TW564337B - Constant net heating power technology - Google Patents
Constant net heating power technology Download PDFInfo
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- TW564337B TW564337B TW91119080A TW91119080A TW564337B TW 564337 B TW564337 B TW 564337B TW 91119080 A TW91119080 A TW 91119080A TW 91119080 A TW91119080 A TW 91119080A TW 564337 B TW564337 B TW 564337B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
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- G01R1/0458—Details related to environmental aspects, e.g. temperature
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Description
564337 五、發明說明（1) 【發明背景】 1. 技術領域 本發明大致係關於一種半導體技術，尤指一種可保持 測試中的半導體裝置於實質恆溫的方法。 2. 技術背景 半導體裝置一般均將經歷多種電子測試步驟，包括有 短路測試、老化測試、以及可確保其適當操作之裝置功能 測試。舉例而言，在其功能測試期間，將該測試中的裝置 保持於選定的、且實質上為定值的溫度將是重要的。然 而，在此些功能測試中，該裝置的功率位準將可能大大地 改變，因而導致該裝置之溫度的波動。因此，在處理此問 題時，廣為使用的方法係為設有加熱頭1 0至表面11上，該 表面1 1係可與測試中的裝置1 4之蓋子1 2相接觸，例如裝設 於印刷電路板1 6上的覆晶裝置（第1圖），或如在無蓋裝置 的實例中將該加熱頭1 0與裝置1 4本身相接觸（第2圖）。該 加熱頭1 0—般係包括沿著表面1 1的電子式加熱元件1 8，經 由此分別增加與減少電流流量以增加或減少其輸出值，以 及可使冷卻劑2 2 (例如水）流經其中的通道2 0。因此，只要 藉著改變電流流量及/或提供或切斷該冷卻劑之流動，則 該加熱頭1 0以及鄰近的測試中裝置1 4之溫度即可調整或變 化。而當該測試中之裝置1 4的溫度因為上述之功率水準改 變而有所變化時，該加熱頭1 0之溫度也將引起改變以補償 該裝置1 4的溫度改變量，以試著保持該測試下之裝置1 4於 固定、選定之溫度。564337 V. Description of the Invention (1) [Background of the Invention] 1. Technical Field The present invention relates generally to a semiconductor technology, and more particularly to a method capable of maintaining a semiconductor device under test at a substantially constant temperature. 2. Technical Background Semiconductor devices generally undergo various electronic test procedures, including short-circuit tests, burn-in tests, and device function tests to ensure proper operation. For example, during its functional test, it will be important to keep the device under test at a selected, substantially constant temperature. However, during these functional tests, the power level of the device may change significantly, resulting in fluctuations in the temperature of the device. Therefore, in dealing with this problem, a widely used method is to provide a heating head 10 to a surface 11 which can be in contact with the cover 12 of the device under test 14 such as being installed on The flip-chip device on the printed circuit board 16 (Figure 1), or as in the case of a coverless device, the heating head 10 is in contact with the device 14 itself (Figure 2). The heating head 10 generally includes electronic heating elements 18 along the surface 11 through which the current flow is increased and decreased to increase or decrease its output value, and the coolant 2 2 (such as water) can flow. Pass through the channel 2 0. Therefore, as long as the temperature of the heating head 10 and the device under test 14 nearby can be adjusted or changed by changing the current flow and / or providing or cutting off the flow of the coolant. And when the temperature of the device 14 in the test is changed due to the above-mentioned power level change, the temperature of the heating head 10 will also cause a change to compensate for the temperature change of the device 14 to try to maintain the The device under test 14 was at a fixed, selected temperature.
92118.ptd 第5頁 564337 五、發明說明（2) ---- 試著保持測試中之裝置1 4於實質恆溫下的方法係為： 當該測试中裝置1 4的溫度隨其功率水準之波動而變化時， 比較該測試中裝置1 4的溫度與已程式化之溫度，並利用比 例式積分微分控制器（P I D )來感測該差異值以變化該加熱 頭1 0的溫度’使该測试中裝置1 4之溫度轉變回該選定值。 然而，此方法需對測試中裝置1 4之溫度作精確測量，因此 將無法貫現於有盖裝置上’且甚至在運用於無蓋褒置上也 是有困難的。因此’該方法將很難在完全令人滿意的情況 下得到證明。 另一解決方法，係由S c h 1 u m b e r g e r股份有限公司目前 所實施中，係對無蓋裝置使用如下所示之演算法： T 〇= T d- κ Θ P d 其中：T為測試中之裝置的溫度 T為加熱頭之溫度 P為測試中裝置之消耗功率 “為裝置之熱量疊加係數（晶粒與加熱頭之間的總 熱阻） 在此方法中，係選定裝置之測試溫度τ具加熱頭溫度 τ係根據此方程式而設定。監控該測試中之裝置1 4的消耗 功率P d。透過使用此方程式，而在試圖保持該測試中裝置 1 4於實質恆溫過程時，加熱頭1 〇之溫度將是可變化的。然 而’我們可發現在K 6»之理想值為常數的情況下，將無法證 明此實例中之結果。換言之，該K 0值可能隨著不同的測試 而改變，因而導致此試圖保持測試中之裝置1 4於實質怪溫92118.ptd Page 5 564337 V. Description of the Invention (2) ---- The method of trying to keep the device 14 under test at a substantially constant temperature is: when the temperature of the device 14 during the test depends on its power level When the fluctuation changes, the temperature of the device 14 in the test is compared with the programmed temperature, and a proportional integral differential controller (PID) is used to sense the difference value to change the temperature of the heating head 10 '. In this test, the temperature of the device 14 is changed back to the selected value. However, this method requires accurate measurement of the temperature of the device 14 under test, so it will not be able to be reproduced on a covered device 'and it will be difficult to apply it even on a covered device. Therefore, this method will be difficult to prove with complete satisfaction. Another solution, which is currently implemented by S ch 1 umberger Co., Ltd., uses the following algorithm for the coverless device: T 〇 = T d- κ Θ P d where: T is the value of the device under test Temperature T is the temperature of the heating head P is the power consumption of the device under test "is the heat superposition coefficient of the device (total thermal resistance between the grain and the heating head) In this method, the test temperature of the selected device τ has a heating head The temperature τ is set according to this equation. Monitor the power consumption P d of the device 14 in the test. By using this equation, while trying to maintain the device 14 in the test at a substantially constant temperature process, the temperature of the heating head 10 Will be variable. However, 'we can find that in the case where the ideal value of K 6 »is constant, the results in this example will not be proven. In other words, the value of K 0 may change with different tests, leading to This attempt to keep the device under test 1 4
92118.ptd 第6頁 564337 五、發明說明（3) 質、相 在且的將總耗能 較示 許發非 實單至 。，準準準量亦 而顯的含的而 於簡達 法處水水水能度 式所解包蓋述 置為能 方近率率率或溫 圖式瞭可涵描 裝需均 的鄰功功功準的 之模須亦所然 之法中 溫的之之之水置 附佳必明其自 中方例 恆置置頭頭率裝 所最惟說離其 試該案 抵裝裝熱熱功之 其其。細偏為 測時之 大之該加加總中 與，明詳致視 持同置 於中致該該其試 述言發其不僅 維，裝 置試導而與，測 描而本且而應 可題蓋 裝測並，置中該 細士現例，明 是問無 之該，準裝法使 詳人實施内說 法出與 中於上水中方以 的之以實在細 方提蓋 試位置率試此， 來藝用他化詳 。之所有 測定裝功測在值 下技可其變與 性需述於 持將該之該。定。接項顯含樣示 確所前且 維頭於置使值抵值由此明包態圖 精前服， 1為熱行裝以定大定可對例可的， 不目克的 示係加執該，抵於之將。施尚顯此 生，能效。揭明，將控化大持質明解實明明因 產此且有果之發中試監變持維實發理之發與。 中因，且效明本法測。而維係在本地述本正圍 程 溫宜之發 方多變其能量持 易描，修範 過 恆便同t 此許改隨和損維 容與是多明 棉 態 施 〇 實 制佳 限最 之之 圍明 範發 其t 其 9 ο 考式 參模 為施 作實 以佳 出最 列之 細明 詳發 此本 於施 將實 例以 施用 實可 定量 特考 之所 明人 發明 本發 為 係92118.ptd Page 6 564337 V. Description of the invention (3) The quality, relative and total energy consumption will be shown to be unrealistic. The quasi-quasi-quasi-quantity is also explicitly included, and the water-water-water energy formula in the Janta method is used to describe the neighboring power that can be described as the approximate rate or temperature diagram of the energy. The skill and skill of the model must be the same as the method of the middle temperature of the water. Jia Jiaming must be from the Chinese example of the constant set head and head equipment. its. The details are the time of the sum of the sum of the sum and the details of the same as in the same place in the cause of the test description and not only its dimension, the device test and the test, and the description and should be possible The cap is installed and tested, and the detailed example is placed in the center. The question is clearly asked. The quasi-installation method enables the detailed person to implement the internal statement and the upper side of the water. Therefore, Laiyi uses him to elaborate. All the determination of load and power can be changed and the characteristics need to be described. set. The items shown include samples that show what is true and the value of the dimension is set to offset the value, so that the state diagram is refined. 1 is a hot pack to set the size and can be used for the case. Yes, it will. Shi Shangxian was energy efficient in this life. It was revealed that the control of the company ’s major holdings should be explained clearly and clearly because of the results of this test and the results of the pilot changes to the maintenance of the results. Middle cause, and follow the test. While maintaining the local narrative process, Wen Yi's sender can change his energy easily, and if he practices too much, it will be the same as the change. This is the best way to achieve the best performance limit of Doming cotton. Fan Ming Fan Fa Qi t 9 9 ο The test reference model is Shi Zuoshi, the best details are listed here. This example is given in the example of the invention.
92118.ptd 第7頁 564337 五、發明說明（4) 第3圖係與第1圖近似，顯示鄰近於測試中裝置 (DUT) 34的加熱頭30，該加熱頭30係有與測試中裝置34之 蓋子3 2相接觸的表面3 1，例如裝設於印刷電路板3 6之覆晶 裝置。該加熱頭3 0係包括電子式加熱單元38，該電子式加 熱單元3 8係鄰近於與該蓋子3 2接觸的加熱頭3 0之表面3卜 該加熱單元38將可經由分別增加與減少電流之流量而增加 及減少其輸出值，並藉由冷卻劑4 0 (例如水）之流動以通過 通道4 2，此係如同先前之描述。 最初，藉此例子所示方法，測試中的裝置3 4係無電力 驅動，亦即不對其執行電力測試，且亦無冷卻劑4 0之流 動，選用之定電流（其大小係由箭頭A之長度所指示）將通 過該加熱元件3 8，使該加熱元件3 8產生以熱量形式消耗的 功率水準，該功率水準將可由下方程式決定：92118.ptd Page 7 564337 V. Description of the invention (4) Figure 3 is similar to Figure 1 and shows the heating head 30 adjacent to the device under test (DUT) 34, which is connected to the device under test 34 The surface 3 1 in which the cover 3 2 is in contact, for example, a flip chip device mounted on a printed circuit board 36. The heating head 30 includes an electronic heating unit 38. The electronic heating unit 38 is adjacent to the surface 3 of the heating head 30 in contact with the cover 32. The heating unit 38 can increase and decrease the current respectively. The flow rate increases and decreases its output value, and flows through the channel 4 2 by the flow of the coolant 40 (such as water), as described previously. Initially, using the method shown in this example, the devices 3 and 4 in the test were not driven by electricity, that is, no electrical test was performed on them, and no coolant 40 was flowing. A constant current (the size of which is determined by the arrow A) (Indicated by the length) will pass the heating element 38, so that the heating element 38 will generate a power level consumed in the form of heat, and the power level will be determined by the following formula:
P〇=IV=I 2R 其中 P為加熱頭功率 I為加熱頭加熱裔電流 V為加至加熱頭加熱器之電壓 R為加熱器電阻 可選擇加熱單元3 8中之電流位準A以決定加熱頭3 0之 功率水準p cl，其中該加熱頭3 0、蓋子3 2以及測試中之裝置 3 4的溫度，假設均為9 0°C (見第7圖流程圖之方塊1 )。在此 情況下，該加熱頭（P cl)與該測試中之裝置（P『0 )的總功率 和P將等於Pcl。P〇 = IV = I 2R where P is the heating head power I is the heating head heating current V is the voltage applied to the heating head heater R is the heater resistance The current level A in the heating unit 3 8 can be selected to determine the heating The power level p cl of the head 30, in which the temperature of the heating head 30, the lid 32, and the device 34 under test is assumed to be 90 ° C (see box 1 in the flowchart of FIG. 7). In this case, the total power and P of the heating head (P cl) and the device under test (P 『0) will be equal to Pcl.
92118.ptd 第8頁 564337 五、發明說明（5) 接著，在仍無冷卻劑4 0之流動的情況下，於諸如功能 測試之執行過程中（見第7圖之方塊2 )，將該測試中之裝置 3 4的功率驅動至給定水準P dl。該測試中裝置3 4之功率將使 該測試中裝置3 4消耗相對應於其功率水準P dl的熱量值，如 果增加之熱量係消耗自該加熱頭3 0，將導致該測試中裝置 3 4、該蓋子3 2、以及該加熱頭3 0之溫度的增加，以致使該 測試中的裝置3 4將不再位於所需的溫度9 0°C下。為了維持 該測試中裝置3 4的溫度於9 0°C，將持續地監控該測試中裝 置3 4之功率水準，且該加熱頭3 0之功率水準亦將變化，亦 即反應於該測試中裝置3 4的改變功率水準，而改變或調整 該加熱頭3 0之功率水準（藉著改變通過該加熱單元3 8的電 流位準），以致使該測試中裝置與加熱頭之功率水準總和 維持大抵之定值P t，亦即當該測試中裝置3 4之功率水準隨 其測試而改變，而該加熱頭3 0之功率水準則將根據下列演 算法而改變： P t= P d+ P 0 其中 P係為總功率，保持在大抵定值 P择為加熱頭之功率 P蔣為測試中裝置之功率 因此在此給定例子中，隨著測試中裝置3 4之功率水準 的增加（由零至P di)，加熱頭3 0之加熱器3 8的電流也將依第 4圖之箭號B長度所指示之大小而降低，以依次降低加熱頭 3 0之功率水準至P c2，其係根據方程式：92118.ptd Page 8 564337 V. Description of the invention (5) Next, in the case where there is still no flow of coolant 40, during the execution of a functional test (see box 2 in Figure 7), the test is performed. The power of the middle device 34 is driven to a given level P dl. The power of the device 34 in this test will cause the device 34 in the test to consume the heat value corresponding to its power level P dl. If the increased heat is consumed from the heating head 30, it will cause the device 3 4 in the test. , The cover 32, and the temperature of the heating head 30 are increased, so that the device 34 under test will no longer be at the required temperature of 90 ° C. In order to maintain the temperature of the device 34 in the test at 90 ° C, the power level of the device 34 in the test will be continuously monitored, and the power level of the heating head 30 will also change, which is reflected in the test The power level of the device 34 is changed, and the power level of the heating head 30 is changed or adjusted (by changing the current level through the heating unit 38), so that the total power level of the device and the heating head is maintained during the test. The large fixed value P t, that is, when the power level of the device 34 in the test changes with its test, and the power level criterion of the heating head 30 will change according to the following algorithm: P t = P d + P 0 Among them, P is the total power, which is maintained at a large value. P is selected as the power of the heating head. P Jiang is the power of the device under test. To P di), the current of the heater 38 of the heating head 30 will also decrease according to the size indicated by the length of the arrow B in Fig. 4, in order to reduce the power level of the heating head 30 to P c2, which is According to the equation:
92118.ptd 第9頁 564337 五、發明說明（6)92118.ptd Page 9 564337 V. Description of Invention (6)
Pt(常數）= Pdl+Pc2 隨著測試中裝置3 4及加熱頭3 0的總功率P和前述狀態 般保持實質相同之定值，該基本相同的總熱量將如前狀態 般消耗（第3圖），以使該測試中之裝置3 4 (以及加熱頭3 0與 蓋子3 2 )的溫度維持在實質9 0°C下（亦見於第7圖的方塊 3)。 接著，舉例而言，測試中之裝置3 4，在其測試期間， 功率將提供至給定水準P d2(大於零但小於P dl)，即如第4圖 所示（亦如第7圖之方塊4 )。該裝置3 4之已降低功率將使該 裝置3 4消耗較前述為少之熱量，並將使加熱頭3 0與測試中 之裝置3 4的總消耗熱量減少，且依次降低該測試中之裝置 3 4的溫度至低於所需之9 0°C。因此，為了維持該測試中裝 置3 4的溫度於9 0°C，在沒有冷卻劑4 0的流動之下，該通過 加熱頭3 0之加熱單元3 8中的電流將增加至如箭號C所指示 的長度（反應於該測試中裝置3 4的功率減少量，其功率水 準係如同前述般予持續監控），以根據此一方程式增加該 加熱頭30之功率水準至Pc3:Pt (constant) = Pdl + Pc2 As the total power P of the device 34 and the heating head 30 during the test remains substantially the same as the previous state, the substantially same total heat will be consumed as before (the third Figure) to maintain the temperature of the device 34 (and the heating head 30 and the lid 32) in this test at a substantial temperature of 90 ° C (see also box 3 in Figure 7). Next, for example, during the test of the device 34, the power will be provided to a given level P d2 (greater than zero but less than P dl), as shown in Figure 4 (also as shown in Figure 7). Box 4). The reduced power of the device 34 will cause the device 34 to consume less heat than before, and will reduce the total heat consumption of the heating head 30 and the device 34 under test, and in turn reduce the device under test The temperature of 3 4 is lower than the required 90 ° C. Therefore, in order to maintain the temperature of the device 34 at 90 ° C in this test, without the flow of the coolant 40, the current in the heating unit 3 8 passing through the heating head 30 will increase to an arrow C The indicated length (response to the power reduction of device 34 in this test, the power level of which is continuously monitored as before), in order to increase the power level of the heating head 30 to Pc3 according to this formula:
Pt(常數）= pd2+pc3 因此，將使總功率P t，以及消耗之熱量保持實質相同之定 值，並依次供使該測試中裝置3 4 (以及該加熱頭3 0與該蓋 子3 2 )維持在大致9 0°C (第7圖之方塊5 )。 第7圖之方塊4與5的步驟可視選擇而重複用於多種測 試功率水準的裝置中。同時，也應瞭解的是在第7圖之方 塊1中，可選用多種不同之溫度T。Pt (constant) = pd2 + pc3 Therefore, the total power P t and the heat consumed will be kept at substantially the same fixed value, and will be provided for the device 3 4 (and the heating head 30 and the cover 3 2) in this order. ) Is maintained at approximately 90 ° C (box 5 in Figure 7). The steps of blocks 4 and 5 in Fig. 7 can be repeated for various test power levels depending on the selection. At the same time, it should be understood that in block 1 of Fig. 7, a plurality of different temperatures T can be selected.
92118.ptd 第10頁 564337 五、發明說明（7) 第6圖顯示與本發明相關的無蓋裝置3 4，其中相鄰於 該測試中之裝置3 4的加熱頭3 0係以其表面3 1與該測試中之 裝置3 4直接接觸。我們可發現上述各步驟將可輕易地適用 於此狀況中。 我們可暸解本方法係以簡單且有效的方式維持測試中 之裝置於實質選定的恆溫中，僅需藉著監控測試中裝置的 功率水準，以及藉著改變流經加熱器的電流位準來選取適 當的加熱頭功率水準即可，亦即不需再對測試中之裝置的 溫度進行監控。我們也將進一步發現本方法具有簡單、便 宜、且於使用上極為有效之特點，並可輕易地將其運用至 有蓋與無蓋的裝置中。 前述之本發明實施例描述已顯示其說明與圖示的目 的，但此一揭示並非試圖限制本發明於此精確揭示形式的 範圍内。其他的修正或變化亦可能包含在上述教導的見解 之中。 此一選用且已描述之實施例將提供本發明與其實際應 用原理的最佳說明，藉此可使熟於此項技藝者將本發明利 用於各種不同實施例與各種適於其他特殊使用考量的修正 中。而在依據公正、合法且公平授與權利的寬大解釋下， 所有的修正與變化均應係包含於後述申請專利範圍所決定 的發明範圍中。92118.ptd Page 10 564337 V. Description of the invention (7) Figure 6 shows the coverless device 3 4 related to the present invention, in which the heating head 3 0 adjacent to the device 3 4 under test is based on its surface 3 1 Make direct contact with the device 34 under test. We can find that the above steps can be easily applied in this situation. We can understand that this method is a simple and effective way to maintain the device under test at a substantially selected constant temperature. It only needs to be selected by monitoring the power level of the device under test and by changing the level of current flowing through the heater. An appropriate heating head power level is sufficient, that is, it is no longer necessary to monitor the temperature of the device under test. We will further find that this method is simple, convenient, and extremely effective in use, and can be easily applied to both covered and uncovered devices. The foregoing description of the embodiments of the present invention has been shown for purposes of illustration and illustration, but this disclosure is not intended to limit the invention to the scope of this precise disclosure. Other amendments or changes may be included in the insights of the above teachings. This selected and described embodiment will provide the best description of the present invention and its practical application principles, thereby enabling those skilled in the art to utilize the present invention in various embodiments and various suitable for other special use considerations. Correcting. Under a generous interpretation based on fair, legal, and fair grant of rights, all amendments and changes should be included in the scope of the invention determined by the scope of patent applications mentioned later.
92118.ptd 第11頁 564337 圖式簡單說明 【圖式簡單說明】 本發明的新穎特徵將於後述之申請專利範圍中提出， 而發明本身與較佳使用模式，以及進一步的目的與優點， 將藉由參考接下來的實施例詳細描述與所附圖式而最佳地 瞭解，其中： 第1圖係為測試中之有蓋裝置於典型習知技藝過程的 剖視圖； 第2圖係為第1圖之近似，惟該裝置為無蓋裝置； 第3至6圖係為本發明過程之圖示；以及 第7圖係為第3至6圖所述過程之流程圖。 【元件符號說明】 10、30 加熱頭 11、31 表面 1 2、3 2 蓋子 1 4、3 4 測試中之裝置 1 6、3 6 印刷電路板 1 8、3 8 電子式加熱單元 2 0、4 2 通道 2 2、4 0 冷卻劑92118.ptd Page 11 564337 Brief description of the drawings [Simplified description of the drawings] The novel features of the present invention will be proposed in the scope of the patent application to be described later. It is best understood by referring to the detailed description of the following embodiments and the accompanying drawings, wherein: FIG. 1 is a cross-sectional view of a covered device under test in a typical conventional technique; FIG. 2 is a view of FIG. 1 Approximately, but the device is a coverless device; Figures 3 to 6 are diagrams of the process of the present invention; and Figure 7 is a flowchart of the process described in Figures 3 to 6. [Description of component symbols] 10, 30 Heating head 11, 31 Surface 1 2, 3 2 Cover 1 4, 3 4 Device under test 1 6, 3 6 Printed circuit board 1 8, 3 8 Electronic heating unit 2 0, 4 2 channels 2 2, 4 0 coolant
92118.ptd 第12頁92118.ptd Page 12
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US96517901A | 2001-09-27 | 2001-09-27 |
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| TW564337B true TW564337B (en) | 2003-12-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW91119080A TW564337B (en) | 2001-09-27 | 2002-08-23 | Constant net heating power technology |
Country Status (3)
| Country | Link |
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| AU (1) | AU2002259063A1 (en) |
| TW (1) | TW564337B (en) |
| WO (1) | WO2003027686A2 (en) |
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| US6794620B1 (en) * | 2001-11-07 | 2004-09-21 | Advanced Micro Devices, Inc. | Feedforward temperature control of device under test |
| DE102005001163B3 (en) | 2005-01-10 | 2006-05-18 | Erich Reitinger | Semiconductor wafers` testing method, involves testing wafer by probes, and reducing heating energy with constant cooling efficiency, under consideration of detected increase of temperature of fluids flowing via tempered chuck device |
| TWI564578B (en) * | 2014-12-05 | 2017-01-01 | 上海兆芯集成電路有限公司 | Test head module and reconditioning method thereof |
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| GB2180959B (en) * | 1985-09-23 | 1989-09-13 | Sharetree Ltd | Apparatus for the burn-in of integrated circuits |
| US6476627B1 (en) * | 1996-10-21 | 2002-11-05 | Delta Design, Inc. | Method and apparatus for temperature control of a device during testing |
| US5911897A (en) * | 1997-01-13 | 1999-06-15 | Micro Control Company | Temperature control for high power burn-in for integrated circuits |
| US6389225B1 (en) * | 1998-07-14 | 2002-05-14 | Delta Design, Inc. | Apparatus, method and system of liquid-based, wide range, fast response temperature control of electronic device |
| US6448992B1 (en) * | 2001-11-07 | 2002-09-10 | Advanced Micro Devices, Inc. | Voltage programmable power dissipater |
-
2002
- 2002-04-29 WO PCT/US2002/013441 patent/WO2003027686A2/en not_active Application Discontinuation
- 2002-04-29 AU AU2002259063A patent/AU2002259063A1/en not_active Abandoned
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| WO2003027686A2 (en) | 2003-04-03 |
| AU2002259063A1 (en) | 2003-04-07 |
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