TW567511B - Ceramic capacitor device, conductive composition and conductive paste - Google Patents

Abstract

Capacity electrodes 21, 22 are fixed to outer surfaces 11, 12 of a ceramic dielectric substrate 1, contain metal, glass and Bi2 O3, and do not contain any of Pb or Pb compound. The metal comprises at least one kind of Cu or Ag. It is able to avoid the lowering of the adhesive strength of the capacity electrode against a ceramic dielectric substrate and avoid the lowering of a capacity and increase of dielectric loss.

Description

567511 V. Description of the Invention (1) Technical Field to Which the Invention belongs Related. Electrical composition and conductive paste. Prior art In the process of manufacturing ceramic capacitors, ceramics made of BaTi03-based materials were used to form capacitor electrodes. Conventionally, lead components such as conductive compounds constituting a capacitor electrode, and the lead components have a ring to remove lead from the conductive paste. However, when the conductive paste is removed, the softening point of the glass increases. The function of the matrix of the glass negative material is that the melting and melting of the soft glass of the glass is insufficient, which reduces the adhesion between electricity. As a result, the capacitor's electrical strength is low, which causes ceramic capacitors to avoid these capacitor electrodes followed by the composition of the glass contained in the strong electric paste. The capacitance of the ceramic capacitor element of the base material of the ceramic dielectric material and the capacitor electrode is low, and as described above, In the case of a capacitor electrode, it is difficult to balance characteristics of a reliability element such as strength. The conductive paste is coated on the surface of the base of the dielectric material, and the fired material contains the wrong glass or the wrong influence is often criticized. Because of this, the conductive paste capacitor electrode then rises, resulting in low reliability of electrical and ceramic dielectric materials. The following method softens the glass composition. Problems such as increased energy consumption, paste intolerance, and dielectric loss contained in the ceramic dielectric film sintered material matrix substrate. If the conductive point is changed, ceramics will cause problems. Lead-containing composition

567511 V. Description of the invention (2) Summary of the invention Capacitive element base material composition Base material composition The pottery of the present invention is a dielectric material attached to the front and Bi2 03, Ag at least outside the above substrate and including Cu and Ag electrodes Ceramics are enough to avoid ceramics, so they have low capacitance and capacitance. The purpose is to provide ceramics that do not contain lead in capacitor electrodes, and use winter conductive compositions. The purpose of f is to provide a ceramic capacitor element that can prevent the capacitor electrode from having a low strength against the ceramic dielectric and the electric conduction used by the capacitor. A ceramic capacitor element of the above-mentioned purpose and a ceramic medium are not included. In the capacitor capacitor of the present invention, at least one of the dielectric materials and ceramic capacitor elements can be obtained as a dielectric material. The dielectric loss electrode is provided to prevent low capacitance and dielectric loss components and the conductive composition used therefor. 2 'The ceramic capacitor element of the present invention includes a ceramic capacitor electrode', characterized in that the outer surface of the above-mentioned capacitor electrode matrix material includes metal, glass, Pb and Pb compounds, and the aforementioned metal includes Cu and ceramic electrodes. Including species. Capacitance electrodes of the base body are intended to increase the size of the base body. The capacitor element is attached to the ceramic dielectric material and contains any Pb and Pb compounds. Metal, glass, and Bi203 are based on this composition, which not only avoids the decrease in the capacitance and subsequent strength of the capacitor, but also confirms that the capacitance is low and the dielectric loss is increased. It does not contain lead, which prevents the capacitors from having a low strength and ceramic capacitors. Here, relative to the total amount of Bi203

2030-5288-PF (N); Ahddub.ptd Page 5 567511 V. Description of the invention (3) The content is determined to be 0.1% by weight of the total metal content of glass. In addition, the conductive metals, glasses, and Bi203 of the capacitor electrodes of the present invention include Cu and Ag to a conductive paste that forms the above-mentioned conductivity. Capacitor electrodes were fired on the outer surface of the feed base to obtain a range of ~ 10 · Owt%. Amount, set at 0.1 wt% ~ 5 revealed, used to form in ceramic composition. The conductive material does not contain any Pb and Pb, a compound, a binder, and a solvent, and the conductive paste is coated, and the ceramic capacitor of the present invention can be described in a ceramic dielectric. The range of porcelain dielectric material matrix composition includes gold compound ", and after mixing the aforementioned gold agent, it can be applied to the ceramic dielectric material material matrix to form elements. The embodiment is shown in Fig. 1 and Fig. 2, the ceramic of the present invention Capacitor element ^ ceramic ^ dielectric material base υ, capacitor electrodes 21 and 22. Although the Taogu element shown in the figure is equipped with two Rayleigh mines; KK 9 1 00 is unjust. 4 electrodes 21, 22, but f capacitor electrodes The number of the ceramic dielectric material substrate 1 can be BaTi, but it can also be made of other materials 3: Ho: the master is made of a knife. And the 'illustrator of the pottery. The main component is made of other materials, such as , The square two plate 2 material = 1 is a circular plate shape, but it can also be seen in the direction τ that there are two square two plates each other. Nj capacity =: 22 is attached, but the dielectric material substrate i is outside. A capacitor electrode 21 is attached Based on Ceramic Dielectric Materials Page 6 2030. 5288-PF (N); Ahddub.ptd

I. 567511 V. Description of the invention (4) The outer surface 11 of the body 1 ′ and another capacitor electrode 22 are attached to the outer surface 12 of the ceramic dielectric material substrate 1 ′ The two capacitor electrodes 2 丨 22 face each other with the ceramic dielectric material substrate 1 interposed therebetween. In the present invention, the capacitor electrodes 21, 22 'which are adhered to the outer surfaces 11, 12 of the ceramic dielectric material base body 1 are constituted so as not to contain any pb or compound. In addition, the capacitor electrodes 21 and 22 are composed of metal, glass, and β ". The metal used to form the capacitor electrodes 21 and 22 is at least one of Cu and Ag. According to this composition, not only can it be avoided Capacitor electrodes 2 丨, 2 2 have a low bonding strength to ceramic dielectric substrate 1, and at the same time, it is determined that the capacitance of ceramic capacitor elements can be reduced and the dielectric loss can be increased. Therefore, it can be obtained that capacitor electrodes 21 and 22 do not contain lead. It can avoid the low bonding strength of the capacitor electrodes 21 and 22 to the ceramic dielectric material matrix}, and can avoid the low capacitance and the increased dielectric loss of the ceramic capacitor element 0. The ideal composition of the capacitor electrodes 2 1, 2 2 will be relatively The content of B "〇3 in the total amount of metal is set within a range of 0.1 wt% / G to 10.0% by weight. And, the content of glass relative to the total amount of metal is set within a range of 0 lwt% to 5.0 wt%. As the glass for forming the capacitor electrodes 21 and 22, for example, sintered glass, lead borosilicate glass, or a combination thereof can be used. A specific jp example of borax glass' is, for example, SrO — B2 03 — Al 2 03 — ZnO-based glass. A specific example of lead borosilicate glass is ‘Z η 0 — B2 03 — S i 02 — A 12 03 series glass. The capacitor electrodes 2 1 and 2 2 can be formed by applying a conductive paste to the outer surfaces 1 1 and 1 2 of the ceramic dielectric material base 1. For this purpose

2030-5288-PF (N); Ahddub.p t d page 7 567511 V. Description of the invention (5) Conductive paste, which can be mixed with conductive composition, adhesive, and solvent to prepare. The composition of the conductive composition includes metal, glass, and Bi203, but does not contain any Pb and Pb compounds. The composition of the above metal should include at least one of Cu and ". The experimental data is listed below to specifically explain the effect of the present invention. ≪ Experiment 1 > First, metal powder, glass frit, and Bi203 were mixed to prepare 7 It is a conductive composition. Cu powder is used for all metal powders, and SrO — B203 — a 12 03 — ZnO glass is used for glass ingots. The content of ^ 203 relative to the total amount of metal powder is 0 · Owt. %, 〇 · wt%, 2.0 wt%, 3.5 wt%, 6.0 wt%, 10.0 wt%, and 15.0 wt% 〇 / 〇. Further, these conductive compositions are respectively It is mixed with a binder and a solvent to prepare 7 kinds of conductive pastes. The binder is an organic color developing agent. Then, the 7 kinds of conductive pastes are used as samples to make ceramic capacitor elements, ceramic trough elements, etc. The ceramic medium used in the production is mainly a BaTi03-based material, which is a circular plate shape with a thickness of 0.5mm. It is endangered Λ c ^ 3 issue T inch fishing king knife. The thickness of the ceramic dielectric material is 9 Each gat ^ ^ 伽 amma φ-· 2 reverse outer sides of the stomach are connected with a conductive paste to form 2 electric valleys 。The diameter of the capacitor electrode is set by the agency. Needle 2 ceramic capacitor elements of samples 1 to 7 to measure the capacitance, dielectric loss, and capacitance electrode pair Tao Shejie Xia good ancestor I, as shown in the following table. Then strong slap. Experimental results

2030-5288-PF (N); Ahddub.ptd Page 8 567511 V. Description of the invention (6) [Table 1] Sample No. * 1 2 3 4 5 6 * 7 Metal powder Cu Cu Cu Cu Cu Cu Cu Glass frit氲 wl%] 2.5 2.5 2.5 2.5 2.5 2.5 2.5 Bi203 content (secret) 0.0 0.1 2.0 3.5 6.0 10.0 15.0 Capacitance (nF) 0.86 1.11 1.14 1.16 1.15 1.15 1.15 Dielectric loss (%) 5.02 1.86 1.60 1.59 1.60 1.60 1.62 Subsequent strength [Kgf] 324 3.11 3.06 1.54 1.32 1.21 0.85 Solder wettability X ○ 〇 〇 〇 〇 Whether to determine whether the pass is qualified Passed qualified Passed unqualified As mentioned above, the content of Bi2 03 is 0. Above lwt0 / 〇 is preferred. Figure 3 shows the relationship between the B 込 03 content and the capacitance. As shown in the figure, when the content of Bi203 is more than 0.1 wt%, the capacitance is approximately within a certain range (1 · 1 InF ~ 1 · 16nF). In contrast, when the content of Bi203 is less than 0.1 wt%, the capacitance decreases sharply. That is, in the vicinity of the content of Bi203 = 0.1 wt%, it can be considered that there is a critical point related to capacitance. Figure 4 shows the relationship between the content of B "〇3 and the dielectric loss. As shown in the figure, when the content of BiJ3 reaches more than 0.1 wt%, the dielectric loss is approximately within the limits (1.59% ~ 1.86%). In contrast, Bi2O3 contains denier; at 0.1 lwt%, the dielectric loss increases sharply. That is, in the vicinity of Bi2O3 = about 0.1 wt%, it can be considered that there is a correlation between dielectric loss 3 Lin ^! As mentioned above, the content of 8 丨 2 0 3 with respect to the total amount of metal powder is ",". 10 · Owt% or less is preferred. Figure 5 shows the relationship between the content of BiA and the subsequent strong accounts. As shown, the degree of adhesion of the capacitor electrode to the substrate of the ceramic dielectric material decreases as the content of BiA increases. For ceramic capacitors, the bonding strength of the electrodes is required to ensure the minimum reliability. 1. Valley 1. OOKgf. When the content of Bi203 is less than 10.0 wt%, 1 can be obtained from the% μ raft.

203〇.5288.PF (N); Ahddub.ptd Page 9 567511 V. Description of the invention (7) The bonding strength above OOKgf is in the best condition 疋-The content of Bl203 is set to 2.0 wt% the following. Refer to

When the content of Bi203 is less than 2.0 wt%, the bonding strength is approximately at a relatively high value (3.06 Kgf to 3 f,, and it is recognized that the value is ± 24 Kgf). On the other hand, the content of Bi2O is greater than that of OwtW 'and the strength decreases sharply. That is, ϊ = 2.0% near, it can be considered that there is a criticality related to the bonding strength. Second, the solder wettability of Tao Shelei 6-for samples 1 to 7 (refer to Table ^ Evaluate its capacitor electrode. 2, 2 ... Crystal solder 2 seconds) clock, = evaluation of the second life, is immersed in the upper area of # 锡 丘 Yue Yu 4: i & § 70% of the entire area of the electric valley electrode to return to When the area is wet, the area is equal to that of lead-tin eutectic solder, θ ”, and only less than 70 / G, refer to Table 1, the parts within the scope of the present invention, the capacitor electrode material frost is wet In the end, the ceramic capacitors with uniform properties finally judge whether the ceramics of samples 1 to 7 are qualified. The combination is disqualified. Qualified by 'do not satisfy the above article are the capacitance dielectric loss _ ^ P2.5% strength above the floor then feed the wettability - L_〇 ~ 1, ...,, Shang a slave die of hunger Pat% solids bucket square pole Cape 7 丄 有 量 0. lwt ^ 0. 0wt% Of the range 2 ~ 7, Bl2203 of eight 枓 2 ~ 6, judged to be qualified

2030-5288-PF (N); Ahddub.p t d 10th stomach 567511 V. Description of the invention (8) In addition, the sample numbers outside the range are attached with wood. < Experiment 2 > First, metal powder and h ^ conductive composition were mixed. The same as the previous = block to prepare 5 kinds of glass frit. All use S Γ 0-β2 〇 two consecutive 1T1 ζ 〇 gold car genus two use c u powder 'Sibo kinyu 23 Α12〇3 — ZnO series glass. The content of the glass frit relative to the metal ^ Wang 1 is 0.00% by weight, 〇 ·, 2.5% by weight,. =, And 7.0% by weight. 'The content of ^ relative to the total amount of metal powder is Owt. % ° Next, 5 kinds of conductive pastes were prepared with 4 or 5 kinds of conductive compositions. The modulation method of the conductive paste is the same as the previous experiment. Then, ceramic ceramic valleys το of samples 8 to 2 were made from the five kinds of conductive pastes. The manufacturing method of the ceramic capacitor element is the same as the previous experiment 1. For ceramic capacitor elements of samples 8 to 12, the capacitance, dielectric loss, and adhesion strength of the capacitor electrode to the ceramic dielectric material substrate were measured. The experimental results are shown in Table 2 below. [Table 2] S material number — * 8 9 1 0 11 * 1 2 The content of metal powder Cu Cu Cu Cu Cu glass lumps [wt%] 0.0 0.1 2.5 5.0 7Ό Bi2 03 content [wt%] 2.0 2.0 2.0 2.0 2Ό Capacitance [nF] 1.18 1.16 1.14 1.10 0.80 Dip loss [% τ 1.59 1.61 1.60 172 2.21 Adhesive strength [Kgf] 0.75 1.95 3.06 3.29 4.32 Wetability of solder

567511

V. Description of the invention (9) As mentioned above, the content of the glass frit relative to the total amount of the metal powder is preferably 50 wt% or less. Figure 6 shows the relationship between the glass frit content and capacitance. As shown in the figure, when the content of the glass frit is 5.0% by weight or less, the electric six will stop within a certain range. Relative to the ground glass I large frit content is greater than 5.0wt%, the capacitance decreases sharply. That is, in the vicinity of the content of the glass frit = 5.0 wt%, it can be considered that there is a critical point of the capacitive phase.

Figure 7 shows the relationship between the glass frit content and the dielectric loss. As shown in the figure, when the glass frit content is less than 5.0 wt%, the dielectric loss is approximately within a certain range (1.59% to 1.72%). In contrast, when the content of the glass block is greater than 5.0wt%, the dielectric loss increases sharply. That is, in the vicinity of the content of the glass frit = 5 · Owt%, it can be considered that there is a critical point related to medium damage education. As mentioned above, it is preferable that the content of the glass frit with respect to the entire amount of the metal powder is not less than 0.1 W t%. Figure 8 shows the glass frit content and adhesion

Degree relationship. As shown, the bonding strength increases as the glass frit content increases. In order to ensure the reliability of the ceramic capacitor element, the minimum adhesion strength of the capacitor electrode to the substrate of the ceramic dielectric material is about 1 · 〇 κ g f. When the content of the glass frit reaches 0.1 wt% or more, a bonding strength of 1.0 kgf or more can be obtained. The best case is to ‘set the content of the glass block to 2.5 wt% or more. When the content of the glass frit reaches 2.5 wt% or more, a high adhesive strength of 3.06 Kgf or more can be obtained. Then, for the ceramic capacitors of samples 8 to 12, the capacitor electrodes were evaluated.

Page 12

567511 V. Description of the invention (10) The method of evaluating the solder wettability is the same as that of the previous solder wettability (refer to Experiment 1 before the table. Refer to Table 2) The sample 9 ~ in the enclosure of the present invention is included? The solder electrode 电容 of the capacitor electrode and the ceramic capacitor r τ of the stomach e 1 2 have good wettability. Finally, for samples 8 to 12 of the ceramic composite-T · 丨, it must be called "V — Wen Dian The method for determining whether the pieces are in order is the same as that of the previous test 1. J refers to 2, and the content of the blocks in samples 9 to 12 within the scope of the present invention is 0 · lwt% ~ 5 · 〇 Samples 9 to u in the wt% range are qualified after melting. In addition, sample numbers outside the range are appended with *., 'Break < Experiment 3 > First, mix metal powder, glass frit, and Bi203 to adjust Conductive composition. 7Cu powder or "powder" is used for metal powder. SrO — B2O3 — A 丨 2〇3 — ZnO glass is used for broken frit. The content of glass frit relative to the total amount of metal powder Both are 2. 5wt%, and the content of Bi2 03 relative to the total amount of metal powder 77 is 2. Owt%. Two kinds of conductive compositions prepared two kinds of conductive pastes. The method for preparing the conductive pastes was the same as in the previous experiment 1. Then, ceramics of samples 丨 3 and 丨 4 were prepared using these two kinds of conductive pastes. Capacitor element. The manufacturing method of ceramic capacitor element is the same as that of the previous experiment i., Again, for the ceramic capacitor element of samples 1 3, 1 and 4, measure its capacitance, dielectric loss, adhesion strength of capacitor electrode to ceramic dielectric material substrate, And the solder wettability of the capacitor electrode. Finally, make a judgment of suitability. The methods of these determinations and suitability are the same as the previous experiment 1. The experimental results are shown in the following 567511 V. Description of the invention (11) Table 3. Table 3] Sample No. 13 14 Metal powder Cu Ag glass fiber containing children [wt%] 2.5 2.5 Bl2 03 containing children [Wt%] 2.0 2.0 Capacitance [nF] 1.14 1.10 Dip loss [%] 1.60 1.70 Adhesive strength [Kgf] 3.06 2.35 Wetability of solder 〇〇_ Pass or fail In Table 3, compare sample 1 3 using cu powder and sample 1 4 using Ag powder. It can be seen that even with sample 14 of Ag powder, ffiCu can be obtained. The same result was obtained for powder sample 13. Therefore, it is speculated that 'even in the case of using a mixture of Cu powder and Ag powder', the same results can be obtained as for Sample 1 3 using Cu powder alone, and for Sample 14 using Ag powder alone. Results ^. — Figure 9 is a plan view showing the welding system of the ceramic electric valley as shown in Figure 1 and Figure 2. Figure 10 is an enlargement along the X-X line of Figure 9 Section i-plane view. Built as above 'because the solder of the capacitor electrodes 2 1, 2 2 has good wettability, as shown in Figure 9 and Chu! π gate

As shown in Fig. 10 for a long time, can the wire conductors 3 1 and 32 be easily soldered to the electric valley electrode? 1 〇 ^ ^ Weld to the capacitor electrode 乂 22 乂, use the solder 41 to weld the wire conductor 31 to the capacitor electrode 22; 9 solder 42 to weld the wire conductor 32 to the garment surface. As the solders 41 and 42, for example, a lead-tin eutectic solder is used. The ceramic reference ~ β of the present invention is an electric valley element, which can be combined with other electronic circuits such as inductors, resistors, and transistors to form an integrated structure. Specific example

2030-5288-PF (N); Ahddub.ptd Page 14 567511 V. Description of the invention (12) LC filter composed of capacitor and inductor. As described above, according to the present invention, the following effects can be obtained. (a) A ceramic capacitor element containing no lead component in the capacitor electrode and a conductive composition used therein can be provided. (b) It is possible to provide a ceramic capacitor element with low strength, which avoids the adhesion of the capacitor electrode to the ceramic dielectric material substrate, and the conductive composition used therefor. (c) A ceramic capacitor element capable of preventing low capacitance and increased dielectric loss, and a conductive composition used therefor can be provided. Participate

2030-5288-PF (N); Ahddub.ptd Page 15 567511 Brief description of the drawings With regard to other objects, structures, and advantages of the present invention, a detailed description will be given with reference to the drawings of the implementation mode. Here, FIG. 1 is a plan view showing an embodiment of the ceramic capacitor element of the present invention. Figure 2 is an enlarged cross-sectional view taken along line I I-I I in Figure 1. Figure 3 shows the relationship between the content of B i2 03 and the capacitance. Figure 4 shows the relationship between the content of Bi203 and the dielectric loss. Figure 5 shows the relationship between the content of B i2 03 and the bonding strength. Figure 6 shows the relationship between glass frit content and capacitance. Figure 7 shows the relationship between the content of glass frit and dielectric loss. Figure 8 shows the relationship between the glass frit content and the bonding strength. Fig. 9 is a plan view showing the welding process of the ceramic capacitor element shown in Figs. 1 and 2. Figure 10 is an enlarged sectional view taken along line X-X in Figure 9. DESCRIPTION OF SYMBOLS 1 Matrix of ceramic dielectric material 11 Outer surface 12 Outer surface 21 Capacitance electrode 22 Capacitance electrode 31 Wire conductor 32 Wire conductor 41 Solder 42 Solder

2030-5288-PF (N); Ahddub.ptd Page 16

Claims (1)

A ceramic capacitor element and a ceramic capacitor element are included. For each electrode, the capacitor electrode is attached to the side of the ceramic dielectric material substrate, including metal, glass, and aluminum. Contains any external sigma, and the aforementioned metal includes at least one of Cu and "2. For example, the ceramic capacitor element according to item 1 of the patent application range, wherein the aforementioned ceramic dielectric material substrate includes a BaTi03 series material ", 3. The ceramic capacitor element according to item 1 or 2 of the patent scope, such as the electric valley electrode, with respect to the total amount of the foregoing metal, the content of the aforementioned" B "% is 0.1 wt% to l (In the range of K0wt%. 4. The ceramic capacitor element according to item 3 of the scope of patent application, wherein, in the front f capacitor electrode, relative to the entire amount of the aforementioned metal, the content of the aforementioned glass i is 0.1 wt% to 5.0 Within the range of wt%. 5. The ceramic capacitor element according to item 1 or 2 of the patent application scope, wherein the aforementioned glass includes at least one of borax glass and lead borosilicate glass. Ceramic capacitor element of 2 items, In the above, the aforementioned glass includes at least one of Sr0-B2 03 —Al2 03 —ZnO-based glass and 2110- 1% — S i 02 — A12 〇3-based glass. 7 • A conductive composition for forming a capacitor The electrode is on the substrate of the ceramic dielectric material, including metal, glass, and Bi203, and does not contain any Pb and Pb compounds, and the aforementioned metal includes at least one of Cu and Ag. 8 • Conductivity as described in the 7th scope of the patent application Sexual composition, wherein the phase 2030-5288-PFl (N) .ptc For the total amount of the aforementioned metal, the content of the aforementioned Bi203 is in the range of 0.1 wt% to 10 wt%. 9 · The conductive composition according to item 8 of the scope of the patent application, wherein the content of the aforementioned glass relative to the entire amount of the aforementioned metal is in the range of 0.1 wt% to 5.0 wt%. 10. The conductive composition according to item 7, 8 or 9 of the scope of patent application, wherein the glass includes at least one of borax glass and lead borosilicate glass. 1 1. The conductive composition according to item 7, 8 or 9 of the scope of patent application, wherein the aforementioned glass includes Sr0_B2 03-ΑΙΑ-ZnO-based glass and ZnO — B2 〇3-S i Ο? — A丨 2 03 is at least one kind of glass. 1 2 · —a conductive paste for forming a capacitor electrode on a ceramic dielectric material substrate, including a conductive composition, a binder, and a solvent, and the aforementioned conductive composition is as described in the patent application range 7 to 9 The conductive composition according to any one of clauses, wherein the conductive composition, the binder, and the solvent are mixed with each other. 1 3. A conductive paste, which is used to form a capacitor electrode on a ceramic dielectric material substrate, includes a conductive composition, a binder, and a solvent, and the foregoing conductive composition is in accordance with the scope of the patent application. The conductive composition is one in which the aforementioned conductive composition, a binder, and a solvent are mixed with each other. 14 · Kinds of Conductive Pastes ’to Form Electric Valley Electrodes for Tao Jingjie 2030-5288-PFl (N) .ptc Page 18:;: Magnetic year 9125216 Amendment 6 、 Applicable to patents on substrates of quality materials, including conductive compositions, adhesives, and solvents, and the aforementioned conductivity The composition is the conductive composition as described in item 11 of the scope of the patent application, wherein the conductive composition, a binder, and a solvent are mixed with each other. 2030-5288-PFl (N) .ptc Page 19