TW562166U - Assembly of back plate fixing device - Google Patents

Assembly of back plate fixing device

Info

Publication number
TW562166U
TW562166U TW091202103U TW91202103U TW562166U TW 562166 U TW562166 U TW 562166U TW 091202103 U TW091202103 U TW 091202103U TW 91202103 U TW91202103 U TW 91202103U TW 562166 U TW562166 U TW 562166U
Authority
TW
Taiwan
Prior art keywords
assembly
fixing device
back plate
plate fixing
plate
Prior art date
Application number
TW091202103U
Other languages
English (en)
Inventor
Ming-Luen Sz
Shian-Rung Chen
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW091202103U priority Critical patent/TW562166U/zh
Priority to US10/192,108 priority patent/US6654254B2/en
Publication of TW562166U publication Critical patent/TW562166U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/44—Clasp, clip, support-clamp, or required component thereof
    • Y10T24/44017—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured
    • Y10T24/44026—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured for cooperating with aperture in supporting structure or structure-to-be-secured

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
TW091202103U 2002-02-22 2002-02-22 Assembly of back plate fixing device TW562166U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW091202103U TW562166U (en) 2002-02-22 2002-02-22 Assembly of back plate fixing device
US10/192,108 US6654254B2 (en) 2002-02-22 2002-07-09 Printed circuit board assembly having retention module and back plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW091202103U TW562166U (en) 2002-02-22 2002-02-22 Assembly of back plate fixing device

Publications (1)

Publication Number Publication Date
TW562166U true TW562166U (en) 2003-11-11

Family

ID=27752498

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091202103U TW562166U (en) 2002-02-22 2002-02-22 Assembly of back plate fixing device

Country Status (2)

Country Link
US (1) US6654254B2 (zh)
TW (1) TW562166U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104471704A (zh) * 2012-07-13 2015-03-25 三菱电机株式会社 半导体装置

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7133288B2 (en) * 2004-05-19 2006-11-07 Tyco Electronics Corporation Processor heat sink retention module and assembly
JP2006059935A (ja) * 2004-08-18 2006-03-02 Fujitsu Ltd 保持具、部品搭載方法、電子回路ユニット、及び電子機器
US7236369B2 (en) * 2005-03-14 2007-06-26 International Business Machines Corporation Torsion spring force and vertical shear pin retention of heat sink to CPU
CN2810113Y (zh) * 2005-06-13 2006-08-23 富准精密工业(深圳)有限公司 散热器背板
US7870888B2 (en) * 2005-08-26 2011-01-18 Illinois Tool Works Inc. Base for heat radiator, heat dissipation assembly for central processing unit, and method of using the same
US7068513B1 (en) * 2005-10-05 2006-06-27 Foxconn Technology Co., Ltd. Fixing apparatus for mounting a heat sink to a printed circuit board
CN1983109B (zh) * 2005-12-15 2010-05-12 富准精密工业(深圳)有限公司 电子装置组合
US7385826B2 (en) * 2005-12-28 2008-06-10 International Business Machines Corporation Method to secure a heat sink
US7382621B2 (en) * 2006-01-24 2008-06-03 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Video graphics array (VGA) card assembly
US7292447B2 (en) * 2006-03-22 2007-11-06 Fu Zhun Precision Industry (Shen Zhen) Co. Ltd. Back plate assembly for a board
US7336496B1 (en) * 2006-09-14 2008-02-26 Inventec Corporation Fixing structure for computer mainboard
CN200972620Y (zh) * 2006-11-23 2007-11-07 番禺得意精密电子工业有限公司 背板
CN102056454A (zh) * 2009-10-29 2011-05-11 鸿富锦精密工业（深圳）有限公司 具防呆结构的散热装置及采用该散热装置的电子装置
US20110216512A1 (en) * 2010-03-05 2011-09-08 Vosper Ian Low Cost PCB Carrier and Connectivity System For Enclosed Electronics
DE102010022562A1 (de) * 2010-06-02 2011-12-08 Vincotech Holdings S.à.r.l. Elektrisches Leistungsmodul und Verfahren zum Verbinden eines elektrischen Leistungsmoduls mit einer Leiterplatte und einer Wärmesenke
TW201328555A (zh) * 2011-12-20 2013-07-01 Hon Hai Prec Ind Co Ltd 電子裝置
WO2013113456A1 (de) * 2012-02-03 2013-08-08 Mechaless Systems Gmbh Kompensation eines optischen sensors über die leiterplatte
DE102013100701B4 (de) 2013-01-24 2022-07-21 Infineon Technologies Ag Halbleitermodulanordnung und verfahren zur herstellung einer halbleitermodulanordnung
CN104412385A (zh) * 2013-07-04 2015-03-11 株式会社东芝 电子装置
WO2017209315A1 (ko) * 2016-05-30 2017-12-07 주식회사 옵텔라 전기 인터페이스 결합구조
CN114583498A (zh) * 2020-12-01 2022-06-03 青岛安普泰科电子有限公司 背板和电子装置
US20240049432A1 (en) * 2022-08-02 2024-02-08 International Business Machines Corporation Adjustable retention device for heat sink assembly

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2899543B2 (ja) * 1995-06-08 1999-06-02 信越ポリマー株式会社 半導体パッケージ接続用ソケット
US5662163A (en) * 1995-11-29 1997-09-02 Silicon Graphics, Inc. Readily removable heat sink assembly
US6244875B1 (en) * 2000-01-21 2001-06-12 Hon Hai Precision Ind. Co., Ltd. Electrical connector
TW491500U (en) * 2001-05-30 2002-06-11 Foxconn Prec Components Co Ltd Heat sink buckle device
US6400577B1 (en) * 2001-08-30 2002-06-04 Tyco Electronics Corporation Integrated circuit socket assembly having integral shielding members

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104471704A (zh) * 2012-07-13 2015-03-25 三菱电机株式会社 半导体装置
CN104471704B (zh) * 2012-07-13 2017-05-17 三菱电机株式会社 半导体装置

Also Published As

Publication number Publication date
US20030161119A1 (en) 2003-08-28
US6654254B2 (en) 2003-11-25

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees