇/〇莫耳比,較佳15至35 %莫耳比 n=約5-60或約10-60 %莫耳比,較佳2〇至4〇 %莫耳比 〇=0-20 %莫耳比,較佳〇至1〇 %莫耳比 p=l-20 %莫耳比,較佳1至1〇 %莫耳比 q=5-50 %莫耳比,較佳15至4〇 %莫耳比 此等基之比例改變讓業界人士可修改聚合物性質配 合用於本發明實務之抗蝕劑元件之抗蝕劑處理所需的任何 特定需求。使用較低百分比所需酚系取代基(例如5_4〇0/〇, 10-30%,15-30%)可提供較高撓性且較低脆性之聚合物; 而使用較南百分比(例如30-60%,35-50%)可提供更易藉熱 能溶解的聚合物。提供於聚合物鏈之其它鍵聯基進一步調 整聚合物亦屬本發明之範圍。 使用「聚合物鏈包含」一詞或使用其它具有非法定限 制的語言時,該語言允許其它基存在於聚合物鏈。當使用 「聚合物鏈之主要組成」或「聚合物鏈之組成」等言詞時 ’該詞表示僅限於一般類型於聚合物鏈上的重複單位,而 本紙張尺度適用中國國家標华(CNS) A4规格(210X297公釐) 14 573208 A7 B7 五、發明説明(12 不可應用於聚合物鍵單位本身的取代。如前述,此等聚合 物述於專利參考文獻,發明人提供一種此處所述新穎方法 其顯然可優異地用於聚合物製造過程控制酚系取代基用量 如刖結構式指示,本發明之縮酸聚合物可為所需四元 體縮盤聚合物或五元體聚合物。於四元體聚合物中,重複 單位包含如上定義之乙酸乙烯酯部分及乙烯醇部分及以第 一及第二環狀縮醛基。於五元體中,重複單位包含前述乙 烯醇部分、乙酸乙烯酯部分及以第一、第二及第三環狀縮 酸基。前述三個縮醛基皆為六員環狀縮醛基,其中一者以 烷基取代,另一者以芳族基取代,而芳族基係以羥基_,或 羥基-及烷氧基-,或羥基·以及選擇性硝基_、溴-基及乙炔 基-OC-取代;以及第三可縮醛基係以酸基、酸取代烷基 或酸取代芳基取代。 本發明之熱吸收成分可選自任一種已知材料,其可吸 收紅外光且將其轉成熱。此等材料包括例如有機及無機染 料及顏料,其吸收紅外光且將其轉成熱。 石反黑,某些花青顏料,角鯊林(SqUarine)染料,角鯊 烯鑰染料,花青染料,布花青染料,噚英鑕染料,苯并吲 ®鑽染料,金屬氧化物,金屬硫化物及其它業界已知可吸 收近、外光區之材料類別。組合物内之紅外光吸收性熱轉 換材料之存在量係基於系統之定址敏感度正常考慮之需要 之熱量、紅外光源強度、曝光時間(例如來自雷射之脈衝長 度)以及其它解決系統敏感度時正常考慮之因素選擇。通常 A4规格(2]0X297公资) (請先閒讀背面之注意事項再填寫本頁) :線丨 本紙張尺度適用"Ϊ國國家標準(CNS) 15 573208 A7 B7 五、發明説明(13 熱吸收成分之存在量係占組合物之〇.;[至2〇%重量比,占組 合物之0.5至10%重量比,占組合物之ο』至8%重量比,或 占組合物之1至7〇/〇重量比。可使用更高含量,但較高量將 影響抗I虫層之物理性質。可使用較低含量,但必須使用對 該為最理想之雷射系統。 基於本發明聚合物之熱敏組合物可提供光刻術印刷 板’其特徵為具有改良耐磨性、延長壓縮性能,以及另一 重大優點為可於不含有機溶劑之鹼性顯像溶液處理。相信 由後述根據本發明之最理想化組合物製成的光刻術印刷板 將可從事500,〇〇〇次印刷。 基於本發明之聚合物之熱敏組合物,也提供具有高解 析度之高密度印刷電路板,原因在於其具有絕佳薄膜形成 性質以及改良黏著性,結果導致於相對低厚度及低成本時 之低瑕疵或無瑕疵抗蝕劑塗層,照光以及未曝露區之溶解 度可明顯甄別,以及對酸性及鹼性蝕刻劑具有良好蝕刻抗 性,以及於水性鹼性溶液具有良好去除能力。 根據本發明之另一特徵方面也提供此種組合物之優 點,可由液體施用或可積層於乾燥單層膜於基材上用於製 造印刷電路板,原因在於本發明組合物具有最理想化之熱 及機械特性。 為了提高本發明之熱敏組合物之敏感度,結合可吸收 入射紅外光及將其轉成熱之輻射吸收劑。適用於本發明之 熱敏組合物之輻射吸收性材料可選自寬廣有機及無機顏料 例如碳黑’金屬氧化物,口引花青等。紅外光吸收性染料 本紙張尺度適用中國國家標準(CNS)人4規袼(2]〇Χ297公督) (請先閱讀背面之注意事項再填寫本頁) II -------- .線丨 16 573208 A7 _ B7 … " 1 1 " · ' - ' 丨丨 ____ _ 五、發明説明(14 ) 亦屬較佳熱吸收劑,其可用於本發明組合物。特別吸收比 700毫微米更長,例如700及1300亳微米波長者,通常使用 近紅外光吸收材料(介於約700至1 〇〇〇亳微米)。 本發明也包括聚乙烯系縮醛樹脂攙合物,聚乙婦系縮 酸樹脂係衍生自前述含有經基及/或其它官能基之脂質及 务吳酸類’與下列其它聚合物之攙合物,例如丙婦酸g旨類 、甲基丙烯酸酯類、聚胺基甲酸酯類、苯乙烯_馬來酐共聚 物、酚系、聚乙烯基酮類、烷基乙烯基醚類、纖維素衍生 物、環氧樹脂及其它樹脂。此等其它樹脂也提供有利用於 本發明之抗蝕劑塗層之特殊用途之額外物理性質。例如更 多親油性樹脂或聚合物可用於提高光蝕劑元件之油墨性質 。對特定表面具有較佳黏著性之熱可軟化聚合物也可添加 至本發明使用之一次聚乙烯系縮醛樹脂,俾改良黏著性以 及特別改良乾膜積層性,此處使用乾膜積層抗蝕劑。 本發明之另一特徵方面係提供一種合成前述聚合物 之方法。本發明提供之方法方便經由含羥基之芳族醛而使 用之酸具有高轉化程度達成聚乙嫦基經基之高度縮駿化反 應。 本發明之另一特徵方面係提供一類新穎本發明之抗 蝕劑組合物之黏著促進劑用於改良塗層抗蝕劑對至少銅表 面之黏著性質,原因在於黏著促進劑内部之參鍵(乙炔鍵) 對銅具有親和力之故。 本發明之熱敏組合物適用於藉熱模成像製造印刷電 路板時作為熱敏正作用抗蝕劑,以及應用於亦藉熱雷射成 本紙張尺度適用中國國家標準(QsjS)从規格(2]〇χ297公釐)-12-573208 A7 ____B7__ 5. Description of the invention (10) Contains a vinyl alcohol moiety, a vinyl acetate moiety, and a first, second and third cyclic acetal group. All tricyclic acetal groups are six-membered cyclic acetal groups, one of which is substituted by an alkyl group and the other is substituted by a hydroxy group or a vial group and an alkoxy group, or a hydroxy group and a aryl group. -And bromo-based aromatic group substitution; and the third is substituted with an acid group, an acid-substituted alkyl group, or an acid-substituted aryl group. When R5 = -C = CH, a particularly advantageous advantage can be obtained on the copper surface. This specific base (detailed later) provides good adhesion to the copper surface. Providing the base inside the polymer itself can further reduce the need for compounds for use in the compositions of the present invention. DETAILED DESCRIPTION OF THE INVENTION One of the main components for implementing the present invention is to select a thermosensitive polymer component that can be used in a positive-acting resist layer. As outlined above, the acetal polymer must contain at least about 5 to about 60% of a Morbibene group (or a percentage of the number of units in the polymer chain): where: V. ▽. , Xi i. Heart rrr ^ 111 is-(: 1 ^ 211 + 1 where n = l-12; R2 is an age group 'which contains no substituents or contains 1 (preferably up to 3) additional substituents selected from -HO' -0CH3, Br- and · N02 or -C0CH group; at least part of it can be expressed by the following formula: This paper size applies the Chinese National Standard (CNS) Α4 specification (2) 0 × 297 mm) ------- ----------------- 装 —— (Please read the precautions on the back before filling this page) • Order · .. Line 丨 13 573208 A7 ^ __ B7_ 5. Description of the invention ( 11) where R4 = -OH; R5 = -〇h or -〇ch3 or Br- or -O-CHrOCH; & R6 = Br or No2 R3 =-(CH2) 2-CO〇H, -C ^ CH, or incense, where r7 = cooh,-(CH2) 3-COOH, · 0 · ((: Η2) 2 < 00Η, and a molar ratio of about 5-40 〇 / 〇, preferably 15 to 35% Mo Ear ratio n = about 5-60 or about 10-60% mole ratio, preferably 20 to 40% mole ratio 0 = 0-20% mole ratio, preferably 0 to 10% mole ratio p = 1-20% Morse ratio, preferably 1 to 10% Morse ratio q = 5-50% Morse ratio, preferably 15 to 40% Morse ratio The ratio of these bases is changed to allow the industry to modify Polymer properties combined with resist elements used in the practice of this invention Any specific needs required for resist processing. Using a lower percentage of the required phenolic substituents (for example, 5-40 / 0, 10-30%, 15-30%) can provide higher flexibility and lower brittleness. Polymers; and the use of souther percentages (such as 30-60%, 35-50%) can provide polymers that are easier to dissolve by thermal energy. Other linking groups provided in the polymer chain to further adjust the polymers are also within the scope of the present invention When using the term "polymer chain contains" or other language with illegal restrictions, the language allows other groups to exist in the polymer chain. When using "major composition of the polymer chain" or "composition of the polymer chain" The word 'in the words' means that it is limited to repeating units of the general type on the polymer chain, and this paper size applies to China National Standard (CNS) A4 specifications (210X297 mm) 14 573208 A7 B7 V. Description of the invention Applied to the substitution of the polymer bond unit itself. As mentioned above, these polymers are described in patent references, and the inventors have provided a novel method described herein that is clearly excellent for controlling phenolic substitution in polymer manufacturing processes The amount of the base is as indicated by the structural formula of fluorene. The acid-condensation polymer of the present invention may be a desired quaternary polymer or a pentad polymer. In the quaternary polymer, the repeating unit includes vinyl acetate as defined above. Moieties and vinyl alcohol moieties and with first and second cyclic acetal groups. In the pentad, the repeating unit includes the aforementioned vinyl alcohol moiety, vinyl acetate moiety, and the first, second, and third cyclic acid groups. The aforementioned three acetal groups are all six-membered cyclic acetal groups, one of which is substituted by an alkyl group and the other by an aromatic group, and the aromatic group is hydroxy_, or hydroxy- and alkoxy- Or hydroxy · and optionally nitro-, bromo-, and ethynyl-OC- substitution; and the third acetal group is substituted with an acid group, an acid-substituted alkyl group, or an acid-substituted aryl group. The heat absorbing component of the present invention may be selected from any known material which can absorb infrared light and convert it into heat. Such materials include, for example, organic and inorganic dyes and pigments, which absorb infrared light and convert it into heat. Stone anti-black, certain cyanine pigments, SqUarine dyes, squalene dyes, cyanine dyes, cloth cyanine dyes, amaranth dyes, benzoin® diamond dyes, metal oxides, metals Sulfides and other types of materials known in the industry to absorb near and outer light areas. The amount of infrared light-absorbing thermal conversion material in the composition is based on the heat normally required for the system's addressing sensitivity, the intensity of the infrared light source, the exposure time (such as the pulse length from the laser), and other solutions to system sensitivity. Selection of factors for normal consideration. Usually A4 specifications (2) 0X297 public capital (please read the precautions on the back before filling out this page): line 丨 this paper size applies " Lao National Standard (CNS) 15 573208 A7 B7 V. Invention Description The amount of the heat-absorbing component is 0.00% of the composition; [to 20% by weight, 0.5 to 10% by weight of the composition, ο 'to 8% by weight of the composition, or 1 to 70/0 weight ratio. Higher content can be used, but higher amount will affect the physical properties of the anti-I insect layer. Lower content can be used, but the laser system which is the most ideal for this must be used. Based on this The thermosensitive composition of the inventive polymer can provide a photolithographic printing plate, which is characterized by improved abrasion resistance, extended compression properties, and another major advantage is that it can be processed in an alkaline imaging solution that does not contain organic solvents. It is believed that A photolithographic printing plate made of the optimized composition according to the present invention described later will be able to perform 500,000 printings. The heat-sensitive composition based on the polymer of the present invention also provides high resolution Density printed circuit board due to its excellent film Formation properties and improved adhesion, resulting in low-defect or non-defective resist coatings at relatively low thickness and low cost, which can clearly distinguish the solubility of light and unexposed areas, as well as good acid and alkaline etchant Etching resistance and good removal ability in aqueous alkaline solution. According to another characteristic aspect of the present invention, it also provides the advantages of such a composition, which can be applied by liquid or can be laminated on a dry monolayer film on a substrate for manufacturing The printed circuit board is because the composition of the present invention has optimal thermal and mechanical characteristics. In order to increase the sensitivity of the heat-sensitive composition of the present invention, a radiation absorber that can absorb incident infrared light and convert it into heat is combined. The radiation-absorbing material suitable for the heat-sensitive composition of the present invention can be selected from a wide range of organic and inorganic pigments such as carbon black 'metal oxides, cyanine, etc. Infrared light-absorbing dyes The paper dimensions are applicable to Chinese national standards (CNS ) People 4 rules (2) 0 × 297 Governor (please read the precautions on the back before filling this page) II --------. Line 丨 16 573208 A7 _ B7 " 11 Those with a wavelength of 1300 μm usually use near-infrared light absorbing materials (between about 700 and 1000 μm). The present invention also includes polyethylene-based acetal resin adducts, and polyethylene-acetal resin derivatives. Blends of the aforementioned lipids and uronic acids containing meridian and / or other functional groups with the following other polymers, such as hyaluronic acid, methacrylates, polyurethanes, benzene Ethylene-maleic anhydride copolymers, phenols, polyvinyl ketones, alkyl vinyl ethers, cellulose derivatives, epoxy resins and other resins. These other resins also provide additional physical properties that are advantageous for the particular use of the resist coatings of the present invention. For example, more lipophilic resins or polymers can be used to improve the ink properties of photoresist elements. A heat-softenable polymer with better adhesion to a specific surface can also be added to the primary polyethylene acetal resin used in the present invention to improve adhesion and especially improve dry film lamination. Here, dry film lamination is used. Agent. Another characteristic aspect of the present invention is to provide a method for synthesizing the aforementioned polymer. The method provided by the present invention facilitates the use of an acid having a high degree of conversion through an aromatic aldehyde containing a hydroxyl group to achieve a high shrinkage reaction of a polyethylene glycol radical. Another characteristic aspect of the present invention is to provide a novel type of adhesion promoter of the resist composition of the present invention for improving the adhesion property of the coating resist to at least the copper surface, because of the internal bond (acetylene) in the adhesion promoter. Bond) because of its affinity for copper. The heat-sensitive composition of the present invention is suitable for use as a heat-sensitive positive-acting resist when manufacturing printed circuit boards by thermal mold imaging, and is also applied to thermal paper cost. Paper standards are applicable to Chinese national standards (QsjS) from specifications (2) 〇χ297 mm)

.訂----- •拿 (請先閱讀背面之注意事項再填寫本頁) 17 573208 A7 —-------B7_ 五、發明説明(15 ) 像時作為正作用印刷形式前驅物,具有概略對正作用液熱 態抗钱劑所述優點。(IPC秀98議事錄,Εν· Halevy,Yossi -· 裝—— (請先閱讀背面之注意事項再4寫本頁).Order ----- • Take (Please read the precautions on the back before filling out this page) 17 573208 A7 —------- B7_ V. Description of the invention (15) As a precursor in positive printing form , Has the advantages outlined for positive action liquid thermal anti-money. (Proceedings of IPC Show 98, Εν · Halevy, Yossi-· Outfit—— (Please read the notes on the back before writing this page)

Atiya)。顯像後組合物之另一項優點為可形成具有良好機 械性吳的薄膜,以及對基材例如印刷板製備用之陽極化鋁 以及印刷電路板製造用之銅護罩具有改良黏著性。可由液 體施用組合物或藉熱輥積層呈為乾膜提供本組合物之另一 項優點。 使用以水為主且不含有機溶劑之顯像劑以及介於已 照射未曝露區於其顯像劑具有良好溶解度飘別力等優點提 供下述熱敏組合物之額外優點。最後,組合物對白光不敏 感’因此可將塗層產物於白光下處理。 本發明之抗#劑元素概略描述為正作用熱抗钱劑元 件,包含金屬基材其於基材之至少一面上黏著有一層正作 用抗熱I虫劑層包含: :線- 一種縮醛聚合物包含5-40。/。(莫耳基準)脂質縮醛基,以 及10_60〇/〇(莫耳基準)酚系縮醛基,以及 紅外線吸收材料其含量係占正作用抗熱蝕層之〇〇1至 20或30%重量比。抗蝕劑層厚度較佳由is%微米,但若施 用為乾膜抗熱蝕層,則較佳為較厚,例如3至5〇微米或5_5〇 微米,或10-50微米。於本發明之聚合物組合物執行的溶解 度改變充分持久,因此無需作即刻顯像。由熱成像形成的 潛像可持續數曰。 本發明之聚乙稀基縮酸聚合物包含載有如下重複單 位於聚合物主鏈之縮醛聚合物: 本紙張尺度適用中國國家標準(CNS) A4规格(2Kj><297公赞) 18 573208 五、發明説明(16Atiya). Another advantage of the developed composition is that it can form a thin film with good mechanical properties, and it has improved adhesion to substrates such as anodized aluminum for printed board preparation and copper shields for printed circuit board manufacturing. Another advantage of this composition is that it can be applied as a liquid film or laminated by a heat roller to provide a dry film. The advantages of using a developer mainly composed of water and containing no organic solvent and having good solubility in the developer between the exposed and unexposed areas provide additional advantages of the heat-sensitive composition described below. Finally, the composition is not sensitive to white light ' so the coating product can be treated under white light. The anti- # agent element of the present invention is roughly described as a positive-acting thermal anti-depressant element, which includes a metal substrate, and a layer of positive-acting thermal anti-insectant is adhered to at least one side of the substrate.物 Contains 5-40. /. (Mole basis) lipid acetal group, and 10-60 / 100 (Mole basis) phenol-based acetal group, and infrared absorbing material, the content of which is 0.001 to 20 or 30% by weight of the positive-acting thermal erosion layer ratio. The thickness of the resist layer is preferably is% micrometer, but if applied as a dry film anti-corrosion layer, it is preferably thicker, such as 3 to 50 micrometers or 5 to 50 micrometers, or 10-50 micrometers. The solubility change performed in the polymer composition of the present invention is sufficiently long-lasting, so that no immediate development is required. The latent image formed by thermal imaging can last several days. The polyethylene acetal polymer of the present invention includes an acetal polymer carrying the following repeating units on the polymer main chain: This paper is sized to the Chinese National Standard (CNS) A4 (2Kj > < 297 public praise) 18 573208 V. Description of Invention (16

CHCH

CH ίΗιCH ίΗι

其中· Ri為-CnH2n+i此處n=l-12 ; R2為 或Where Ri is -CnH2n + i where n = l-12; R2 is or

其中 R4=-OH ; R5=-OH或-OCH3或Br-或-〇-CH2-CECH 及 R6=-Br 或 N〇2 R3=-(CH2)2-COOH或-C Ξ CH或 ------------------------裝…: (請先閱讀背面之注意事項再填寫本頁}Where R4 = -OH; R5 = -OH or -OCH3 or Br- or -〇-CH2-CECH and R6 = -Br or No 2 R3 =-(CH2) 2-COOH or -C Ξ CH or --- --------------------- Install ...: (Please read the precautions on the back before filling this page}

.、一叮· :線丨 此處r7=cooh,-(CH2)4COOH,_0-(CH2)3C00H 以及m=約5-40 %莫耳比,較佳15至35 %莫耳比 n=約10-60 %莫耳比,較佳20至40 %莫耳比 〇=0-20 %莫耳比,較佳〇至1〇 %莫耳比 p=l-20 %莫耳比,較佳1至10 %莫耳比 q=5-50 %莫耳比,較佳15至40 %莫耳比 如上結構式指示,本發明之縮醛聚合物可為四元體, 其中重複單位包括一乙酸乙烯酯部分以及一乙嫦醇部分, 以及一第一及第二環狀縮酸基,或為五元體其中重複單位 包含一乙酸乙稀酯部分,以及一第一、第二及第三環狀縮 本紙張尺度適用中國國家標準(CNS) A4规格(230X297公釐) 19 573208., One bite: line 丨 here r7 = cooh,-(CH2) 4COOH, _0- (CH2) 3C00H and m = about 5-40% mole ratio, preferably 15 to 35% mole ratio n = about 10-60% mole ratio, preferably 20 to 40% mole ratio 0 = 0-20% mole ratio, preferably 0 to 10% mole ratio p = 1-20% mole ratio, preferably 1 To 10% Morse ratio q = 5-50% Morse ratio, preferably 15 to 40% Morse As indicated in the above structural formula, the acetal polymer of the present invention may be a quaternary, wherein the repeating unit includes vinyl acetate An ester moiety and an ethyl alcohol moiety, and a first and second cyclic acid group, or a pentad in which the repeating unit includes an ethyl acetate moiety, and a first, second, and third cyclic Reduced paper size applies to Chinese National Standard (CNS) A4 (230X297 mm) 19 573208

五、發明説明(17 A7V. Description of the invention (17 A7

醛基。全部三環狀縮酸基皆為六員環狀祕基,其中一者 以烧基取代,而另-者以取代有㈣-或㈣-及燒氧基… 或經基-及硝基-及漠-基之芳族基取& ;以及第三者係以酸 基、酸取代烷基或酸取代芳基取代。 選用此種熱敏聚合物聚結構至少有若干原因為,基於 聚乙稀醇主鏈之聚合物之機械性質已知為優異,薄膜形成 特性卓越,耐磨性極佳,同時對化學攻擊的抗性絕佳。聚 乙烯醇之修改可能性寬廣且容易執行。 含酚系基之縮醛單元主要負責成像(熱敏性),亦即其 作用類似前述以甲階酚醛清漆樹脂為主的聚合物。羥基可 對分子間及分子内氫鍵積聚縮醛氧,或來自主鏈聚合物分 子之其餘經基之氧。此等氫鍵保護聚合物不易溶解於驗性 顯像劑。當材料曝露於入射能源時,輻射吸收材料將吸收 的能量轉成熱,而打斷積聚於塗膜内部的氫鍵,藉此促成 曝露區的溶解度提高。由於此種鍵結打斷結果,出現曝露 區及未曝露區於水性鹼性顯像劑的甄別。此種曝露區及未 曝露區之溶解度甄別乃聚合物薄膜之特有性質,而無需於 調配劑中引進溶解抑制劑例如重氮萘醌(DNQ)或產熱物種 其可月b攻擊聚合物鏈之各部分或鍵聯而提高其溶解度。此 種化合物可存在,但其存在增添材料成分且與抗蝕劑層化 合故非較佳添加劑。加熱區之溶解度實質增加量可用於印 刷電路板製造或光刻術印刷板的製造。由於與任何吸熱顏 料或染料形成熱易感性錯合物,甄別率僅略增,於調配劑 中之用量極小,故僅需顏料或染料來將輕射能轉成熱。 請 先 閱 讀 背 面 之 注 意 事 項 再 填 寫 本 頁Aldehyde group. All tricyclic acid groups are six-membered cyclic mysteryl groups, one of which is substituted with an alkyl group, and the other is substituted with fluorene- or fluorene- and alkoxy group ... The aromatic group of the molyl group is substituted by &; and the third is substituted with an acid group, an acid-substituted alkyl group, or an acid-substituted aryl group. There are at least several reasons for choosing such a thermosensitive polymer polystructure because the polymers based on the polyethylene backbone are known to have excellent mechanical properties, excellent film formation characteristics, excellent abrasion resistance, and resistance to chemical attack. Sex is excellent. Modifications of polyvinyl alcohol are broad and easy to implement. The acetal unit containing a phenolic group is mainly responsible for imaging (heat sensitivity), that is, its function is similar to the aforementioned polymer mainly composed of resole novolac resin. Hydroxyl groups can accumulate acetal oxygen for intermolecular and intramolecular hydrogen bonding, or oxygen from the other radicals of the main chain polymer molecules. These hydrogen-bonding protective polymers are not easily soluble in diagnostic developers. When the material is exposed to incident energy, the radiation absorbing material converts the absorbed energy into heat and breaks the hydrogen bonds accumulated inside the coating film, thereby promoting the solubility of the exposed area. As a result of this type of bond breaking, the exposed and unexposed areas were screened for aqueous alkaline imaging agents. This type of solubility discrimination between exposed and unexposed areas is a peculiar property of polymer films, without the need to introduce dissolution inhibitors such as diazonaphthoquinone (DNQ) or heat-generating species in the formulation, which can attack the polymer chain. The various parts or bonds increase their solubility. Such compounds may be present, but their presence is not a preferred additive as it adds material components and combines with the resist layer. The substantial increase in solubility in the heated zone can be used for printed circuit board manufacturing or photolithographic printing board manufacturing. Due to the formation of thermally susceptible complexes with any endothermic pigments or dyes, the discrimination rate has only slightly increased, and the amount used in the formulation is extremely small, so only pigments or dyes are needed to convert light emission energy into heat. Please read the notes on the back before completing this page

訂 本紙張尺度適用中國國家標华()从規格(2]〇Χ297公赘) 20 573208 A7 I---------— B7 __ 五、發明説明(18 ) 一 ~ 旁出脂族縮醛部分負責熱特性(丁 g)、疏水性_墨水接受 性(用於印刷電路板製造時),或負責防蝕刻性(當用於光刻 術印刷板製造時)。 含有羧酸旁出物縮醛或載有羧酸官能基之芳族基之 第三縮醛基相信可提高於水性顯像劑之溶解度,以及於聚 合物結構上為選擇性。因此,經由最理想化或調整主鏈聚 合物之縮醛與其餘羥基間之比例,可達成一種聚合物具有 多種特定用途的預定特性··敏感度、熱性質(對於乾抗蝕劑 薄膜的積層相當重要)、機械性質、於水性驗性顯像劑具有 經控制的溶解度、抗蝕刻性質以及親水/疏水平衡等性質各 自可藉由根據前文教示說明其對聚合物性質之個別貢獻而 I 改變個別基團操控。 用於根據本發明之熱敏組合物作為主要且唯一黏結 劑樹脂之聚乙烯基縮醛聚合物,該聚合物於水/鹼性顯像劑 之溶解度可進行熱感應變化,該組合物可利用新穎合成手 段始於大規模技術可利用的廉價聚合物製備。製備根據本 發明之聚合物之起始物質為含有至少約80°/。乙埽醇單位以 及具有平均分子量約2000至120000或以上,較佳約8〇〇〇至 50000之乙酸乙烯酯-乙烯醇共聚物(分子量為數量平均或 重量平均分子量,其間的變化對本發明之整體實施並無相 對限制)。適當聚乙烯醇例如包括可以寬廣分子量範圍以商 品名莫威爾(MOWIOL)3-83,莫威爾3-98,莫威爾4-88等得 自克雷恩(Clariant)GMbH公司,其它可以商品名艾爾佛 (AIRVOL) 103,203,502等得自從空氣產品公司,得自亞 ----—— —_____________ 本紙&尺度適财關家標準(⑽)A4规格⑵ϋχ297公楚) " -21 - (請先閱讀背面之注意事項再填寫本頁) .、^τ 線丨 573208 A7 _____B7_— 一 五、發明説明(19 ) 利希(ALDRICH)及其它供應商之適當聚乙烯基醇類。 可用於製備本發明之縮醛聚合物之第一環狀縮醛基 之適當醛例如包括: 乙醛 丙酸 正丁醛 正戊酸 正己醛 正庚酿 異丁醛 異戊酸,其混合物等。 可用於製備本發明之縮醛聚合物之第二環狀縮醛基 之適當醛例如包括: 2- 羥苄醛 3- 羥苄醛 4- 羥苄醛 2 -羥-1-萘酸 2,4-二羥苄醛 3,5·二溴-4-羥苄醛 4-氧丙炔基-3-羥苄醛 香草素 異香草素 桂皮醛其混合物等。 可用於製備本發明之縮醛聚合物之第三環狀縮醛基 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) (諸先閲讀脅面之注意事項存墙寫本頁)The paper size of the edition is applicable to China National Standards () from the specifications (2) 0 × 297 public redundant) 20 573208 A7 I ---------— B7 __ V. Description of the invention (18) 1 ~ Side by side aliphatic The acetal part is responsible for thermal properties (butyl g), hydrophobicity_ink acceptability (for printed circuit board manufacturing), or anti-etching property (for photolithographic printed board manufacturing). A third acetal group containing a carboxylic acid by-product acetal or an aromatic group carrying a carboxylic acid functional group is believed to increase solubility in an aqueous developer and selectivity in polymer structure. Therefore, by optimizing or adjusting the ratio between the acetal of the main chain polymer and the remaining hydroxyl groups, it is possible to achieve a polymer with predetermined characteristics for a variety of specific applications. Sensitivity and thermal properties (for the lamination of dry resist films (Very important), mechanical properties, controlled solubility in aqueous imaging agents, anti-etching properties, and hydrophilic / hydrophobic balance properties can be changed individually by explaining their individual contributions to polymer properties based on previous teachings Group manipulation. Polyvinyl acetal polymer used as the main and sole binder resin for the heat-sensitive composition according to the present invention. The solubility of the polymer in water / alkaline developer can be changed thermally. The composition can be utilized. Novel synthetic methods begin with the preparation of inexpensive polymers available on a large scale. The starting materials for preparing the polymers according to the present invention are those containing at least about 80 ° /. Acetyl alcohol units and vinyl acetate-vinyl alcohol copolymers having an average molecular weight of about 2,000 to 120,000 or more, preferably about 8,000 to 50,000 (molecular weight is a number average or weight average molecular weight, and the changes therebetween affect the whole of the invention There are no relative restrictions on implementation). Suitable polyvinyl alcohols include, for example, a wide range of molecular weights available under the trade names MOWIOL 3-83, Mowell 3-98, Mowell 4-88, etc. from Clariant GMbH, others can be Trade names: AIRVOL 103, 203, 502, etc. are obtained from Air Products, and are obtained from Asia -------- _____________ This paper & standard suitable financial standards (⑽) A4 specifications (⑵ϋ297297) " -21-(Please read the notes on the back before filling this page). ^ Τ line 丨 573208 A7 _____ B7_— One. V. Description of the invention (19) Appropriate polyvinyl alcohol from ALDRICH and other suppliers class. Suitable aldehydes that can be used to prepare the first cyclic acetal group of the acetal polymer of the present invention include, for example, acetaldehyde, propanoic acid, n-butyraldehyde, n-valeric acid, n-hexanal, n-heptanyl isobutyraldehyde, isovaleric acid, mixtures thereof, and the like. Suitable aldehydes that can be used to prepare the second cyclic acetal group of the acetal polymer of the present invention include, for example: 2-hydroxybenzaldehyde 3-hydroxybenzaldehyde 4-hydroxybenzaldehyde 2-hydroxy-1-naphthoic acid 2,4 -Dihydroxybenzaldehyde 3,5 · dibromo-4-hydroxybenzaldehyde 4-oxopropynyl-3-hydroxybenzaldehyde vanillin isovanillin cinnamaldehyde, a mixture thereof, and the like. The third cyclic acetal group which can be used to prepare the acetal polymer of the present invention. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm).

22 573208 A7 B7 五、發明説明(20 之適當醛例如包括: 乙醛酸 2·曱醯基苯氧乙酸 3-曱氧-4-曱醯基苯氧乙酸 丙炔醛,其混合物等。 聚乙烯醇之縮醛化反應係根據已知標準方法進行;例 如述於美國專利第4,665,124號;美國第4,940,646號;美國 第5,169,898號;美國第5,700,619號;美國第5,792,823號; 曰本09,328,519號等。 此種縮醛化反應通常需要添加強無機或有機催化劑 酸。催化劑酸例如為鹽酸、硫酸、磷酸或對_甲苯磺酸。其 它強酸也可使用,例如全氟烷基磺酸及其它全氟活化酸。 酸之用量須可有效允許進行質子化反應,但不會經由造成 非期望的縮酸基水解而顯著變更終產物。縮醛化反應溫度 係依據醛的種類以及預定取代程度決定。反應溫度為〇c>c, 及若適用時所用溶劑之沸點。有機溶劑及水與有機溶劑之 混合物也可使用。特別適當之有機溶劑為醇(例如甲醇,乙 醇,丙醇,丁醇或二醇醚),環狀醚類(例如丨,^二噚烷)或 雙極性質子惰性溶劑(例如N,N•二甲基甲醢胺,n_甲基吼咯 疋嗣或一甲亞礙若縮酸化反應係於有機溶劑或有機溶劑 與水之混合物進行,則即使原料聚乙婦醇未能完全溶解, =應產物仍常留於溶液。原料聚乙稀醇未完全溶解於有機 切不利'、,°果導致無法再現的轉化程度以及不同的產物 。水或有機溶劑與水之混合物須用於達成聚乙稀醇的完全 本》尺度適用中國國家標準^ -……------------------裝:… (請先閱讀背面之注意事項再填寫本頁) •線丨 23 573208 A7 --—-___B7____ 五、發明説明" ~ 料以及縮酸化反應結果可再現的產物。添加不同縮酸化 劑的順序並不重要,經由不同的製備程序可獲得可相媲美 的成品。為了呈固體分離終產物,聚合物溶液係於激烈攪 拌、過濾及乾燥之下導入非溶劑内。水特別適合用作為聚 合物之非溶劑。 申凊人發現使用羥基取代芳族醛進行縮醛化比較於 相同合成條件下,由脂族醛或無取代芳族醛或由含羧酸部 分之醛建立縮醛,遠更容易出現縮醛基之非期望水解。反 應混合物内即使存在有小量水也導致縮醛化程度減低,以 及使用的芳族羥醛未完全轉化。它方面發現於無水存在下 ,羥取代芳族醛即刻與醇之羥基反應且幾乎獲得丨〇〇%轉化 率。故藉經取代芳族酿縮酸化聚乙婦醇之過程而獲得根據 本發明之所需聚乙烯基縮醛係以與先前技術已知之不同方 | 式進行。本發明之主要差異在於合成過程中由反應混合物 去除水。主要量之水可於減壓下藉蒸餾去除,以及使用有 機溶劑置換。申請人發現反應混合物中剩餘水可經由添加 方便與水反應之有機材料之混合物,以及反應結果產生揮 發性物質或惰性化合物而去除混合物之剩下餘水。此等物 質可選自易與含氧化矽化合物之水反應之碳酸鹽類,碳酸 或羧酸之原酸酯類,例如碳酸二乙酯,原甲酸三甲酯,碳 酸四乙酯,矽酸四乙酯等。添加此等物質至反應混合物, 結果導致使用的醇100〇/〇轉化,以及就發明人所知未使用先 前技術於製造類型聚合物縮醛時用作為水去除劑。(合成5 -内酯類時使用原曱酸三甲酯述於G. Saucy,R· Borer及D.P. 本紙張尺度適用中國@家標华(0^ )八4规格⑵〇><297公幻 -24 - 573208 kl ____ B7_ 五、發明説明(22 )22 573208 A7 B7 V. Description of the invention (Appropriate aldehydes of 20 include, for example: glyoxylic acid 2 · fluorenylphenoxyacetic acid 3-fluorenyl-4-fluorenylphenoxyacetic acid propynaldehyde, mixtures thereof, etc. Polyethylene The acetalization of an alcohol is performed according to a known standard method; for example, described in U.S. Patent No. 4,665,124; U.S. Patent No. 4,940,646; U.S. Patent No. 5,169,898; U.S. Patent No. 5,700,619; U.S. Patent No. 5,792,823; Japanese 09,328,519 No. etc. This acetalization reaction usually requires the addition of a strong inorganic or organic catalyst acid. The catalyst acid is, for example, hydrochloric acid, sulfuric acid, phosphoric acid or p-toluenesulfonic acid. Other strong acids can also be used, such as perfluoroalkylsulfonic acid and others Perfluorinated activated acid. The amount of acid must be effective to allow the protonation reaction, but it will not significantly change the final product by causing undesired hydrolysis of the acid group. The temperature of the acetalization reaction is determined according to the type of aldehyde and the predetermined degree of substitution. The reaction temperature is 0c> c, and the boiling point of the solvent used if applicable. Organic solvents and mixtures of water and organic solvents can also be used. Particularly suitable organic solvents are alcohols (for example Methanol, ethanol, propanol, butanol, or glycol ethers), cyclic ethers (such as 丨, ^ dioxane) or bipolar aprotic solvents (such as N, N • dimethylformamide, n_ If the methylation reaction is carried out in an organic solvent or a mixture of organic solvent and water, even if the raw material polyethylene glycol is not completely dissolved, the product still remains in the solution. Raw material Polyvinyl alcohol does not completely dissolve in organic solvents, which may lead to irreproducible degrees of conversion and different products. Water or organic solvents and water mixtures must be used to achieve the complete polyethylene standard. The standard applies to China National Standards ^-…… ------------------ Packing: ... (Please read the precautions on the back before filling this page) • Line 丨 23 573208 A7 ---- ___B7____ V. Description of the invention " ~ Material and reproducible products of the acidification reaction results. The order of adding different acidification agents is not important, and comparable products can be obtained through different preparation procedures. In order to separate the final product as a solid, Polymer solution is introduced under vigorous stirring, filtration and drying In a solvent. Water is particularly suitable as a non-solvent for polymers. Shen Jianren found that acetalization using hydroxy-substituted aromatic aldehydes was compared with aliphatic or unsubstituted aromatic aldehydes or from carboxylic acids under the same synthetic conditions. Some aldehydes establish acetals, which is far more prone to undesired hydrolysis of acetal groups. Even a small amount of water in the reaction mixture will lead to a reduction in acetalization, and the aromatic aldol used is not completely converted. It was found In the absence of water, the hydroxy-substituted aromatic aldehyde reacts immediately with the hydroxy group of the alcohol and obtains a conversion rate of almost 100%. Therefore, the desired polymerization according to the present invention is obtained by the process of substituting the aromatic aromatic polycondensation acid. Vinyl acetals are carried out in a different way than known from the prior art. The main difference in the present invention is the removal of water from the reaction mixture during the synthesis. The main amount of water can be removed by distillation under reduced pressure and replaced with an organic solvent. The applicant has found that the remaining water in the reaction mixture can be removed by adding a mixture of organic materials that are convenient to react with water, and the reaction results in volatile substances or inert compounds. These materials may be selected from carbonates, orthocarbonates of carbonic acid or carboxylic acids, such as diethyl carbonate, trimethyl orthoformate, tetraethyl carbonate, tetrasilicate Ethyl esters, etc. Adding these materials to the reaction mixture resulted in a 100/0 conversion of the used alcohol and, as far as the inventors know, no prior art was used as a water-removing agent in the manufacture of type polymer acetals. (The use of trimethyl orthoacetate when synthesizing 5-lactones is described in G. Saucy, R. Borer and DP. The paper size is applicable to China @ 家 标 华 (0 ^) 八 44⑵ > < 297g Magic-24-573208 kl ____ B7_ V. Description of the invention (22)

Trullinger ;有機化學期刊第42卷,第19期,32〇6頁,1977 年)。根據本發明之合成聚乙烯基縮醛聚合物之方法包含以 含經基芳族醛及強催化劑酸縮醛化聚乙烯基醇樹脂,經由 添加可與水反應且與水產生揮發性及/或惰性化合物而其 速度足夠於縮醛反應完成之前有效去除部分水(降低濃度 但非完全去除)之材料而由聚乙烯醇及羥基取代芳族醛去 除水’經由減少聚乙烯醇及羥基取代芳族醛之存在水量使 用羥基取代芳族醛進行縮醛化達成控制縮醛基之水解數量 。該方法例如可使用選自有機碳酸酯類、碳酸或羧酸之原 酸酯類,以及含矽化合物組成的組群之物質作為與水反應 之材料。含碎化合物例如係選自;5夕酸鹽類及石夕烧類組成的 組群,例如原矽酸鹽類、偏矽酸鹽類以及含酯基之矽烷類 本發明中’目標聚合物之製備始於於80_90。〇將原料聚 乙烯醇溶解於水,然後溶液急冷至60°c ,以及加入酸性催 化劑溶解於有機溶劑,用於本發明之溶劑為醇類或二醇醚 類,例如正丙醇,2-甲氧乙醇或丨_甲氧·2·丙醇多瓦諾 (D〇wanol)PM,後文稱作為rPM」)等,然後芳族羥基取代 醛於相同溶劑之溶液添加至溶液,恰於添加芳族醛後,加 入脂族醛及/或羧酸取代醛或其它醛於相同溶劑之溶液,以 及反應混合物又於此種溫度攪拌2·3小時,然後經由蒸餾及 以有機溶劑置換而去除水與有機溶劑形成的共沸混合物。 此等階段,芳族羥基醛之轉化率達95_98%。然後反應混合 物之酸經中和,混合物與水攙混而沉澱出聚合物,聚合物 本紙張尺度適用中國1家標準(CNS) M规袼(2]〇><297公梦) 25 573208 A7 B7五、發明説明(23 ) 經過濾,以水洗滌及脫水。第二種達成芳族羥醛100%轉化 成苄醇之方式係於添加酸類至反應混合物後,加入水去除 作用之有機物質(例如碳酸脂、原甲酸酯等)。 適合用於本發明之熱敏組合物之輻射吸收材料係選 自寬廣多種有機及無機顏料例如碳黑類、吲花青類或金屬 氧化物類。綠色顏料:海利金(Heliogen)綠D8730,D9360 以及費諾(Fanal)綠D8830 BASF公司製造;普雷地索 (Predisol) 64H-CAB678昇陽化學公司製造,以及黑色顏料 :普雷地索CAB2604,普雷地索N1203,普雷地索黑 CB-C9558昇陽化學公司製造為若干有效吸熱顏料之實例 。此等顏料與組合物之用量作占組合物之3至20%或較佳占 組合物之3至7%重量比之範圍。紅外線吸收性染料為較佳 熱吸收劑,其可用於本發明組合物,特別可吸收比7〇〇毫微 米更長例如約700至11〇〇毫微米範圍之波長之紅外光吸收 性染料。此等染料例如依玻林(ΕΡ〇Ηη)公司製造的依玻來 (Epolight) IV-62A,IV-62B及 IV-66X ;美國染料來源公司 製造的 ADS 830,ADS 835 及 ADS 840 ;林原(Hayashibara) 生化實驗室公司製造的NK-2911及NK-4432等。組合物中紅 外光吸收性染料之存在量通常係低於顏料,而其存在量係 占組合物之0.1至5 %重量比’或較佳占組合物之〇 · 1至1 %重 量比。 已知含炔屬參鍵化合物對銅具有親和力(Jukes A.E·, 有機金屬化學進展,第12期,紐約,1974年,215-322頁) 促成申請人使用此類化合物作為熱敏組合物對銅表面之黏 ----------------------裝—— (請先閲讀背面之注意事項再填寫本頁) :線丨 本紙張尺度適用中國國家標準(CNS) A4规格(210X297公釐) 26 573208 A7 ------ B7 五、發明説明(24 ) 著促進劑材料。就申請人了解,並無任何炔屬化合物用於 此項用途。 本發明之黏著促進劑屬於含參鍵或一系列參鍵之酯 類、磺基酯類、醯胺類、聚酯類、聚碳酸酯類以及聚胺基 甲酸酯類: Ινχ-(:(Ι13,Ι14)-(:Ξ(:-(:(Ι13,Ι14)-Χ·κ2,或Ri-X-C(r3,r4)Trullinger; Journal of Organic Chemistry, Vol. 42, No. 19, p. 3206, 1977). The method for synthesizing a polyvinyl acetal polymer according to the present invention includes acetalizing a polyvinyl alcohol resin with a radical-containing aromatic aldehyde and a strong catalyst, and reacting with water and adding volatility to the water and / or Inert compounds whose speed is sufficient to effectively remove part of the water (reduced concentration but not completely removed) before the acetal reaction is completed and replace the water with polyvinyl alcohol and hydroxyl substituted aromatic aldehydes' by reducing polyvinyl alcohol and hydroxyl substituted aromatics The amount of water in the aldehyde is acetalized by replacing the aromatic aldehyde with a hydroxyl group to control the number of acetal groups to be hydrolyzed. In this method, for example, a material selected from the group consisting of organic carbonates, orthocarbonates of carbonic acid or carboxylic acid, and a group containing silicon compounds can be used as a material that reacts with water. Crude-containing compounds are, for example, selected from the group consisting of oxalates and syrups, such as orthosilicates, metasilicates, and ester-containing silanes. Preparation starts at 80_90. 〇The raw material polyvinyl alcohol is dissolved in water, and then the solution is rapidly cooled to 60 ° C, and an acidic catalyst is added to dissolve it in an organic solvent. The solvent used in the present invention is an alcohol or a glycol ether, such as n-propanol, 2-methyl Oxyethanol or 丨 methoxy · 2 · propanol Dowanol PM (hereinafter referred to as rPM ") and so on, and then the solution of aromatic hydroxy substituted aldehyde in the same solvent is added to the solution, just as adding aromatic After the family aldehydes, add a solution of aliphatic aldehydes and / or carboxylic acid substituted aldehydes or other aldehydes in the same solvent, and the reaction mixture is stirred at this temperature for 2 · 3 hours, and then water and water are removed by distillation and replacement with organic solvents. An azeotropic mixture of organic solvents. In these stages, the conversion of aromatic hydroxyaldehyde reached 95-98%. Then, the acid of the reaction mixture is neutralized, and the mixture is mixed with water to precipitate a polymer. The size of the polymer paper conforms to Chinese Standard (CNS) M Regulation (2) 〇 > < 297 Gongmeng) 25 573208 A7 B7 V. Description of the invention (23) Filtered, washed with water and dehydrated. The second way to achieve 100% conversion of aromatic aldol to benzyl alcohol is to add organic substances (such as carbonate, orthoformate, etc.) to remove water after adding acids to the reaction mixture. Radiation absorbing materials suitable for use in the heat-sensitive composition of the present invention are selected from a wide variety of organic and inorganic pigments such as carbon blacks, incyanines, or metal oxides. Green pigment: manufactured by Heliogen Green D8730, D9360 and Fanal Green D8830 BASF; manufactured by Predisol 64H-CAB678 by Sun Yang Chemical Co., and black pigment: Prediso CAB2604 , Prediso N1203, Prediso Black CB-C9558, made by Shengyang Chemical Co., Ltd., are examples of some effective endothermic pigments. These pigments and compositions are used in an amount of 3 to 20% or preferably 3 to 7% by weight of the composition. Infrared absorbing dyes are preferred heat absorbing agents and can be used in the composition of the present invention. In particular, infrared absorbing dyes can absorb infrared light having a wavelength longer than 700 nanometers, for example, in the range of about 700 to 1100 nanometers. These dyes are, for example, Epolight IV-62A, IV-62B, and IV-66X manufactured by Epolin Corporation; ADS 830, ADS 835, and ADS 840 manufactured by American Dye Source Corporation; Hayashibara) NK-2911 and NK-4432 manufactured by Biochemical Labs. The amount of the infrared light-absorbing dye in the composition is generally lower than that of the pigment, and the amount of the light-absorbing dye is 0.1 to 5% by weight of the composition ', or preferably 0.1 to 1% by weight of the composition. Known acetylene-containing reference compounds have copper affinity (Jukes AE ·, Advances in Organometallic Chemistry, No. 12, New York, 1974, pp. 215-322), prompting applicants to use such compounds as heat-sensitive compositions for copper Adhesion on the surface ---------------------- Installation-(Please read the precautions on the back before filling this page): Line 丨 This paper size applies to China Standard (CNS) A4 specification (210X297 mm) 26 573208 A7 ------ B7 V. Description of invention (24) Accelerator material. To the applicant's knowledge, no acetylenic compound is used for this purpose. The adhesion promoter of the present invention belongs to esters, sulfoesters, amidoamines, polyesters, polycarbonates, and polyurethanes containing a bond or a series of bonds: Ινχ-(:( Ι13 , I14)-(: Ξ (:-( :( I13, I14) -X · κ2, or Ri-XC (r3, r4)

-C 三 C-C(R3,R4)-X-(Y)m-X-C(R3,R4)_c ξ C-C(R3,R4)_X-R2 或Ri-X-C (R3,R4)-CeCH 此處·· Ι^&Ι12=-(:ηΗ2η+1,取代芳族或雜環族片段; R3及R4=H或烷基 X=-0-C(0)- ’ -O-S(O)-,-NH-C(O)-; Y=-CnH2n4取代芳族基; 以及例如可由丙炔醇或2-丁炔-1,4-二醇,以及適當羧 酸或磺酸之氯酐,或脂族或芳族異氰酸酯或二異氰酸酯; 或由丙炔溴或丙炔氯或丙炔氯甲酸酯以及適當多元醇,或 藉任一種業界人士已知方式達成。含參鍵之聚碳酸酯類 -(CH2Ce C-CH2-0-C(0)-0-R-0-)m 其可得自2-丁炔-1,4-二醇氣曱酸酯及對應之二元醇: HO-R-OH,此處:RMCHOm-,n=2-6 ; R=-CH2CH2 (OCH2CH2)n,n=l,4 ; R=-CH2-CH=CH-CHr,-CH2-C=C-CH2-, CH3 CHj Cft 0¾ CHj CHj-C Three CC (R3, R4) -X- (Y) mXC (R3, R4) _c ξ CC (R3, R4) _X-R2 or Ri-XC (R3, R4) -CeCH here ... Ι ^ & amp I12 =-(: ηΗ2η + 1, substituted aromatic or heterocyclic fragments; R3 and R4 = H or alkyl X = -0-C (0) -'- OS (O)-, -NH-C ( O)-; Y = -CnH2n4 substituted aromatic groups; and, for example, may be propynol or 2-butyne-1,4-diol, and chloro anhydride of an appropriate carboxylic acid or sulfonic acid, or an aliphatic or aromatic isocyanate Or diisocyanates; or by propyne bromide or propyne chloride or propyne chloroformate and appropriate polyols, or by any method known to those in the industry. Polycarbonates with reference bonds-(CH2Ce C-CH2 -0-C (0) -0-R-0-) m which can be obtained from 2-butyne-1,4-diol pirates and the corresponding glycol: HO-R-OH, here : RMCHOm-, n = 2-6; R = -CH2CH2 (OCH2CH2) n, n = 1, 4; R = -CH2-CH = CH-CHr, -CH2-C = C-CH2-, CH3 CHj Cft 0¾ CHj CHj

II I I I I •C-CHjCHa-C- , *C«CH-CH心 ,,II I I I I • C-CHjCHa-C-, * C «CH-CH heart,,

II I I CH3 Ob CH> CH, CH2CH(OCH2CH)”,n;M; I I Oh CHj 本紙張尺度適用中國國家標準(CNS) A4规格(2]0X297公釐) ------------------------^—— (請先閱讀背面之注意事項再塡寫本頁)II II CH3 Ob CH > CH, CH2CH (OCH2CH) ", n; M; II Oh CHj This paper size is applicable to China National Standard (CNS) A4 specification (2) 0X297 mm) ---------- -------------- ^ —— (Please read the notes on the back before writing this page)

、可I ;線丨 27 ^3208 A7 ^^^__— B7__ 五、發明説明(25 ) " '—~~ R=芳族基,例如=Ar-=-C6H4,-C1()H6等。 由此等非限制例可知,炔屬鍵結可存在於分子結構内 部或分子之端末位置。 此外,著色劑、增塑劑、界面活性劑、其它金屬黏著 促進劑、增量劑、標籤劑、進一步樹脂成分等可添加至熱 敏組合物。有用的著色劑包含抗蝕劑以及印刷板塗布調配 劑中眾所周知的染料,亦即甲基紫、乙基紫、結晶紫、鹼 性蘇丹黑、維多利亞藍R、甲基藍、苯胺黑及其它。染料 之較佳用量係占熱敏組合物之〇 〇1至2%重量比。有用的塗 布助劑包括氟碳界面活性劑例如隆尼爾(z〇nyl)系列(杜邦 公司)或FC-430或FC-43 1 (3M公司)或其它陰離子性、陽離子 非離子性或混合物界面活性劑。界面活性劑之較佳用 量係占組合物總重之約〇 〇 1至1 0/〇。 特別增塑例如包括吞恩類(Tweens)(例如得自ICI公司) ’聚氧伸烷基增塑劑(例如聚環氧乙烷/聚環氧丙烷共聚單 體或共聚物)等。增塑劑之用量可於寬廣範圍例如占熱敏組 合物之0.1至15%重量比。增塑劑也已知可輔助熱敏聚合物 於顯像步驟的顯像性質。 填充劑及增量劑也可用於本發明之可熱成像組合物 ’例如使用惰性或具有改良性質(例如組合物之耐熱性或透 熱性)增加組合物之固體含量。填充劑可用於累積塗布後之 可熱成像層之厚度,或調整該層之強度及物理性質。其本 身為惰性、粒狀或薄膜形成性。特別適合之惰性填充劑之 非限制例包括澱粉,高嶺土,二氧化鈦,氧化矽,聚四氟 本紙張尺度適用中國國家標準(CNS) A4规格(2]〇χ297公釐) ----------------………^! (請先閱讀背面之注意事項再填寫本頁) •訂· -線丨 28 573208 A7 B7 五、發明説明(26 乙稀及滑石。 本發明之熱敏組合物可用於製造印刷電路板、用於光 刻術印刷板以及其它適合進行雷射導引成像之熱敏元件。 以本發明之組合物為主的熱敏(可熱成像)組合物可額外提 供具有高精度之以化學方式研磨的金屬。至少部分原因係 由於其對寬廣多種金屬及合金具有絕佳黏著性,經由添加 添加劑而未對組合物性能造成不良影響而改良黏著性,曝 光區與未曝光區之溶解度甄別力良好,良好蝕刻抗性(對廣 用之氣化鐵姓刻溶液具有良好餘刻抗性),以及殘餘組合物 容易去除。如此可用於藉業界已知之輻射曝露以及洗除顯 像方法用於製造小型醫療元件部件例如血管支架及導管, 如美國專利第6,027,863號所述。 以本發明之組合物為主的熱敏組合物也可提供熱活 化樹脂用於製造印刷板例如凹版印刷滾筒母質。本發明組 合物可於塗層提供良好薄膜形成性質,對凹版印刷滾筒表 面之良好黏著性,以及水性顯像能力,而顯像及蝕刻後其 餘組合物容易去除。本發明之熱敏組合物也對網版印刷之 模版提供對紅外光雷射照射之高度敏感性以及前述之良好 黏著劑去除性質。 適當基材包括常規銅猪,回處理銅羯,轉鼓側處理銅 羯以及雙重處理銅箔護罩於用於製造印刷電路板之塑膠積 層板上;|呂板及薄片以及陽極化紹板之薄片用於製造印刷 板。基材如鋼、聚合物(例如尼龍、高密度聚烯烴、聚碳酸 s旨類、聚丙晞酸酯類、聚乙稀系樹脂類等)可用於製造網版 ----— — 本紙張尺度_中關家標準(CNS) A4规格⑵QX297公幻 (請先閱讀背面之注意事項再填寫本頁), 可 I; Line 丨 27 ^ 3208 A7 ^^^ __ — B7__ 5. Description of the invention (25) " '-~~ R = aromatic group, for example = Ar-=-C6H4, -C1 () H6 and so on. From these non-limiting examples, it is understood that the acetylene bond may exist inside the molecular structure or at the terminal position of the molecule. In addition, colorants, plasticizers, surfactants, other metal adhesion promoters, extenders, labeling agents, further resin components, and the like may be added to the heat-sensitive composition. Useful colorants include resists and well-known dyes in printing plate coating formulations, i.e. methyl violet, ethyl violet, crystal violet, basic Sudan black, Victoria Blue R, methyl blue, aniline black, and others. The preferred amount of dye is from 0.01 to 2% by weight of the heat-sensitive composition. Useful coating aids include fluorocarbon surfactants such as the Zonyl series (DuPont) or FC-430 or FC-43 1 (3M) or other anionic, cationic nonionic or mixture interfaces Active agent. The preferred amount of surfactant is from about 0.01 to 10/0, based on the total weight of the composition. Specific plasticizing includes, for example, Tweens (e.g., available from ICI Corporation) 'polyoxyalkylene plasticizers (e.g., polyethylene oxide / polypropylene oxide co-monomer or copolymer) and the like. The amount of the plasticizer may be in a wide range, for example, 0.1 to 15% by weight of the heat-sensitive composition. Plasticizers are also known to aid the imaging properties of the thermosensitive polymer in the imaging step. Fillers and extenders can also be used in the thermal imageable composition of the present invention ', for example, to increase the solids content of the composition by using inertness or having improved properties such as the heat resistance or heat permeability of the composition. The filler can be used to accumulate the thickness of the thermally imageable layer after coating, or to adjust the strength and physical properties of the layer. It is inherently inert, granular, or film-forming. Non-limiting examples of particularly suitable inert fillers include starch, kaolin, titanium dioxide, silicon oxide, polytetrafluoro. This paper is sized to the Chinese National Standard (CNS) A4 (2) 0 × 297 mm. ------- ---------......... ^! (Please read the notes on the back before filling out this page) • Order · -line 丨 28 573208 A7 B7 V. Description of the invention (26 Ethylene and talc. The present invention The heat-sensitive composition can be used for manufacturing printed circuit boards, lithography printed boards, and other heat-sensitive elements suitable for laser guided imaging. The heat-sensitive (thermo-imageable) combination mainly composed of the composition of the present invention It can additionally provide highly polished, chemically ground metals. At least in part because of its excellent adhesion to a wide variety of metals and alloys, the addition of additives does not adversely affect the performance of the composition and improves the adhesion. The solubility of exposed and unexposed areas has good discrimination power, good etching resistance (good after-resistance to the widely used gasified iron surname solution), and easy removal of residual composition. This can be used for the industry's known Radiation exposure and washout imaging methods are used to make small medical component parts such as vascular stents and catheters, as described in US Patent No. 6,027,863. The heat-sensitive composition based on the composition of the present invention can also provide heat-activated resins. It can be used in the manufacture of printing plates such as gravure printing cylinders. The composition of the present invention can provide good film forming properties on the coating, good adhesion to the surface of the gravure printing cylinders, and the ability to develop water, and the remaining composition after development and etching Easy to remove. The heat-sensitive composition of the present invention also provides high sensitivity to infrared laser radiation and good adhesive removal properties for screen printing stencils. Suitable substrates include conventional copper pigs, back-treated copper cymbals, Drum-side processed copper cymbals and double-processed copper foil shields are used on plastic laminates used to make printed circuit boards; | Lu boards and sheets and anodized sheets are used to make printed boards. Substrates such as steel, polymer Materials (such as nylon, high-density polyolefins, polycarbonates, polyacrylates, polyethylene resins, etc.) can be used to make screen plates ----— — This paper size _ Zhongguanjia Standard (CNS) A4 specifications ⑵QX297 public magic (Please read the precautions on the back before filling this page)

29 573208 A7 B7 五、發明説明(27 ) 印刷之模版。鉻及銅基質材也可用於形成凹版印刷板。 用於最終處理,獲得熱敏調配劑於適當溶劑之溶液, 過濾去除不溶性成分,以及以已知方式例如刮刀塗、線塗 方疋塗、棍塗或浸塗而由液體施用。用於本發明之溶劑為 二醇醚類亦即-PM或2·甲氧乙醇。聚合物料於溶液之固體 含量係依據薄膜之預定乾厚度決定,係於5至25%重量比之 範圍。 另一種施用方式係以熱敏組合物溶液塗布於適當中 間基材(聚酯或聚乙烯),乾燥,及然後藉熱壓積層而施用 薄膜於基材終成品(銅)上。 經適當乾燥施用之塗層後,印刷板利用雷射束於克雷 歐板設定器(CREO PLATESETTER)-3244,以及印刷電路板 於克雷歐鑽石2028F成像機曝光而成像。曝光區使用鹼金 屬鹽溶液或弱鹼氫氧化物溶液顯像。 本發明係經由下列實施例進一步舉例說明。 製備例1 110克莫威爾3-98聚乙烯醇(平均分子量約16000之98〇/〇 水解聚乙酸乙烯酯)添加至密閉反應容器内,容器配備有水 冷式冷凝器、添加漏斗及溫度計且含有250克去礦物質水。 藉連續攪拌,混合物於90°C加熱1小時至變成澄清溶液為止 。Ik後溫度調整至60°C及加入3克濃硫酸。經15分鐘時間, 逐滴添加59.8克4-羥苄醛及ι·4克2,6-二·第三丁基·‘甲酚 於450克2-甲氧乙醇之溶液。反應混合物以5〇〇克2_甲氧乙 醇稀釋,及以逐滴方式添加35·3克正丁醛於5〇〇克2•曱氧乙 本紙張尺度適用中國®家標準(CNS)从規格(2]〇χ297公漦) (請先閲讀背面之注意事項再填寫本頁)29 573208 A7 B7 V. Description of the invention (27) Printed template. Chromium and copper substrates can also be used to form gravure printing plates. For final treatment, obtain a solution of the thermosensitive formulation in an appropriate solvent, filter to remove insoluble components, and apply from a liquid in a known manner such as doctor blade coating, line coating, square coating, stick coating or dip coating. The solvents used in the present invention are glycol ethers, that is, -PM or 2.methoxyethanol. The solid content of the polymer material in the solution is determined based on the predetermined dry thickness of the film and is in the range of 5 to 25% by weight. Another application method is to coat a suitable intermediate substrate (polyester or polyethylene) with a heat-sensitive composition solution, dry, and then apply a film to the final substrate (copper) by heat lamination. After the coating is properly dried, the printed board is imaged using a laser beam on the CREO PLATESETTER-3244, and the printed circuit board is exposed on a Creo Diamond 2028F imager. The exposed area is developed using an alkali metal salt solution or a weak alkali hydroxide solution. The invention is further illustrated by the following examples. Preparation Example 1 110 g of Mowell 3-98 polyvinyl alcohol (980000/0 hydrolyzed polyvinyl acetate with an average molecular weight of about 16,000) was added to a closed reaction container. The container was equipped with a water-cooled condenser, an addition funnel, and a thermometer. Contains 250 grams of demineralized water. With continuous stirring, the mixture was heated at 90 ° C for 1 hour until it became a clear solution. After Ik the temperature was adjusted to 60 ° C and 3 grams of concentrated sulfuric acid was added. Over a period of 15 minutes, a solution of 59.8 g of 4-hydroxybenzaldehyde and 4 g of 2,6-di-tert-butyl · 'cresol in 450 g of 2-methoxyethanol was added dropwise. The reaction mixture was diluted with 500 g of 2-methoxyethanol, and 35.3 g of n-butyraldehyde was added dropwise to 500 g of 2 • oxoethyl paper. The paper was scaled to the China® Standard (CNS) from the specifications. (2) 〇χ297 公 漦) (Please read the notes on the back before filling this page)

30 573208 A7 B7_ 五、發明説明(28 ) 醇。酸類之添加完成時又繼續於50°C反應3小時。由反應混 合物蒸餾出水及使用2-甲氧乙醇(溶液中剩餘水低於0.30/〇) 置換。反應混合物以碳酸氫鈉中和至pH 7± 0.5,然後攙混 15升水·甲醇(10:1)。沉澱聚合物以水洗滌,經過濾及於5〇 °C真空脫水。 獲得178克聚合物,產率95.2%(基於PVA計算),4-經节 醛轉化率92%。聚合物結構係符合結構式,其中Ri基係衍 生自正丁醛,以及R2基係衍生自4-羥苄醛,1Ώ值為36%莫耳 比,η值為37%莫耳比,p值為2%莫耳比以及q值為25%莫耳 比(Tg63〇C) 〇 製備例2 110克莫威爾3-83聚乙烯醇(具有數目平均分子量約 14000之83%水解聚乙酸乙婦S旨)添加至密閉反應容器内, 容器配備有水冷式冷凝器、添加漏斗及溫度計,且含有1 J 〇 克去礦物質水及11 〇克甲醇。藉連續攪拌,將混合物於80 °C加熱0.5小時至變澄清溶液。此後溫度調整至6(rc及加入 3克濃硫酸於100克PM。經15分鐘時間,以逐滴方式加入65 克3-羥苄醛及1.4克2,6-二-第三丁基_4·曱酚於45〇克pM2 溶液。反應混合物藉額外200克PM稀釋,及以逐滴方式添 加9.2克正丁酿於200克PM,當駿類之添加完成時,反應於 50°C又持續進行3小時。於此階段丁醛之轉化完成,3•羥苄 駿之轉化率接近50°/ρ授拌時以逐滴方式添加5〇〇克原曱酸 三甲酯至反應混合物。添加原曱酸三甲醋後,弘經节酸之 轉化率達100%(反應混合物之水含量低於〇 1 %)。 本紙張尺度適用中國國家標準(CNS) Α4規格(2WX297公釐) (請先閲讀背面之注意事項再填寫本頁)30 573208 A7 B7_ V. Description of the invention (28) Alcohol. When the addition of acids was completed, the reaction was continued at 50 ° C for another 3 hours. Water was distilled from the reaction mixture and replaced with 2-methoxyethanol (the remaining water in the solution was less than 0.30 / 0). The reaction mixture was neutralized with sodium bicarbonate to pH 7 ± 0.5, and then 15 liters of water · methanol (10: 1) were mixed. The precipitated polymer was washed with water, filtered and dehydrated in vacuo at 50 ° C. 178 g of polymer was obtained with a yield of 95.2% (calculated based on PVA) and a 4-benzaldehyde conversion of 92%. The polymer structure conforms to the structural formula, in which the Ri group is derived from n-butyraldehyde and the R2 group is derived from 4-hydroxybenzaldehyde. The 1Ώ value is 36% mole ratio, the η value is 37% mole ratio, and the p value. Molar ratio of 2% and q value of 25% Molar ratio (Tg63 ° C). Preparation Example 2 110 g of Mowell 3-83 polyvinyl alcohol (83% hydrolyzed polyacetic acid with a number average molecular weight of about 14,000) S purpose) is added to a closed reaction container, the container is equipped with a water-cooled condenser, an addition funnel and a thermometer, and contains 1 J g of demineralized water and 110 g of methanol. With continuous stirring, the mixture was heated at 80 ° C for 0.5 hours until it became a clear solution. The temperature was then adjusted to 6 ° C and 3 g of concentrated sulfuric acid was added to 100 g of PM. Over a period of 15 minutes, 65 g of 3-hydroxybenzaldehyde and 1.4 g of 2,6-di-tert-butyl-4 were added dropwise. • Phenol in 45 grams of pM2 solution. The reaction mixture was diluted by an additional 200 grams of PM, and 9.2 grams of n-butyl was brewed in 200 grams of PM in a dropwise manner. When the addition of the genus was complete, the reaction continued at 50 ° C and continued. It was carried out for 3 hours. At this stage, the conversion of butyraldehyde was completed, and the conversion rate of 3 · hydroxybenzyl was close to 50 ° / ρ. During the mixing, 500 g of trimethyl orthoacetate was added dropwise to the reaction mixture. After trimethyl acetic acid, the conversion rate of Hongjingjiejie acid reaches 100% (the water content of the reaction mixture is less than 0%). This paper size is applicable to China National Standard (CNS) A4 size (2WX297 mm) (Please read first (Notes on the back then fill out this page)

31 573208 A7 __B7_ 五、發明説明(29 ) 獲得158克聚合物,產率96.8%(基於PVA計算)。聚合 物結構係符合結構式,其中R〗基係衍生自正丁醛,以及r2 基係衍生自3-羥苄醛,m值為12°/。莫耳比,η值為49%莫耳 比,ρ值為17%莫耳比以,及q值為22%莫耳比(Tg 59°C )。 製備例3 110克艾爾佛103聚乙烯醇(平均分子量約18000之98% 水解聚乙酸乙烯酯)添加至密閉反應容器内,容器配備有水 冷式冷凝器、添加漏斗及溫度計且含有250克去礦物質水。 藉連續攪拌,將混合物於90°C加熱1小時至變成澄清溶液。 隨後溫度調整至60°C及加入3克濃硫酸於1〇〇克pm。經15 分鐘時間,以逐滴方式加入61克2-羥苄醛(水楊醛)及ι·4克 2,6-二-第三丁基-4-甲酚於450克PM之溶液。反應混合物又 以500克PM稀釋,以逐滴方式添加27克正丁醛及1〇克乙醛 酸於500克PM,醛類之添加完成時反應於5〇。(:又持續進行3 小時。由反應混合物蒸餾出水,及以PM置換(溶液中殘留 10克水,亦即低於1.5%)。1〇〇克原曱酸三乙酯於授拌下添 加至反應混合物。此時反應混合物之水含量低於〇·Ρ/。,以 及水揚醛轉化為节醛之轉化率為定量。使用碳酸氫鈉將反 應混合物中和至pH 7± 0.5,然後攙混15升水-甲醇(1〇:1)。 沉澱聚合物以水洗滌,過濾及於5〇eC真空脫水。 獲得185.8克聚合物,產率97.6%(基於PVA計算),2-經苄酸轉化率1 〇〇%。聚合物結構係符合結構式,其中& 基係衍生自正丁醛,以及&基係衍生自2-羥苄醛,以及r3 基係衍生自乙醛酸;m值為30%莫耳比,n值為41%莫耳比 本紙張尺度適用中國國家標準(CNS)入4规格(2]0X297公釐) (請先閱讀背面之注意事項再構寫本頁) •、盯 ;線· 32 573208 A7 _____B7 五、發明説明(3〇 ) ,p值為2%莫耳比,〇值為9%莫耳比,以及q值為20%莫耳 比(Tg68°C)。 製備例4 110克艾爾佛502聚乙烯醇(平均分子量約16000之88% 水解聚乙酸乙烯酯)添加至密閉反應容器内,容器配備有水 冷式冷凝器、添加漏斗及溫度計且含有110克去礦物質水及 110克甲醇。藉連續攪拌,將混合物於90°c加熱1小時至變 成澄清溶液。隨後溫度調整至60°C及加入3克濃硫酸於1 〇〇 克PM。經15分鐘時間,以逐滴方式加入61克3_羥苄醛及1 4 克2,6-二·第三丁基-4-甲酚於450克PM之溶液。反應混合物 又以200克PM稀釋,以逐滴方式添加18.2克正丁醛及8.1克 丙炔醛於500克PM,醛類之添加完成時反應於50。(3又持續 進行3小時。由反應混合物蒸餾出水,及以pm置換。此時 反應混合物之水含量低於0.2%,以及間-羥苄醛轉化為节醛 之轉化率為定量。使用碳酸氫鈉將反應混合物中和至pH 7 ± 〇·5,然後攙混15升水-甲醇(10:1)。沉澱聚合物以水洗滌 ,過濾及於50°C真空脫水。 獲得177克聚合物,產率97.6%(基於PVA計算),間·經 苄醛轉化率100%。聚合物結構係符合結構式,其中R】基係 衍生自正丁醛,以及R2基係衍生自3-羥苄醛,以及r3基係 衍生自丙炔S ; m值為21%莫耳比,η值為43%莫耳比,p 值為2%莫耳比’ 〇值為10%莫耳比,以及q值為24%莫耳比 (Tg65〇C)。 製備例5 本紙張尺度適用中國國家標準(CNS) A4规格(2)0X297公釐) (請先閱讀背面之注意事項再填寫本頁)31 573208 A7 __B7_ V. Description of the invention (29) 158 grams of polymer was obtained with a yield of 96.8% (based on PVA calculation). The polymer structure conforms to the structural formula, in which the R group is derived from n-butyraldehyde, and the r2 group is derived from 3-hydroxybenzaldehyde, and the m value is 12 ° /. Molar ratio, η value is 49% Molar ratio, ρ value is 17% Molar ratio, and q value is 22% Molar ratio (Tg 59 ° C). Preparation Example 3 110 grams of Alfo 103 polyvinyl alcohol (98% hydrolyzed polyvinyl acetate with an average molecular weight of about 18,000) was added to a closed reaction container. The container was equipped with a water-cooled condenser, an addition funnel and a thermometer, and contained 250 grams Mineral water. With continuous stirring, the mixture was heated at 90 ° C. for 1 hour until it became a clear solution. The temperature was then adjusted to 60 ° C and 3 grams of concentrated sulfuric acid was added to 100 grams of pm. Over a period of 15 minutes, a solution of 61 g of 2-hydroxybenzaldehyde (salicylaldehyde) and 1 · 4 g of 2,6-di-tert-butyl-4-cresol in 450 g of PM was added dropwise. The reaction mixture was diluted with 500 g of PM, and 27 g of n-butyraldehyde and 10 g of glyoxylic acid were added dropwise to 500 g of PM. The reaction was completed at 50 when the addition of aldehydes was completed. (: Continue for another 3 hours. Distill the water from the reaction mixture and replace it with PM (10 g of water remains in the solution, ie less than 1.5%). 100 g of triethyl orthoacetate are added to the mixture with stirring. The reaction mixture. At this time, the water content of the reaction mixture was lower than 0 · P /, and the conversion rate of salicylaldehyde to benzaldehyde was quantified. The reaction mixture was neutralized to pH 7 ± 0.5 using sodium bicarbonate, and then mixed. 15 liters of water-methanol (10: 1). The precipitated polymer was washed with water, filtered, and dehydrated under vacuum at 50 eC. 185.8 g of polymer was obtained, yield 97.6% (calculated based on PVA), and 2-benzyl acid conversion 100%. The polymer structure conforms to the structural formula, where the & group is derived from n-butyraldehyde, and the & group is derived from 2-hydroxybenzaldehyde, and the r3 group is derived from glyoxylic acid; the m value is 30% Morse ratio, n value 41% Morse ratio This paper size is applicable to Chinese National Standard (CNS) into 4 specifications (2) 0X297 mm) (Please read the precautions on the back before composing this page) •, Stare; line · 32 573208 A7 _____B7 V. Description of the invention (30), p value is 2% Morse ratio, 0 value is 9% Morse ratio, and q It is 20% molar ratio (Tg68 ° C). Preparation Example 4 110 grams of Alfo 502 polyvinyl alcohol (88% hydrolyzed polyvinyl acetate with an average molecular weight of about 16,000) is added to a closed reaction container, and the container is equipped with a water-cooled type Condenser, addition funnel and thermometer containing 110 grams of demineralized water and 110 grams of methanol. The mixture was heated at 90 ° C for 1 hour to a clear solution by continuous stirring. The temperature was then adjusted to 60 ° C and 3 grams of concentrated Sulfuric acid at 100 g of PM. A solution of 61 g of 3-hydroxybenzaldehyde and 14 g of 2,6-di · tert-butyl-4-cresol in 450 g of PM was added dropwise over a period of 15 minutes. The reaction mixture was diluted with 200 g of PM, and 18.2 g of n-butyraldehyde and 8.1 g of propargaldehyde were added dropwise to 500 g of PM. The reaction of aldehydes was completed at 50. (3 continued for 3 hours. The reaction mixture was distilled off water and replaced with pm. At this time, the water content of the reaction mixture was less than 0.2%, and the conversion rate of m-hydroxybenzaldehyde to benzaldehyde was quantified. The reaction mixture was neutralized to pH 7 using sodium bicarbonate. ± 0.5, and then mix 15 liters of water-methanol (10: 1). The precipitated polymer was washed with water Filtration and vacuum dehydration at 50 ° C. 177 g of polymer was obtained with a yield of 97.6% (based on PVA calculation), and the conversion rate of benzaldehyde was 100%. The polymer structure conforms to the structural formula, where R] is derived from N-butyraldehyde, and R2 group are derived from 3-hydroxybenzaldehyde, and r3 group is derived from propyne S; m value is 21% mole ratio, η value is 43% mole ratio, p value is 2% mole The ear-to-earth 'value is 10% mole ratio, and the q-value is 24% to mole ratio (Tg65 ° C). Preparation Example 5 This paper is sized to Chinese National Standard (CNS) A4 (2) 0X297 mm) (Please read the precautions on the back before filling this page)

33 573208 A733 573208 A7

本紙張尺度適用中國國家標準(CNS) A4规袼(2]0X297公發) 34 573208 A7 -------—_______ 五、發明説明(32 ) 冷式冷凝器、添加漏斗及溫度計且含有110克去礦物質水及 110克甲醇。藉連續攪拌,將混合物於8〇〇c加熱1小時至變 成澄清溶液。隨後溫度調整至60°c及加入3克濃硫酸於1〇〇 克PM°經15分鐘時間,以逐滴方式加入32克4_羥苄醛,3〇 克2·羥-1-萘醛及L4克2,…二·第三丁基·4_曱酚於5〇〇*pM 之溶液。反應混合物又以2〇〇克pm稀釋,以逐滴方式添加 21·4克正丁醛於500克PM,醛類之添加完成時反應於5〇艺 又持續進行3小時。由反應混合物蒸餾出水,及αρΜ置換 。此時反應混合物之水含量低於〇·21〇/❶,以及芳族醛轉化 為苄醛之轉化率為定量。使用碳酸氫鈉將反應混合物中和 至pH 7± 0.5,然後攙混15升水·甲醇(1〇:1)。沉澱聚合物以 水洗滌,過遽及於5〇°C真空脫水。 獲得170克聚合物,產率96%(基於pvA計算),4_羥苄 醛及2-羥-1-萘醛轉化率1〇〇%。聚合物結構係符合結構式, 其中R丨基係衍生自正丁醛,以及R2基係衍生自4•羥苄醛及 2-羥-1-萘醛之混合物;m值為25%莫耳比,n值為莫耳 比,ρ值為12%莫耳比,以及q值為26%莫耳比(丁g74t:)。 製備例7 110克父爾佛502聚乙烯醇(平均分子量約〗6〇〇〇之88〇/〇 水解聚乙酸乙稀酯)添加至密閉反應容器内,容器配備有水 冷式冷凝器、添加漏斗及溫度計且含有〗2 〇克去礦物質水及 100克甲醇。藉連續攪拌,將混合物於9(rc加熱丨小時至變 成澄清溶液。隨後溫度調整至60t及加入12·4克濃鹽酸於 100克ΡΜ。經30分鐘時間,以逐滴方式加入4〇.3克4•甲醯 本紙張尺度適用中國國家標準(CNS) Α4规格(2]〇χ297公梦)This paper size applies the Chinese National Standard (CNS) A4 Regulations (2) 0X297. 34 573208 A7 ----------- _______ V. Description of the invention (32) Cold condenser, adding funnel and thermometer and contains 110 grams of demineralized water and 110 grams of methanol. With continuous stirring, the mixture was heated at 800 c for 1 hour until it became a clear solution. Subsequently, the temperature was adjusted to 60 ° C and 3 g of concentrated sulfuric acid was added at 100 g PM ° for 15 minutes. 32 g of 4-hydroxybenzaldehyde, 30 g of 2-hydroxy-1-naphthaldehyde and L4 g of a solution of 2, ... di-tertiary-butyl-4-phenol in 500 * pM. The reaction mixture was diluted with 200 g of pm, and 21.4 g of n-butyraldehyde was added dropwise to 500 g of PM. When the addition of aldehydes was completed, the reaction was continued for 50 hours and continued for 3 hours. Water was distilled from the reaction mixture and αρΜ was replaced. The water content of the reaction mixture at this time was less than 0.21 0 / ❶, and the conversion of the aromatic aldehyde to benzaldehyde was quantitative. The reaction mixture was neutralized to pH 7 ± 0.5 using sodium bicarbonate, and then 15 liters of water · methanol (10: 1) were mixed. The precipitated polymer was washed with water, decanted and dried under vacuum at 50 ° C. 170 g of polymer was obtained with a yield of 96% (calculated based on pvA) and 4-hydroxybenzaldehyde and 2-hydroxy-1-naphthaldehyde conversion of 100%. The polymer structure conforms to the structural formula, in which the R 丨 group is derived from n-butyraldehyde and the R2 group is derived from a mixture of 4 • hydroxybenzaldehyde and 2-hydroxy-1-naphthaldehyde; the m value is 25% molar ratio , N value is a mole ratio, ρ value is 12% mole ratio, and q value is 26% mole ratio (Ding g74t :). Preparation Example 7: 110 g of Pulver 502 polyvinyl alcohol (average molecular weight of about 6,000 to 880/0 hydrolyzed polyvinyl acetate) was added to a closed reaction container. The container was equipped with a water-cooled condenser and an addition funnel. And a thermometer containing 20 grams of demineralized water and 100 grams of methanol. With continuous stirring, the mixture was heated at 9 ° C for 1 hour until it became a clear solution. The temperature was then adjusted to 60t and 12.4 grams of concentrated hydrochloric acid was added to 100 grams of PM. After 30 minutes, 40.3 was added dropwise. Gram 4 • Medium size This paper applies Chinese National Standard (CNS) Α4 specification (2) 〇χ297 公 梦

(請先閱讀背面之注意事項再4寫本頁) 訂 .線· 35 573208 A7(Please read the precautions on the back before writing this page) Order. 35 573208 A7

___B7 五、發明説明(33 ) 基苯氧乙酸及30.8克2-羥苄醛及1.5克2,6·二-第三丁基-4-甲盼於750克PM之溶液。反應混合物又以2〇〇克pm稀釋, 以逐滴方式添加34.2克異戊醛於500克PM,醛類之添加完 成時反應於5 0 C又持續進行3小時。由反應混合物蒸德出水 ,及以PM置換。此時反應混合物之水含量低於〇 1 % ,以及 2-經节酸及4-甲醯基苯氧乙酸轉成节酸:之轉化率為定量。 使用碳酸氫鈉將反應混合物中和至pH 7± 0.5 ,然後攙混15升水-甲醇(1〇:1)。沉澱聚合物以水洗滌,過 濾及於50°C真空脫水。 獲得194克聚合物,產率92.6%(基於pva計算)。聚合 物構係符合結構式’其中Rl基係衍生自正丁酸,以及 基係衍生自2-羥苄醛,以及R3基係衍生自4_甲醯基苯氧乙 酸,m值為16%莫耳比,n值為1〇%莫耳比,p值為12%莫耳 比,〇值為18%莫耳比,以及q值為44%莫耳比(Tg65°C)。 製備例8 110克莫威爾3-98聚乙烯醇(具有數目平均分子量約 16000之98°/〇水解聚乙酸乙烯酯)添加至密閉反應容器内, 容器配備有水冷冷凝器、添加漏斗及溫度計,且含有25〇 克去礦物質水。藉連續攪拌,將混合物於9〇〇c加熱i小時至 變澄清溶液。此後溫度調整至6(rc及加入6克對-甲苯磺酸 。經15分鐘時間,以逐滴方式加入152克3,5•二溴羥节醛 及1.4克2,6·二·第三丁基曱酚於75〇克?1^之溶液。反應混 合物藉額外500克PV[稀釋,及以逐滴方式添加123克正丁 酉全於5〇〇克1>“,當醛類之添加完成時,反應於50°C又持續 A4規格(210X297公釐) 本紙張尺度適用中國國家標準(CNS) 573208 A7 B7 五、發明説明(34 進行3小時。水由反應混合物蒸餾去除,及以pM置換(溶液 中殘留水量低於1% )。1〇〇克原甲酸三乙酯添加至反應混合 物。於反應混合物中偵測得水量低於01 %,3,弘二溴羥 苄酸之轉化率為定量。反應混合物以碳酸銨中和至pH 7土 〇·5,然後攙混15升水·甲醇(1〇:1)。沉澱聚合物以水洗滌, 過濾及於50°C真空脫水。 獲得248克聚合物,產率95.2%(基於PVA計算)。聚合 物結構係符合結構式,其中Ri基係衍生自正丁酸,以及r2 基係衍生自3,5-二溴-4-羥苄醛,m值為14%莫耳比,n值為 莫耳比,p值為2%莫耳比以,及q值為40%莫耳比(Tg 73 °C)〇 應用例1 得自製備例1之聚合物溶解於PM且用於製備具有如下 配方之熱敏組合物: 成分 縮酸聚合物1 13.2 顏料(普雷地索N1203*) 0.8 界面活性劑 〇.〇5 多瓦諾PM 85.95 *昇陽化學公司 組合物經球磨12小時,過濾及塗布於〇.5盎司預先經過 清潔及微蝕刻的常規銅護罩表面之8密耳玻璃_環氧樹脂積 層上。於13CTC乾燥3分鐘後,所得平板帶有5.5克/平方米 乾厚度之塗層。平板於克雷歐鑽石2028F成像機成像。要 求獲得良好影像的能量密度為200毫焦/平方厘米。平板於 本紙張尺度適用中國國家標华(CNs) A4规格(2]0><297公釐) (請先閱讀背面之注意事項再墙寫本頁) 、可 ........線— 37 573208 五、發明説明(35 5%旦氫氧化納於水溶液顯像6〇秒,獲得帶有2密耳線對間比 之影像。顯像後之平板於習知氣化銅蝕刻劑蝕刻,結果獲 得鮮明導體邊緣及2密耳線對間比之印刷電路。^又 ΜΛΜ1 得自製備例2之聚合物溶解於多瓦—ΡΜ,以及用於製 備具有如下配方之熱敏組合物: 成分 。/ + s .. /〇 W w 縮醛聚合物2 16 0 黏著促進劑-1,3,5-參[丙炔基氧羰基]苯〇 〇5 顏料海利金綠D-8330* i 界面活性劑 〇 〇5 多瓦諾PM 82 9___B7 V. Description of the invention (33) A solution of phenylphenoxyacetic acid and 30.8 g of 2-hydroxybenzaldehyde and 1.5 g of 2,6 · di-tert-butyl-4-methanol in 750 g of PM. The reaction mixture was diluted with 200 g of pm, and 34.2 g of isovaleraldehyde was added dropwise to 500 g of PM. When the addition of aldehydes was completed, the reaction was continued at 50 C for another 3 hours. Water was distilled from the reaction mixture and replaced with PM. At this time, the water content of the reaction mixture was less than 0.01%, and the conversion ratio of 2-to benzyl acid via 2-anosic acid and 4-methylfluorenylphenoxyacetic acid was quantitative. The reaction mixture was neutralized to pH 7 ± 0.5 using sodium bicarbonate, and then 15 liters of water-methanol (10: 1) were mixed. The precipitated polymer was washed with water, filtered and dehydrated under vacuum at 50 ° C. 194 g of polymer was obtained with a yield of 92.6% (calculated based on pva). The polymer structure conforms to the structural formula 'wherein the R1 group is derived from n-butyric acid, and the group is derived from 2-hydroxybenzaldehyde, and the R3 group is derived from 4-formamylphenoxyacetic acid, and the m value is 16%. Ear ratio, n value is 10% mole ratio, p value is 12% mole ratio, 0 value is 18% mole ratio, and q value is 44% mole ratio (Tg65 ° C). Preparation Example 8 110 g of Mowell 3-98 polyvinyl alcohol (having a number average molecular weight of about 16000 of 98 ° / 〇 hydrolyzed polyvinyl acetate) was added to a closed reaction container, and the container was equipped with a water-cooled condenser, an addition funnel, and a thermometer. And contains 25 grams of demineralized water. With continuous stirring, the mixture was heated at 900 c for 1 hour until it became a clear solution. Thereafter the temperature was adjusted to 6 ° C and 6 grams of p-toluenesulfonic acid was added. Over a period of 15 minutes, 152 grams of 3,5 • dibromohydroxyaldehyde and 1.4 grams of 2,6 · di · tertiary butyl were added dropwise. A solution of stilbeneol in 750 g? ^. The reaction mixture was diluted with an additional 500 g of PV [diluted, and 123 g of n-butyl fluorene was added in a dropwise manner to 500 g. Responds to A4 specification (210X297 mm) at 50 ° C. This paper size applies Chinese National Standard (CNS) 573208 A7 B7. 5. Description of the invention (34 for 3 hours. Water is distilled off from the reaction mixture and replaced with pM ( The amount of residual water in the solution was less than 1%). 100 g of triethyl orthoformate was added to the reaction mixture. The water content in the reaction mixture was detected to be less than 01%, and 3, the conversion rate of dibromohydroxybenzoic acid was quantitative. The reaction mixture was neutralized with ammonium carbonate to pH 7.5, and then mixed with 15 liters of water · methanol (10: 1). The precipitated polymer was washed with water, filtered and dehydrated under vacuum at 50 ° C. 248 g of polymer was obtained The yield is 95.2% (calculated based on PVA). The polymer structure conforms to the structural formula, of which the Ri-based system is derived from The butyric acid and r2 groups are derived from 3,5-dibromo-4-hydroxybenzaldehyde, with an m value of 14% mole ratio, an n value of mole ratio, a p value of 2% mole ratio, and q The value is 40% Molar ratio (Tg 73 ° C). Application Example 1 The polymer obtained from Preparation Example 1 was dissolved in PM and used to prepare a heat-sensitive composition having the following formula: Ingredient acid-acid polymer 1 13.2 Pigment ( Predisosol N1203 *) 0.8 Surfactant 0.05 Dovano PM 85.95 * The composition of Shengyang Chemical Co., Ltd. was ball-milled for 12 hours, filtered and coated on 0.5 ounces of conventional copper shield pre-cleaned and micro-etched 8 mil glass_epoxy laminate on the cover surface. After drying at 13CTC for 3 minutes, the resulting plate is coated with a dry thickness of 5.5 g / m2. The plate is imaged on a Clio diamond 2028F imaging machine. Good quality is required The energy density of the image is 200 millijoules per square centimeter. The flat plate is suitable for China National Standards (CNs) A4 specifications (2) 0 > < 297 mm) at this paper scale. (Please read the precautions on the back before writing on the wall Page), can ........ line — 37 573208 V. Description of the invention (35 5% denatured sodium hydroxide in aqueous solution for 60 seconds to obtain a band There is an image of 2 mil line-to-line ratio. The developed plate is etched with a conventional vaporized copper etchant, and the printed circuit with a sharp conductor edge and a 2 mil line-to-line ratio is obtained. ^ MΛM1 is obtained from the preparation example The polymer of 2 is dissolved in Dowa-PM, and is used to prepare a heat-sensitive composition having the following formula: ingredients. / + S .. / 〇W w acetal polymer 2 16 0 adhesion promoter-1, 3, 5-reference [propynyloxycarbonyl] benzene 〇 05 pigment Haili Golden Green D-8330 * i Surfactant 005 Dowano PM 82 9

*BASF ------------------------裝—— (請先閱讀背面之注意事項再嶼寫本頁) •、一-T丨 :線丨 組合物經球磨12小時,過濾及塗布於1盎司預先經過 清潔的反向處理銅護罩表面之20密耳玻璃·環氧樹脂積層 上。於130°C乾燥4分鐘後,所得平板帶有9.5克/平方米乾 厚度之塗層。平板於克雷歐鑽石2028F成像機成像。要求 獲得良好影像的能量密度為300毫焦/平方厘米。平板於 0.75%氫氧化鈉於水溶液顯像50秒,獲得帶有2密耳線對間 比之影像。顯像後之平板於習知氣化銅蝕刻劑蝕刻,結果 獲得鮮明導體邊緣及2密耳線對間比之印刷電路。 應用例3 得自製備例3之聚合物溶解於多瓦諾PM,以及用於製 備具有如下配方之熱敏組合物: 本紙張尺度適用中國國家標準(CNS) A4规袼(230X297公赘) 38 573208 A7 B7 五、發明説明(36 ,刀 %重量比 縮醛聚合物3 15 〇 鼓彦促進劑- 2,4,6 -參(2·兩缺某氣1,3,5-三_ 0 〇3 IR 染料-NK-2911* * 著色劑-曱基藍 界面活性劑 多瓦諾PM *林原生化實驗室公司* BASF ------------------------ install—— (Please read the precautions on the back before writing this page) • 、 一 -T 丨: Line 丨 The composition was ball-milled for 12 hours, filtered and coated on a 20-mil glass-epoxy laminate laminated to the surface of a 1-ounce pre-cleaned copper shield. After drying at 130 ° C for 4 minutes, the resulting plate was coated with a dry thickness of 9.5 g / m 2. The plate was imaged on a Clio Diamond 2028F imager. The energy density required to obtain a good image is 300 mJ / cm2. The plate was developed with 0.75% sodium hydroxide in aqueous solution for 50 seconds to obtain an image with a 2-mil line-to-line ratio. The developed plate was etched with a conventional vaporized copper etchant. As a result, a printed circuit with a sharp conductor edge and a 2-mil wire-to-wire ratio was obtained. Application Example 3 The polymer obtained from Preparation Example 3 was dissolved in Donovan PM and used to prepare a heat-sensitive composition having the following formula: This paper is in accordance with Chinese National Standard (CNS) A4 Regulation (230X297) 573208 A7 B7 V. Description of the invention (36, knife% weight ratio acetal polymer 3 15 〇 Guyan accelerator-2,4,6-ginseng (2 · two lack of certain gas 1,3,5-tri_ 0 〇 3 IR Dye-NK-2911 * * Colorant-Pyridyl Blue Surfactant Dovano PM * Lim Biochemical Laboratory Company

組合物之成分溶解於PM ’經過濾及塗布於0 25盘司預 先經清潔以及顯微餘刻之銅護罩表面之8密耳玻璃_環氧樹 脂積層上。於13(TC乾燥3分鐘後,所得平板帶有65克/平 方米乾厚度之塗層。平板於克雷歐鑽石2028F成像機成像 。要求獲得良好影像的能量密度為250毫焦/平方厘米。平 板於0.9氫氧化鈉於水溶液顯像60秒,獲得帶有〇·75密耳線 對間比之影像。顯像後之平板於習知鹼性蝕刻劑姓刻,結 果獲得鮮明導體邊緣及〇·75密耳線對間比之印刷電路。 應用例4 得自製備例4之聚合物溶解於pm,以及用於製備具有 如下配方之熱敏組合物: (請先閱讀背面之注意事喟再填寫本頁〕 :線· 成分 縮醛聚合物4 IR 染料·ΝΚ-4432* 界面活性劑 著色劑·結晶紫 多瓦諾ΡΜ *林原生化實驗室公司 %重量比 16.0 0.1 0.05 0.05 83.8 本紙張尺度適用中國國家標準(CNS) μ规格(2]0Χ297公赘) -39 573208 A7 B7 五、發明説明(37 組合物之成分溶解於PM,經過濾及塗布於〇5盎司未 經預先清潔的銅護罩表面,12密耳玻璃_環氧樹脂積層上。 於130C乾燥3分鐘後,所得平板帶有6克/平方米乾厚度之 塗層。平板於克雷歐鑽石2028F成像機成像。要求獲得良 好影像的能量密度為250毫焦/平方厘米。平板於〇·7氫氧化 鈉於水溶液顯像60秒,獲得帶有丨密耳線對間比之影像。顯 像後之平板於習知鹼性蝕刻劑蝕刻,結果獲得鮮明導體邊 緣及1密耳線對間比之印刷電路。 應用例5 得自製備例4之聚合物溶解於多瓦諾pm,以及用於製 備具有如下配方之熱敏組合物: ------------------------裝—— (請先閱讀背面之注意事項再磺寫本頁} 、一-Τ— 成分 %重量比 縮醛聚合物4 15.0 聚乙酸乙烯酯-共聚-巴豆酸" 3 IR 染料-ΝΚ-2911* 0.08著色劑-結晶紫 0.05 界面活性劑 0.05 多瓦諾ΡΜ 81.82 :線· **亞利希公司 *林原生化實驗室公司 組合物之成分溶解於ΡΜ,經過濾及塗布於0.5盘司未 經預先清潔而轉鼓側經處理的銅護罩表面之12密耳玻璃-環氧樹脂積層上。於13(TC乾燥4分鐘後,所得平板帶有9.5 克/平方米乾厚度之塗層。平板於克雷歐鑽石2028F成像機 成像。要求獲得良好影像的能量密度為300毫焦/平方厘米 4、紙張尺度適用中國國家標华(0化)M规格(2】0χ297公釐) 40 573208 A7 ____ B7 五、發明説明(38 ) 。平板於0.75氫氧化鈉於水溶液顯像60秒,獲得帶有i密耳 線對間比之影像。顯像後之平板於習知酸性氯化鋼蝕刻劑 餘刻,結果獲得鮮明導體邊緣及1密耳線對間比之印刷電路 組成及製備係同製備例5,但聚乙酸乙烯酯-共聚·巴豆 酸共聚合物以聚甲基丙烯酸甲酯-共聚-甲基丙烯酸共聚物 (亞利希公司)置換。於13(TC乾燥4分鐘後,所得平板帶有 9·5克/平方米乾厚度之塗層。平板於克雷歐鑽石2028F成像 機成像。要求獲得良好影像的能量密度為250毫焦/平方厘 米。平板於0.8氫氧化鈉於水溶液顯像60秒,獲得帶有1密 耳線對間比之影像。顯像後之平板於習知鹼性蝕刻劑蝕刻 ,結果獲得鮮明導體邊緣及1密耳線對間比之印刷電路。 應用例7 得自製備例4之聚合物溶解於多瓦諾pm,以及用於製 備具有如下配方之熱敏組合物: 成分 %重量比 縮醛聚合物4 20.0 IR 染料 _ADS_830* 0.1 著色劑-結晶紫 0.2 界面活性劑 0.05 多瓦諾PM 79.65 *美國染料來源公司 本紙張尺度適用中國國家標準(⑶幻A4规格(2]0X297公釐)The ingredients of the composition were dissolved in PM ′, filtered and coated on an 8 mil glass-epoxy resin laminate of a copper shield surface that was previously cleaned and microscopically etched on a 25 mm plate. After drying at 13 ° C for 3 minutes, the resulting plate was coated with a dry thickness of 65 g / m 2. The plate was imaged on a Clio Diamond 2028F imager. The energy density required to obtain a good image was 250 mJ / cm 2. The plate was developed with 0.9% sodium hydroxide in an aqueous solution for 60 seconds to obtain an image with a 75.75 mil line-to-line ratio. The developed plate was engraved with a conventional alkaline etchant, and as a result, a sharp conductor edge and 〇 were obtained. · 75 mil line-to-line printed circuit. Application Example 4 The polymer obtained in Preparation Example 4 was dissolved in PM and used to prepare a heat-sensitive composition with the following formula: (Please read the precautions on the back first, and then Fill out this page]: Line · Ingredients: Acetal polymer 4 IR Dye · ΝΚ-4432 * Surfactant colorant · Crystal violet Dovano PM * Forest weight ratio 16.0 0.1 0.05 0.05 83.8 This paper size is applicable Chinese National Standard (CNS) μ Specification (2) 0 × 297 Public Key -39 573208 A7 B7 V. Description of the Invention (37 The components of the composition are dissolved in PM, filtered and coated in a 0.5-ounce unprotected copper shield Surface, 12 mil glass_ring Laminated on the resin. After drying at 130C for 3 minutes, the resulting plate was coated with a dry thickness of 6 g / m2. The plate was imaged on a Clio Diamond 2028F imager. The energy density required to obtain a good image was 250 mJ / square Cm. The plate was developed with 0.7 sodium hydroxide in aqueous solution for 60 seconds to obtain an image with 丨 mil line-to-line ratio. The plate after etching was etched with a conventional alkaline etchant to obtain a sharp conductor edge and 1 mil wire-to-line ratio printed circuit. Application Example 5 The polymer from Preparation Example 4 was dissolved in Donovan PM and used to prepare a thermosensitive composition having the following formula: -------- ---------------- 装 —— (Please read the precautions on the back before writing this page} 、 一 -Τ— Ingredients% by weight acetal polymer 4 15.0 Polyacetic acid Vinyl ester-copolymer-crotonic acid " 3 IR dye-ΝΚ-2911 * 0.08 colorant-crystal violet 0.05 surfactant surfactant 0.05 Dowano PM 81.82: line · ** Alich Corporation * Lin Biochemical Laboratory Company composition The ingredients are dissolved in PM, filtered and coated on 0.5 pans. The drum side is treated without prior cleaning. A 12 mil glass-epoxy laminate was laminated on the surface of the copper shield. After drying at 13 ° C for 4 minutes, the resulting plate was coated with a dry thickness of 9.5 g / m 2. The plate was imaged on a Clio Diamond 2028F imager The energy density required to obtain a good image is 300 mJ / cm2. 4. The paper size is applicable to China National Standard (0) M specifications (2) 0 x 297 mm. 40 573208 A7 ____ B7 5. Description of the invention (38). The plate was developed with 0.75 sodium hydroxide in aqueous solution for 60 seconds to obtain an image with i-mil line-to-line ratio. After the development, the plate was left in a conventional acid chloride steel etchant. As a result, the printed circuit composition and preparation of a sharp conductor edge and a 1 mil wire-to-line ratio were the same as those in Preparation Example 5, but polyvinyl acetate-copolymerization · The crotonic acid copolymer was replaced with a polymethyl methacrylate-co-methacrylic acid copolymer (Alirich). After drying at 13 ° C for 4 minutes, the resulting plate was coated with a dry thickness of 9.5 g / m 2. The plate was imaged on a Clio Diamond 2028F imager. The energy density required to obtain a good image was 250 mJ / square Cm. The plate was developed with 0.8 sodium hydroxide in aqueous solution for 60 seconds to obtain an image with a 1-mil line-to-line ratio. The plate after etching was etched with a conventional alkaline etchant to obtain a sharp conductor edge and a dense Printed circuit with ear-to-ear ratio. Application Example 7 The polymer obtained from Preparation Example 4 was dissolved in Donovan PM, and used to prepare a thermosensitive composition having the following formula: Ingredient% by weight to acetal polymer 4 20.0 IR Dye_ADS_830 * 0.1 Colorant-Crystal Violet 0.2 Surfactant 0.05 Dowano PM 79.65 * American Dye Source Company's paper standards are applicable to Chinese national standards (3) A4 size (2) 0X297 mm

.訂----- (請先閱讀背面之注意事項再填寫本頁) .線丨 41 573208 A7 B7 五、發明説明(39 溶液塗布於1密耳厚度經電弧處理之聚酯襯墊上,及 於120°C乾燥5分鐘。塗布後電阻薄膜達成之乾厚度為12微 米。薄膜熱積層於〇·25盎司未經預先清潔而轉鼓側經處理 之銅護罩表面之8密耳玻璃·環氧樹脂積層上(輥加熱至1〇〇 c)。聚酯蓋經去除,及平板於克雷歐鑽石2〇2817成像機成 像。要求獲得良好影像的能量密度為3〇〇毫焦/平方厘米 。平板於0.9氫氧化鈉於水溶液顯像6〇秒,獲得帶有}密耳 線對間比之影像。顯像後之平板於習知酸性蝕刻劑蝕刻 ’結果獲得鮮明導體邊緣及丨密耳線對間比之印刷電路,未 見黏著失敗徵象。 應用例8 得自製備例5之聚合物溶解於pm,以及用於製備具有 如下配方之熱敏組合物: %重量比 15.0 成分 縮醛聚合物5 鱼_著促進劑-聚胺基甲酸酯 0.35 IR染料-NK-2911** 〇.〇8 著色劑-甲基藍 〇.〇5 界面活性劑 〇 〇5 多瓦諾PM 84.57 原生化實驗室公司 麥脸基曱故酯係由43克2·丁炔-1 4-二醇及58斿震肀 1兰孕1署雜義容曱液滅铭⑼巧克臺㉝ 組合物之成分溶解於PM,經過濾及塗布於〇·5盎司未 經預先清潔的雙重處理銅護罩表面之8密耳玻璃-環氧樹脂 積層上。於130°C乾燥4分鐘後,所得平板帶有8克/平方米 乾厚度之塗層。平板於克雷歐鑽石2028F成像機成像。要 求獲得良好影像的能量密度為250毫焦/平方厘米。平板於 573208 A7 B7 五、發明説明(4〇 5%氫氧化鈉於水溶液顯像6〇秒,獲得帶有丨密耳線對間比 之影像。顯像後之平板於習知鹼性蝕刻劑蝕刻,結果獲得 鮮明導體邊緣及1密耳線對間比之印刷電路。 又 &MM1 得自製備例7之聚合物溶解MPM,以及用於製備具有 如下配方之熱敏組合物: 成刀 %重量比 縮醛聚合物7 18 〇 數·^ASL-2,4,6-參(2-丙炔基氧)-ns·三畊〇〇2 IR染料-ADS-830* 〇 〇8 著色劑-甲基藍 界面活性劑 〇 多瓦諾PM 81 8 *美國染料來源公司 組合物之成分溶解於PM,經過濾及塗布於〇·5盎司經 波買石刮擦銅護罩表面之20密耳玻璃-環氧樹脂積層上。於 130C乾燥3分鐘後’所得平板帶有5克/平方米乾厚度之汾 層。平板於克雷歐鑽石2028F成像機成像。要求獲得良好 影像的能量密度為200毫焦/平方厘米。平板於2%氫氧化納 於水溶液顯像40秒,獲得帶有1密耳線對間比之影像。顯像 後之平板於習知鹼性蝕刻劑蝕刻,結果獲得鮮明導體邊緣 及1密耳線對間比之印刷電路。 應用例10 得自製備例8之聚合物溶解於ΡΜ,以及用於製備具有 本紙張尺度適用中國國家標準(CNS) Α4规格Ul〇X297公釐) (請先閱讀背面之注意事項再填寫本頁) .、一吁丨 :線丨 43 573208 A7 __ _B7_ 五、發明説明(41 ) 如下配方之熱敏組合物: 成分 %重量比 縮醛聚合物8 12>8 黏著促進劑-2儿6-參(2-丙炔基氣)-1丄5二^ 〇 〇3 IR染料-ADS-830* 〇 〇5 者色劑·結晶紫 005Order ----- (Please read the precautions on the back before filling this page). Line 丨 41 573208 A7 B7 V. Description of the invention (39 solution coated on 1 mil thick polyester liner with arc treatment, And dried at 120 ° C for 5 minutes. The dry thickness of the resistive film after coating was 12 microns. The film was thermally laminated to 0.25 ounces of 8 mil glass on the drum side treated copper shield surface without pre-cleaning. Laminated with epoxy resin (roller heated to 100c). The polyester cover was removed and the plate was imaged on a Creo Diamond 202817 imager. The energy density required to obtain a good image was 300 mJ / square Cm. The plate was developed with 0.9% sodium hydroxide in an aqueous solution for 60 seconds to obtain an image with} mil line-to-line ratio. The plate after etching was etched with a conventional acid etchant to obtain a sharp conductor edge and dense. There was no sign of adhesion failure on the printed circuit of the ear-to-line ratio. Application Example 8 The polymer obtained in Preparation Example 5 was dissolved in PM and was used to prepare a heat-sensitive composition having the following formula:% by weight 15.0 Ingredient Acetal Polymer 5 Fish _ Accelerator-Polyurethane 0.35 IR Dye-NK-2911 ** 〇.08 Colorant-Methyl Blue 〇.05 Surfactant 005 Donovano PM 84.57 Natrium Labs Inc. Butyne-1 4-diol and 58 斿 肀 肀 兰 兰 兰 兰 孕 孕 杂 义 杂 杂 杂 杂 杂 杂 杂 杂 灭 ⑼ ⑼ ⑼ ⑼ ⑼ 克 ㉝ ㉝ ㉝ 之 The composition of the composition is dissolved in PM, filtered and coated in 0.5 ounces without prior 8 mil glass-epoxy laminate on a clean, double-treated copper shield surface. After drying at 130 ° C for 4 minutes, the resulting plate is coated with a dry thickness of 8 g / m2. The plate is a Clio diamond 2028F imager imaging. The energy density required to obtain a good image is 250 mJ / cm2. Flat plate at 573208 A7 B7 V. Description of the invention (405% sodium hydroxide was developed in aqueous solution for 60 seconds. Image of ear-to-line ratio. The developed plate was etched with a conventional alkaline etchant to obtain a printed circuit with a sharp conductor edge and a 1-mil line-to-line ratio. Also & MM1 Polymerization from Preparation Example 7 It dissolves MPM, and is used to prepare a heat-sensitive composition having the following formula: knife-to-weight% acetal polymer 7 18 〇Number ^ ASL-2,4,6-ginseng (2-propynyloxy) -ns · Sangen 002 IR dye-ADS-830 * 〇08 Colorant-methyl blue surfactant 〇 多Wano PM 81 8 * The ingredients of the American Dyestuffs Corporation composition are dissolved in PM, filtered and coated on a 0.5 ounce glass-epoxy laminate of a copper shield surface scratched with a wave of stone. After drying at 130C for 3 minutes, the resulting plate had a fen layer of 5 g / m 2 dry thickness. The plate was imaged on a Clio Diamond 2028F imaging machine. The energy density required to obtain a good image is 200 mJ / cm2. The plate was developed with 2% sodium hydroxide in aqueous solution for 40 seconds to obtain an image with a 1-mil line-to-line ratio. The developed plate was etched with a conventional alkaline etchant. As a result, a printed circuit with a sharp conductor edge and a 1-mil wire-to-line ratio was obtained. Application Example 10 The polymer obtained from Preparation Example 8 was dissolved in PM and used to prepare the paper with the applicable Chinese National Standard (CNS) A4 specification Ulx297 mm. (Please read the precautions on the back before filling this page ). One appeal 丨: Line 丨 43 573208 A7 __ _B7_ V. Description of the invention (41) The thermosensitive composition with the following formula: Ingredient% by weight acetal polymer 8 12 > 8 Adhesion promoter-2-6 (2-propynyl gas) -1.55 ^ ^ 〇〇3 IR dye-ADS-830 * 〇005 color agent · Crystal Violet 005

界面活性劑 0.M 多瓦諾PM 87 q2 *美國染料來源公司 組合物之成分溶解於PM,經過濾及塗布於〇5盎司預 先經清潔且轉鼓側經處理銅護罩表面之12密耳玻璃-環氧 樹脂積層上。於130°C乾燥3分鐘後,所得平板帶有9·5克/ 平方米乾厚度之塗層。平板於克雷歐鑽石2〇2817成像機成 像。要求獲得良好影像的能量密度為3〇〇毫焦/平方厘米。 平板於2%碳酸鈉於水溶液於35。(^顯像60秒,且於熱(45°C) 水清洗,獲得帶有1密耳線對間比之影像。顯像後之平板於 習知酸性氣化銅蝕刻劑蝕刻,結果獲得鮮明導體邊緣及1 密耳線對間比之印刷電路。 應用例11 得自製備例6之聚合物溶解於多瓦諾pM,以及用於製 備具如下配方之熱敏組合物: 成分 縮醛聚合物6 本紙張尺度適用中國國家標準(CNS) %重量比 12.0 (請先閱讀背面之注意事項再4寫本頁) 訂----- :線丨 44 573208 A7 B7 五、發明説明(42 IR 染料-ADS-830* 0.12 著色劑·結晶紫 0.05 界面活性劑 0.03 多瓦諾ΡΜ 87.8 請 先 *美國染料來源公司 閲 讀 背Surfactant 0.M Dovano PM 87 q2 * The ingredients of the American Dyestuffs Corporation composition are dissolved in PM, filtered and coated on 05 ounces. 12 mils of pre-cleaned and drum-side treated copper shield surface. Glass-epoxy laminate. After drying at 130 ° C for 3 minutes, the resulting plate was coated with a dry thickness of 9.5 g / m 2. The plate was imaged on a Creo Diamond 202817 imager. The energy density required to obtain a good image is 300 mJ / cm2. Plate at 2% sodium carbonate in water at 35. (^ Development is 60 seconds, and it is washed with hot (45 ° C) water to obtain an image with a 1 mil line-to-line ratio. After development, the plate is etched with a conventional acid vaporized copper etchant, and the result is sharp. Printed circuit with conductor edge and 1 mil line-to-line ratio. Application Example 11 The polymer obtained in Preparation Example 6 was dissolved in Donovan pM and used to prepare a thermosensitive composition having the following formula: Acetal polymer 6 This paper size applies Chinese National Standard (CNS)% weight ratio 12.0 (Please read the precautions on the back before writing this page) Order -----: Line 丨 44 573208 A7 B7 V. Description of the invention (42 IR dyes -ADS-830 * 0.12 Colorant · Crystal Violet 0.05 Surfactant 0.03 Donovan PM 87.8

S 之 注 組合物之成分溶解於PM,經過濾及塗布於陽極化鋁表 | 面上。於12CTC乾燥3分鐘後,所得平板具有2·5克/平方米 | 乾厚度塗層。平板於克雷歐平板設定器3244成像。獲得極 | 為良好影像所需的能量密度為250毫焦/平方厘米。平板於 一 5.5%氫氧化鈉於水溶液顯像8〇秒,以水清洗及乾燥。使用 薄片進給壓機及市售製程之黑色墨水,印刷板經過丨〇〇,⑼〇 _人壓縮操作未見任何影像的磨耗。〇5%標示點於15〇線/吋 篩目上為可接受。 已經參照某些較佳具體實施例說明本發明之細節,但 須了解於本發明之精髓及範圍内可作多種變化及修改。 本紙張尺度適用中國國家標準(CNS) Α4规格(2Κ)Χ297公赘) 45S Note The components of the composition are dissolved in PM, filtered and coated on the anodized aluminum surface. After drying at 12CTC for 3 minutes, the resulting plate had a coating thickness of 2.5 g / m2 | dry thickness. Plates were imaged on the Creo Plate Setter 3244. The energy density required to obtain polar images is 250 mJ / cm². The plate was developed with a 5.5% sodium hydroxide solution in water for 80 seconds, washed with water and dried. Using a sheet feeding press and black ink in a commercially available process, the printing plate was subjected to a compression operation without any image wear. A 5% mark is acceptable on a 150 mesh / inch screen. The details of the present invention have been described with reference to certain preferred embodiments, but it should be understood that various changes and modifications can be made within the spirit and scope of the present invention. This paper size applies to China National Standard (CNS) Α4 size (2K) × 297 male and female 45

Claims (1)

573208 公告本 六、申請專利範圍573208 Bulletin VI. Scope of Patent Application 第89126927號專利中請案中請專利範圍修正本 修正日期:92年4月 一種正作用抗熱蝕元件,包括一金屬次層、合金次層或 印刷板包含一基材具有至少一金屬表面且帶有一正竹 用抗熱餘劑黏著於該至少一金屬表面,該正作用抗熱|涵 層包含一種縮醛聚合物包含通式: Vy° 0、>· \ / Ιο* -?f r & 1· CH \ R 1 其中 RA_CnH2n+1 此處n=l-12 ; R2為Patent No. 89126927 claims for amendment of the scope of the patent. This revision date: April 1992 A positive action anti-corrosion element, including a metal sublayer, an alloy sublayer, or a printing board including a substrate with at least one metal surface and A positive heat-resisting agent is used to adhere to the at least one metal surface, and the positive-acting heat-resisting material contains an acetal polymer containing the general formula: Vy ° 0, > · \ / Ιο *-? Fr & 1 · CH \ R 1 where RA_CnH2n + 1 where n = l-12; R2 is 經濟部智慧財產局員工消費合作社印製 其中 R4OH ; R5=-0H 或-OCH3·或 Br-或-O-CH2-C eCH;以及R6=Br-或N02 R3=-(CH2)n-COOH或-C 三 CH或 一^^~% 此處R7=COOH,-(CH2)3COOH,-0-(CH2)2-C00H, 以及m=5-40%莫耳比, n=10-60 %莫耳比, 〇=0-20 %莫耳比, p=l-10 %莫耳比, 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公t ) I I I I If I I --·1111111 ^ ·111111 I Γ Jr. (請先閱讀背面之注意事項再填寫本頁) 46 申請專利範圍 q=5-50 %莫耳比;以及 一種紅外光吸收材料其含量係占該正作用抗熱蝕 層之0·01至20%重量比。 2·如申請專利範圍第1項之正作用抗熱蝕元件,其中該正 作用抗熱蝕層為一種正作用抗熱蝕層包含: 一種縮醛聚合物,包含5-40%(莫耳基準)脂族縮醛 基’以及10-60%(莫耳基準)酚系縮醛基,以及 一種紅外光吸收材料,其含量係占正作用抗熱蝕層 之0.01至20%重量比。 3·如申請專利範圍第丨或2項之正作用抗熱蝕元件,其中該 金屬係選自鉻、铭及銅組成的組群。 4·如申請專利範圍第1或2項之正作用抗熱蝕元件,其中該 金屬係選自鋁及銅組成的組群;以及該抗熱蝕層含有黏 著促進量之帶有炔屬鍵結之化合物。 5.如申請專利範圍第1或2項之正作用抗熱钱元件,其中至 少一個於該旁出基縮醛樹脂之旁出基具有含炔屬鍵結 基於其中。 6·如申請專利範圍第1或2項之正作用抗熱触元件,其中該 紅外光吸收材料包括一種紅外光吸收顏料。 7.如申請專利範圍第1或2項之正作用抗熱餘元件,其中該 紅外光吸收材料包括一種紅外光吸收染料。 8·如申請專利範圍第1或2項之正作用抗熱蝕元件,其中該 抗熱#層不含光敏化合物,其當使用紫外光或可見光輻 射照射時可變更其顯像能力。 本紙張尺度適—(2iq 297公釐) 573208 六 經濟部智慧財產局員工消費合作社印製 、申請專利範圍 9·如申請專利範圍第1或2項之正作用抗熱蝕元件,其中該 抗熱敍層具有平均厚度為1至3〇微求。 10_ —種正作用抗熱蝕元件,包含一含銅基材於該基材之至 少一表面上黏合有一具有厚度為1至3〇微米之正作用抗 熱姓層,該層包含: a) —種縮醛聚合物,包含5-40❶/〇(莫耳基準)脂族縮醛 基’以及10-60%(莫耳基準)盼系縮醛基,以及 b) —種紅外光吸收材料,其含量係占正作用抗熱蝕 層之0.01至20%重量比。 11· 一種乾膜可積層抗蝕元件,包含一可去除載具,於其離 型表面上可去除式附著有一厚度由約3至5〇微米之正作 用抗熱姓層,以及該層包含: 一種縮醛聚合物,包含5-40%(莫耳基準)脂族縮醛 基’以及10-60%(莫耳基準)酚系縮醛基,以及 一種紅外光吸收材料,其含量係占正作用抗熱蝕層 之0.01至20%重量比。 12· —種合成如申請專利範圍第丨項之聚乙烯基縮醛聚合物 之方法,包含a)使用羥基取代芳族醛及強催化劑酸縮醛 化聚乙烯醇,以及控制使用羥基取代芳族醛進行縮醛化 所得達成之縮醛基水解量,該控制方式係經由於縮醛反 應完成前,藉蒸餾而由聚乙烯醇及羥基取代芳族醛中去 除水’俾減少聚乙稀醇及經基取代芳族酿之水量而達成 ;或b)使用羥基取代芳族醛及強催化劑酸縮醛化聚乙烯 醇’以及控制使用經基取代芳族酸進行縮駿化所得達成 本紙張尺度適用中國國家標準(CNS)A4規格(2】0 X 297公釐) 訂 I 48 573208 、申清專利範圍 之縮駿基水解量,該控制方式係經由於縮醛反應完成前 ’經由添加可與水反應而產生揮發性及/或惰性材料。 13. 如申請專利範圍第12項之方法,其中可與水反應之材料 係選自有機碳酸鹽類、碳酸或羧酸之原酸酯類、及含矽 化合物組成的組群。 14. 一種於印刷板表面上製造一成像圖樣之直接方法,該方 法包含形成如申請專利範圍第丨項之正作用抗熱蝕印刷 板之各步驟: a) 導引具有足夠強度通量之聚焦能束至該薄膜之 選定區俾於組合物之溶解度性質執行熱感應轉變;以及 b) 薄膜接觸一種顯像劑,該顯像劑可由受能束撞擊 區中有效去除組合物。 15·如申請專利範圍第14項之方法,其中該基材表面包含銅 或紹。 16·如申請專利範圍第14項之方法,其中該正作用抗蝕組合 物進一步包括黏著促進用量之一種含快屬鍵結之化合 物0 297公釐) 訂 &從场用中國國家標準(CNS)A4規格(2J0: 49Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy where R4OH; R5 = -0H or -OCH3 · or Br- or -O-CH2-C eCH; and R6 = Br- or N02 R3 =-(CH2) n-COOH or -C three CH or one ^^ ~% where R7 = COOH,-(CH2) 3COOH, -0- (CH2) 2-C00H, and m = 5-40% mole ratio, n = 10-60% mole Ear ratio, 〇 = 0-20% Morse ratio, p = 1- 10% Morse ratio, this paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 g t) IIII If II-· 1111111 ^ · 111111 I Γ Jr. (Please read the notes on the back before filling out this page) 46 Patent application scope q = 5-50% Molar ratio; and an infrared light absorbing material whose content accounts for the positive action anti-corrosion layer 0.01 to 20% by weight. 2. The positive-acting anti-corrosion element according to item 1 of the scope of patent application, wherein the positive-acting anti-corrosion layer is a positive-acting anti-corrosion layer comprising: an acetal polymer containing 5-40% (Moore's reference) ) Aliphatic acetal group ', 10-60% (Mole basis) phenolic acetal group, and an infrared light absorbing material, the content of which is 0.01 to 20% by weight of the positive-acting thermal corrosion layer. 3. The positive-acting anti-corrosion element according to item 丨 or 2 of the scope of the patent application, wherein the metal is selected from the group consisting of chromium, inscription and copper. 4. The positive-acting anti-corrosion element according to item 1 or 2 of the scope of patent application, wherein the metal is selected from the group consisting of aluminum and copper; and the anti-corrosion layer contains an adhesion-promoting amount with an acetylene bond Of compounds. 5. The positive-acting heat-resistant money element according to item 1 or 2 of the scope of patent application, wherein at least one of the side groups of the side group acetal resin has an acetylenic bond based thereon. 6. The positive-acting heat-resistant element according to item 1 or 2 of the patent application scope, wherein the infrared light absorbing material includes an infrared light absorbing pigment. 7. The positive-acting heat-resistance element according to item 1 or 2 of the patent application scope, wherein the infrared light absorbing material comprises an infrared light absorbing dye. 8. If the positive-acting anti-corrosion element of item 1 or 2 of the patent application scope, wherein the heat-resistant # layer does not contain a photosensitive compound, its imaging ability can be changed when it is irradiated with ultraviolet or visible light radiation. The size of this paper is suitable— (2iq 297 mm) 573208 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs and applied for a patent scope 9. If a positive-acting anti-corrosion element of the scope of patent application item 1 or 2, The layer has an average thickness of 1 to 30 micron. 10_ —A type of positive action anti-corrosion element comprising a copper-containing substrate bonded to at least one surface of the substrate and a positive-acting heat-resistant surname layer having a thickness of 1 to 30 microns, the layer comprising: a) — Acetal polymer, containing 5-40 ❶ / 〇 (Mole basis) aliphatic acetal group 'and 10-60% (Mole basis) hope system acetal group, and b) an infrared light absorbing material, which The content is 0.01 to 20% by weight of the positive-acting anti-corrosion layer. 11. A dry film buildable resist element comprising a removable carrier, a positive-acting heat-resistant layer having a thickness of about 3 to 50 microns is removably attached to a release surface thereof, and the layer comprises: An acetal polymer containing 5-40% (Mole-based) aliphatic acetal group 'and 10-60% (Mole-based) phenol-based acetal group, and an infrared light absorbing material, the content of which is positive 0.01 to 20% by weight of the anti-corrosion layer. 12 · —A method for synthesizing a polyvinyl acetal polymer such as the one in the scope of the patent application, comprising a) using a hydroxyl group to replace the aromatic aldehyde and a strong catalyst acid acetalizing polyvinyl alcohol, and controlling the use of a hydroxyl group to replace the aromatic The amount of acetal hydrolysis obtained by acetalization of aldehydes is controlled by removing water from polyvinyl alcohol and hydroxyl-substituted aromatic aldehydes by distillation before the acetal reaction is completed. Achieved by radically substituted aromatic water; or b) using hydroxyl substituted aromatic aldehydes and strong catalysts to acetalize polyvinyl alcohol 'and controlling the use of radically substituted aromatic acids for shrinking to reach paper costs Chinese National Standard (CNS) A4 Specification (2) 0 X 297 mm Order I 48 573208, the amount of shrinking base hydrolyzed in the scope of the patent application, the control method is through the completion of the acetal reaction 'with the addition of water and water The reaction produces volatile and / or inert materials. 13. The method of claim 12 in which the material capable of reacting with water is selected from the group consisting of organic carbonates, orthoesters of carbonic acid or carboxylic acids, and silicon-containing compounds. 14. A direct method for making an imaging pattern on the surface of a printing plate, the method comprising the steps of forming a positive-acting anti-corrosive printing plate as described in the scope of the patent application: a) guiding a focus with sufficient intensity flux The energy beam can reach a selected area of the film to perform a thermally induced transformation based on the solubility properties of the composition; and b) the film is contacted with an imaging agent which can effectively remove the composition from the impacted area of the energy beam. 15. The method of claim 14 in which the surface of the substrate comprises copper or copper. 16. The method according to item 14 of the patent application scope, wherein the positive-acting resist composition further includes an adhesion-promoting amount of a compound containing a fast-type bond (0 297 mm). Order & Application of Chinese National Standards (CNS) ) A4 specifications (2J0: 49
TW89126927A 1999-07-30 2000-12-15 Positive acting photoresist composition and imageable element TW573208B (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/365,279 US6255033B1 (en) 1999-07-30 1999-07-30 Positive acting photoresist compositions and imageable element
US09/625,582 US6541181B1 (en) 1999-07-30 2000-07-26 Positive acting photoresist composition and imageable element
PCT/IB2000/001147 WO2001009682A2 (en) 1999-07-30 2000-07-28 Positive acting photoresist composition and imageable element
IN680KO2000 2000-12-14
IL140299A IL140299A (en) 2000-12-14 2000-12-14 Positive acting photoresist composition and imageable element

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