TW563216B - Wire bonding method and apparatus - Google Patents

Wire bonding method and apparatus Download PDF

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Publication number
TW563216B
TW563216B TW091124643A TW91124643A TW563216B TW 563216 B TW563216 B TW 563216B TW 091124643 A TW091124643 A TW 091124643A TW 91124643 A TW91124643 A TW 91124643A TW 563216 B TW563216 B TW 563216B
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Taiwan
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capillary
camera
position detection
aforementioned
ball
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TW091124643A
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Chinese (zh)
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Shigeru Hayata
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Shinkawa Kk
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
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  • Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Wire Bonding (AREA)

Abstract

The subject of the present invention is to measure tail length, ball diameter and the like using a detection means, which is typically provided in a wire bonding apparatus, without using a dedicated detection means. A light path converting means 22 is provided for introducing an image in the vicinity of the end of a capillary 5 to a camera 11 for position detection, and the image obtained by the position detection camera 11 is processed. Then, one item of the followings is performed: the diameter of the ball 4a, which is formed at a wire 4 extending at the lower end of the capillary 5, is measured; the length of the tail extending at the lower end of the capillary 5 is measured; a ball position from the lower surface of the capillary is measured; a bend of the tail is detected; the capillary 5 is visually inspected; and at least an amplitude or the like at the time when an ultrasonic vibration is applied to the capillary 5 is found.

Description

玖、發明說明 【發明所屬之技術領域】 本發明，係關於打線方法及打線裝置。 【先前技術】 在1C等半導體裝配裝置之製程中有打線步驟。藉由此 製程，如圖12所示，將引線4連接於工件3之半導體晶片 1之銲墊（第1銲點）la與導線架2之接腳（第2銲點）2a。圖 13係表示打線製程之打線方法，圖14係表示打線裝置10 〇 在圖13，首先，如（a)所示，以電炬6之火花放電在從 毛細管5下端延伸之引線4製作球4a。然後，電炬6向箭 頭方向移動。其次如（b)所示，毛細管5移動至第1銲點la 之上方。接著如（c)所示，毛細管5下降，將引線4前端之 球4a銲接於第1銲點ia。然後，如⑷所示，毛細管5上升 。接著如（e)所示，毛細管5下降，將引線4銲接於第2銲 點2a。然後’毛細管5上升至一定之位置後，夾子7關閉 ，毛細管5與夾子7 —起上升，如（g)所示，切斷引線4。 藉此，完成1條引線連接。 在這樣之打線方法，一般，係首先以圖14所示之位置 檢測用攝影機11檢測半導體晶片1上之至少2個定點、及 導線架2上之至少2個定點兩者正規位置之偏差，以運算 部根據該檢測値修正預先所儲存之打線座標。以該位置檢 測用攝影機11來檢測時，會驅動X軸馬達12及Y軸馬達 13使位置檢測用攝影機u之光軸ila位於測定點之正上方 563216 ，。如前述，修正打線座標後，使毛細管5向XY軸方向及 Ζ軸方向移動，並如圖13所說明，將插穿毛細管5之引線 4接合於第1銲點la與第2銲點2a。 在此情形，因位置檢測用攝影機11之光軸11a與毛細 管5之軸心5a係差距離W，故在以位置檢測用攝影機11 檢測定點之偏差並修正打線座標後，以X軸馬達12及Y軸 馬達13使XY台15移動偏差量W，而使毛細管5位於第1 銲點la上方。然後，藉由以X軸馬達12及Y軸馬達13使 XY台15在XY軸方向移動，以及藉由以Z軸馬達14使毛 細管臂16上下動（或搖動）而使毛細管5在Z軸方向移動， 將引線4接合於前述修正過之打線座標。在圖Η，毛細管 臂16係搖動自如地設於打線頭17,位置檢測用攝影機11 係透過攝影機保持臂18固定於打線頭17。又，Xw表示偏 差量W之X軸分量，Yw表示偏差量W之Y軸分量。 圖13之（a)所示的球4a之大小及圖13(g)所示之從毛細 管5下端延伸的引線4之長度（線尾長度）、形狀等，係爲決 定打線之最佳條件時之重要資訊。習知，作爲檢測球徑或 線尾長度、形狀等之方法及裝置，舉例來說有日本之特開 昭60-242627號公報。該裝置，係以檢測機構對從毛細管延 伸之線尾長度、球從側方檢測並測定線尾長度、球徑。該 方法，因直接測定線尾長度、球徑，故能以高精度求得打 線之最佳條件。 【發明內容】 (一）發明所欲解決之技術問題 563216 上述習知技術，因需要用以測定線尾長度、球徑之特 別檢測機構，故有裝置複雜而昂貴之問題。 本發明之課題，在於提供一種不須使用特別的檢測機 構，使用一般打線所用之檢測機構即可測定線尾長度、球 徑等之打線方法及裝置。 (二）解決問題之技術手段 用以解決上述問題之本發明申請專利範圍第1項，係 一種打線方法，其使用於打線裝置，該打線裝置具備有引 線插穿，對工件進行打線之毛細管、及攝影工件之位置檢 測用攝影機；其特徵在於：將前述毛細管下端附近之像導 引至前述位置檢測用攝影機而取得前述像之影像，處理該 影像，來進行以下之至少一項：形成於延伸在毛細管下端 之引線球徑之測定、延伸在毛細管下端之線尾長度之測定 、距離毛細管下面之球位置之測定、線尾彎曲之檢測、毛 細管之外觀檢查、對毛細管施加超音波振動時之振幅。 用以解決上述問題之本發明申請專利範圍第2項，係 一種打線裝置，其具備有引線插穿，對工件進行打線之毛 細管、及攝影工件之位置檢測用攝影機；其特徵在於：設 置將毛細管下端附近之像導引至前述位置檢測用攝影機的 光路轉換機構，將以前述位置檢測用攝影機所取得之前述 像之影像加以處理，來進行以下之至少一項：形成於延伸 在毛細管下端之引線球徑之測定、延伸在毛細管下端之線 尾長度之測定、距離毛細管下面之球位置之測定、線尾彎 曲之檢測、毛細管之外觀檢查、對毛細管施加超音波振動 563216 時之振幅。 用以解決上述問題之本發明申請專利範圍第3項，係 如前述申請專利範圍第1項之打線方法，其中，將以前述 位置檢測用攝影機所取得之影像藉由資料處理機構加以處 理，進行良否判斷後，若係不良時以警報機構警告。 用以解決上述問題之本發明申請專利範圍第4項，係 如前述申請專利範圍第2項之打線裝置，其中，將以前述 位置檢測用攝影機所取得之影像藉由資料處理機構加以處 理，進行良否判斷後，若係不良時以警報機構警告。 用以解決上述問題之本發明申請專利範圍第5項，係 如前述申請專利範圍第1項之打線方法，其中，將以前述 位置檢測用攝影機所取得之影像中球徑、線尾長度、距離 毛細管下面之球位置藉由資料處理機構加以處理，並回饋 至電炬之控制電路或訊號電測轉換器（transducer)之控制電 路或引線拉上機能控制電路。 用以解決上述問題之本發明申請專利範圍第6項，係 如前述申請專利範圍第2項之打線裝置，其中，將以前述 位置檢測用攝影機所取得之影像中球徑、線尾長度、距離 毛細管下面之球位置藉由資料處理機構加以處理，並回饋 至電炬之控制電路或訊號電測轉換器之控制電路或引線拉 上機能控制電路。 用以解決上述問題之本發明申請專利範圍第7項，係 如前述申請專利範圍第2項之打線裝置，其中，前述光路 轉換機構，係具有構成非聚焦系統之透鏡，該非聚焦系統 563216 由前述透鏡與設於前述位置檢測用攝影機之透鏡組合而成 〇 用以解決上述問題之本發明申請專利範圍第8項，係 如前述申請專利範圍第1項之打線方法，其中，爲測定前 述球徑、距離毛細管下面之球位置、及線尾長度，須預先 進行校準，來求得前述位置檢測用攝影機之攝影元件之1 像素係相當於所測定之物體面的多少倍。 用以解決上述問題之本發明申請專利範圍第9項，係 如前述申請專利範圍第2項之打線裝置，其中，爲測定前 述球徑、距離毛細管下面之球位置、及線尾長度，須預先 進行校準，來求得前述位置檢測用攝影機之攝影元件之！ 像素係相當於所測定之物體面的多少倍。 用以解決上述問題之本發明申請專利範圍第1〇項，係 如前述申請專利範圍第8項之打線方法，其中，前述校準 ，係藉由移動毛細管時之移動量、與以前述位置檢測用攝 影機所取得之影像上前述毛細管之移動量，來算出每1像 素之實際長度。 用以解決上述問題之本發明申請專利範圍第U項，係 如前述申請專利範圍第9項之打線裝置，其中，前述校準 ，係藉由移動毛細管時之移動量、與以前述位置檢測用攝 影機所取得之影像上前述毛細管之移動量，來算·出每1像 素之實際長度。 用以解決上述問題之本發明申請專利範圍第12項，係 如前述申請專利範圍第8項之打線方法，其中，前述校準 563216 ，係設置與毛細管同時以前述位置檢測用攝影機取得之基 準構件，藉由以前述位置檢測用攝影機所取得之基準構件 之影像，來算出每1像素之實際長度。 用以解決上述問題之本發明申請專利範圍第13項，係 如前述申請專利範圍第9項之打線方法，其中，前述校準 ，係設置與毛細管同時以前述位置檢測用攝影機取得之基 準構件，藉由以前述位置檢測用攝影機所取得之基準構件 之影像，來算出每1像素之實際長度。 用以解決上述問題之本發明申請專利範圍第14項，係 如前述申請專利範圍第8項之打線方法，其中，前述校準 ，係設置與毛細管同時以前述位置檢測用攝影機取得之基 準構件，藉由移動毛細管時之移動量、與以前述位置檢測 用攝影機所取得之影像上前述毛細管之基準構件的差，來 算出每1像素之實際長度。 用以解決上述問題之本發明申請專利範圍第15項，係 如前述申請專利範圍第9項之打線裝置，其中，前述校準 ，係設置與毛細管同時以前述位置檢測用攝影機取得之基 準構件，藉由移動毛細管時之移動量、與以前述位置檢測 用攝影機所取得之影像上前述毛細管之基準構件的差，來 算出每1像素之實際長度。 【實施方式】 以圖1說明本發明之第1實施例。又，對於與圖12至 圖14相同或相當之構件使用相同符號，並省略其詳細說明 。位置檢測用攝影機11，係具備攝影元件（CCD或CMOS等 563216 )之光電轉換式攝影機，該位置檢測用攝影機11之光學系 統之透鏡20之焦點位置，係在工件水平面3a。在未圖示之 打線台（將圖12至圖14所示之導線架2定位且載置）之附近 配設光路轉換機構支撐板21。在光路轉換機構支撐板21上 固定光路轉換機構22與照明機構30。 在光路轉換機構22之外殻23內設有垂直配設之透鏡 24、與相對於水平方向成45°之角度交叉且面向透鏡24配 設成之反射鏡25。外殻23，係於透鏡24之右方設有窗23a ，於反射鏡25之上方則設有窗23b。反射鏡25之中心，係 配設於透鏡20之焦點位置。從反射鏡25之中心至物體間 距離d，係設定爲大致與位置檢測用攝影機11之光軸11a 及毛細管5之軸心5a間X軸方向之偏差量Xw大致相同。 首先，說明測定球4a(在圖13之（a)之步驟所形成）直 徑之情形。爲要得知球4a徑之絕對値，須知位置檢測用攝 影機11之攝影元件之1像素係相當於合成光學系統之物體 面的多少倍。因此，預先進行校準。該校準有3種方法。 第1校準之方法如以下方式進行。驅動圖14所示之 XY台15，使位置檢測用攝影機11之光軸11a位於反射鏡 25之上方。藉此，毛細管5就位於透鏡24之焦點之上方。 其次，驅動Z軸馬達14，使毛細管5下降，使毛細管之下 端部分位於透鏡24之前方。藉此，以位置檢測用攝影機11 所攝得之影像如圖2之（a)所示。在此，假設透鏡24之倍率 係1倍。然後，將XY台15移動a //m。假設移動後時之 影像爲圖2之（b)。在影像處理中假設毛細管5之移動量爲 11 563216 冷像素，因位置檢測用攝影機11亦與毛細管5 —起移動α // m，故每1像素之實際長度爲α /石之1/2，即α /2石[// m/ 像素]。在實際之校準，爲提高精度，以等節距移動XY台 15並取得許多資料，再以統計之方式求出校準値。 因此，在測定球4a徑（在圖13之（a)之步驟所形成）之情 形，與上述同樣，驅動XY台15，使位置檢測用攝影機11 之光軸11a位於反射鏡25上方。接著驅動Z軸馬達14，使 毛細管5下降，使毛細管之下端部分位於透鏡24之前方。 藉此，以位置檢測用攝影機11所攝得之影像如圖3之（a)所 示。假設球4a徑在所取得之影像上爲B像素，經資料處理 機構處理，球4a徑之實際徑A爲Α=Β · α /2冷[# m]。該球 4 a徑之大小之絕對値爲決定打線之最佳條件時的重要資訊 。又藉由每逢打線就測定球4a徑，能偵知不良球。若係不 良球時，能以警報燈、警報器等警告作業員。又藉由測定 球4a徑之大小，並將該大小回饋至用以形成球4a之電炬6 之控制電路或訊號電測轉換器之控制電路或引線拉上機能 控制電路來控制，能經常形成一定之最佳大小之球4a。 圖3之（b)，係表示測定從毛細管下面至球4a位置的距 離P之情形。通常係從如圖3(b)之狀態拉引線4，使引線4 形成如圖3之（a)之狀態，再進行打線。測定圖3之(b)狀態 之距離P，確認該距離是否爲既定長度，若尙未達既定長 度時，就將此訊息回饋至引線拉上機能控制電路，使引線 爲既定長度後再進行打線’藉此能經常進行穩定且精度良 好之打線。 12 563216 圖3之（cl)及（c2)，係表示從毛細管5之下端延伸的引 線4(以圖13(g)之步驟所形成）之影像。球4a徑，係取決於 從毛細管5之下端延伸的引線4之長度（線尾長度L)。在即 將打線之前進行形成球4a之操作時，藉由測定線尾長度L ，能獲得與測定前述球4a之情形同樣之效果。即，假設在 所取得之影像上線尾長度L爲C像素，線尾長度L則L=C • a/2々[//m]。又，以影像亦可判別引線4之形狀，例如 引線4之前端彎曲等不適用的情形。線尾長度L之測定， 能測定垂直長度L1，順沿線尾之長度L2、L3等。 圖3之（dl)及（d2)，係表示檢查毛細管5時之影像。若 獲知如圖3之（dl)所示毛細管5破損5b，又獲知如圖3之 (d2)所示在毛細管5附著異物5c，則能將須更換毛細管5 之警報，或須淸掃毛細管5之警報，以警報燈、警報器等 通知作業員。 圖3之（e)，係表示對毛細管5施加超音波時之影像。 在施加超音波之前，會拍到有如虛線所示輪廓之毛細管5。 若施加超音波，毛細管5就振動，會拍到有如實線所示輪 廓之毛細管5。因此，藉由測量毛細管5之寬度增加多少， 就能獲知毛細管5之振幅。將該振幅回饋至超音波驅動源 之控制，藉此能經常保持最佳狀態。 其次說明第2校準之方法。圖4係表示於透鏡24之焦 點位置設有基準構件35。在此情形所取得之影像如圖5所 示。基準構件35之寬度係已知，預先調查該寬度係相當於 多少像素。當測定球4a徑時，藉由所測定之球4a徑之像 13 563216 素數則獲知實際之球4a徑。若設置基準構件35，即使不使 用如前述以將毛細管5用χγ台移動之方法進行校準，亦能 得知球徑、線尾長度等之大小之絕對値。 其次說明第3校準之方法。係如圖4設置基準構件35 之情形之其他例。與前述同樣驅動圖14所示之χγ台15而 使位置檢測用攝影機11之光軸na位於反射鏡25上方。 接著驅動Z軸馬達14使毛細管5下降，使毛細管之下端部 分位於透鏡24之前方。藉此，以位置檢測用攝影機u所 攝下之影像就如圖6之（a)所示。移動χγ台15a 。假 設移動後之影像爲圖6之（b)。在影像面，毛細管5與基準 構件35之像素，若在圖6之⑷時係a像素而在圖6之（b)時 爲b像素，則每1像素之實際長度爲^；/〇)一&) [/zm/像素] 。藉此，能得知球徑、線尾長度等之大小之絕對値。 以圖7說明本發明之第2實施例。前述之實施例，係 僅從1個方向觀察球4a、引線4(線尾長度L)、毛細管5等 對象物。本實施例，係能從χγ軸之2方向觀察對象物。在 本實施例之光路轉換機構22之外殼23內，除前述實施例 所示之透鏡24、反射鏡25外，又配設1個半透明反射鏡 26、與2個反射鏡27、28。將半透明反射鏡26配設於透鏡 24之右方側，將反射鏡27配設於半透明反射鏡26之上方 側，將反射鏡28配設於半透明反射鏡26之右方。反射鏡 27之反射面與半透明反射鏡26之反射面係互相平行，均相 對於X軸方向以一45°之角度交叉。反射鏡28之反射面係 相對於X軸方向以45°之角度交叉。以面向反射鏡27、28 14 563216 並夾對象物之方式分別配設照明機構30、31。 在此，當測定球4a徑時，與前述實施例相同，將圖1 所示之位置檢測用攝影機11移動至反射鏡25之上方，下 降毛細管5而移動至反射鏡27、28之前方。，然後，使照 明機構31熄燈，並使照明機構30開燈，在此狀態，毛細 管5及球4a之X軸方向的像，係來自照明機構30之光所 產生的影，其在反射鏡27、半透明反射鏡26反射，通過透 鏡24在反射鏡25反射，經過圖1之透鏡20，並由位置檢 測用攝影機11獲得圖3之（a)所示之X軸方向之影像。藉此 ，以與前述實施例相同之方法測定X軸方向之球4a徑。使 照明機構30熄燈，使照明機構31開燈之狀態，毛細管5 及球4a之Y軸方向的像，係來自照明機構31之光所產生 的影，其在反射鏡28反射，通過半透明反射鏡26、透鏡 24在反射鏡25反射，經過圖1之透鏡20，並以位置檢測 用攝影機11獲得圖3之（a)所示之Y軸方向之影像。藉此， 以與前述實施例相同之方法測定Y軸方向之球4a徑。 同樣地，亦能檢查：X軸方向及Y軸方向如圖3之(b) 所示從毛細管5之下面至球4a之距離P、圖3之（cl)、（c2) 所示之線尾長度LI、L2、L3與引線之彎曲狀態、圖3之 (dl)、（d2)所示之毛細管5之破損5b與異物5c之附著等。 以圖8說明本發明之第3實施例。在本實施例之光路 轉換機構22之外殻23內僅設置反射鏡25。當將毛細管5 位於反射鏡25之前方時，以未圖示之驅動機構將透鏡20 上下動，使透鏡20之焦點聚集於毛細管5。即使構成如此 15 563216 ，亦能獲得與前述各實施例同樣之效果。又，亦可不將透 鏡20及位置檢測用攝影機11全體上下動，而僅將透鏡20 在透鏡筒之內部移動。雖圖表示1個透鏡20，但通常係以 複數之透鏡所構成，亦能藉由移動其中之特定之透鏡，而 不必移動透鏡筒來進行焦點調整。 又，在前述各實施例，亦可使用稜鏡代替反射鏡25、 27 、 28 。 以圖9說明本發明之第4實施例。在光路轉換機構40 之外殻41內設有：反射鏡42，配設於透鏡20之工件水平 面20a並與水平方向以45°之角度交叉；反射鏡43，配設 於該反射鏡42之上方側並與水平方向以一 45°之角度交叉 ;透鏡44，配設於該反射鏡43之左側；反射鏡45，配設 於該透鏡44之左側與水平方向以45°之角度交叉。外殻41 內，係於反射鏡42之右側設有窗41a，於反射鏡45之上方 側設有窗41b。又，面對反射鏡42配設射出平行之照明光 的照明機構50。 因此，與前述各實施例同樣，驅動圖14所示之XY台 15而使位置檢測用攝影機11移動至反射鏡45之上方，使 毛細管5下降而移動至反射鏡42之前方。毛細管5之下端 部分的像，在反射鏡42、43反射，通過透鏡44在反射鏡 45反射，經過透鏡20，並由位置檢測用攝影機11拍到圖3 所示之影像。即，能獲得球4a (圖3之（a)、（b)所示）、引線 4(圖3之（cl)、（c2)所示）、毛細管5(圖3之（dl)、（d2)所示） 三者的影像。藉此，與前述各實施例同樣，能測定球4a徑 16 563216 之大小（圖3(a)所示）、測定從毛細管5下面至球4a之距離 P(圖3(b)所示）、測定線尾長度LI、L2、L3與檢測引線之彎 曲狀態（圖3(cl)、（c2)所示）、檢測毛細管5之破損5b與異 物5c之附著（圖3之（dl)、（d2)所示）等。 本實施例之特徵在於：以透鏡20與透鏡44之組合來 構成非聚焦系統。設透鏡20之合成焦點距離爲Π，透鏡44 之合成焦點距離爲f2，則可使透鏡20之前側主平面與透鏡 44之後側主平面之距離爲fl+ f2。又因倍率能以fl/f2表示 ，故可選擇f2値使能獲得適切之倍率。這樣因係非聚焦系 統，無論毛細管5之水平方向之位置如何，均能獲得良好 之影像。 以圖10說明本發明之第5實施例。本實施例，係使圖 9之第4實施例與圖7之第2實施例同樣地，能從XY軸之 2個方向觀察對象物（毛細管5之下端附近）。本實施例，係 在圖9之第4實施例之光路轉換機構40設置半透明反射鏡 46、反射鏡47、48及照明機構51。半透明反射鏡46配設 於前述實施例之反射鏡42之右側，面對該半透明反射鏡46 配設照明機構50。將反射鏡47配置於半透明反射鏡46之 圖中下側，將反射鏡48配置於反射鏡47之右側，面對反 射鏡48配設照明機構51。反射鏡47之反射面與半透明反 射鏡46之反射面互相平行，均與X軸方向以45°之角度交 叉。反射鏡48之反射面與X軸方向以一45°之角度交叉。 在此，與圖7之實施例相同，若使照明機構51熄燈， 使照明機構50開燈之狀態，毛細管5及球4a之X軸方向 17 563216 的像，係來自照明機構50之光所產生的影，通過半透明反 射鏡46在反射鏡42、43反射，通過透鏡44在反射鏡45反 射，經過圖9之透鏡20，並由位置檢測用攝影機11攝得X 軸方向之圖3所示之影像。若使照明機構50熄燈，使照明 機構51開燈之狀態，毛細管5及球4a之Y軸方向的像， 係來自照明機構51之光所產生的影，經過反射鏡48、47 在半透明反射鏡46之反射面反射，接著在反射鏡42、43 反射，通過透鏡44在反射鏡45反射，經過透鏡20並由位 置檢測用攝影機11攝得Y軸方向之圖3所示之影像。 在圖7所示之光路轉換機構22之情形，需要使照明機 構30之從對象物（毛細管5之下端附近）至透鏡24之光路、 與照明機構31之從對象物（毛細管5之下端附近）至透鏡24 之光路的長度爲相等。若不相等，兩方之焦點就不一致。 這一點，因本實施例，係形成爲非聚焦系統，故如圖10所 示，不需要使照明機構50之從對象物（毛細管5之下端附 近）至透鏡44之光路、與照明機構51之從對象物（毛細管5 之下端附近）至透鏡44之光路的路徑爲相等。 以圖11說明本發明之第6實施例。本實施例，係不要 前述第5實施例之反射鏡42，不要反射鏡43而使用45。偏 角稜鏡55,使對象物（毛細管5之下端附近）看起來呈傾斜 。即，因本實施例係非聚焦系統，即使對象物看起來呈傾 斜，對象物輪廓之影像也不會變差。又因能從斜上方觀察 ，能將光路轉換機構40搭載於圖14所示之XY台15。藉 此，不需要將光路轉換機構40設置於工件3附近。 18 563216 又，在圖9、圖10、圖11之前述各實施例，亦可不要 反射鏡42、43、45、47、48而使用稜鏡。又在圖11之實施 例，亦可不要偏角稜鏡55而使用反射鏡，又，角度並不限 定於45° 。 【發明之效果】 本發明，因將毛細管下端附近之像導引至位置檢測用 攝影機11來取得前述像之影像，處理該影像，並進行以下 之至少一項：形成於延伸在毛細管下端之引線球徑之測定 、延伸在毛細管下端線尾長度之測定、距離毛細管下面之 球位置之測定、線尾彎曲之檢測、毛細管之外觀檢查、對 毛細管施加超音波振動時之振幅，故不需要用以測定線尾 長度、球徑之特別的檢測機構，使裝置簡化，亦不會昂貴 。又藉由將前述測定値作回饋，能經常進行最佳之打線。 【圖式簡單說明】 (一）圖式部分 圖1，係表示本發明之打線裝置之第1實施例的局部截 面主要部前視圖。 圖2，係表示如圖1不設置基準構件而進行校準時之影 像面的說明圖。 圖3，⑷及⑻係表示球的影像，（cl)及（〇2)係表示從毛 細管延伸之引線的影像，（dl)及（d2)係表示毛細管之破損的 影像，（e)係表示施加超音波時之毛細管的影像。 圖4，係表示在圖1之打線裝置之第1實施例設置基準 構件之情形的局部截面主要部前視圖。 19 563216 圖5，係表示如圖4設置基準構件來進行校準時之一例 之影像的說明圖。 圖6，係表示如圖4設置基準構件來進行校準時之其他 例之影像的說明圖。 圖7，係表示本發明之打線裝置之第2實施例的俯視說 圖8，係表示本發明之打線裝置之第3實施例的局部截 面主要部前視圖。 圖9，係表示本發明之打線裝置之第4實施例的局部截 面主要部前視圖。 圖10，係表示本發明之打線裝置之第5實施例的局部 截面主要部前視圖。 圖11，係表示本發明之打線裝置之第6實施例的局部 截面主要部前視圖。 圖12，係打線完成之工件的俯視圖。 圖13，係表示一般之打線方法的步驟圖。 圖14，打線裝置的立體圖。 (二）元件代表符號 4 引線 4a 球 5 毛細管 5b 破損 11 位置檢測用攝影機 20 透鏡 20 563216 22 光路轉換機構 24 透鏡 25、26、27、28 反射鏡 30、31照明機構 35 基準構件 40 光路轉換機構 44 透鏡 42、43、45、47、48 反射鏡 46 半透明反射鏡 50、51照明機構 55 45° 偏角稜鏡说明. Description of the invention [Technical field to which the invention belongs] The present invention relates to a wire bonding method and a wire bonding device. [Prior Art] There are wire bonding steps in the manufacturing process of semiconductor assembly devices such as 1C. Through this process, as shown in FIG. 12, the lead 4 is connected to the pad (first solder joint) la of the semiconductor wafer 1 of the workpiece 3 and the pin (second solder joint) 2a of the lead frame 2. FIG. 13 shows a wire bonding method of the wire bonding process, and FIG. 14 shows a wire bonding device 10. In FIG. 13, first, as shown in (a), a ball 4 a is produced by the spark discharge of the torch 6 on the lead 4 extending from the lower end of the capillary 5. . Then, the torch 6 moves in the direction of the arrow. Next, as shown in (b), the capillary 5 moves above the first welding point la. Next, as shown in (c), the capillary 5 is lowered, and the ball 4a at the tip of the lead 4 is welded to the first pad ia. Then, as shown by ⑷, the capillary 5 rises. Next, as shown in (e), the capillary 5 is lowered, and the lead 4 is soldered to the second pad 2a. Then, after the 'capillary tube 5 rises to a certain position, the clip 7 is closed, and the capillary tube 5 and the clip 7 rise together. As shown in (g), the lead wire 4 is cut. Thereby, one lead connection is completed. In such a wiring method, in general, first, the position detection camera 11 shown in FIG. 14 is used to detect the deviation between the regular positions of at least two fixed points on the semiconductor wafer 1 and at least two fixed points on the lead frame 2. The arithmetic unit corrects the wired coordinates stored in advance based on the detection frame. When the position detection camera 11 is used for detection, the X-axis motor 12 and the Y-axis motor 13 are driven so that the optical axis ila of the position detection camera u is positioned directly above the measurement point 563216. As described above, after correcting the wire-coordinate, the capillary 5 is moved in the XY-axis direction and the Z-axis direction, and the lead 4 inserted through the capillary 5 is bonded to the first solder joint 1a and the second solder joint 2a as described in FIG. In this case, the optical axis 11a of the position detection camera 11 and the axial center 5a of the capillary 5 are different from each other by the distance W. Therefore, after the position detection camera 11 detects the deviation of the fixed point and corrects the wire-coordinate, the X-axis motor 12 and The Y-axis motor 13 moves the XY stage 15 by the amount of deviation W, so that the capillary 5 is positioned above the first welding point la. Then, the X-axis motor 12 and the Y-axis motor 13 are used to move the XY stage 15 in the XY-axis direction, and the Z-axis motor 14 is used to move the capillary arm 16 up and down (or shaken), so that the capillary 5 is in the Z-axis direction. Move to join the lead wire 4 to the wire coordinates that have been corrected as described above. In the figure, the capillary arm 16 is swingably provided on the threading head 17, and the position detection camera 11 is fixed to the threading head 17 through the camera holding arm 18. Xw represents the X-axis component of the deviation amount W, and Yw represents the Y-axis component of the deviation amount W. The size of the ball 4a shown in (a) of FIG. 13 and the length (tail length) and shape of the lead wire 4 extending from the lower end of the capillary 5 shown in FIG. 13 (g) are when determining the optimal conditions for wire bonding. Important information. Conventionally, as a method and a device for detecting a ball diameter, a line tail length, a shape, and the like, there is, for example, Japanese Unexamined Patent Publication No. 60-242627. This device uses a detection mechanism to detect the length of the tail and the diameter of the tail extending from the capillary and the ball from the side. In this method, the length of the wire tail and the diameter of the ball are directly measured, so that the optimal conditions for the wire can be obtained with high accuracy. [Summary of the invention] (1) Technical problems to be solved by the invention 563216 The above-mentioned conventional technology requires a special detection mechanism for measuring the length of the wire tail and the ball diameter, so it has the problem of complicated and expensive equipment. The object of the present invention is to provide a method and a device for measuring a wire tail, a ball diameter, and the like without using a special detection mechanism and using a detection mechanism for a general wire. (2) Technical means for solving the problem The first scope of the present invention patent application for solving the above-mentioned problems is a wire bonding method, which is used in a wire bonding device, the wire bonding device is provided with a capillary, a capillary, And a camera for detecting the position of a photographic workpiece; characterized in that the image near the lower end of the capillary tube is guided to the camera for position detection to obtain the image of the aforementioned image, and the image is processed to perform at least one of the following: formed on the extension Measurement of the diameter of the lead ball at the lower end of the capillary, measurement of the length of the line tail extending at the lower end of the capillary, measurement of the position of the ball from the bottom of the capillary, detection of the end of the wire, inspection of the appearance of the capillary, and amplitude of the ultrasonic vibration applied to the capillary . Item 2 of the scope of patent application of the present invention for solving the above-mentioned problems is a wire bonding device, which includes a capillary tube with a lead inserted to wire the workpiece, and a camera for detecting the position of a photographed workpiece; An image near the lower end is guided to the optical path conversion mechanism of the camera for position detection, and the image of the image obtained by the camera for position detection is processed to perform at least one of the following: a lead formed on the lower end of the capillary Measurement of the ball diameter, measurement of the length of the line tail extending at the lower end of the capillary, measurement of the position of the ball from the bottom of the capillary, detection of the end of the line, inspection of the appearance of the capillary, and amplitude of ultrasonic vibration applied to the capillary 563216. The third item of the scope of patent application for the present invention to solve the above-mentioned problems is the wiring method as in the first item of scope of the aforementioned patent application, in which the image obtained by the aforementioned position detection camera is processed by a data processing mechanism to perform After a good or bad judgment, if the system is bad, a warning mechanism will warn. The fourth item of the scope of patent application of the present invention for solving the above-mentioned problems is the wire bonding device as the second item of scope of the aforementioned patent application, in which the image obtained by the aforementioned position detection camera is processed by a data processing mechanism and processed. After a good or bad judgment, if the system is bad, a warning mechanism will warn. The fifth item of the scope of patent application for the present invention to solve the above problems is the method of wiring as in the first item of the scope of patent application mentioned above, in which the ball diameter, line tail length and distance in the image obtained by the aforementioned position detection camera are used. The position of the ball under the capillary is processed by the data processing mechanism and fed back to the control circuit of the torch or the control circuit of the signal transducer or the function control circuit of the lead. Item 6 of the scope of patent application of the present invention for solving the above-mentioned problems is a wire bonding device as described in item 2 of the aforementioned scope of patent application, in which the ball diameter, line tail length, and distance in the image obtained by the aforementioned position detection camera are used. The position of the ball under the capillary is processed by the data processing mechanism, and is fed back to the control circuit of the torch or the control circuit of the signal electrical measuring converter or the function control circuit. Item 7 of the scope of patent application of the present invention for solving the above problems is a wire bonding device as described in item 2 of the aforementioned patent scope, wherein the aforementioned optical path conversion mechanism has a lens constituting a non-focusing system, and the non-focusing system 563216 is provided by the aforementioned The lens is combined with the lens provided in the aforementioned position detection camera. The eighth item of the patent application scope of the present invention to solve the above-mentioned problems is the wire method as described in the first patent scope of the aforementioned application. The distance between the ball below the capillary and the length of the line tail must be calibrated in advance to determine how many times one pixel of the imaging element of the aforementioned position detection camera corresponds to the measured object surface. Item 9 of the scope of patent application of the present invention for solving the above-mentioned problems is a wire bonding device as described in item 2 of the scope of the aforementioned patent application. In order to determine the aforementioned ball diameter, the position of the ball from below the capillary, and the length of the wire tail, Perform calibration to find the imaging element of the camera for position detection! The number of pixels corresponds to the measured object surface. Item 10 of the scope of patent application of the present invention for solving the above problems is a wire bonding method as described in item 8 of the aforementioned scope of patent application, wherein the aforementioned calibration is performed by using the amount of movement when the capillary is moved and the position detection The amount of movement of the capillary on the image obtained by the camera is used to calculate the actual length per pixel. Item U of the scope of patent application of the present invention for solving the above problems is a wire bonding device as described in item 9 of the aforementioned scope of patent application, wherein the aforementioned calibration is based on the amount of movement when the capillary is moved and the camera for position detection The amount of movement of the capillary on the acquired image is used to calculate the actual length per pixel. Item 12 of the scope of patent application of the present invention for solving the above-mentioned problems is the wire bonding method as described in item 8 of the aforementioned scope of patent application, wherein the aforementioned calibration 563216 is provided with a reference member obtained simultaneously with a capillary tube with the aforementioned position detection camera, The actual length of each pixel is calculated from the image of the reference member obtained by the camera for position detection. Item 13 of the scope of patent application of the present invention for solving the above-mentioned problems is a method of wiring according to item 9 of the aforementioned scope of patent application, wherein the calibration is to set a reference member obtained by the camera for position detection at the same time as the capillary. The actual length of each pixel is calculated from the image of the reference member obtained by the camera for position detection. Item 14 of the scope of patent application of the present invention for solving the above-mentioned problems is the wire bonding method as described in item 8 of the aforementioned scope of patent application, wherein the calibration is to set the reference member obtained by the camera for position detection at the same time as the capillary tube. The actual length per pixel is calculated from the amount of movement when the capillary is moved and the difference between the reference member of the capillary on the image obtained by the camera for position detection. Item 15 of the scope of patent application for the present invention to solve the above-mentioned problems is a wire bonding device as described in item 9 of the aforementioned scope of patent application, wherein the calibration is to set a reference member obtained by the camera for position detection at the same time as the capillary. The actual length per pixel is calculated from the amount of movement when the capillary is moved and the difference between the reference member of the capillary on the image obtained by the camera for position detection. [Embodiment] A first embodiment of the present invention will be described with reference to Fig. 1. In addition, the same reference numerals are used for components that are the same as or equivalent to those in FIGS. 12 to 14, and detailed descriptions thereof are omitted. The position detection camera 11 is a photoelectric conversion camera provided with a photographing element (CCD, CMOS, etc. 563216). The focal position of the lens 20 of the optical system of the position detection camera 11 is on the workpiece horizontal plane 3a. An optical path conversion mechanism support plate 21 is provided near a wire drawing table (the lead frame 2 shown in FIGS. 12 to 14 is positioned and placed) (not shown). The optical path conversion mechanism 22 and the lighting mechanism 30 are fixed to the optical path conversion mechanism support plate 21. Inside the housing 23 of the optical path conversion mechanism 22, a lens 24 arranged vertically, and a reflection mirror 25 arranged to intersect at an angle of 45 ° with respect to the horizontal direction and face the lens 24 are provided. The casing 23 is provided with a window 23a on the right side of the lens 24, and a window 23b is provided above the reflector 25. The center of the reflecting mirror 25 is arranged at the focal position of the lens 20. The distance d from the center of the mirror 25 to the object is set to be substantially the same as the amount of deviation Xw in the X-axis direction between the optical axis 11a of the position detection camera 11 and the axial center 5a of the capillary 5. First, the case where the diameter of the measuring ball 4a (formed in the step (a) of Fig. 13) is described will be described. In order to know the absolute size of the diameter of the ball 4a, it is necessary to know how many times one pixel of the imaging element of the position detection camera 11 corresponds to the object surface of the synthetic optical system. Therefore, calibration is performed in advance. There are three methods for this calibration. The first calibration method is performed as follows. The XY stage 15 shown in FIG. 14 is driven so that the optical axis 11a of the position detecting camera 11 is positioned above the reflecting mirror 25. As a result, the capillary 5 is positioned above the focal point of the lens 24. Next, the Z-axis motor 14 is driven to lower the capillary 5 so that the lower end portion of the capillary is positioned in front of the lens 24. As a result, the image captured by the position detection camera 11 is shown in FIG. 2 (a). Here, it is assumed that the magnification of the lens 24 is 1 time. Then, the XY stage 15 is moved a // m. Assume that the image after moving is (b) in Figure 2. In the image processing, it is assumed that the movement amount of the capillary 5 is 11 563216 cold pixels. Since the position detection camera 11 also moves α // m together with the capillary 5, the actual length of each pixel is 1/2 of the stone per stone. That is, α / 2 stone [// m / pixel]. In the actual calibration, in order to improve the accuracy, the XY stage 15 is moved at an equal pitch and a lot of data is obtained, and then the calibration frame is calculated in a statistical manner. Therefore, in the case of measuring the diameter of the ball 4a (formed in step (a) of FIG. 13), the XY stage 15 is driven so that the optical axis 11a of the position detecting camera 11 is positioned above the reflecting mirror 25 in the same manner as described above. Next, the Z-axis motor 14 is driven to lower the capillary 5 so that the lower end portion of the capillary is positioned in front of the lens 24. As a result, the image captured by the position detection camera 11 is shown in Fig. 3 (a). Assume that the diameter of the ball 4a is B pixels on the obtained image, and after processing by the data processing mechanism, the actual diameter A of the ball 4a diameter is A = B · α / 2cold [# m]. The absolute size of the ball's 4a diameter is important information when determining the best conditions for hitting. By measuring the 4a diameter of the ball every time a line is hit, bad balls can be detected. In the case of a bad ball, the operator can be warned with warning lights, sirens, etc. By measuring the size of the diameter of the ball 4a, and feeding it back to the control circuit of the torch 6 forming the ball 4a or the control circuit of the signal electrical measuring converter or the function control circuit of the lead pull, it can often be formed A certain best size ball 4a. Fig. 3 (b) shows the measurement of the distance P from below the capillary to the position of the ball 4a. Generally, the lead wire 4 is pulled from the state shown in FIG. 3 (b), so that the lead wire 4 is formed into the state shown in FIG. 3 (a), and then the wire is wired. Measure the distance P in the state of (b) in Fig. 3, and confirm whether the distance is a predetermined length. If it does not reach the predetermined length, return this message to the lead pull-up function control circuit to make the lead a predetermined length before wiring. 'As a result, stable and accurate wire bonding can often be performed. 12 563216 (c) and (c2) in Fig. 3 are images of the lead wire 4 (formed by the step in Fig. 13 (g)) extending from the lower end of the capillary tube 5. The diameter of the ball 4a depends on the length of the lead wire 4 (tail length L) extending from the lower end of the capillary 5. When the operation of forming the ball 4a is performed immediately before the line is hit, by measuring the line tail length L, the same effect as that in the case of measuring the ball 4a can be obtained. That is, it is assumed that the line tail length L on the obtained image is C pixels, and the line tail length L is L = C • a / 2々 [// m]. In addition, the shape of the lead 4 can also be discriminated from an image, for example, the front end of the lead 4 is not applicable, such as being bent. The measurement of the line tail length L can measure the vertical length L1, the lengths L2, L3, etc. along the line tail. (Dl) and (d2) of FIG. 3 show images when the capillary tube 5 is inspected. If it is known that the capillary 5 is broken 5b as shown in (dl) of FIG. 3, and it is learned that foreign matter 5c is attached to the capillary 5 as shown in (d2) of FIG. 3, the alarm that the capillary 5 must be replaced or the capillary 5 must be swept To alert the operator to alarm lights, sirens, etc. (E) of FIG. 3 shows an image when an ultrasonic wave is applied to the capillary 5. Before the ultrasonic wave is applied, a capillary 5 having a contour shown by a dotted line is photographed. When an ultrasonic wave is applied, the capillary tube 5 vibrates, and the capillary tube 5 having an outline as shown by the solid line is photographed. Therefore, by measuring how much the width of the capillary 5 increases, the amplitude of the capillary 5 can be known. This amplitude is fed back to the control of the ultrasonic drive source, so that the optimum state can always be maintained. Next, the second calibration method will be described. FIG. 4 shows that a reference member 35 is provided at the focal point position of the lens 24. As shown in FIG. The images obtained in this case are shown in Figure 5. The width of the reference member 35 is known, and it is checked in advance how many pixels the width corresponds to. When the diameter of the ball 4a is measured, the actual ball 4a diameter is obtained from the image of the measured ball 4a diameter 13 563216 prime number. If the reference member 35 is provided, the absolute value of the size of the ball diameter, the line tail length, and the like can be obtained even if the calibration is not performed by moving the capillary 5 with the χγ stage as described above. Next, the third calibration method will be described. This is another example of the case where the reference member 35 is provided as shown in FIG. 4. The χγ stage 15 shown in Fig. 14 is driven in the same manner as described above so that the optical axis na of the position detecting camera 11 is positioned above the reflecting mirror 25. Next, the Z-axis motor 14 is driven to lower the capillary 5 so that the lower end portion of the capillary is positioned in front of the lens 24. Thereby, the image captured by the position detecting camera u is as shown in FIG. 6 (a). Move the χγ stage 15a. It is assumed that the image after moving is (b) in FIG. 6. On the image plane, if the pixels of the capillary 5 and the reference member 35 are a pixel at the time of FIG. 6 and b pixels at the time of (b) in FIG. 6, the actual length of each pixel is ^; &) [/ zm / pixel]. By this, it is possible to know the absolute size of the ball diameter, line tail length, and the like. A second embodiment of the present invention will be described with reference to Fig. 7. In the foregoing embodiment, objects such as the ball 4a, the lead 4 (tail length L), and the capillary 5 are viewed from only one direction. In this embodiment, the object can be viewed from two directions of the χγ axis. In the housing 23 of the optical path conversion mechanism 22 of this embodiment, in addition to the lens 24 and the reflection mirror 25 shown in the foregoing embodiment, a translucent reflection mirror 26 and two reflection mirrors 27 and 28 are provided. A semi-transparent mirror 26 is arranged on the right side of the lens 24, a mirror 27 is arranged on the upper side of the semi-transparent mirror 26, and a mirror 28 is arranged on the right side of the semi-transparent mirror 26. The reflecting surface of the reflecting mirror 27 and the reflecting surface of the translucent reflecting mirror 26 are parallel to each other and both intersect at an angle of 45 with respect to the X-axis direction. The reflecting surface of the reflecting mirror 28 intersects at an angle of 45 ° with respect to the X-axis direction. Illumination mechanisms 30 and 31 are respectively arranged so as to face the mirrors 27 and 28 14 563216 and sandwich the objects. Here, when measuring the diameter of the ball 4a, the position detection camera 11 shown in Fig. 1 is moved above the reflecting mirror 25, and the capillary 5 is lowered to move to the front of the reflecting mirrors 27, 28, as in the previous embodiment. Then, the lighting mechanism 31 is turned off, and the lighting mechanism 30 is turned on. In this state, the image in the X-axis direction of the capillary 5 and the ball 4a is a shadow generated by the light from the lighting mechanism 30, and it is reflected in the mirror 27 The semi-transparent mirror 26 reflects and reflects on the mirror 25 through the lens 24, passes through the lens 20 in FIG. 1, and obtains an image in the X-axis direction shown in FIG. 3 (a) by the position detecting camera 11. Thereby, the diameter of the ball 4a in the X-axis direction was measured in the same manner as in the previous embodiment. When the lighting mechanism 30 is turned off and the lighting mechanism 31 is turned on, the image in the Y-axis direction of the capillary 5 and the ball 4a is a shadow generated by the light from the lighting mechanism 31, which is reflected by the reflector 28 and is reflected by the translucent The mirror 26 and the lens 24 are reflected by the reflecting mirror 25, pass through the lens 20 in FIG. 1, and obtain the image in the Y-axis direction shown in FIG. 3 (a) by the camera 11 for position detection. With this, the diameter of the ball 4a in the Y-axis direction was measured in the same manner as in the previous embodiment. Similarly, it is also possible to check that the X-axis direction and Y-axis direction are as shown in FIG. 3 (b), the distance P from the underside of the capillary 5 to the ball 4a, and the line tails shown in (cl) and (c2) in FIG. 3 The lengths L1, L2, L3 and the bent state of the leads, the broken 5b of the capillary 5 shown in (d1) and (d2) of FIG. 3, and the adhesion of foreign matter 5c, and the like. A third embodiment of the present invention will be described with reference to Fig. 8. Only the reflector 25 is provided in the housing 23 of the optical path conversion mechanism 22 of this embodiment. When the capillary tube 5 is positioned in front of the reflecting mirror 25, the lens 20 is moved up and down by a driving mechanism (not shown), so that the focus of the lens 20 is collected on the capillary tube 5. Even with such a configuration, the same effects as those of the foregoing embodiments can be obtained. Further, instead of moving the lens 20 and the position detection camera 11 up and down, the lens 20 may be moved only inside the lens barrel. Although the figure shows one lens 20, it is usually composed of a plurality of lenses, and it is also possible to perform focus adjustment by moving a specific lens among them without moving the lens barrel. In each of the foregoing embodiments, chirp may be used instead of the mirrors 25, 27, and 28. A fourth embodiment of the present invention will be described with reference to Fig. 9. Inside the housing 41 of the optical path conversion mechanism 40 is provided: a reflecting mirror 42 arranged on the workpiece horizontal plane 20a of the lens 20 and crossing at an angle of 45 ° in the horizontal direction; and a reflecting mirror 43 arranged above the reflecting mirror 42 The lens 44 is arranged on the left side of the mirror 43 at an angle of 45 ° with the horizontal direction; the mirror 45 is arranged at the left side of the lens 44 at a 45 ° angle with the horizontal direction. Inside the casing 41, a window 41a is provided on the right side of the reflecting mirror 42, and a window 41b is provided on the upper side of the reflecting mirror 45. The facing mirror 42 is provided with an illumination mechanism 50 that emits parallel illumination light. Therefore, as in the previous embodiments, the XY stage 15 shown in Fig. 14 is driven to move the position detecting camera 11 above the reflecting mirror 45, and the capillary 5 is lowered to move in front of the reflecting mirror 42. The image of the lower end portion of the capillary tube 5 is reflected by the reflecting mirrors 42 and 43 and is reflected by the lens 44 by the reflecting mirror 45. After passing through the lens 20, the position detection camera 11 captures the image shown in FIG. That is, a ball 4a (shown in (a) and (b) of FIG. 3), a lead wire 4 (shown in (cl) and (c2) of FIG. 3), and a capillary 5 (shown in (dl), (d2 of FIG. 3)) (Shown)) three images. In this way, as in the previous examples, the size of the ball 4a with a diameter of 16 563216 (shown in FIG. 3 (a)), the distance P from the bottom of the capillary 5 to the ball 4a (shown in FIG. 3 (b)), Measure the length of the end of the wire LI, L2, L3 and the bending state of the detection lead (shown in Figure 3 (cl), (c2)), the adhesion of the broken 5b of the detection capillary 5 and the foreign matter 5c ((dl), (d2 )) Etc. This embodiment is characterized in that a non-focusing system is constituted by a combination of a lens 20 and a lens 44. Assuming that the combined focal distance of the lens 20 is Π and the combined focal distance of the lens 44 is f2, the distance between the principal plane on the front side of the lens 20 and the principal plane on the rear side of the lens 44 can be fl + f2. And because the magnification can be expressed as fl / f2, you can choose f2 値 to get the appropriate magnification. In this way, because of the non-focusing system, a good image can be obtained regardless of the position of the capillary 5 in the horizontal direction. A fifth embodiment of the present invention will be described with reference to Fig. 10. This embodiment is similar to the fourth embodiment of FIG. 9 in that the object (near the lower end of the capillary 5) can be viewed from two directions of the XY axis in the same manner as the second embodiment of FIG. This embodiment is provided with a semi-transparent mirror 46, reflecting mirrors 47 and 48, and an illumination mechanism 51 in the optical path conversion mechanism 40 of the fourth embodiment in FIG. A semi-transparent mirror 46 is disposed on the right side of the mirror 42 in the foregoing embodiment, and an illumination mechanism 50 is disposed facing the semi-transparent mirror 46. The reflecting mirror 47 is arranged on the lower side in the figure of the translucent reflecting mirror 46, the reflecting mirror 48 is arranged on the right side of the reflecting mirror 47, and an illumination mechanism 51 is arranged facing the reflecting mirror 48. The reflecting surface of the reflecting mirror 47 and the reflecting surface of the translucent reflecting mirror 46 are parallel to each other and both cross the X-axis direction at an angle of 45 °. The reflecting surface of the reflecting mirror 48 intersects the X-axis direction at an angle of 45 °. Here, as in the embodiment of FIG. 7, if the lighting mechanism 51 is turned off and the lighting mechanism 50 is turned on, the images of the capillary 5 and the ball 4 a in the X-axis direction 17 563216 are generated by the light from the lighting mechanism 50. The reflected image is reflected by the semi-transparent mirror 46 on the mirrors 42 and 43, and reflected by the lens 44 on the mirror 45, passes through the lens 20 in FIG. 9, and is captured by the position detection camera 11 in the X-axis direction as shown in FIG. 3. Image. When the lighting mechanism 50 is turned off and the lighting mechanism 51 is turned on, the image in the Y-axis direction of the capillary 5 and the ball 4a is a shadow generated by the light from the lighting mechanism 51, and is reflected by the mirrors 48 and 47 in a translucent manner. The reflecting surface of the mirror 46 reflects, and then reflects on the reflecting mirrors 42 and 43, reflects on the reflecting mirror 45 through the lens 44, passes through the lens 20, and captures the image shown in FIG. 3 in the Y-axis direction by the position detection camera 11. In the case of the optical path conversion mechanism 22 shown in FIG. 7, it is necessary to make the illumination mechanism 30 from the object (near the lower end of the capillary 5) to the optical path of the lens 24 and the illumination object 31 from the object (near the lower end of the capillary 5). The length of the optical path to the lens 24 is equal. If they are not equal, the focus of the two parties will be different. In this regard, since this embodiment is formed as a non-focusing system, as shown in FIG. 10, it is not necessary to make the illumination mechanism 50 from the object (near the lower end of the capillary 5) to the optical path of the lens 44 and the illumination mechanism 51. The path from the object (near the lower end of the capillary 5) to the light path of the lens 44 is equal. A sixth embodiment of the present invention will be described with reference to Fig. 11. In this embodiment, the mirror 42 of the fifth embodiment is not used, and 45 is used instead of the mirror 43. The deflection angle 稜鏡 55 makes the object (near the lower end of the capillary 5) appear inclined. That is, since this embodiment is a non-focusing system, even if the object looks inclined, the image of the outline of the object will not deteriorate. In addition, the optical path conversion mechanism 40 can be mounted on the XY stage 15 shown in FIG. 14 because it can be viewed from diagonally above. Thereby, it is not necessary to provide the optical path conversion mechanism 40 near the workpiece 3. 18 563216 In the foregoing embodiments of Figs. 9, 10, and 11, the mirrors 42, 43, 45, 47, and 48 may be used instead of the mirrors. Also in the embodiment of Fig. 11, it is also possible to use a reflecting mirror without deflection angle 稜鏡 55, and the angle is not limited to 45 °. [Effects of the Invention] In the present invention, the image near the lower end of the capillary is guided to the position detection camera 11 to obtain an image of the aforementioned image, the image is processed, and at least one of the following is performed: a lead formed on the lower end of the capillary is formed The measurement of the ball diameter, the length of the line tail extending at the lower end of the capillary, the measurement of the ball position from the bottom of the capillary, the detection of the end of the wire, the appearance of the capillary, and the amplitude of the capillary when ultrasonic vibration is applied, so it is not necessary The special detection mechanism for measuring the length of the tail and the diameter of the ball simplifies the device and is not expensive. In addition, by using the aforementioned measurement as a feedback, it is possible to frequently perform the best wiring. [Brief description of the drawings] (I) Schematic part FIG. 1 is a front view of a main part of a partial cross-section showing the first embodiment of the wire bonding device of the present invention. Fig. 2 is an explanatory diagram showing an image plane when calibration is performed without a reference member as shown in Fig. 1. In Figure 3, ⑷ and ⑻ are images of a sphere, (cl) and (〇2) are images of a lead extending from a capillary, (dl) and (d2) are images of a damaged capillary, and (e) is an image of Image of a capillary tube when ultrasound is applied. Fig. 4 is a front view of a main part of a partial cross section showing a state where a reference member is provided in the first embodiment of the wire bonding apparatus of Fig. 1; 19 563216 Fig. 5 is an explanatory diagram showing an example of a case where a reference member is set for calibration as shown in Fig. 4. Fig. 6 is an explanatory diagram showing another example of a case where a reference member is set for calibration as shown in Fig. 4. Fig. 7 is a plan view showing a second embodiment of the threading device according to the present invention. Fig. 8 is a front view of a main part of a partial cross section showing the third embodiment of the threading device according to the present invention. Fig. 9 is a front view of a principal part of a partial cross section showing a fourth embodiment of the threading device of the present invention. Fig. 10 is a front view of a principal part of a partial cross section showing a fifth embodiment of the threading device of the present invention. Fig. 11 is a front view of a main part of a partial cross-section showing a sixth embodiment of the threading device of the present invention. FIG. 12 is a top view of the workpiece after the threading is completed. FIG. 13 is a step diagram showing a general wire bonding method. FIG. 14 is a perspective view of a threading device. (II) Symbols for components 4 Lead 4a Ball 5 Capillary 5b Broken 11 Position detection camera 20 Lens 20 563216 22 Optical path conversion mechanism 24 Lens 25, 26, 27, 28 Reflector 30, 31 Illumination mechanism 35 Reference member 40 Optical path conversion mechanism 44 lens 42, 43, 45, 47, 48 reflector 46 translucent reflector 50, 51 lighting mechanism 55 45 ° deflection angle 稜鏡

21twenty one

Claims (1)

563216 拾、申請專利餘圍Λ ι· 一種打線方法，係使用於打線裝置，該打線裝置具 備：有引線插穿，對工件進行打線之毛細管、及攝影工件 之位置檢測用攝影機；其特徵在於： 將毛細管下端附近之像導引至前述位置檢測用攝影機 而取得前述像之影像，處理該影像，來進行以下之至少一 項：形成於延伸在毛細管下端之引線球徑之測定、延伸在 毛細管下端之線尾長度之測定、距離毛細管下面之球位置 之測定、線尾彎曲之檢測、毛細管之外觀檢查、對毛細管 施加超音波振動時之振幅。 2. —種打線裝置，係具備：有引線插穿，對工件進行 打線之毛細管、及攝影工件之位置檢測用攝影機；其特徵 在於： 設置將毛細管下端附近之像導引至前述位置檢測用攝 影機的光路轉換機構，將以前述位置檢測用攝影機所取得 之前述像之影像加以處理，來進行以下之至少一項：形成 於延伸在毛細管下端之引線球徑之測定、延伸在毛細管下 端之線尾長度之測定、距離毛細管下面之球位置之測定、 線尾彎曲之檢測、毛細管之外觀檢查、對毛細管施加超音 波振動時之振幅。 3. 如申請專利範圍第1項之打線方法，其中，將前述 位置檢測用攝影機所取得之影像藉由資料處理機構加以處 理，進行良否判斷後，若係不良時以警報機構警告。 4. 如申請專利範圍第2項之打線裝置，其中，將前述 22 563216 位置檢測用攝影機所取得之影像藉由資料處理機構加以處 理，進行良否判斷後，若係不良時以警報機構警告。 5. 如申請專利範圍第1項之打線方法，其中，將以前 述位置檢測用攝影機所取得之影像中球徑、線尾長度、距 離毛細管下面之球位置藉由資料處理機構加以處理，並回 饋至電炬之控制電路或訊號電測轉換器之控制電路或引線 拉上機能控制電路。 6. 如申請專利範圍第2項之打線裝置，其中，將以前 述位置檢測用攝影機所取得之影像中球徑、線尾長度、距 離毛細管下面之球位置藉由資料處理機構加以處理，並回 饋至電炬之控制電路或訊號電測轉換器之控制電路或引線 拉上機能控制電路。 7·如申請專利範圍第2項之打線裝置，其中，前述光 路轉換機構，係具有構成非聚焦系統之透鏡，該非聚焦系 統由前述透鏡與設於前述位置檢測用攝影機之透鏡組合而 成。 8. 如申請專利範圍第1項之打線方法，其中，爲測定 前述球徑、距離毛細管下面之球位置、及線尾長度，須預 先進行校準，來求得前述位置檢測用攝影機之攝影元件之1 像素係相當於所測定之物體面的多少倍。 9. 如申請專利範圍第2項之打線裝置，其中，爲測定 則述球徑、距離毛細管下面之球位置、及線尾長度，須預 先進行校準，來求得前述位置檢測用攝影機之攝影元件之j 像素係相當於所測定之物體面的多少倍。 23 563216 1〇·如申請專利範圍第8項之打線方法，其中，前述 校準，係藉由移動毛細管時之移動量、與以前述位置檢測 用攝影機所取得之影像上前述毛細管之移動量，來算出每1 像素之實際長度。 11·如申請專利範圍第9項之打線裝置，其中，前述 校準，係藉由移動毛細管時之移動量、與以前述位置檢測 用攝影機所取得之影像上前述毛細管之移動量，來算出每1 像素之實際長度。 12 ·如申請專利範圍第8項之打線方法，其中，前述 校準，係設置與毛細管同時以前述位置檢測用攝影機取得 之基準構件，藉由以前述位置檢測用攝影機所取得之基準 構件之影像，來算出每1像素之實際長度。 13. 如申請專利範圍第9項之打線裝置，其中，前述 校準，係設置與毛細管同時以前述位置檢測用攝影機取得 之基準構件，藉由以前述位置檢測用攝影機所取得之基準 構件之影像，來算出每1像素之實際長度。 14. 如申請專利範圍第8項之打線方法，其中，前述 校準，係設置與毛細管同時以前述位置檢測用攝影機取得 之基準構件，藉由移動毛細管時之移動量、與以前述位置 檢測用攝影機所取得之影像上前述毛細管之基準構件的差 ，來算出每1像素之實際長度。 15. 如申請專利範圍第9項之打線裝置，其中，前述 校準，係設置與毛細管同時以前述位置檢測用攝影機取得 之基準構件，藉由移動毛細管時之移動量、與以前述位置 24 563216 檢測用攝影機所取得之影像上前述毛細管之基準構件的差 ，來算出每1像素之實際長度。 拾壹、圖式 如次頁563216 Pick up and apply for patent Yuwei Λ ι · A wire bonding method is used in a wire bonding device. The wire bonding device is provided with a capillary with a lead inserted to wire the workpiece, and a camera for detecting the position of the photographic workpiece; it is characterized by: The image near the lower end of the capillary is guided to the camera for position detection to obtain the image of the aforementioned image, and the image is processed to perform at least one of the following: measurement of the diameter of the lead ball extending at the lower end of the capillary, and extending at the lower end of the capillary Measurement of the length of the wire tail, the measurement of the position of the ball below the capillary, the detection of the bend of the wire tail, the appearance inspection of the capillary, and the amplitude when the ultrasonic vibration is applied to the capillary. 2. —A threading device comprising: a capillary tube with a lead inserted to wire the workpiece, and a camera for detecting the position of the photographic workpiece; characterized in that: a camera for guiding the image near the lower end of the capillary tube to the aforementioned position detection camera is provided; The optical path conversion mechanism processes at least one of the following: the image of the aforementioned image obtained by the camera for position detection is used to measure at least the diameter of the lead ball extending at the lower end of the capillary, and the tail of the line extending at the lower end of the capillary Measurement of length, measurement of the position of the ball below the capillary, detection of wire tail bending, appearance inspection of the capillary, and amplitude of ultrasonic vibration applied to the capillary. 3. For the wiring method of item 1 of the scope of patent application, in which the image obtained by the aforementioned position detection camera is processed by a data processing mechanism, and after a good or bad judgment, an alarm mechanism warns if it is defective. 4. As for the wire bonding device in the second item of the scope of patent application, the image obtained by the aforementioned 22 563216 position detection camera is processed by a data processing organization, and after a good or bad judgment, an alarm mechanism warns if it is defective. 5. For example, the wire bonding method according to item 1 of the scope of patent application, wherein the ball diameter, wire tail length, and ball position below the capillary in the image obtained by the position detection camera are processed by the data processing mechanism and returned. Pull the function control circuit to the control circuit of the torch or the control circuit or lead of the signal electrical measurement converter. 6. For the wire bonding device in the scope of the patent application, the ball diameter, wire tail length, and ball position below the capillary in the image obtained by the camera for position detection are processed by the data processing mechanism and returned. Pull the function control circuit to the control circuit of the torch or the control circuit or lead of the signal electrical measurement converter. 7. The wire bonding device according to item 2 of the patent application, wherein the aforementioned optical path conversion mechanism is provided with a lens constituting a non-focusing system, which is a combination of the aforementioned lens and a lens provided in the aforementioned position detection camera. 8. For the wire bonding method according to item 1 of the scope of patent application, in order to determine the aforementioned ball diameter, distance from the ball below the capillary and the length of the wire tail, calibration must be performed in advance to obtain the photographic element of the aforementioned position detection camera. 1 pixel is how many times the measured object surface. 9. As for the wire bonding device in the second item of the scope of patent application, in order to determine the diameter of the ball, the position of the ball below the capillary, and the length of the wire tail, it must be calibrated in advance to obtain the imaging element of the aforementioned position detection camera. The number of pixels in j corresponds to the number of times the measured object surface. 23 563216 1〇. According to the wire bonding method of the eighth aspect of the patent application, the aforementioned calibration is based on the amount of movement of the capillary when moving the capillary and the amount of movement of the capillary on the image obtained by the camera for position detection. Calculate the actual length of each pixel. 11. The wire bonding device according to item 9 of the scope of patent application, wherein the aforementioned calibration is calculated by moving the capillary when moving the capillary and the moving amount of the capillary on the image obtained by the camera for position detection. The actual pixel length. 12 · According to the wiring method of item 8 in the scope of patent application, wherein the aforementioned calibration is to set the reference member obtained by the camera for position detection at the same time as the capillary tube, and by using the image of the reference member obtained by the camera for position detection, Calculate the actual length of each pixel. 13. For the wire bonding device according to item 9 of the scope of patent application, wherein the aforementioned calibration is to set the reference member obtained by the camera for position detection at the same time as the capillary tube, and by using the image of the reference member obtained by the camera for position detection, Calculate the actual length of each pixel. 14. The wire bonding method according to item 8 of the scope of patent application, wherein the aforementioned calibration is to set a reference member obtained by the position detecting camera at the same time as the capillary tube, the amount of movement when the capillary tube is moved, and the camera for the position detection The actual length of each pixel is calculated by the difference between the reference members of the capillary on the acquired image. 15. For the wire bonding device according to item 9 of the scope of patent application, wherein the aforementioned calibration is to set the reference member obtained by the camera for position detection at the same time as the capillary tube, and measure the amount of movement when the capillary tube is moved, and detect at the position 24 563216 The actual length of each pixel is calculated using the difference between the reference members of the capillary on the image obtained by the camera. Pick up, schema as the next page 2525
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