TW570227U - Computer heat dissipating system - Google Patents

Computer heat dissipating system

Info

Publication number
TW570227U
TW570227U TW090205780U TW90205780U TW570227U TW 570227 U TW570227 U TW 570227U TW 090205780 U TW090205780 U TW 090205780U TW 90205780 U TW90205780 U TW 90205780U TW 570227 U TW570227 U TW 570227U
Authority
TW
Taiwan
Prior art keywords
heat dissipating
computer heat
dissipating system
computer
heat
Prior art date
Application number
TW090205780U
Other languages
English (en)
Inventor
Tzung-Lung Li
Jen-Tian Lai
Shuai Jiang
Original Assignee
Foxconn Prec Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Prec Components Co Ltd filed Critical Foxconn Prec Components Co Ltd
Priority to TW090205780U priority Critical patent/TW570227U/zh
Priority to US09/841,612 priority patent/US6650536B2/en
Publication of TW570227U publication Critical patent/TW570227U/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW090205780U 2001-04-13 2001-04-13 Computer heat dissipating system TW570227U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW090205780U TW570227U (en) 2001-04-13 2001-04-13 Computer heat dissipating system
US09/841,612 US6650536B2 (en) 2001-04-13 2001-04-24 Cooling system for computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW090205780U TW570227U (en) 2001-04-13 2001-04-13 Computer heat dissipating system

Publications (1)

Publication Number Publication Date
TW570227U true TW570227U (en) 2004-01-01

Family

ID=21682958

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090205780U TW570227U (en) 2001-04-13 2001-04-13 Computer heat dissipating system

Country Status (2)

Country Link
US (1) US6650536B2 (zh)
TW (1) TW570227U (zh)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6975509B2 (en) * 2002-05-16 2005-12-13 Sun Microsystems, Inc. Computing apparatus with cooling fan
US6951513B1 (en) * 2003-05-02 2005-10-04 Foundry Networks, Inc. Enclosure for the storage and operation of electronic components having increased airflow characteristics
US7238104B1 (en) * 2003-05-02 2007-07-03 Foundry Networks, Inc. System and method for venting air from a computer casing
CN1302356C (zh) * 2003-10-22 2007-02-28 纬创资通股份有限公司 冷却装置
US20050136826A1 (en) * 2003-12-22 2005-06-23 Liang-Hua Wang Central processing unit cooling device
US20100059310A1 (en) * 2003-12-24 2010-03-11 Foundry Networks, Inc., A Delaware Corporation System and method for suppressing noise generated from a computer casing
US7300485B1 (en) 2004-10-12 2007-11-27 Moore Franklin R Cooling fan for electronic devices
US20060181846A1 (en) * 2005-02-11 2006-08-17 Farnsworth Arthur K Cooling system for a computer environment
TWI257285B (en) * 2005-04-11 2006-06-21 Delta Electronics Inc Heat-dissipating module of electronic device
US20070044482A1 (en) * 2005-08-24 2007-03-01 Chen-Hui Lai Cooling system capable of reducing ambient temperature of a computer
US7325406B2 (en) * 2005-10-06 2008-02-05 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Cooling system for computer
US7447025B2 (en) * 2005-11-01 2008-11-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US7382047B2 (en) * 2005-12-27 2008-06-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20070275650A1 (en) * 2006-05-12 2007-11-29 Lian Li Industrial Co., Ltd. Quiescent computer casing
US20080028767A1 (en) * 2006-08-01 2008-02-07 Broderick Lionel H Computer cooler
JP5031327B2 (ja) * 2006-11-08 2012-09-19 任天堂株式会社 電子機器
US7447023B2 (en) * 2006-12-08 2008-11-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for computer add-on cards
US20080278905A1 (en) * 2007-05-09 2008-11-13 Dell Products, Lp Information handling systems including fan control modules and methods of using the systems
US7764500B2 (en) * 2007-08-31 2010-07-27 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Electronic system with a heat sink assembly
US7548427B2 (en) * 2007-09-28 2009-06-16 Intel Corporation Apparatus and docking station for cooling of computing devices
TW201311127A (zh) * 2011-08-30 2013-03-01 Hon Hai Prec Ind Co Ltd 導風罩
TW201325416A (zh) * 2011-12-12 2013-06-16 Hon Hai Prec Ind Co Ltd 電子裝置及其導風罩
TW201328552A (zh) * 2011-12-16 2013-07-01 Hon Hai Prec Ind Co Ltd 電子設備及其散熱裝置
CN103249275A (zh) * 2012-02-07 2013-08-14 鸿富锦精密工业（深圳）有限公司 散热系统
US10072881B2 (en) 2014-11-26 2018-09-11 Hoffman Enclosures, Inc. Reduced footprint thermoelectric cooler controller
US10502463B2 (en) 2014-11-26 2019-12-10 Hoffman Enclosures, Inc. Thermoelectric cooler controller and angled mounting thereof
US9686891B2 (en) 2015-07-06 2017-06-20 International Business Machines Corporation Thermoelectric-enhanced, inlet air cooling for an electronics rack
US9504189B1 (en) * 2015-08-12 2016-11-22 International Business Machines Corporation Thermoelectric-enhanced, inlet air-cooled thermal conductors
US9949412B2 (en) 2015-08-12 2018-04-17 International Business Machines Corporation Thermoelectric-enhanced, inlet air-cooled thermal conductors
WO2017059443A1 (en) * 2015-10-01 2017-04-06 Hoffman Enclosures, Inc. Reduced footprint thermoelectric cooler controller
US10039213B1 (en) * 2017-01-13 2018-07-31 Hewlett Packard Enterprise Development Lp Air inlet channel with thermoelectric cooling element
US10365699B2 (en) * 2017-09-05 2019-07-30 Evga Corporation Computer case cooling structure
WO2020123557A1 (en) 2018-12-12 2020-06-18 Edwards George Anthony Computer component cooling device and method
US12016110B2 (en) 2022-01-31 2024-06-18 Microsoft Technology Licensing, Llc Electronic device with active heat transfer

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3817010B2 (ja) * 1997-02-14 2006-08-30 富士通株式会社 通気ダクト，冷却装置および電子機器
US6113485A (en) * 1997-11-26 2000-09-05 Advanced Micro Devices, Inc. Duct processor cooling for personal computer
US6038128A (en) * 1998-07-14 2000-03-14 Dell U.S.A., L.P. Computer and computer/docking assembly with improved internal cooling
US5946188A (en) * 1998-07-29 1999-08-31 Epsilon Electronics, Inc. Car amplifier incorporating a peltier device for cooling
US6125924A (en) * 1999-05-03 2000-10-03 Lin; Hao-Cheng Heat-dissipating device
US6196003B1 (en) * 1999-11-04 2001-03-06 Pc/Ac, Inc. Computer enclosure cooling unit
TW456762U (en) * 2000-02-22 2001-09-21 Lin Hau Jeng Cooling equipment
IL135017A0 (en) * 2000-03-12 2001-05-20 Active Cool Ltd Cooling system for an enclosure for heat sensitive components and method

Also Published As

Publication number Publication date
US6650536B2 (en) 2003-11-18
US20020149910A1 (en) 2002-10-17

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees