571604 w 五 、發明說明（l) 刷雷if =利隸屬Γ種印刷電路板之技術領域，藉由印 性辦κ ^二i/d頂面形成導電或非導電的彈性體，且於彈 印刖t + °又電體的特殊設計，有效解決晶片D丨e貼設於 “路板時，常因熱膨脹係數所生之剝離及變形問題， 有政的提升整體的傳輸品質及生產良率。 f ’為因應科技產品的功能日趨精緻，（c封裝的接腳 3來越多，HX寸縮小也就更為迫切，制傳統表面黏 術之1 c封裝漸漸無法滿足這些需要，而現有的I C封裝 =法有TSOP、BGA、CSP及WLCSI^，但以TS〇p為例其導線 太大、且引線太長Delay太久，無法提供高傳輸之需 =，且無法縮小其面積，而BGA因其印刷電路板面積太 大、，而造，Delay,雖已比TS0P之功能增強了許多，然仍 無法達成尚傳輸、低成本之需求，而csp雖已倶備此能 力，但仍擺脫不了印刷電路板，Wire B〇nd、Encapsulant 之封裝製程，WLCSP雖然已經不需封裝，但因s〇lder ball 直接上在Die上，而Die之CTE (熱膨脹係數）約為3 — 4PPM，g此Di e焊接於印刷電路板上時，會因與印刷電路 板之CTE (約為16-18PPM)差異太大，而影響Reliability (會斷裂）’或者需在主板與I C間灌入填充劑以黏著雙 方’但灌入填充器之製程並不容易處理（Yield不高）、 且又太貴，再者WLCSP此種方式之長金屬層的成本太高、 且又需封膠，無疑又多了成本； 由於上述不論係在TSOP、BGA、CSP或是WLCSP等各種 不同的封裝體上’均各自存在有不少的問題，因此在美國571604 w 5. Description of the invention (l) Lightning brush if = belongs to the technical field of Γ printed circuit boards. The conductive surface or non-conductive elastic body is formed by the printed surface κ ^ 2 i / d, and the elastic printing刖 t + ° and the special design of the electric body effectively solve the problem of peeling and deformation caused by the thermal expansion coefficient when the chip D 丨 e is mounted on the road board, and it can improve the overall transmission quality and production yield. f 'In response to the increasingly sophisticated functions of technology products, (the more the pin 3 of the c package, the more urgent the reduction of HX inches, the traditional surface adhesive 1c package is gradually unable to meet these needs, and the existing IC Packaging = TSOP, BGA, CSP, and WLCSI ^, but taking TS〇p as an example, the wires are too large and the leads are too long and the delay is too long to provide high transmission requirements =, and the area cannot be reduced. Its printed circuit board area is too large. However, Delay, although it has a lot of enhanced functions over TS0P, still can't meet the needs of transmission and low cost. Although csp has prepared this capability, it still cannot get rid of printing. Circuit board, Wire Bond, Encapsulant packaging process, WLC Although the SP does not need to be packaged, because the solder ball is directly on the die, and the CTE (Coefficient of Thermal Expansion) of the die is about 3-4 PPM. When this die is soldered to the printed circuit board, it will be caused by the printed circuit. The CTE of the board (about 16-18PPM) is too different, which affects the Reliability (will break) or a filler needs to be filled between the motherboard and the IC to adhere to the two sides, but the process of filling the filler is not easy to handle (Yield Not high), and it is too expensive, and the cost of the long metal layer of WLCSP is too high, and the sealing is necessary, which will undoubtedly increase the cost. There are many problems in various packages, so in the United States
第4頁 571604 五、發明說明（2) 專利第5，6 7 2 5 5 0號、第6，3 2 9 4 9 7號、歐盟專利 EP1137067、日本專利JP61260649，以及台灣專利公告第 46505 8號「無接腳式四方扁平封裝結構及其製造方法」、 公告第4 6 4 9 6 1號「高性能積體電路晶片封裝」、公告第 464 1 54號「改善撓曲之印刷電路板構造」、公告第464〇54 號「積體電路之封裝結構」、公告第463342號「覆晶式四 方肩平無接腳構裝」 '公告第4 6 32 74號「晶圓級晶片尺寸 構裝之製造方法」及公告第45 768 1號「晶片封裝方法」等 f利案均在刀別解決如述各種封裝體或方法所面臨的問 的方式外，亦有部份係由印 出一種具有高傳輸、且高密 電路板及方法，係被期待Page 4 571604 V. Description of the invention (2) Patent Nos. 5,6 7 2 5 50, 6, 3 2 9 4 9 7, EU patent EP1137067, Japanese patent JP61260649, and Taiwan Patent Bulletin No. 46505 8 "Pinless Quad Flat Package Structure and Manufacturing Method", Bulletin No. 4 6 4 9 6 1 "High Performance Integrated Circuit Chip Package", Bulletin No. 464 1 54 "Printed Circuit Board Structure with Improved Deflection" Announcement No. 464040, "Packaging Structure of Integrated Circuits", Announcement No. 463342, "Flip-Chip Quadrilateral Shoulder Flat No-Pin Structure" 'Announcement 4 6 32 74 " Manufacturing methods "and Announcement No. 45 768 1" Chip Packaging Method "and other fate cases are not only ways to solve the problems faced by various packages or methods described above, but also some are printed with a high Transmission and high-density circuit boards and methods are expected
而除了上述由晶片來解決 刷電路板來克服，故如何開發 度’並可提升整體良率的印刷 的〇 緣是， 發經驗，針 積極尋求解 功的發明出 熱膨脹係數 為達到 手段來進— 要係於印刷 上加入一層 所製成，且 本發明人乃 對上述印刷 決的方案， 一種印刷電 的問題，並 上述各項目 步具體實現 電路板製作 彈性體，該 在於彈性體 藉由多 電路板 經長期 路板及 大幅提 的，本 或增進 過程中 彈性體 頂面設 所面臨的 努力的開 其製作方 升產品良 發明主要 本發明的 ，將欲與 可為導電 置一薄導 關領域的 問題深入 發與試作 法，藉以 率 〇 係透過下 目的及成 I C連結導 材質或非 電體，如 研究與開 探討，並 ，終於成 有效克服 列的技術 效：其主 通之Pad 導電材質. 此I C即可In addition to the above, the chip is used to solve the problem by brushing the circuit board. Therefore, the development of printing that can improve the overall yield is based on the experience. The invention of the needle actively seeking solution is to achieve the means of thermal expansion— It is made by adding a layer to the printing, and the inventor has solved the above printing solution, a problem of printed electricity, and the above-mentioned each item step specifically realizes the circuit board to make an elastomer, which is that the elastomer uses multiple circuits The long-term road board and the substantial increase in the development of the top surface of the elastomer during the development of the process or the development of the product are well-invented. The main invention of the present invention is to set a thin gate to the conductive field. The problem is developed in depth and trial methods. The rate is based on the following purposes and the connection of conductive materials or non-electrical bodies through ICs. If research and development are explored, they finally become effective in overcoming the technical effects of the column: its main conductive Pad material This IC is enough
571604 五、發明說明（3) 一 f接焊接於此印刷電路板上’不需另外加填充劑，可有效 克服D i e與印刷電路板間的變形量· 精此，可使切割下來的單顆1C構裝體即可直接焊接於 二刷電路板上’而達到防止變形或剝離的現象，有效提升 整體的良率，並可降低成本。 接下來舉-較佳實施例，同時配合下列的圖式及圖號做進 一步之說明，其能使貴審查委員對本發明有更詳細的瞭 解，惟以下所述者僅為用來解釋本發明之較佳實施例，並 非企圖據以對本發明做任何形式上之限制，故凡是以本發 明之創作精神為基礎，而為本發明任何形式的修飾或變 更’ s仍應屬於本發明意圖保護之範脅。 本發明係一種可吸收I c與印刷電路板間CTE的印刷電 路板及其製作方法，請參閱第一圖所顯示者，本發明係於 印刷電路板1 0上形成若干用來連接丨c的金屬Pa^ 2 〇，然 後於金屬Pad層2 0上佈設有一層彈性體6 〇，該彈性體6 〇則 係由導電性材質或非導電材質所製成，且在於彈性體頂面 没置一薄導電體30，且最後在於導電體3 〇頂面可形成導電 體4 0或直接供I c之導電體連接，該導電體4 〇係用來直接焊 a又於I C 5 0上，藉以利用彈性體6 〇的應變量與導電體3 〇之延 展性來吸收I C5 0與印刷電路板1 〇間的cte變形量； 至於本發明上述構裝體的製造方法，則係如第二圖 示，其包含有： A、在印刷電路板上連接線路的金屬Pad層尚未塗上 Solder Mask前以PR(顯影劑）、鋼版、網版、點膠機、571604 V. Description of the invention (3) One f soldered to this printed circuit board 'no additional filler is needed, which can effectively overcome the amount of deformation between Die and the printed circuit board The 1C structure can be directly soldered to the two-brush circuit board to prevent deformation or peeling, effectively improve the overall yield, and reduce costs. The following is a preferred embodiment, which will be further explained in conjunction with the following drawings and numbers, which will enable your reviewers to have a more detailed understanding of the present invention, but the following are only used to explain the present invention The preferred embodiment is not intended to limit the present invention in any form, so any modification or change based on the creative spirit of the present invention should still belong to the scope of the present invention. Threaten. The present invention relates to a printed circuit board capable of absorbing CTE between I c and a printed circuit board, and a manufacturing method thereof. Please refer to the first figure. The present invention is to form a number of printed circuit boards 10 for connecting to c. A metal Pa ^ 2 〇, and then a layer of elastic body 6 〇 is arranged on the metal Pad layer 20, the elastic body 60 is made of conductive or non-conductive material, and the top surface of the elastomer is not placed The thin conductive body 30 is finally formed on the top surface of the conductive body 30. The conductive body 40 may be directly connected to the conductive body of Ic, and the conductive body 40 is used for directly soldering a to IC 50, thereby utilizing The strain of the elastic body 60 and the ductility of the conductive body 30 absorb the amount of cte deformation between I C50 and the printed circuit board 10; as for the manufacturing method of the above-mentioned structure of the present invention, it is as shown in the second figure , Which includes: A. The metal pad layer of the connection circuit on the printed circuit board is printed with PR (developer), steel plate, screen plate, dispenser before coating with Solder Mask,
第6頁 571604 五、發明說明（4) 塗佈或魏之方式’ B、 再以化學1 方式）在印刷電路 C、 再以有電1 電鍍等方式），將 D、 並於金屬j 後，留下對應彈性 性體頂面形成導電 Solder Mask)即可 藉此，本發明 Pad層上形成彈性晃 體，最後於該薄導 板在與I C連接時， 吸收CET的變形量， 高傳輸、且高密度 經由上述的說 構，本發明的構裝 諸如： 1 、提高產品 由於印刷電路板的 於彈性體頂面設置 性與薄導電體3 0之 電路板連接時，可 量’避免發生變形 將彈性體附著於金屬Pad層上； 【鍛（亦可為濺鍍、蒸鍍或無電電鍍等 ^反及彈性體表面形成一層金屬薄膜； ^鍍 式（亦可為濺鍍、蒸鑛或益電 表面的金屬薄膜加厚； … ^頂面上一層PR，且在經過曝光顯影 體的PR,’而在經過#刻的製程後、，於彈 體，最後在於導電體周圍塗佈護層（例 〇 在、、工過則述形成金屬P a d層，再於金屬 I，且在於彈性體頂面設置一薄導電 電體上^成導電體的製程，冑印刷電路 可利用彈性體與薄導電體3 0之延展性來 有效提升其良率，而組構成一種具有 及降低成本的印刷電路板者。 明’透過本發明特殊的製作方法與結 體至夕存在有下列的優點及實用價值； :af導電體間形成有-彈性體，且在 延電體，，用彈性體具有才目當應變 有％ «的特性，單顆1 c構裝體在與印刷 兩者間因CET所產生的變形 …、現有，大幅的提升單顆1C連接 571604 五、發明說明（5) 印刷電路板之良率。 2、 減少不必要之設備與製程·· 承前所述，由於單顆IC構裝體在連貼印刷電路板時的效果 極佳，因此相對上亦不需要如Die BONDER、Wire BONDER、Encapsulant等機台設備的投資，也可以減少不 必的製程，直接使用裸晶即可。 3、 降低成本： 由前述兩點說明，進一步可以理解到，在產品良率提 升、設備與製程減少後，確實可降低產品的製程成本，有 效提升其經濟效益。Page 6 571604 V. Description of the invention (4) Coating or Wei method 'B, then chemical 1 method) in printed circuit C, and then electroless 1 electroplating method, etc., after D, and metal j, By leaving the top surface of the corresponding elastic body to form a conductive Solder Mask), an elastic sway body is formed on the Pad layer of the present invention. Finally, when the thin guide plate is connected to the IC, it absorbs the amount of CET deformation and has high transmission. Through the above-mentioned structure of high density, the structure of the present invention is such as: 1. Improving the product's placement on the top surface of the elastomer due to the printed circuit board's connection with the thin conductive body of the circuit board, the amount can be avoided to prevent deformation. The elastomer is attached to the metal Pad layer; [forging (also can be sputtering, evaporation, or electroless plating, etc.) and a layer of metal film is formed on the surface of the elastomer; ^ plating type (also can be sputtering, evaporation, or benefit electricity The metal film on the surface is thickened; ... ^ a layer of PR on the top surface, and after the PR process of the exposed developer, and after the #etching process, the protective layer is coated on the elastic body and finally around the conductor (for example, 〇Formation of metal P ad layer Next to metal I, and a process of forming a thin conductive body on the top surface of the elastomer to form a conductive body, the printed circuit can use the ductility of the elastomer and the thin conductive body 30 to effectively improve its yield. Those who constitute a printed circuit board with and reduce costs. Ming 'through the special manufacturing method of the present invention and the existence of the structure to have the following advantages and practical value;: a-elastomer is formed between the af conductors, and in electricity extension The use of elastomers has the characteristic of strain when the strain is% «. The deformation of a single 1 c structure between CET and printing due to CET ... Existing, a single 1C connection is greatly improved. 571604 V. Description of the invention (5) Yield of printed circuit board 2. Reduction of unnecessary equipment and processes ... As mentioned before, since a single IC structure has an excellent effect when attaching a printed circuit board, it is also relatively high. It does not require investment in equipment such as Die BONDER, Wire BONDER, Encapsulant, etc. It can also reduce unnecessary processes and use bare crystals directly. 3. Reducing costs: According to the foregoing two points, it can be further understood that Yield rose to mention, the process equipment and reduce, indeed reduce the manufacturing cost of the product, effectively enhance its economic efficiency.
綜上所述，藉由本發明利用自然法則的高度創作，有 效解決印刷電路板易變形及剝離的問題，並提升其產品良 率，同時大幅提升其傳輸速度，完全符合專利法第十九條 及第二十條之規定，為一利用自然法則之高度技術的創 作，故爰依法提出發明專利申請，懇請貴審查委員賜予 核准發明專利。In summary, the invention uses the high degree of creation of natural laws to effectively solve the problem of easy deformation and peeling of printed circuit boards, and to improve the yield of its products, while greatly increasing its transmission speed, which fully meets Article 19 of the Patent Law and The provisions of Article 20 are highly technical creations that make use of the laws of nature. Therefore, you have filed an application for an invention patent in accordance with the law, and urge your reviewing committee to grant an approved invention patent.
第8頁 571604 圖式簡單說明 (一） 圖式說明 第一圖：係本發明構裝體的局部剖面示意圖，用以說明各 層之相對關係。 第二圖：係本發明之製程步驟示意圖。 (二） 圖號說明 (10)印刷電路板 （20)金屬Pad層 (30)薄導電體 （40)導電體 (50) 1C ( 60 )彈性體Page 8 571604 Brief description of the drawings (1) Description of the drawings The first drawing: is a partial cross-sectional view of the structure of the present invention, which is used to explain the relative relationship between the various layers. The second figure is a schematic diagram of the process steps of the present invention. (2) Explanation of drawing numbers (10) Printed circuit board (20) Metal pad layer (30) Thin conductor (40) Conductor (50) 1C (60) Elastomer
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