TW577187B - Interposer and method thereof for use in electronic packages - Google Patents

Abstract

The present invention features an interposer that provides a high reliability interface between an LGA connector and a motherboard. The novel interposer overcomes the limitations of prior art interposers by including a stepped spacer for each solder interconnection which prevents the relaxation of mechanical contact force while ensuring the integrity of each solder interposer provides noble metal plated contact pads on a first surface to receive the contact members of an LGA connector, and contact pads for BGA solder connections for attachment to a motherboard. A description of the processes to manufacture the interposer is also disclosed.

Description

577187 V. Description of the invention (l)-[Related patent applications j This invention is related to patent applications in joint US applications, such as US patent application numbers 09/457776 and 2000 filed on December 9, 1999 U.S. Patent Application No. 09 / 645,86, filed on August 24, 2014, the above patent applications are designated as references for the present invention. [Invention domain] The present invention is related to electronic packaging structures, such as printed circuit boards, electronics, molds, or the like, especially those who are advanced. It is a structure that requires special gold plating such as gold plating for electrical contact. [Background of the Invention] In the design of connectors, e ^ i uses the trend of high-speed electrical systems to provide high-density and high-susceptibility connections between multiple important circuit components t and multiple circuit devices t. This system device can be a computer, a telecommunication circuit network device, a handheld personal digital assistant j (PDA, ργ ^ γ assistant), medical equipment, or other electrical connections necessary for this type of connection. Because the potential end is to ensure that all kinds of deadly disconnections in the system. In addition, u column, such as the repair, upgrade, and / or replacement of connectors, cards, and / or replacements is satisfied that this type of connection is in the f module ... etc.). Another. In addition, it is satisfactory that the plutonium can be separated and reconnected during the manufacturing process. 1. The ability of this type of product to be convenient and easy to test is also historically, the f-conductor device field-isolated interconnects are used to allow connectors on the board to allow for full connectivity, such as microprocessors and memory modules.

577187

Into the edge connector (spring loaded edge connector) technology. This connector technology allows the site to upgrade or replace a failed device. However, when the density of the system, the size of the input / output array, and the execution performance increase dramatically, there is urgency for the specifications of the interconnection. In particular, when coupled with field-separability, these demanding requirements' lead to large changes in possible connector solutions. Most connector pads on motherboards need to be plated with a precious metal to ensure reliability and repeatable electrical contact. This additional demand will increase the cost of the motherboard so that this routine is not widely adopted. An example of such a connection is a socket grid array (LGA), which allows two main connected circuit elements to be connected. Each component has a plurality of contact points or conductive pads connected in a linear or quadratic array arrangement. An array of interconnect members, called interposers, is placed between two arrays and provides the electrical connection between these contact points or conductive pads. The conventional grid array inserts described in the conventional technology are implemented in many different ways. For most interesting implementations, please refer to the application of the US patent in the common application. The conductive pads on the motherboard are generally composed of copper and have a nickel-plated 0 banker layer immediately following a thin layer (for example, 001 yinghuai gold and gold. Such plating combination For ball grid array (A), tin interconnection can work well. But for socket grid array connector, it works well, where a thicker layer of gold is needed to ensure a reliable interconnect. A thicker gold layer is a thinner gold layer cost

577187 V. Description of the invention (3) To be high 'Motherboard manufacturers are reluctant to implement such changes. A solution is recommended in IBM Technology Disclosure Bulletin Board, Volume 37, No. 2A, pages 277 and 278, published in February 1994. This method describes an insert that, unfortunately, is shorter than the inserts required by today's systems. The insert is recommended to provide an array of electrically conductive pads on a first surface connected to a socket grid array connector, and a ball grid array (BGA) solder attached to a host on a second surface board. However, the service of this solder interconnect is creep, so the loose contact force from the individual contact structure to the contact point will cause the contact grid array connector to lose electrical contact. Every two kinds of chicks! The solution for the point is to provide a sufficient contact force to maintain a relative height to ensure that 2: == not too high to prevent a good ball grid worry for all contact points due to the unevenness of the matching surfaces Make some-some tin-tin interconnection will not get good-a high-reliability insert can be reduced as the master = f believe that 'and solve the problem of the cost of welding 4 machine boards as described above' constitutes A major advancement in technology, services are moving slowly. Therefore, one object of the present invention is to strengthen the second object of the present invention to provide: Connected technology. Interconnect to reduce the cost of the motherboard. ’In order to provide reliability, Lien = [Binocular inserts to ensure that the distance between the grid and the matrix is particularly high in the case of warming. 577187 V. Description of the invention (4) ---- [Overview of the invention] The present invention provides an insert as a socket grid array connector, a high-reliability interface between motherboards. The novel insert overcomes the conventional technology of inserts by including a ladder-like spacer for each solder interconnect to prevent the contact force of the mechanism contact point and ensuring the integrity of each solder interconnect. limit. The insert provides valuable = conductive plating on the first surface to receive the connection members of a socket grid array connector, and the conductive pads of the ball grid array (BGA) interconnect are attached to A motherboard. Procedures describing the production of inserts will also be revealed. [Brief description of the drawings] In order to allow your reviewers to further understand the structure, characteristics and purpose of the present invention, a detailed description of the drawings and preferred embodiments is attached as follows: Figure 1 is based on the conventional technology Partial perspective view of the insert of FIG. 2; FIG. 2 is a partial side view and a sectional view of the insert of the conventional technique as shown in FIG. The other circuit components are lined up to provide the final interconnection between them; 1 FIG. 3a and FIG. 3b are four-point side views of the insert of the conventional technique as shown in FIG. 1, and, separately, the solder connection Moving slowly, Fig. 4 is a perspective view of an electrical connector according to a preferred embodiment of the present invention; Fig. 5 is a partial side view of the connector in Fig. 4; and Figs. 6a and 6b are enlarged views. The side view of the connector in 4 and, 'The solder connection progresses slowly, respectively.

Page 8 577187 V. Description of the invention (5) [Detailed description of the preferred embodiment]% # t 2 and 5, the present invention provides an insert to provide a socket holder and a high reliability between the motherboard Interface. This novel anti-machine 2 !: for each solder interconnect including-ladder-like spacers with a pre-pressed loose contact force to ensure that each solder interconnect as a whole provides master: know-how insertion Restrictions. The insert is connected to the conductive pad of the first surface of the first metal device to receive a socket grid array connection. The quilt is: to; the board; and the conductive of the BGA interconnect. And reliability. Board. Improved productivity can also be achieved with the present invention. It is used to mention: 1 electric and gas diagram electric, 2 electric circuits and 2 electric circuits. In the conventional technique,-the conductive pad 46 is inserted. The mine $ 道 冓 牛 4 a repeatable multiple electrical example is gold. When the fish: J Jia is plated-the precious metal 40 interconnects the path of pieces 24 and 34 provided. Suitable for inserting modules, etc. Examples of such components include: printed circuit boards, circuit-layer circuit structures, twisted printed circuit boards, etc. (including, but not limited to, multiple grounds). Or multiple conductive layers (for example, signal, power, and / or industry-known, circuit boards, also known as printed wiring boards), which need not be described in more detail in "circuit modules". The so-called ( For example, a semiconductor substrate, a substrate or a component with different electronic parts forming a part of it, conductive circuit, more conductive, etc.), can be further-more detailed: this module '' also It is well known in the industry, and does not need to be in 577187. V. Description of the invention (6) The insert 40 includes a dielectric layer 42 with a plurality of internal apertures or openings 44. Each opening corresponds to an electrical conductive pad 46 and is Lined up. In one example, the dielectric layer 42 is composed of a material such as Kapton (registered trademark of DuPont, USA) or UpUex (registered trademark of Ube, Japan) and has a thickness of 001 inches The appearance of these openings is typically cylindrical and is formed by a KaptOn-etching process. The electrical conductive pad 46 is composed of copper and is covered by a plating layer 48. In this example, it is 2 °. 〇Micro-inch thickness It is composed of nickel and is covered by a 50 micro-inch thick layer of gold.

After being lined up by a method well known in the art (for example, feet and holes, optically aligned, etc.), the insert 40 can be electrically formed by a specific configuration with appropriate procedures. Attached to a flat conductive pad 38 (eg, a copper terminal) placed on the upper surface of the electrical circuit member 34. For example, if the conductive member 50 is solder, red wire or hot air flow (ref 10w) may be used to attach the insert 40 to the conductive pads 38.凊 Referring to FIG. 3a and FIG. 3b, they individually illustrate the insertion of the expansion of the conventional technology, a partial side view, and, respectively, the solder connection is performed slowly.

Yes, t ^, the sexual member 50 (Fig. 3 (for example, solder connection) is placed in the opening 44 of the phase ~ and is in electrical contact with the corresponding electrical conductive pad 46. The array Ϊ f ^ described, because today The hotter semiconductors are fluttered along the bearing grid. The temperature is increased by the combination of tight clamping force. The conductive member 52 (shown in the figure) can be flattened by slowly moving to maintain electrical connection. This contact force causes the socket grid array connector to malfunction.

Page 10 577187 V. Description of the invention (7) After the line is aligned by the method well known in the art (for example, feet = and holes, "learning to line up ', etc.), the insert is replaced by appropriate = program = special The conductive member 50 may be electrically attached to a flat conductive pad 38 (eg, a copper terminal) placed on the upper surface of the electrical circuit member 34. For example, if the conductive member 50 is solder, infrared rays or ref low may be used to attach the insert 40 to the conductive pads 38. 4 and circle 5, a partial perspective view of the insert 60 of the preferred embodiment is shown individually to provide the electrical circuit component 34 a plurality of electrically conductive pads 66 that can be repeatedly implemented. The radon conductive side is preferably plated with a precious layer, such as gold. When used with the _connector, a path for electrically interconnecting a pair of electrical circuit members 24 and 34 is provided. Suitable a. Examples of electrical circuit components interconnected by inserts 60 include printed circuit boards, circuit modules, and the like. The insert 60 includes a dielectric layer 62 having a plurality of stepped holes or openings 64 inside, each opening corresponding to an electrical conductive pad and aligned in a straight line. These stepped openings provide the height of the required spacer (height of the ladder) to ensure the force required to maintain contact with the connector. In one example, the dielectric layer 62 is made of a material such as Kapton (registered trademark of DuPont, USA) or Upilex (registered trademark of Ube, Japan) and has a thickness of 100,000 inches. Examples of other suitable materials for the dielectric layer 62 are liquid crystal polymer (LCP) and epoxy-glass-based materials (eg, FR4). The most outer

Page 11 of 187

5. Description of the invention (8) The material on the side has a thermal expansion coefficient (CTE) to substantially match the surrounding structure = thermal expansion coefficient. The dielectric layer 62 may also be formed of more layers of material to allow other manufacturing methods to be implemented. The conductive member 70 (for example, a solder connection) is deliberately placed corresponding to the shaped openings 64 and is electrically connected to the corresponding conductive pad 66. In an example f, the diameter of the root of the conductive member 70 is 026 inches and the height of the conductive member 70 is 30 inches to attach to the motherboard. The conductive pad 66 is composed of copper and is covered by a plating layer 68. In this example, it is composed of 2000 micro-inches of nickel and is covered by a 50 micro-inch thick gold layer. Provide good electrical contact.

In one example, the distance from the center to the center of the conductive pad 66 is 0.050 inches, but can be reduced to 0.040 inches or less if necessary. ,

Refer to FIG. 6 a and FIG. 6 b ′, which individually show enlarged side views of the insert 60 in FIG. 4, and respectively, the solder connection progresses slowly. Again, the appearance of such valuable trapezoidal openings 64 is typically cylindrical. In one example, the higher portions 72 of the openings 64 are adjacent to the conductive pad 66 and are straight!相同 is the same as the opening 4 4 in the conventional technology (Figure 2), while the lower part 74 is directly controlled and used as a reservoir (reserv) to better accommodate each conductive member (Figure 6b) ) 'S volume. This increased spacer height can ensure that the contact force of the connector is maintained but the unevenness of the surface of the electrical circuit members 24, 34 and the insert 60 cannot be too high to destroy the integrity of the solder connection. In one example, the diameter of the higher portion 72 of the openings 64 is 0.026 inches and its height is 0.0010 inches. And the diameter of the lower portion 74 is 0.5 inches and the height of the spacer is 0.5 inches.

Page 12 577187 V. Description of the invention (9) When a trapezoidal opening 6 4 is selected for the purpose of disclosure, it is obvious that the principles taught by the present invention can be applied to the use of openings of various shapes and sizes. To meet the needs of a specific design. In addition, the main materials of the conductive members 70 and 76 have been selected for the purpose of disclosure. It is obvious that the principles taught by the present invention can be applied to other materials including conductive adhesives. ~ After aligning with a well-known method in the art (for example, feet and holes, optical alignment, etc.), the insert 60 can be formed with a specific structure by appropriate procedures. 70 (A flat guide placed on the upper surface of the electrical circuit member 34, such as a steel terminal). For example, if the conductive member 70 is solder, infrared rays or hot air may flow back. Pressure can be applied during the flow-back so that the appearance of the conductive member 76 will be shown in the figure "Some conductive member / pad combinations are used for other electrical interconnection reasons (eg, mechanical or thermal benefits) It is also possible that these are in the second domain of the present invention. Further, the specific appearance of the conductive member 70 does not require the 2 positive cylindrical shape to be obvious in the technology. It is easy to see, and many other kinds of red ♦, including but not limited to cylindrical objects, can provide benefits according to performance requirements, and assembly equipment and procedures are also effective. ', ♦ clearly see the insert 60, once the conductive member 70 is being used by Shida To the conductive pads 38 of the electrical circuit member 34, each of the contact ends 16 and 18 of the contact member 16 is provided through a connector to provide an electrical path connecting the circuit of the electrical circuit member 34 to the conductive pad 28. The conductive Pad ^

577187 V. Description of the invention (10) is placed on the bottom, the outer surface m of the electrical circuit member 24, the path of the electrical circuit member 24, which can be equal to 9 '. Thus, the semiconductor device and the soil plate 26 have a plurality of i 面。 I surface. It can be understood that the conductive pads 28 and 38 can be obtained. 4 The source or ground is based on the operation of the individual circuit components. A resilient contact member 16 is compressed in this way. As well as other methods known to Hui Xi in this technique. The device 10 may be the type shown in the conventional art, and the connection 4 & 疋 0 歹 1 is the structure taught in the US patent A # in the common application referenced by the present invention. The electrical circuit members 24 and 34 aligned in a straight line may be relative to the connector i 0, and a pair of protruding pins 30 is used, and the pair of protruding pins 30 is formed by these electrical circuit members (for example, module 2 4) One extended. These pins are arranged in a straight line and placed in the corresponding openings 22 of the carrier 2 and the openings 3 6 (shown in dotted lines) of other electrical circuit structures 3 4. It must be understood that other alignments are also possible, including providing feet extending from the opposite surface of the stage 12 to invert the corresponding openings in the corresponding electrical circuit components. For example, it will be adjusted and relaxed. An opening 22 of the connector may be considered as an elongated structure to form a slot. The insert 60 can be constructed in a number of ways. For example, the dielectric layer is composed of two layers of materials, such as Jualu (ρ ο 1 y i m i d e) or F R 4. A car ’s best method is to start with the first dielectric layer and create the required openings.

Page 14 577187

mouth,. The first dielectric layer and a copper layer are made into a thin plate shape. The copper layer is covered to allow precious metals to be plated in the required area, which becomes the conductive pads and other functions such as fiducials that line up. Once the mask is removed, the excess copper etch is removed by etching with a suitable etching device. The openings are created in a second dielectric layer. An adhesive layer is placed and aligned in a straight line between the two dielectric layers to form the structure into a thin plate shape. In one case, the set temperature is 185 degrees Fahrenheit and the pressure is 20 pounds per square inch (PSI). If all layers are properly aligned, the ladder-shaped openings are formed and aligned with the contact pads. Once this is done, all structures are reversed and conductive materials such as solder are plated into the appropriate openings. Such a structure is sent to the flow-back furnace through one to form the conductive members. The insert is then ready to be attached to a suitable electronic packaging connection, such as a printed circuit board. To demonstrate that the dielectric layer is composed of a single layer of material, such as polyimide, FR4, or liquid crystal polymer, a preferred method is to start with the dielectric layer and create the required openings therein. These stepped openings can be formed in many ways including a stepped dr i 11, standard drilling operations, routing, etching, or other Well-known method. The dielectric layer and a copper layer are formed into a thin plate shape. The copper layer is covered to allow the precious metal to be electroformed in the required EI region. This region will become the basis for these conductive ions and other functions such as alignment (f i d u c i a 1 s). Once the shield is removed ’, the excess copper box is moved by a suitable time device ...

577187 V. Description of invention (12) Except. If the layers are properly aligned, the ladder-shaped openings are formed and aligned with the contact pads. Once these operations are completed, all structures are reversed and conductive materials such as solder are plated into appropriate openings. Such a structure is passed to a reflow furnace to form the conductive members. The insert is then ready to be bonded to a suitable electronic packaging structure, such as a printed circuit board. Although the present invention has been disclosed in the preferred embodiment as above, it is not intended to limit the present invention. Any person skilled in the art can be regarded as a private private product, called a μm product, without departing from the scope. The spirit of #mf is changed and retouched. Therefore, the present invention is only assured by the scope of the attached patent application. Moon Shy

Page 577187 Simple description of the drawings' ------- [Simplified description of the drawings] Figure 1, a perspective view of a part of an insert according to the conventional technology; Figure 2 is an enlarged conventional view as shown in Figure 丨Insertion of the technology :::: he: The insert is placed to attach to the circuit component. Figure 3a and the drawings are aligned to provide the final interconnection between them; Figure 3a and Figure 3b 疋 as shown in Figure 1 The display system expands the side view of the conventional part, and J J Figure 4 /; the southern part of the knife, the solder connection travels slowly; a perspective view; Fig. 5 is a partial side view, and Fig. 6 is enlarged. Fig. 6 is an enlarged view of 2 to 2 of the connector in Fig. 4 and the ground. The side view of the solder connection is slowly moving.

Connection 11 10-load A contact member, β 12 open end 18, 20 substrate electrical circuit member 24 protruded pin!! Electron 28 Electrical circuit member q / 1 Semiconductor member 32 Conductive 塾 38 Γ 36 Dielectric layer 42 40 46 Electrical ore layer 44 Conductive member ^ 48 Insert conductive member 60 Dielectric layer 62 577187 Simple illustration of opening 64 Electrical conductive pad 66 Electroplated layer 68 Conductive member 70 Higher part 72 Lower part 74 Conductive member 76 iran No. 18 pages

Claims (1)

577187 VI. Scope of patent application a) forming a first substrate including at least one dielectric material layer, at least one metal layer, and at least one first opening adjacent to the at least one metal layer; b) forming a second substrate including at least one first Two dielectric material layers and at least one second opening; c) a providing / adhesive layer is interposed between the first substrate and the second substrate; and d) the first substrate, the second substrate and the adhesive layer are arranged Straight and made into a thin plate, at least one of the first openings and at least one of the second openings are aligned so as to expose a portion of the at least one metal layer to the outside. 19. The method according to item 18 of the scope of patent application, wherein the step a) forming a first substrate includes the following sub-steps: i) providing the at least one first dielectric material layer including first and second edges Ii) forming the at least one first opening in the at least one first dielectric material layer; 1 ii) providing an adhesive layer to connect the at least one first dielectric material layer to the at least one metal layer; iv) adhering 4 Layer and the at least one metal layer to one of the at least one first dielectric material layer to make a thin plate; and v) covering, exposing, and etching the at least one metal layer as needed to create a predetermined metal-containing function. 2 0. The method according to item 9 of the scope of patent application, wherein the step b) forming a second substrate includes the following sub-steps: I Page 21 577187 i) providing the at least one second dielectric material layer; and H) forming the at least one or two openings in the at least one second dielectric material layer. μ spear 21 · The following steps of the method described in item 8 of the scope of patent application: $ 7 dagger, e) introducing conductive materials into the openings aligned with the at least one metal layer Electrical contact. The conductive material 22 is the method described in item 21 of the scope of patent application, and the material is paste solder. 23. The method of claim 22, further comprising the step of flowing back the paste-like solder. 24. The method as described in item 18 of the scope of patent application, wherein the diameter of the at least one second opening is equal to or greater than the diameter of the at least one first opening. Factory 25. The method as described in item 19 of the scope of patent application, wherein the at least one first dielectric material layer includes an insulating material. 26. The method according to item 25 of the scope of patent application, wherein the insulating material is epoxy-glass-based. 2. The method as described in item 26 of the scope of patent application, wherein the insulating rod material comprises F R 4. -28. The method as described in claim 20, wherein the at least one second dielectric material layer includes / insulating material. 29. The method according to item 28 of the scope of patent application, wherein the insulating material is epoxy-based. 577187 VI. Patent Application Range 30 · The method described in item 29 of the patent application scope, wherein the insulating material includes FR4. 31. The method as described in claim 18, wherein the openings provided on the first substrate and the second substrate are selected during melting, etching, routing, drilling, and drilling. . 32. The method as described in claim 19, wherein the at least one metal layer includes copper. 3 3 · The insertion method according to item 19 of the scope of patent application, wherein the function of the at least one predetermined metal includes a conductive pad. 34. The method of claim 18, wherein the thin plate shape occurs at a temperature of 185 degrees Fahrenheit and a pressure of pounds per square inch (PSI). Page 23