TW569501B - A shielded carrier for land grid array connectors - Google Patents

Abstract

The present invention provides a carrier with electrical shielding of individual contact elements, resulting in LGA interposer connectors with improved electrical performance. The carrier includes a plurality of openings, each of which may contain an individual contact element. The openings may be plated with conductive material, and may also be commoned to one or more reference voltages (e.g., ground) present on at least one conductive layer of the carrier. The carrier may be as simple as a single unified structure with a conductive layer on one outer surface, or much more complex, having many layers of dielectric and conductive material. The carrier may also provide improved retention of the individual contact elements. The process to assemble one embodiment of the carrier is also disclosed.

Description

569501 V. Description of the invention (1) [Related patent applications] This invention is related to the patent applications in the United States joint application, such as US Patent Application No. 09/457, 776 filed on December 9, 1999 Patent applications 09/645, 86〇 and 60/227, 689 in joint applications on August 24, 2000; U.S. Patent No. 6,264, issued to Li et al. Inserts based on connected metal wire segments ", this patent is based on U.S. Patent Application No. 09 / 457,776, filed on December 9, 1999; U.S. Patent No. 6,312,266 carrier of the grid array ", this patent is based on US Patent Application No. 09/645, 8 60 filed on August 24, 2000; and common on May 29, 2001 US Patent Application No. 09/866, 434 in the application, which is a non-tentative application based on US Patent Application No. 09/46 1,065 tentatively dated August 24, 2000. The patent application is designated as a reference for the present invention. [Scope of the Invention] The present invention relates to an electrical connector for internal connection of at least two types of electrical circuit components, such as a printed circuit board, a circuit module, or the like, particularly those who are more advanced, such as for connecting data processing systems ( Computer) or telecommunications environments. [Background of the Invention] Nowadays, in the design of connectors, the trend of using high-speed electrical systems is to provide high-density and high-reliability connections between a variety of circuit devices that are important parts of the system. This system device can be a computer, a

569501 V. Description of the invention (2) A telecommunication circuit network device, a handheld personal digital assistant (PDA), medical equipment, or other electrical equipment. High reliability is necessary for this type of connection because the potential end product failure is a fatal disconnection in these devices. In addition, to ensure the effective repair, upgrade, and / or replacement of various components in the system (eg, connectors, cards, chips, boards, modules ...). Another satisfaction is that this type of connection is detachable and reconnectable within the final product. For example, the ability of such products to be easily and easily tested during manufacturing is also satisfactory. The socket grid array (LG A) is an example of such a connection, which allows two main connected circuit elements with a plurality of contact points to be connected in a linear or quadratic array arrangement. Internal connection elements, called interposers, are placed between two connected arrays and provide electrical connections between contacts or paths. Technology, how do LGA inserts perform in many different ways? Examples are described and compared in US G9 / 645,86 patent renewal. Compared with the conventional technique, the reference carrier significantly improves the reliability of the LGA carrier. For the LGA rate stated in the case, more inventions are needed, but there is no need to improve the electrical performance of the LGA connector. An electrical performance of the LGA connector is improved. A separate contact member provides electrical shielding. At the terminal, each shield is limited in space and the cost is very heavy; knife = two = when a separate contact member provides electrical shielding where ":::::::

569501 V. Description of the invention (3) Entire structure. This provides a great deal of complexity to another method. A technology that can provide an appropriate amount of shielding to one or more reference voltage levels of the surrounding structure is a more cost-effective trend. Initial inspection of some elements of U.S. Patent No. 5,59,193 showed that similar to various embodiments of the present invention, but further research proved that there is a great difference. In the embodiment shown in Figs. 1 and 2, when the synthetic rubber stage of the element is formed by a method such as a model, at the same time, a non-conductive elastomeric element LGA connector is formed. The synthetic rubber element is selectively plated on its surface to create a plurality of conductive elements. Unfortunately, 'because it relies on the plating of conductive elements on the outside of synthetic rubber, it is considered to be conductive', which makes electrical shielding impractical. In addition, $ is a loss since the rubber element becomes a necessary element for the stage, because it is very difficult to restore it to a conductive element. As a result, the whole connection is broken. In addition, the stage is composed of synthetic rubber, and its thermal expansion coefficient (CTE) is actually very different from the surrounding structure. As shown in FIGS. 4 and 5 in the embodiment of the 5, 599, 193 patent of the country, it describes an LGA connector with a fixed carrier, which has a contoured opening and an external conductive synthetic rubber. The components are complementary. Once again, relying on the plating of conductive elements on the outside of synthetic rubber for conductivity would make electrical shielding impractical. In the connector of the two known technologies, the individual hollow (c a v i t i e s) forests are cylindrical in shape and provide a minimum number of individual contacts 70. Unfortunate ’since individual contact elements tend to occur or change vertically

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Page 7 569501 V. Description of the invention (4) Change 'This causes the connection contact elements to often create consistent electrical reliability problems. This device 09/645, 860 patent provides a separate connector to improve the electrical performance. Therefore, the carrier of the secondary device of the present invention is to modify the re-station of the invention, to improve the contact with the re-station of the invention, and to improve the connection to the invention. The distance from the array connector is even more difficult. Although there is a lack of way, the vertical change of the components leads to the problem. Therefore, the internal connection is greatly reduced. The US air shield in the joint application will make an important step in the LGA plug-in connection technology. Department of strengthening electrical connector technology. Provides a socket grid array (LGA) connection performance. The only example is the application for the change of electrical and mechanical features of a carrier for a carrier grid array connector. The electrical performance of the contact member is here—the purpose is to improve electrical performance, the purpose is to maintain the components, and the purpose is to provide the productivity of a carrier that supports a grid array connector. One purpose is to provide a combination of a low-thickness carrier and a bearing grid. ^ Another object of the invention is to provide a combination of a stage and a socket grid array connector capable of re-supposing that the contact member is damaged. Another objective of this month is to provide a carrier for a grid array connector to provide consistent electrical and mechanical performance of the connector. [Introduction to Invention] The present invention provides a stage that provides electrical shielding for individual contact members, which will allow the LGA's plug connector to improve electrical performance. The stage includes a plurality of openings, and each opening may include a separate contact member. The

569501

V. Description of the invention (5) Openings such as multiple may refer to at least one single layer of the outer surface and the conductive holding force. Describe. [Simplified diagram for the purpose and its purpose, after: Figure 1a is a diagram in a straight line; Figure 2a is a perspective view; Figure 2b is a mechanism relationship; Figure 2c is a side view; Figure 2d is a side view of Figure 2e; View; Figure 3 is-is plated with a conductive material, and may also-generally be divided into one or a bit (eg, ground potential) to indicate that the platform knows at least one conductive layer. The stage may be as simple as a conductive material: a unique structure, or more complex, including many electrical layers. These stages can also provide a method to improve the structure of the loading stage and all the connectors in a single place. The inspection committee can further understand the structure of the present invention. Detailed description of the specific embodiment, such as a partial perspective view of an electrical connector according to the conventional technology. · Large picture la 'The connector is placed in pairs and between circuit components' to provide a side view of the actual internal connection. Invention-Partial view of the electrical connector of the preferred embodiment 'enlarges a top view of a preferred stage in Fig. 2b of the exemplary stage component connector in Fig. 2a; -Broken: J'enlarges Fig. 2 " connector contact Components; and, expanding the load of the electrical connector of the second embodiment of the shielding concept invention of the exemplary connector shown in FIG. 2a

$ 9Page 5. Description of the invention (6) Side view of the platform [Compare: ί: Detailed description of the example]: He Lei: Conductor holding power, productivity, reliability, electric milking lamp effect and electric rolling performance. In order to understand the degree of crime and more consistent machines, "refer to Figure 1a and Figure 1b, and prepare for the electrical circuit components 24 and 34 respectively] == In the conventional technology, from-= view. For example, by connector i. : 部 ϊ :: = ι. Perspective Dagger: Brush circuit boards, circuit modules, etc. "=" Circuit components represent, but are not limited to, a multi-circuit "printed circuit board" (eg, signal, power, and / or ground) that includes one or more conductive layers and is also referred to as a printed wiring board ^. This printed circuit board, Ming. And the so-called "electricity: table: Γ: need to change the road, etc.), can form part of it. This ^ conductor chip, conductive electricity, there is no need to further repeat if ,,,, and also the industry You are familiar with connectors! There are a total of electrical station components 12 and a plurality of internal holes or openings 12, where the load type is a typical cylindrical shape. Elasticity (reH. These openings 14 are externally placed on the platform Each opening / inner part of the member 12 contacts the contact member 16 so that the two opposite ends 18 and 20 of each contact member 16 contact an individual circuit member. As mentioned above, +, _ ', for the purpose of electrical connection to the circuit board 34 has a flat Straight conductive parts ^ 'Some electrical components may be printed or cymbals (such as copper terminals) 28 placed on top of 569501 V. Invention Description (7) One of these circuit components may also include— 24. The circuit module 24 includes a substrate with a complex array thereon, and a relatively thin and straight copper conductive pad 28. It is understood that the conductive pads 28 are two corresponding ones: Surface. Can: No .: Circuit components. These conductive pads 28 According to the requirements of the individual circuit] f, provide signal, power or ground. File operation? Ji ΐ 10 10 is designed to be placed on the opposite circuit members 24 and 34. ΐ Linear arrangement may be configured by the stage member ”. Includes a straight opening 22. ^ i 罝, where each elastic contact member 6 is pressed within the fixed electric pad 28. The connection is protected by a pair of guide branches, such as the opening 14 of the member 12 It is a typical circle in appearance (gold / also provides electrical shielding or maintains a different elasticity. Unfortunately, this limits the connector 10 at high speed if it is more difficult to close.) Since individual contact components tend to occur vertically, this will cause a connection The assembly of the device becomes more difficult, so the i-contact component may tend to be removed or vertically displaced. Although -ΐ ^, contacting 7G parts will cause an open circuit, but the displacement of the components is consistent with the electrical and mechanical The characteristic time interruption 5 greatly reduces the reliability of the internal 1% connection. ^ So large ^ Refer to Figure 2a and Figure 2b 'its individual green shows the connector 4 of one of the two electrical circuit members 24 and 34 in the middle of the hair ::: : ^. Eg 'suitable circuit configuration Including: Printed circuit board, circuit module Page 11 569501 V. Description of the invention (8) ^ The connector 40 includes a common and electrically insulating carrier member a, wherein the carrier member 42 includes a plurality of internal holes or openings 5 5 1. Comparing with the conventional technique of the stage member 12 (Figure lb), the electrically insulating stage member 42 and so on · The openings 50, 51 (Figure 2e) are electrically conductive and are electrically connected to the first screen Shielding layer 57 and / or first shielding layer 58. In a preferred embodiment, the stage member 42 (FIG. 2b) includes an upper layer 44, upper spacers 52, and a lower section 46 The lower and upper spacers 54 and an adhesive layer 48 (or retention layer) are interposed between the upper 44 and lower 46 layers. In one example of this embodiment, the openings 50,51 are cylindrical in shape. It must be understood that in any case, the openings 50, 51 can also use other geometries and corresponding contact members 16a-16e if needed. The conductive part of the stage member 乜 is intentionally not included in Fig. 2b for the purpose of clarity, but can be seen in Fig. 2e. In this embodiment, the upper layer 44 and the lower layer 46 are typically made of epoxy-glass-based materials. Epoxy-glass-based materials are typically used for printed circuit board assembly. (Such as FR4). Because the thermal expansion coefficient (CTE) of these materials actually matches the CTE of the surrounding structure, and its cost is relatively low, it is widely used. Another possibility is that the material is polyimide. Each of the layers 44 and 46 has a thickness of 007 .times. = Inches. The retaining layer 48 is basically composed of a 0.002 inch polyester film (ylar) material. The polyester film is produced by DuPont of the United States. Those who are familiar with the art without departing from the spirit of the present invention It is necessary that the parts of the present invention may be composed of other materials to replace the disclosed ones.

Page 12 569501 V. Description of the invention (9) The specific parts in the embodiment are disclosed. A single-layer carrier 40 includes an upper layer 44, an upper spacer 52, a lower layer, and a lower spacer 54 ′ and a retaining layer 48 is selected between the upper and lower layers 44 and 46 for the purpose of disclosure. It is obvious that The principles taught by the invention can also be applied to a multilayer structure having one or more of the above-listed components. For example, for some applications, it may be worth separating the upper layer 44 and the lower layer 46 into two and a half days' and separating the two layers with an additional glue layer. The upper and lower spacers 52 and 54 are also made of epoxy-glass-based materials. Epoxy-glass-based materials are typically used for printed circuit board assembly. Each spacer 52 and 54 has a thickness of 0.055 inches. The stage member 42 (including the upper and lower layers, the upper and lower spacers, and the retaining layer 48) is all thick; the thickness = 〇.02727 inches. In this case, the functions of the spacers 52 and 54 are limited to a contact member & 可能 which may be compressed from 0.040 to 0.0027 inches, and provide an upper surface interposed between the stage member 42 The shielding layer 58 on the lower surface of the shielding layer 57 and the electrically conductive portions of the contact members Ua-16e are electrically isolated from each other. Knowledge ^ ^: The inclusion of an optional retaining layer 48 in the piece 42 can help slow down the electrical and mechanical loss of opportunity. Mechanical characteristics, thus greatly improving the reliable creation of internal connections and θ & ΐ ί is created by the removable part of the holding layer 48 ... the section of the holding material is a larger one of the carrier member 42 Opening 569501 V. Description of Invention (ίο) In the example of 5 holdings and 7 internal use, each of the larger openings 50 includes 4 circular openings. Hemp I is included in each element of the present invention to be changed to produce the holding force required to contact the members 16a-16e (not shown in Fig. 2c). You include, but are not limited to, many] ί: Teaching package No. 09/645, 860 of the application ^ 52 hidden. 42 has one or more retaining layers 48 and upper isolation structure. The main 77 is not included in the following diagrams to improve the clarity of other components and the function of the present invention. It is then possible to construct an electrically shielded device mounting platform 42 that does not include the foregoing, and it is included in the scope of the present invention that the solution is' in any case, including these functions provides an excellent Referring to Figure 2d, the drawing shows-Perspective ®1, the separate contact member 16a 'of the connector in A' includes the opposite conductive terminals 18 and 20, the conductor 'and the insulating surface 17' to ensure that it is conductive with these The electrical opening 50 is electrically isolated. The contact members 16a, 16b and 16C are substantially the same; only they are expected to function differently. The contact members 16d and 16e are similar but slightly shorter than the contact members 16a, 16b, and 16c. ★ Please refer to Fig. 2e, showing a cross-sectional view of the connector 40 to demonstrate the shielding concept of the carrier 42. As described above, in contrast to the conventional stage member 12 (FIG. 1b), the openings 50, 51 in the stage 42 are electrically conductive and electrically connected to the first shielding layer 57 and / or the second Shielding layer 58. The shielding layers 57 and 58 have a round shape. Each contact member 16a-16c, page 14 569501 V. Description of the invention (11) 16d-16e is placed in the stage 42 to substantially occupy the openings 50, 51, respectively. The contact members 16a-16e preferably have the structure and composition taught in U.S. Patent Application No. 09 / 457,776 in the joint application as described in Figs. 2 and 3a-3e. It is important that the potentials of the sides 17 of the contact members 16a-16e and the shielding layers 57,58 and the openings 50,51 are different, and are isolated to prevent the conductive parts of the contact members 16a-16e from the conductive openings 50. Short circuit. The upper spacer 52 and the lower spacer 54 (FIG. 2b) also help to ensure that the conductive parts of the contact members 16a-16e are not separated from the first and second shielding layers 57, 58 placed on the upper and lower surfaces of the stage 42, respectively. Short circuit. Upper spacers 52 and lower spacers 54 also provide shorter contact members 16 (i, I6e) institutional support (Figure 2e) to prevent, for example, cracking 57 and 58 from shielding layer 42 of carrier 42 and / or The danger of peeling. Each of the elastic contact members 16-16c may have a diameter of about 0.026 inches and a corresponding length of 0.040 inches. The openings 50, 51 have a diameter of 0.028 Compared with the contact member 16a_16e, it is only more than about one thousandth of an inch. The diameter from the center to the center is 0.05 inch, and it can be reduced to about 0.5 inch pair if necessary. The difference between the opening 51 and the opening 50 is that instead of being completely opened inside, one end of the openings 51 is closed by one of the shielding layers 57 and 58. The purpose is to accommodate the shorter contact member 16d described below. -16e. S For any known application, a single contact member can be used = provide a signal, power, or ground interconnection. An example is shown in Figure 2e. 'Contact member 16e is used for signals and contacts Component 16b is used for power supply. Shorter contact component 1 6d is used to connect the shielding layer 57 to the battery

Page 15 569501 V. Description of the invention (12) = ground potential contact 塾 28 on the component 24; the other shorter connection 16e is used to connect the first shielding layer 57 to a circuit component 34. Thousands of potential contact pads 28. The contact member 16c is then used to connect the ground connection on the circuit member 24 and the circuit member 34 via the paths 25 and 35, respectively. It must be noted that the length of the pull-out pieces 16d, 16e, which is intended to contact the shielding layer 57, 58, is the same as the other The contact members are different. This is to ensure that the opposite ends 18 and 20 of all contact members are combined with the contact pads 28 of the circuit members 24 and 34 at the same high yield. Although all the components of the XL field have been used as described above to provide = ^ In order to ensure that the connection can be = = 'For example, for thermal reasons, including thermal conduction, and: $ by: including but not limited to force 'Balance' minimizes skew and provides support. The contact members may be different in structure and, for example, report; we do not need to include any conductive material when electrical interconnection is required; bit, Π 范 Fan: the shielding layer 57 '58 is connected to the ground potential In some applications, these shielding layers are electrically referenced to other potentials or fragments of other shielding layers: 2: connected to the ground potential and other parts can be connected to enhance. 』Suitable for wiring and possibly providing shielding effectiveness = Conductive on n5G. The inductance of the power supply can also improve the electrical quality of the power conductor. It is said that “ibb lower stage member 42” may also include an additional “setting” to further improve the shielding by providing a return. The extra return in this example

569501 V. Description of the invention (13) ___ Circuit = One contact pad of circuit member 34 is realized. Use, according to the special feature: the carrier can also be shielded by the smaller, then σ 槎 is provided and if only the most is needed. It is also possible to provide a shielding layer without providing a conductive opening. It is also possible that the shield does not need to be shielded from the actual identification member and is electrically insulated or at least = 2 in these cases' making certain openings 50 non-conductive. …… Layers 57 and 58 electrical isolation may be more satisfactory. Circuit components may be printed electrical: board components. These include a circuit module 24, and the circuit components of the circuit module 24 may also include a substrate on which the component 32 is placed (a substrat including a plurality of semiconductor pads 28 (for example, a thin copper member) placed in a basin) and corresponding The flat conductive electric pad 28 is electrically engaged to the corresponding electric outer surface. The guide: the component part. According to the respective circuits ::; make the respective electric pads M can provide signals, power or ground connection] the need of the operation, these guide pads 28 are plated with a layer of metal (for example, yellow. Preferably, These conductive interconnections. Ensure that the reliable connector 40 of the connector 40 is arranged in the arrangement of the two opposing Leizhentai members 42 in which the packages 24 and 34 are arranged. A straight opening 56 is enclosed by the carrier. Chapter 569501

The pieces 24 and 34 and the middle connector 40 are arranged in a straight line, and use the opening 56 protruding from a circuit member (such as the module 24) into the corresponding stage member 42 and another circuit S fU u P Taxi ... The opening of the circuit component 34 (two off: display). It is important to understand that other devices are aligned in a straight line. Inverted = opposite openings of individual circuit components. For example, two out = one and 56 of ί 2 Ϊ 40, which may be regarded as an elongated structure, and a slot.

In the fixed internal connection, each of the elastic contact members 16a-i6e is compressed by two opposite conductive pads 28. Please refer to FIG. 3, which is a cross-sectional view showing that the carrier 62 according to the second embodiment of the present invention is used as a part of the electrical connector 60. The main purpose of using the carrier member 62 on the conventional carrier is to be the same as the carrier member 42 (Fig. 2b, 2e): to provide a shielded carrier member for a grid array connector of a socket to electrically interact with it. A pair of electrical circuit members 24 and 34 are connected.

The connector 60 includes a stage member 62 having a plurality of internal openings 50,70. As described in the first embodiment (Figures 2a-2e), the openings 5Q are electrically conductive; the openings 50, 70 are electrically connected to a larger number of shielding layers. For disclosure purposes, three shielding layers 64, 66, and 68 are included. As in the previous embodiment, the first shielding layer 64 and the second shielding layer 66 are on the outer surface, but the third shielding layer w is placed inside. For simplification again, the stage member 62 is represented by a unified structure that does not have a holding function, but can be composed of a plurality of upper and lower layers and holding layers as simple as previously described. In addition, for the purpose of clarity such as using spacers and

Page 18 569501 V. Description of the invention (15) The function of the spacer is not included. In this example, the openings 50'70 are cylindrical again. The stage member 62 is preferably made of an epoxy-glass-based material and is typically used in the manufacture of printed circuit boards. The size of the stage members 62 is similar to that of the stage members 42 (FIG. 2b). The holding means of the contact member (Fig. 2b) is preferred but not necessarily required. Generally speaking, the contact members in this embodiment are the same as the embodiment described in FIG. 2d and above, and include conductive opposite ends 18 and 20, a conductor 19, and an isolated surface 17 to ensure contact with Electrical isolation of the conductive opening 50. Once again 'the contact members 16a-16c are substantially the same; except that they are expected to function differently. The contact members 16 f and 16 g are similar, but only about half the length of the contact members 16 a-6 c. They are used to electrically connect to the shielding member (eg, shielding layer 64) of stage member 62 via contact pads 28 that contact a specific reference voltage (eg, ground potential) of third shielding layer 68 and surrounding circuit members 24 and 34. , 66, 68 and conductive openings 50, 70). The difference between these openings 70 and 50 is that instead of being completely opened inside, one end of these openings 70 is closed by one of the shielding layers 68. The purpose is to accommodate two shorter contact members 6 f _ 6 g in one opening 70, one above the shielding layer 68 and the other below the shielding layer 68. Each of the contact members 16a-16c, and 16f-16g are placed in the stage 62 to substantially occupy the openings 50, 70, respectively. The contact members 16a-16c, and 16f-16g preferably have the structures and components taught in U.S. Patent Application No. 09 / 457,776 in the joint application as described in Figs. 2 and 3a-3e. It is important that the contact members 16a-16c side 17 and the shielding layers 64, 66 and

Page 19 569501

68 and these openings 50 〇 蕾 mb ^, η η ^ ^ < The potential 疋 is different, is isolated to prevent a short circuit between the electrical contact of the component and the conductive opening 50. The upper spacer 52 and the lower ® hidden opening, and the lower "off 54 (Figure 2b) also helps to ensure that the conductive part of the contact member # will not be placed on the upper surface of the carrier 62 and the first and second sections of the table f below. The two shielding layers 64, 66 are short-circuited. &Quot; Each flexible contact member 16-16c may have an upright position of about 0.026 inches and a corresponding length of 0.04 0 inches. These openings 5 0, 7 0 The diameter is 0.028 inches, compared to the contact members 16a-16c, i6f_i6g is only larger than about one thousand blades. The diameter from the center to the center of the foot is 〇 · ㈣ 英 对 'can be reduced to about 〇 · 〇3 5 inches. For any known application, a single contact member can be used: provide flood signal, power, or ground interconnection. As an example shown in Figure 3, the contact member 16a is used for the signal, The contact member 16b is used for electrical connection and the contact member 16c is used for grounding. In this embodiment, for the purpose of exposure, the shielding layers 64, 66, 68 and the conductive openings 50, 70 are electrically referenced to Ground potential. The shorter contact member 16 f is shielded by two shields to the circuit member 24. The previous ground potential contact 28 is connected to the other-shorter contact member 16g, which is used to connect the third shielding layer 68 to the contact pad 28 on a circuit member 34. The shielding layer to the circuit member 24 and 34 is no longer necessary for the contact member 16c and the connection paths 25 and 35 (Figure 2e) when interconnected, including the half-length contact members 16f, 16g to provide benefits in at least three aspects. First, because the contact members 16f, 16g are Placed in the same opening 70, thus removing the need for an isolated second opening for grounding ', thus allowing the second opening to be used for other purposes (for example,

569501 V. Description of the invention (17) Other signals). The second opening can also be used to provide additional grounding of the carrier shield by including an external contact member 16f, 16g. In the above two cases, the loop inductance from the opening 70 to the ground potential of the circuit members 24 and 34 is greatly reduced, thereby improving the electrical performance. Third, if shielding without a second opening is sufficient, the second opening can be removed, thereby reducing the number of all contacts and the space that may be required. It must be noted again that the lengths of the contact members 16f, 16g are different from other contact members. This is to ensure that the opposite ends 18 and 20 of all contact members are at the same height to properly engage the contact pads 28 of the circuit members 24 and 34. Even the shielding layers 64, 66, 68 are connected to the ground potential. In some cases, the shielding layers 64, 66, 68 may need to be used; = segments and some segments are connected to the ground potential and the other can provide The shielding effectiveness of the lifting platform 62 includes a through-hole 74 to facilitate wiring and a usable electrical power source-carrying contact member with lower x-rise power conductor electrical quality. The iS π two-component 62 can also include an additional device 59 by adding a return path to further a Wakita fork for an additional path. The return path is connected by: electricity; This additional option in this example is achieved using a contact pad. Another-back path. The purpose of the wind line can also be regarded as an additional return. The opening 56 can be made of conductive materials like the openings 16a to 16f, and

Page 21 569501 V. Description of the invention (18) Pin type that can be electrically connected to the pin type to provide to the opening 56! : Even J may be made submissive and suitable for some applications, and may actually be more needed in a particular context. When shielding is not required and is electrically isolated or at least with these shielding layers 64, 6;: 6: Ray: 1 certain openings 50 are not satisfactory. 6 8 Electrical isolation may be a more well-known technique. Each contact member, such as a factory, is designed to electrically contact individual circuit members. Ii = (, the two pieces may be that the printed circuit board 34 has straight circuit components, and may also include a surface on the surface. Ting-m ^ ^ ^ L circuit module 24, the circuit module 24 includes a soil plate 26 A plurality of semiconductor elements 32 are made of conductive pads 28 on the following table ... ... Surfaces; ί !! To the corresponding circuit, forming part of the individual electrical requirements, provide; lide 28 is based on the operation of individual circuit components. It needs to be dreamed; or remote or ground connection. It is preferred that the conductive pads 28 ^ upper-layer metal (for example, gold) to ensure that the reliable inter-connector 60 of the connector 6Q is placed on the opposite circuit Between members 24 and 34, ΐ! Row = line. By placing the stage member 62 in such a straight line, ./, ', may include a line opening 5 6. Relative to the connector 6 0 6。 circuit The members 24 and 34 may provide a pair of protruding pins 30 extending from one of the dedicated circuit members 24 and 34 (for example, 'module 24'.) This pin is connected to the stage member 62 and the other circuit member 34 Opening 36 (fig.

1T Page 22 569501 V. The corresponding openings in the description of the invention (19) are not) 5 6 line up. It is possible to use the old tools that are lined up in a straight line. Other uses are possible, including providing an opening corresponding to the stage member 62: for example, the adjustment is relaxed and the connector port 56 may be an elongated one. Structure while forming a slot. In a fixed internal connection, each contact member 16a-16c, 16f-16g is compressed by two opposite conductive pads 28. These techniques are well known in the art, that is, the electrical impedance of a conductor relative to a reference voltage is determined by the geometry and spacing of the conductor and the reference voltage, and the size and type of insulating material between them. By selecting the specific material and size of the components of the contact member 16a-16g ('Figure 2d, 2e, 3) and the diameter of the opening 50, 51, 70, the electrical impedance of the contact member 16a-16g can be controlled and optimized for the specific application Into. For example, the impedance of the signal-carrying contact member 6a may be matched with the impedance of other components such as the circuit members 24 and 34. This is very important for the efficiency of the electrical implementation of the entire system, especially when the demand for semiconductor speed increases and the voltage and noise budgets of the semiconductor continue to decrease. The electrical impedance is 28 ohms in a high-speed memory system. It is also possible to optimize the power- and ground-carrying circuit components 1 6 c-1 6 g by using different sizes and / or materials to obtain a lower impedance, and therefore have a lower inductance for them. The stage member 6 2 (FIG. 3) can also be constructed in many different ways. A preferred method is to provide a first layer of FR4. This layer of FR4 has a layer of copper on a surface. This layer of copper is used for shielding purposes. Glue layer

569501 V. Description of Invention (20) One side of the protective sheet is removed and the upper and lower layers of FR4 are also made into a thin sheet. In one case, the set temperature was 185 degrees Fahrenheit and the pressure was 20 pounds per inch (PSI). Drill or route the FR4 / adhesive layer composition to form the required holes and openings, including the ability to line up and the outside edges of the stage. Cover both surfaces with a layer of copper. Each method of removing the masking creates a one-time copper surface that has steel foil on the etched copper surface where shielding is needed for shielding purposes. Remaining f is removed from the FR4 / adhesive layer composition, and the etched copper surface is made into a thin plate shape. Prepare a second FR4 / glue and the formed copper on the opposite surface of the first synthetic surface, and then use it for two purposes and two for shielding purposes. Drill the second layer of FR4 / adhesive layer to form a panel, an opening ', and an outer edge of the stage. Remove the remaining protective sheet from the second = spear and make the etched copper surface and the second layer of the first layer = / engraved copper into a thin plate shape so that the engraved copper layer is placed on the two copper foil layers by the f component. between. 3 be cut to create the required gold-plated-through-holes and through-holes in all structures. The additional FR4 sound is used to form the material used for the upper and lower spacers. s A computer data control (CNC) drilling machine is used for the physical layer. Then, the upper and lower isolation layers can be formed to generate upper and lower surfaces φ of the lower isolation structure. A simple without internal shielding layer: By simply omitting the first layer of FR4 / adhesive layer components, 2D can borrow the holding function of the carrier, the first and second FR4 layers. In order to increase the structure, for example, two thin FR4 layers with a polyester film (M1 laminated composition) are replaced.

Page 24 569501 V. Description of the invention (21) Although the present invention has been disclosed in the preferred embodiment as above, it is not intended to limit the present invention. Any person skilled in the art should not depart from the spirit and scope of the present invention. Minor changes and retouching can be made, so the protection scope of the present invention shall be determined by the scope of the appended patent application.

Page 569501 Brief description of the drawings / [Simplified description of the drawings] Figure 1a is a partial perspective view of an electrical connector according to the conventional technology; and Figure lb is a cross-sectional view, which expands Figure 1 & Placed in pairs and aligned in a straight line to provide a practical side view of the internal connections. Figure 2a is a perspective view of the electrical connection according to the present invention and the conventional embodiment. Sectional view 'enlarged side view of the mechanism relationship of the exemplary platform member connection number in Figure 2a; Figure 2c is a top view of a preferred planting platform in Figure 2b; a perspective view, which expands the connector J2e in Figure 2a (1) A sectional view 'enlarges the side view shown in Fig. 2a; and the concept of an out-of-heart enemy Fig. 3 is a side view of an electric & platform according to a second embodiment of the present invention. Electrical hole connection the load of the graphical component number description of the connector opening contact member conductive end point linear opening substrate pin printed circuit board 10 14 16a-16g 18, 20 22 26 30 34 stage member contact member insulation surface conductor electrical Circuit member conductive pad semiconductor opening element 12 16 17 19 24 28 32 36 34

Page 26 569501 Schematic illustration of connector 40 Stage member 42 Upper layer 44 Lower layer 46 Holding section 47 Adhesive layer 48 Opening 50 ^ 51 Upper spacer 52 Lower spacer 54 Straight opening 56 Shield 57 Shield 58 Connector 60 Stage 62 Opening 70 Shield 64 '66, 68

Page 27

Claims (1)

569501 6. Scope of patent application 1. A carrier for receiving a grid array connector, including: a) a substrate having at least one layer of a dielectric material, the layer of the dielectric material having an upper surface and a lower surface, And at least one shielding layer is distributed on one of the upper surface and the lower surface; and b) the substrate has a plurality of openings, at least one of the openings is electrically conductive and is used to receive a contact member for Used in a socket grid array connector. 2. The carrier of the grid array connector of the socket according to item 1 of the scope of patent application, wherein the substrate comprises at least one insulating material. 3. The carrier of the grid array connector of the socket according to item 2 of the scope of patent application, wherein the insulating material is epoxy-glass-based. 4. The carrier of the grid array array connector according to item 3 of the patent application scope, wherein the insulating material comprises FR4. 5. The carrier of the grid array array connector according to item 2 of the scope of patent application, wherein the insulating material comprises polyimide. 6 The carrier of the grid array array connector according to item 1 of the patent application scope, wherein the substrate further includes a plurality of spacers. 7 · The carrier of the grid array array connector according to item 6 of the patent application scope, wherein the spacers are placed on the upper surface. 8 · The carrier of the grid array array connector as described in item 6 of the Shenjing patent scope, wherein the spacers are placed under the lower surface. 9 · The carrier of the grid array array connector as described in item 6 of the patent application scope, wherein the spacers include at least one insulating material. 1 0 · Socket grid array connector as described in item 9 of the scope of patent application Page 28 569501 VI. Patent application scope, where the insulating material is epoxy-glass-based. 11 · The carrier of the grid array array connector as described in item 10 of the patent application scope, wherein the insulating material includes 1? 12 The carrier of the grid array array connector according to item 1 of the scope of patent application, wherein each of the openings is actually cylindrical. 1 3 · The carrier of the grid array array connector as described in item 1 of the patent application scope, wherein the base plate further includes a plurality of alignment means °, 1 4 · as in item 1 of the patent application scope According to the carrier of the grid array connector, the substrate further includes a plurality of holding devices in at least one opening to compress and maintain at least a portion of a contact member. 1 5 · The carrier of the grid array array connector according to item 4 of the patent application scope, wherein the contact member has a controlled electrical impedance. 1 6 · The carrier port of the socket grid array connector described in item 1 of the scope of the patent application, wherein the e-hailer stage further includes a plurality of through holes. 1 7. The carrier of the grid array connector of the socket according to item 1 of the scope of the patent application, wherein the carrier 4 further includes a device electrically connected to the at least one shielding layer. 29th I