TW556330B - Resin-molded package with cavity structure - Google Patents

Abstract

A package includes: a substrate having a ridged peripheral portion and a center portion defined by and lower in level than the ridged peripheral portion. A semiconductor chip is mounted on the center portion. A plurality of lead is electrically coupled to the semiconductor chip and penetrates the substrate outwardly from the center portion. The package also includes a cap defining a cavity space which accommodates the semiconductor chip. The cap has a cap bonding face bonded with a substrate bonding face of the ridged peripheral portion. The cap bonding face and the substrate bonding face are higher in level than the center portion.

Description

556330 V. Description of the invention (1) [Background of the invention-1. Field of the invention The present invention relates to a resin mold package, a resin mold package, which has: packaging, more specifically ... ^ low. The body ’s resistance is reduced, and its lead inductance is reduced. 2. Related technical descriptions. Knowing the ceramic sealing electrical constant and parasitic capacitance of the cavity structure, 1% a reduction + conductor Pei Zhizhishen 3 disadvantages of the ceramic package Because of its high cost, it is installed with ρ. On the other hand, because the resin mold package with a cavity structure is low and convenient, it is quite attractive == less cost than a resin substrate, and a semiconductor package mounted thereon includes a grease cap and a semiconductor. =? 曰 曰; 'And-resin cover, the trunk conductor sun and the sun sheet together define a cavity, so you can = the cavity space ·. The resin cover is adhered to the resin base :. If it is an ultra-southern frequency semiconductor device x, reduce its inductance to suppress high-frequency losses. Therefore, the electricity should be as short as possible as long as possible. From the point of view, the leadless hole structure Packaging is better. "Ei Li No. 2600689 and Japanese Patent No. 31 27584 disclose the structured package. The leadless type cavity structure package includes-two or two * semiconductor crystals mounted on the resin substrate, and several leads. The upper surface of the substrate is penetrated to the lower level, and the metal substrate is coupled through the metal wire, and a cover is adhered to the resin base.

Page 5 556330 V. Description of the invention (2) One = = lead; U has the leadless hole seal ^, wherein the long lead is protruding outward from the side of the package, and the outer side of the sacred and ten waves is bent downward . Also, the package in this disclosure in the aforementioned two Japanese patents has the following common disadvantages. & The above-mentioned leadless cavity structure First, the above package is via a soldering method = 丄 SI of the conductive pattern of the circuit board. The Erhai package is placed in a solder container full of flux: it can enter the cavity. Do not enter the cavity if the tree is outside and outside. In a word, step-by-step with the semiconductor ...: the agent enters the hole 'and the electrical characteristics and performance of the conductor are weakened. Thousands': must = agent enter the cavity ... prevent or »Hil 28, make the side of the resin substrate flat and the bottom of the horizontal plate level A right Yanshan IU Shiding shirt surface water is the same as the base flat surface The toilet was made sure that the resin substrate was flat and the liquid medicine had a sufficient height on the upper surface. This means that the upper surface of the resin substrate needs a longer lead through the resin substrate so as to be level from the surface or bottom of the substrate #m a icP &. This long lead has a large inductance, which causes high-frequency losses in an unsuitable UHF semiconductor device. people. In order to connect the flat and horizontal upper surface of the resin substrate to the cover, a sufficient cavity space for the semiconductor wafer and the bonding wire must have a sufficient height. This results in the total thickness or length of the package. Page 6 556330 V. Description of the invention (3) The degree is large. Third, the user will know the strong edges, the flatness and horizontality of the resin substrate, and the surface and the resin substrate. The grease substrate is misaligned. The package rule θ = into displacement or the cover and the tree, the thickness is about 0.5 micrometers. Such a shape defect such as' its diameter is about 2 micrometers. The lack of this package will not make the package external. The Guyi and the metal wire are broken. Under the above conditions, Aia Lua's novel packaging of the cavity structure. Instead, it is necessary to develop a new type with voids that does not have the above-mentioned problem. [Summary of the Invention] The aim is to provide a new type with voids that does not have the above problems. Lai package. In addition, the purpose is to provide a device having a cavity structure with a reduced total height. The purpose is to provide a novel seal having a cavity structure to prevent flux from entering the cavity. The purpose is to provide a novel seal with a cavity structure and an automatic alignment feature between the substrate and the substrate. The peripheral package includes:-a substrate having a ridge definition, 2 /, a central portion, the order portion is formed by the perimeter portion of the ridge and its level is lower than the perimeter portion of the ridge. A semiconductor wafer 556330 V. Description of the invention (4) is mounted on the central portion. A plurality of leads are electrically coupled to the semiconductor wafer and pass through the substrate outwardly from the central portion. The package also includes a cover that defines a cavity space that houses the semiconductor wafer. The cover has a cover bonding surface which is bonded to a substrate bonding surface of a portion around the bulge. The cover bonding surface and the substrate bonding surface are higher in level than the central portion. The upper surface of the central portion on which the semiconductor wafer is mounted is lower than the upper portion of the peripheral portion of the bump. This structural characteristic can advantageously avoid the undesirable phenomenon of flux entering and cavitation. In other words, the raised perimeter portion serves as a solder barrier surrounding the central portion on which the semiconductor wafer is mounted, wherein the solder barrier helps prevent the flux from entering the cavity. It does not cause the electrical characteristics and performance of the package to be degraded. Said structural characteristics The penetration of the central part upwards and outwards will reduce its electrical semiconductor device. Said structural characteristics The total height under the cavity space. In addition, the joint surface of the cover and the automatic alignment function make it necessary to fully empty the surface of the package that covers the cover at a frequency that is smaller than the central part to reduce the frequency. Reducing the thickness of the central portion shortens the distance between the surfaces as follows, thus minimizing the length of the leads from the middle substrate. These quotes & long sense. The reduced inductance of these leads makes it easier to suppress poor high frequency losses. : To further reduce the height of the cover by ensuring that the material conductor wafer is contained effectively. In this way, the bonding surfaces of the boards can be effectively sprayed together, and each of the bonding surfaces of the substrate includes at least an automatic alignment of the cover and the substrate. ^ An automatic assembly machine can be used to implant a high degree of manual precision. The above-mentioned J 仃 automatic assembly side 556330 V. Description of the invention (5) The shape is not defective. The sealing line and wire will not produce any bad disconnection. It will be manufactured in large quantities and improve the yield of the final product. One. ~ ^ The above and other objects, characteristics, and features of the present invention will be understood from the following description: The shape is not defective. The package's defect-free external shape allows the gold to generate a large amount of open circuit. The above-mentioned automatic alignment function can also be made using the I, and improve the yield of the final product-from the following button Da ... -α person 丄 w " " · Advantages [detailed description of preferred embodiments] a substrate, Its system consists of the semi-conductor which is lower than the surface of the ridge, and the cover joint surface of the cover is lower than the surface of the cover. This avoids the flux branch as the welding upper surface, which will not cause the A first embodiment of the present invention is a package comprising: a bulged peripheral portion and a central portion, the central portion has been delimited by the surrounding portion, and the upper surface of the central portion is above the water surrounding portion; The upper part is connected to the semiconductor wafer through a plurality of leads, which are electrically coupled to the semiconductor wafer, and the second wire runs through the substrate outward from the central portion; and 纳, to hold the cavity space of the semiconductor wafer, the cover has a cover = its, The substrate joint surface around the bulge is joined, and the level of the joint surface is higher than the central portion. Raised piece? Improper expression of the structural characteristics on the upper surface of the central part can be beneficial. The central part is mounted around the central part on which the semiconductor wafer is mounted. In this way, the electrical characteristics and performance of Πϊϊ are weakened. Thickness, so that the center is reduced from the center; points :: work :: effectively reduce the distance between the surface of the central part and the lower surface, because page 9 556330 V. Description of the invention (6) The reduction of the central part will reduce the The above structure of the electric high-frequency semiconductor device specifically divides the total height of the package under the cavity space. In addition, the cover and the plane of the joint surface of the cover to generate a self-aligning function method 'do not require any external metal wires of the package to be produced for mass manufacturing, and preferably includes a ring-shaped extension. The cover is in line with the structure, then the connection of the cover should be tilted inwardly so that the automatic alignment function of the cover's joints does not need any external shape of the package. The line does not produce any: substrate "line length is reduced to Minimal. The length of the lead reduces the inductance of the dedicated lead, making it easier to suppress bad high-frequency losses. ^ In addition, it can effectively reduce the height of the cover while ensuring that the semiconductor wafer is fully charged. This can effectively reduce the bonding surface and the The dynamic alignment of the base plate makes the high-shaped human shape defect-free. Any defect and improvement in the end, the automatic alignment of the cover inward and downward and the base oblique plane will guide the surface and the The substrate must be able to use too high artificial defect-free. What is wrong to break the substrate joint surface and the substrate using an automatic method to precisely open the package. The joint surface of the product and Oblique flat function. The board is connected to the cover. The automatic assembly of the cover is accurately packaged. Each of the joints on the board is covered by the automatic assembly machine. The above-mentioned defect-free automatic yield. The surface of the substrate. As a result, the cover and the mating surface will not be mounted on the same machine as the substrate surface. The above-mentioned self-defective externally automatically aligns with each other, and includes at least a non-water alignment function. This performs automatic assembly and automatic alignment The external shape of the function enables the alignment function to also join the surface structure to provide the substrates with each other accurately. The shape of the automatic alignment section can be adjusted automatically. Each of the quasi-functions is automatically misaligned, but it is accurate. This kind of assembly side function Make the money available

Page 10 556330 V. Description of the invention (7) Make the big 2 :: ϊ Yield of final product. height. For example, the downwardly inclined plane within the three-three plane provides the largest junction surface on the outside of the solder barrier. It is difficult for the solder to reach the bonding surface between the cover's joint surface and the substrate. This prevents the flux from passing through the cover's joint surface and the = " The interface between the faces enters the cavity. Including ί ϊ 1 ΐ: It is a combination of a plane and a horizontal and flat surface each of the joint surface of the cover and the joint surface of the substrate. At this point, the substrate is misaligned :: J = j 5 of 5: dynamic alignment function. If the cover engages with this, the joint surface of " f and the joint surface of the substrate will not be aligned exactly with each other. The inclined plane will guide the lid and the substrate. The bonding surface of this m and the bonding surface of the substrate become each other. Ti Group m pair: The function enables the use of an automatic assembly machine for # m ^ / without any excessive manual precision. The outer shape of the above automatic skirt is flawless. The non-defective external function of the package can also be used for mass production, and to improve the final product's four-action soap package nr sibling, the joint surface of the cover and the joint surface of the substrate are inclined downward and outward. This structure provides auto-calibration; ϋ:! 'S auto-alignment function. If the cover and the substrate are not correct, the joint surface with the substrate will not mesh with each other, but this ϋ-tilted inclined plane will guide the cover to accurately align with the substrate, because the joint surface with the substrate changes. Have to murmur each other. This method does not require any artificial accuracy that is too high. The above automatic work = 556330

Defect-free shape. The defect-free external shape of the package causes the metal to make any undesirable disconnections. The above-mentioned automatic alignment function can also be used for large-scale manufacturing and improve the yield of the final product. The outwardly inclined plane is inclined downward and the downwardly inclined tube phenomenon makes it necessary to ensure that the outer surface of the downwardly inclined inner plane is there, and the interface part is welded to the inner surface of the solder substrate with an inner inner plane. The solder barrier is a part of the flux. The substrate is difficult to be located on the inside of the cover along the inner circumference that will not enter the outer downward inclined plane. Therefore, the outward downward downward extension of the substrate extends from the direction of the cover. Extend outwards and inwards. These provide the maximum height outwards. It is assumed that the capillary extends through the internal extension of the outwardly-downward inclined plane between the substrate joint surface and the cover, and climbs inward due to the capillary. Such as inside the cavity. A further preferred case is that the joining surface of the cover and the joining surface of the substrate include at least one convexly extending convex surface, and the second one includes a circular I-shaped concave surface that is engaged with the convex surface. With the engagement of convex and concave surfaces, Γ 1 provides an automatic alignment function for automatically aligning the cover and the substrate. If the combination = the substrate is misaligned, the joint surface of the cover is engaged with the joint surface of the substrate, but the combination of the convex and concave surfaces will guide the lid to accurately align, so that the lid ’s The joint surface should engage with the joint surface of the substrate. This auto-alignment function makes it possible to use the auto-assembly four-row auto-assembly method without any need for excessive manual precision. The 2-motion alignment function makes the external shape of the package defect-free. The white-free shape of the package prevents the metal wires from causing any undesirable disconnection. The above-mentioned quasi-functions can also be used for mass production and improve the production of the final product.

556330

rate. In addition, it is assumed that the combination of the capillary tube existing on the substrate joint surface and the lid joint surface helps to intercept the part of the cavity. It is particularly preferable that the joint surface of the cover includes the concave surface, and the joint surface has such a large size that it is easy to intercept the part of the flux and not enter the cavity. For example, the convex surface may include a concave surface including a bad shape extension, and in this example, the engaging surface of the cover may include the circular depression including the circular groove, and the substrate. For some reason, part of the flux passes through the interface between the interfaces, the meshing convex surface and the concave flux. This prevents the solder from entering the joint surface including the convex surface, and the width of the joint surface of the substrate base is larger than the convex surface of the cover. This additional structural feature is within the concave side. This ensures that the flux has a circular ridge extending in a ring shape, and the = circular ridge engaging the circular groove. Can include the circular hump and the substrate groove. Or, the joint surface of the cover may include the circular bulge

For example, the convex surface may include a concave surface including a conical ridge that extends from 肜. In this example, 钵 said that although t bulges and conical depressions; 的 μ box junctions may include impurities

The joint surface may be a white carrying bucket with a conical bulge from w η Zhenhai, and the J includes the conical ridge. ^. The joint surface of the ™ cover 3 The conical bulge may be u ϋ wj ^ y and this includes a cone The bulge can optionally include a 1-shaped groove. The structure of the combination of the ridge and the groove provides an alignment function when the tapered groove has a misalignment between the spraying and the substrate automatically aligning the cover. If the cover and the substrate

556330 V. Description of the Invention (ίο) The cover joint surface and the substrate joint surface will not merge with each other, but the combination with the groove will also guide the cover and the substrate to be accurately aligned, so the joint surface and the substrate joint surface are fused with each other . This kind of automatic, two, can use the automatic assembly machine for automatic assembly method, without the need for ::: high manual accuracy. The above-mentioned automatic f +, I τ · / τ & ^ $ μ & Klein alignment function makes the package shape A defective. The non-defective external shape of the package causes the metal wire 2 to be disconnected poorly. The above-mentioned automatic alignment function can also be used for a large number of ί :: Good yield of the final product "and change: In addition-suppose-the interface between the solder joint surface of the plate and the lid joint surface due to capillary phenomenon, the ringing hump With concave = there is 亥 in intercepting the part of the flux. In this way, j I ^ ~ 'guarantee that the flux will not enter the grooved meat. In a particularly preferred case, the cover engaging bread is slightly raised and the substrate joining surface includes the groove, and the width of the substrate joining surface is greater than the cover engaging surface, and the size of the groove is larger than the protrusion. . tf_ s k get the tanner part in the groove. This]: =; = makes it easy to intercept this phenomenon to prevent the flux from entering the cavity. In addition, the tapered ridge may optionally include a trapezoidal ridge, = cone: the groove may optionally include a trapezoidal groove. The combination of the trapezoidal ridges and recesses makes it easy to apply an adhesive to the trapezoidal ridges and a portion. I knife field A to / better case, these two you &A; taxi A W, extended to the bottom periphery of the substrate s. : The obliquely extending upper surface shortens the length of the lead from the central part to the length of the lead. These lead lengths are further shortened by one cow and one cow ^ # π $ + θ to reduce their inductance. These lead inductances are further reduced, making it easier for Fanggugu to suppress high-frequency losses in high-frequency semiconductor devices.

ΙΗ Page 14 556330 V. Description of the Invention (11) Preferably, the cover includes a flat body and one circle, and == the joint surface of the cover. This structural characteristic is to ensure that the height of the cover is further reduced under the condition of accommodating: Hai; guide: space. This can further reduce the overall height of the package. The second embodiment of the present invention is a kind of package, including one, which has a surrounding portion and is defined by the surrounding portion = and the upper surface level of the hollow portion is lower than that of the surrounding portion. ^ 部分 丰 ^ ΐί: The upper surface of the hollow portion; a number of objects that are electrically connected to the abundance of the conductor; and these leads extend obliquely through the upper surface of the substrate portion and extend around the bottom of the substrate; and a = 2: empty of the semiconductor wafer In the cavity space, the cover includes a flat main body; and the second part of the peripheral circle has a cover joint surface, the cover connection: the surface and the substrate interface are mixed, and the cover interface and the substrate interface The bonding surface with the substrate: the engaging surface and the bonding surface of the substrate each include at least a non-horizontal mounting portion of the semiconductor wafer with a central periphery. The upper surface level of this social knife is lower than the cavity. In other words, it helps to prevent the solder from entering the hollow part of the chip, which is improperly soldered, so as to surround the cavity with semiconductor crystals. If this is not the case, the flux barrier can prevent the flux from weakening. 9 ^ " Electrical characteristics and properties of the packaged semiconductor device The above structural characteristics are also beneficial. This reduces the thickness of the central portion above and below and reduces the thickness of the central portion, such as the distance between the lower portions, so that the distance from the central portion

Page 15 556330 V. Description of the invention (12) The length of the lead wire that runs outward through the substrate is reduced to a minimum. These smaller leads will reduce their inductance. The reduction in the inductance of these leads makes it easy to suffer high-frequency losses of high-frequency semiconductor devices. The above-mentioned structural characteristics can further reduce the height of the cover while ensuring that the semiconductor wafer is filled with eight holes. This can further reduce the overall height of the package. $ &

In addition, the cover bonding surface and the substrate bonding surface are engaged with each other, and each of the bonding surface and the substrate bonding surface includes at least one non-horizontal plane, and the automatic alignment function of the cover and the substrate is automatically aligned. This kind of self- =: "You can use an automatic assembly machine to perform an automatic assembly method, not the high manual accuracy of i. The above-mentioned automatic alignment function allows the package to be disconnected. The above-mentioned automatic alignment function can also It is used to produce a large amount of product and improve the yield of the final product. The preferred case is that the cover's joint surface is beautiful-a circularly extending inwardly inclined surface: ": == at least the cover and the substrate are automatically Alignment function. If it is for automatic alignment, the joint surface of the 盍 and the substrate will not tilt upwards and downwards. The plane will guide the cluster, but the joint surface of the 面 and the substrate will change. You have to confuse each other] = no need for any excessively high manual precision automatic assembly method of the watch 'the external shape is flawless. The package's flawless alignment function prevents the package from producing any undesired disconnections. The shape is such that the automatic alignment function of the metal wire 乩 can also be used for manufacturing 556330 V. Invention description (13) and improve the yield of the final product. Outside the taxi, the inwardly sloping plane provides the maximum height outside the solder barrier. This makes it difficult for the flux to reach the interface between the cover joint surface and the substrate interface, and thus prevents the flux from entering the cavity through the interface between the cover joint surface and the substrate interface. It is also preferable that the cover joint surface and the substrate joint surface each include a production plane, an inclined plane, and a horizontal and flat surface. This structure is provided by: = The automatic alignment function of the quasi-chirp and the substrate. If the cover and the substrate are not ^, the joint surface of the cover and the joint surface of the substrate will not mesh with each other, but the direction = downward inclined plane will guide the cover to accurately align with the substrate, so that the cover The bonding surface of the substrate and the bonding surface of the substrate become engaged with each other. This automatic alignment function makes it possible to use the automatic assembly machine method without any excessive manual precision. The above is automatically disconnected. The above-mentioned auto-alignment function can also be used to make a large one and improve the yield of the final product. It is also preferable that the cover joint surface and the substrate joint surface each have a plane extending downward and downward. This structure provides an automatic alignment function. If the cover is not aligned with the substrate, the joint surface of the 盍 and the substrate will not engage with each other, but the two inclined planes downward will guide the cover and the substrate accurately, so the joint surface and the substrate's The joint surfaces become intermeshing each other. This type of function makes it possible to use an automatic assembly machine for self-reliance without any excessively high manual accuracy.

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Page 17 556330 V. Description of the invention (14) = t 2 f defect. The non-defective external shape of the package prevents the metal wire from being broken by if:: t. The automatic alignment function described above can also be used for mass production and improve the yield of the final product. In the case of spinning, the outer edge of the substrate is inclined outwardly and downwardly from the plane. The lower part of it is the inner side of the inner surface of the downwardly inclined plane. The inner extension area is further enclosed from the inner plane of the cover S i to extend inwardly and upwardly. This design provides a maximum height at the inside of the agent barrier. If it is connected to the cover: surface to surface Ϊ surface welding:: f points pass through the adjacent surface of the substrate joint surface, from r, 1 surface, within 5 ° of the substrate's outward downward slope plane = extension area :: the Part of the flux is difficult to climb along the interior extension. This ensures that the flux does not enter the cavity. Enclose it to = =; the first surface of the cover joint surface and the substrate joint surface, and the concave surface. Presented by: human: the dagger extends the recess of the bad shape and the automatic alignment function of the substrate. If the lids are engaged with each other, but the joint surface of the joint and the substrate will not be accurately aligned with the substrate, therefore, the group f of the lid will guide the lid and the mating to each other. This kind of automatic assembly method for the M, 〇 plane and the junction surface of the substrate assembly method, $ J =! To use the automatic alignment machine automatic alignment function can also be used for a large number of open circuits. This improves the yield of the final product. 556330 V. Description of the invention (15) In this = Bu La; because of the capillary phenomenon, the flux-partially passes the interface between the surface of the interface and the joint surface of the cover. Flux. This prevents the flux from entering: the joint surface includes the joint surface including a convex surface, and the substrate joint surface, such as "Concave 2 :: The width of the substrate's joint surface is larger than that of the cover, making it easy to make # ^, face size larger than the convex surface. This An additional structural characteristic of the flux is captured in the concave surface. In this way, the flux concave surface can be protected: a circular ridge extending in a ring shape can be included, and the circular groove in this example is a circular groove. Circular groove. Or, the ridge. Only the cymbal / groove 'and the joint surface of the substrate may include the concave surface of the circular bulge: the cone-shaped ridge extending in a circular shape, and in this example Xi ': And ... the conical grooves of the cone-shaped ridge engagement may include the conical recess #mu' and the substrate includes the conical recess #, and the joint interface of the substrate may be selectively It includes a ¥ -shaped groove. A bulge, and the tapered groove may have the engaging ridge. The cover and the substrate are automatically aligned. Two for automatic alignment. The cover joint surface and the substrate joint surface do not: :: 基 合 556330 5. Description of the invention (16) Slot group = will guide The cover and the substrate accurately match the δ-plane and the substrate-joining surface of each other. This self-=== makes it possible to use an automatic assembly machine for automatic assembly = manual precision. The automatic alignment function described above makes the seal ϊ ΐ ΐ ΐ Open circuit. The above-mentioned automatic alignment function can also be used to improve the yield of the final product. In addition, suppose that a part of the flux is due to the interface between the joint surface of the plate and the joint surface of the cover due to capillary phenomenon. This part of the flux. This ensures the welding; 4 into =; =, and the width of the substrate joint surface is larger than the cover; ^ Intercept the flux part in the groove. This phenomenon prevents the flux from entering ^ the empty and the :: concave can : Selectivity includes-trapezoidal ridges, and the group of grooves optionally includes a trapezoidal groove. The trapezoidal ridges and recesses are at least one in the flat portion of the trapezoidal ridges and grooves. Separately coated with adhesive.

The first embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a cross-sectional enlarged view of the inside of a novel package having a cavity structure according to the first embodiment of the invention. Figure 2 is a novel structure with a cavity structure shown in Figure 1.

556330 V. Description of the invention (17) The plan view of the package The package 1 with a cavity structure 10 includes a resin substrate 16 and a semiconductor box “20”. The resin substrate 16 further includes a die pad 12 and four And the leads 1 4. The resin substrate 16 includes a hollow portion 21 with reduced thickness. The raised portion 22 surrounds the reduced thickness = 4 7 knives 21 are frame-shaped extensions. The reduced thickness hollow portion 21 is over The surface level is lower than the top of the perimeter of the ridge 2 2. The perimeter of the ridge is a barrier to the flux 'so that the flux will not enter the thickness reduction; ": the crystal is formed. The upper surface of the crystal is larger than the plan view of the 12-die mold Lines 14 around the pad 12 are 16 to the exit. Each lead is horizontally outside the high side. The high-reduction hollow line and the semi-planar surface water-conductor crystal pad 12 are combined at the bottom of the four leads to the outer hollow portion. The horizontal inner thickness is the same as that of the sheet 18 and the thickness line 14 of the resin. Around the center 21, the grain pads 12 and the grain pads 12 are selected to be the same. Into and in plan view The four directions of the thickness reduction resin substrate 16 and the line 14 include the high portion. The horizontal inner portion of the upper conductor wafer 1 of the horizontal inner portion 21 is mounted on the crystal substrate 16 during the thickness reduction. The middle hollow portion is divided into radial and cross sections, and the upper surface penetrates from the bottom and the middle inclined hollow portion 21 on the grain pad 12 of the hollow portion 21. The central portion. The grains are divided into 21. Do not use the grains The four protruding resin substrates are located on the upper surface of the thickness-reduced hollow portion 2 and the low points are located on the upper surface of the thickness-reduced hollow portion 2. The upper exposed surface 3Q is exposed from the thickness surface. The upper exposed surface 30 is electrically connected via gold. The low-level outer part is located in the core 556330

ϊϊί] Also located outside the high-level inner portion. The bottom is exposed. The middle sloping part gradually slopes outwards and downwards, providing a smooth connection between the south horizontal inner part and the low horizontal outer part. = The wire 14 is molded and incorporated in the resin substrate 16.

The raised peripheral portion 22 extends around the thickness-reduced hollow portion 21. The raised peripheral portion 22 includes an inner wall, an outer wall opposite to the inner wall, and a flat surface, and an inwardly and downwardly inclined plane. The inwardly and downwardly inclined plane joins between the inner wall and the flat surface. The inwardly and downwardly inclined plane extends outside the inner wall of the palate and inside the flat surface. The flat surface engages with the outer wall at the inwardly and downwardly inclined plane. The flat surface extends out of the inwardly and downwardly inclined plane and inwardly of the outer wall. The plan view of the inwardly downward inclined plane is a circular band. The inwardly and downwardly inclined plane has a uniform inclination angle. From a geometric point of view, the vertical shape of the inwardly and downwardly sloping plane is equivalent to a part of the inner surface of the cone, in other words, the inner surface of the truncated cone. This inwardly and downwardly sloping plane allows the substrate to have a bonding surface 28 to which the cover 20 is bonded.

The cover is bonded or adhered to the substrate bonding surface 28, which includes the inwardly and downwardly inclined plane of the raised peripheral portion 22 of the substrate 16; therefore, the tree substrate 16 and the cover 20 jointly define a housing for the semiconductor The cavity 24 of the wafer 18. This hole also helps reduce parasitic inductance. The cover 20 includes a dish-shaped main body 23 and a raised peripheral portion 25 that extend in a ring shape around the periphery of the dish-shaped main body 23. The dish-shaped body 23 is generally both flat and thin. The raised peripheral portion 25 is raised downward and raised toward the resin substrate 16. The raised peripheral portion 25 includes an inner wall and an outer wall opposite to the inner wall.

Page 22 556330 V. Description of the invention (19) · The prerequisites for the wall and an inwardly inclined surface are that the cover 20 is connected to the substrate 16 and the inner wall is facing downward. The inwardly downward sloping surface engages between the inner wall and the outer wall. The inwardly downward sloping surface extends between the inside and outside of the inner wall. Viewed from a bottom view, the inwardly and downwardly inclined surface is in the shape of a circular band. From a geometrical point of view, the three-dimensional shape of the inwardly and downwardly sloping surface is equivalent to a part of the outer surface of a cone, in other words, the outer surface of a truncated cone. The inwardly and downwardly inclined surface of the cover 20 provides a cover engaging surface 26 which is adjusted and engaged with the substrate engaging surface 2 8 of the resin substrate 16. The cover joint surface 26 has a uniform inclination angle, which is the same as the uniform inclination angle of the above-mentioned substrate joint surface 28, so that the cover joint surface 26 and the substrate joint surface 28 are closely contacted and engaged. As illustrated in detail, the width of the cover joint surface 26 can be selectively narrower than that of the substrate joint surface 28. The lid joint surface 26 extends inside the flat surface of the raised peripheral portion 2 2 of the resin substrate 16. The inner periphery of the lid joint surface 26 extends outside the inner periphery of the substrate joint surface 28. The bonding interface between the lid bonding surface 26 and the substrate bonding surface 28 is horizontally extended downward from the uppermost surface of the resin substrate 16. This helps reduce the overall height or thickness of the package 10. The above package 10 has the following advantages. The thickness-reduced hollow portion 21 helps to form a cavity 24 ′ accommodating a semiconductor wafer 丨 8 _ while reducing the height or thickness of the resin substrate 丨 6 and the cover 20 respectively, so that the total height or thickness of the package becomes smaller. The upper surface j of the hollow portion 21 where the thickness of the semiconductor wafer 18 is reduced is lower than the uppermost portion 22 of the resin substrate 16 surrounding the bulge. This structural feature is useful to prevent the flux from entering the cavity 24 improperly. In other words, the

Page 23 556330

The raised peripheral portion 22 serves as a solder barrier and surrounds the thickness-reduced hollow portion 21 where the semiconductor wafer 18 is mounted. The solder barrier of the raised peripheral portion 22 prevents the solder from entering the cavity 24. This will not cause the electrical characteristics and performance of the packaged semiconductor device to deteriorate. In addition, the inwardly and downwardly inclined plane of the cover joint surface 26 and the substrate joint surface 28 provides a maximum height outside the solder barrier of the perimeter portion 2 2 which makes it difficult for the flux to reach the substrate between the cover joint surface 26 and the substrate. The interface between the faces 28 'thus prevents the flux from entering the cavity 24 via the interface between the cover joining surface 26 and the substrate joining surface 28'. Said above-mentioned structural characteristics are also conducive to effectively reducing the thickness of the thickness-reduced hollow portion 21, thus reducing the distance between the upper and lower surfaces of the thickness-reduced hollow portion 2 丨 and thus extending from the thickness-reduced hollow portion 2 丨 the upper surface to the The lead length around the bottom of the resin substrate 16 becomes smaller. A reduction in the length of the lead 14 reduces its inductance. The decrease in the inductance of the lead wire 14 makes it easy to cause poor high-frequency losses in the semiconductor device. In addition, each of the leads 14 includes a middle inclined portion. This oblique extension also helps to further reduce the length of the lead wire 14 passing through the resin substrate 16. Further reduction in the length of the lead 14 further reduces its inductance. The further reduction of the inductance of the leads makes it easy to further suppress the high-frequency loss of the high-frequency semiconductor device. The structural characteristics may effectively reduce the height of the cover 20 while ensuring a sufficient space to accommodate the holes 2 in the semiconductor wafer. This effectively reduces the overall height of the package. In addition, the cover joint surface 26 and the substrate joint surface 28 are closely meshed with each other,

Page 24 556330 V. Description of the invention (21) The inclined surface or non-hydraulic alignment of the cover 20 and the alignment function makes it possible to avoid any excessive installation. 10 The external shape of the line does not produce any mass production and bulge. The peripheral portion 22 extends from the joint surface 28 to the joint surface 28 of the substrate. This is helpful and each of the cover bonding surface 26 and the substrate bonding surface 28 includes a flat surface, and the automatic alignment function from the resin substrate 16 is caused by the weight of the cover 20 itself. This kind of automatic uses the automatic assembly method to perform the automatic assembly method, the manual precision. The automatic alignment function described above makes the seal defective. The defect-free external shape of the package 10 breaks the metal badly. The above-mentioned automatic alignment function can also be used to improve the yield of the final product. In addition, the lid joint surface 26 extends inside the flat surface of the resin substrate 16. The inner periphery of the lid joint surface 26 extends outside the inner periphery. The interface between the lid joint surface 26 and the substrate is horizontally downward from the uppermost surface of the resin substrate 16 to reduce the total height or thickness of the package 10. : 3 Chuanshuzi / Λ Kotu / Detailed description of the second embodiment according to the present invention. Figure ^ X Λ Λ .0 " / ^ " The package of this second embodiment differs from the package of this embodiment in that it engages the substrate and cover joint surfaces. The package 40 having a cavity structure includes a resin substrate 42, a semiconductor m, and a cover 44. The resin substrate 42 further includes the crystal grains 12 and the four ridges 1 to 14. The resin substrate 42 includes a reduced-thickness hollow portion 43 of the hollow portion 43. The raised peripheral portion 45 extends annularly around the thickness-reducing sigma blade 43. Water on the upper surface of the reduced thickness hollow portion 43

Page 25 556330 V. Description of the invention (22) Leveling lower than the uppermost part of the perimeter of the hump 45 as a solder barrier, so that the flux does not enter thick. The perimeter of the hump 45 surrounds the hump. The flat surface, an inward downward inclined surface, and a flat surface are joined to the inward downward inclined surface, the outer side of the inner wall and the inner downward inclined surface, which are flatter than the upper surface of the thickness-reduced hollow portion 43. The inwardly downward sloping surface engages the floor. The inwardly downward sloping surface extends on the flat inner side. The flat surface is bonded between the walls. The flat surface extends inwardly and downwardly. The plan view of the flat upland is circularly inclined. The inwardly downwardly inclined plane has a uniformly downwardly inclined plane. = The three-dimensional shape of the downwardly sloping surface is equivalent to the inner surface of a short truncated cone. The first substrate bonding surface 46 for the inward bonding. The flat a second substrate bonding surface 48. The first and the combination provide the bonding substrate bonding surface. The cover 44 is bonded to the first and second substrates, wherein the first and second substrate bonding surfaces 46 and 48 are inclined inwardly and downwardly, and the peripheral portion 4 5 is raised. The raised peripheral portion 45 is reduced in the hollow portion 43. The peripheral portion 43 extends in a ring shape. The inner wall is opposite the outer wall and a flat height. The flat highlands are between. The flat high ground extends at the. The water surface of the flat upland, but its level is lower than that of Tanandi, the outer side of the highland, and the inward-downward sloping surface of the sloping surface. The shape of the surface is circular. From the geometric point of view, the cone-shaped sloping surface faces down the sloping surface. It is also mentioned that the second substrate is connected to a flat surface and the flat surface inclined surface and the outer and inner cross-sectional views of the outer wall have no band shape. From this perspective, a part of this orientation is provided for joining or adhering with the cover 4 4 and the cover 44 with the joint surfaces 46 and 48 surfaces 46 and 48 respectively including the resin substrate 4 2, so the resin substrate 4 2 and

Page 26 556330 V. Description of the invention (23) The cover 44 collectively defines the cavity containing the semiconductor wafer 18 and helps reduce parasitic inductance. The cover 44 includes a dish-shaped body 47 * = a cavity also having a portion 49 which extends in a ring shape around the circumference of the dish-shaped body 47; the surrounding body 47 is usually flat and flat from Shen-J. This ridge, the dish-shaped main grease substrate 42 bulges. The knife 49 is directed downward and toward the tree. The surrounding area 49 of the bulge includes an inner wall, a flat bottom, and an inclined surface inward and downward, as the wall and "joined with the resin substrate 42, with the inner wall facing downward. The bottom bracket = joint between the inwardly and downwardly inclined surface of the cover. The flat bottom surface extends at: the side and the inwardly downwardly inclined surface. The downwardly inclined surface is shaped like a circular belt by the lower and lower inclined surface. The flat surface is joined to the outer wall of the ridge. From the bottom view, the inward downward slope is a circular strip. From a geometric point of view, the three-dimensional shape of the inward downward slope is like a cone. Part, in other words, the outside of the truncated cone.

The inwardly and downwardly inclined surface of the cover 44 provides a first cover engaging surface 50 which is aligned with and fused with the first substrate engaging surface 46 of the resin substrate 42. The flat bottom surface of the cover 44 provides a second cover-engaging surface 52, which is aligned with the second substrate-engaging surface 48 of the resin substrate 42 and fused. The first cover engaging surface 50 has a uniform inclination angle, which is the same as the above-mentioned uniform inclination angle of the first resin substrate 46, so that the first cover engaging surface 50 and the first substrate engaging surface 46 are closely contacted and engaged. The second cover-engaging surface 52 has no inclination angle, and is the same as the above-mentioned second substrate-engaging surface 48. Therefore, the second cover-engaging surface 52 and the second substrate-engaging surface 48 are in close contact and mesh with each other. As illustrated in detail, the width of the second cover joint surface 52 may be selectively

Page 27 556330 V. Description of the invention (24) The first substrate bonding surface 48 is narrow. The above-mentioned package 40 provides the following advantages. The same as the first embodiment, the thickness is reduced by the hollow portion = the cavity 24 of the body wafer 18, while the resin substrate 42 = the small interval or thickness is reduced, so the total height or thickness of the seal is changed: & The thickness of the hollow portion of the semiconductor wafer 18 is reduced to bulge the solder barrier of the surrounding portion 45 to prevent the flux from entering the cavity so that the electrical characteristics and performance of the packaged semiconductor device are not reduced. 43 24 & The thickness of the upper surface of the semiconductor substrate 18 with the thickness of Doubu Qiu Ba = ° 卩 / knife 43 is lower than the uppermost surface of the resin substrate 42's ridges αA. This kind of structural characteristics is conducive to avoid improper flux. 0 = 乂 4. In other words, the raised peripheral portion 45 serves as a flux barrier θ: 7 The same as in the seventh embodiment, the inward mrm ^ ^ f of the first cover joint surface 50 of the substrate joint surface 46 on the raised peripheral portion 45 is the flux P On the outer side of the early wall, there are ancient, i, one mob, two c, and quilt. This makes it difficult for the flux to reach the interface between the first and second joint surfaces 50, ^ ± κ, ^ ^ ^ ^ /, and the first substrate joint surface 46, thereby avoiding entering the cavity 24. The interface between the a-side 50 and the first substrate joint surface 46 is also the first Si * Sale 1 # y to reduce the thickness reduction A, the above structural characteristics can also effectively reduce the hollow portion 43 ;: "The thickness of the knife 43 ' In this way, the distance between the I-surfaces on the thickness-reduced hollow portion 43 is reduced, so that the lead extending from the thickness surface to the periphery of the bottom of the resin substrate 42 is reduced.

Page 28 556330 V. Description of the invention (25) Electric wire 5 ί f: Shortening the length of the lead wire 14 will reduce its inductance. The electric charge of the lead 14 easily suppresses the high-frequency loss of the high-frequency semiconductor device. The sufficient * two G characteristics can further effectively reduce the height of the cover while ensuring that the semiconductor wafer 18 is housed in a reduced space. This effectively reduces the overall height of the remote package. The first cover joint surface 50 and the first substrate-joint surface 46 are tightly tilted toward each other. Surface: Each of the first substrate-joint surfaces 46 and the first substrate-joint surface 46 includes a dynamic alignment. Alignment work = etch ... The automatic alignment function of the resin substrate 42. This kind of automatic does not require r / server: the automatic assembly method is to use an automatic assembly machine, and the manual precision of the second and second j 3 :. The above automatic alignment function makes the seal i $ 1 ^ 4,, and defects. The defect-free outer shape of the package 40 causes the gold to be broken. The above-mentioned automatic alignment function can also be used to improve the yield of the final product. Shout 2 outside and cover: The cover joint surface 52 and the second substrate joint surface 48 are tightly coupled to each other-each of the two cover joint surfaces 52 and the second substrate joint surface 48 is packaged -A: then = makes it easy to At least one of the second cover joint surface 52 and the second plate joint surface 48 is coated with an adhesive grease substrate 42. This helps to improve the package interface 44 and the third embodiment. The enlarged cross-sectional view of the internal structure according to the present invention will be described in detail with reference to the drawings. The package of this third embodiment: the first package and the implementation of the package 556330 V. Description of the invention (26) The difference in the package in the example is the joint surface of the substrate and the cover. The package 60 with a free structure includes a resin substrate 62, a semiconductor: and a cover 64. The resin substrate 62 further includes a die pad 12 and four "pan and wires 14." The resin substrate 62 includes-a thickness reduction hollow part factory method, and a raised portion 65. The raised portion 65 surrounds the thickness reduction = The working portion 63 extends in a ring shape. The thickness-reduced hollow portion ㈡'s upper surface is on the top of the bulge surrounding portion 65. The bulging surrounding portion 65 = acts as a solder barrier 'so that the flux does not enter the thickness reducing hollow portion M, and the perimeter of the bulging The part 65 surrounds the bulge and the surrounding part 63 ring = the surrounding part 65 includes an inner wall and an outer wall opposite to the inner wall: a 2 b downward inclined surface. The outward downward inclined surface is tied to the inner and outer walls; 2 = b inclined downward The plane is outside the inner wall and the outer wall: The plan view of the inclined surface is a circular band. :: The three-dimensional shape is equivalent to the outer part of a truncated cone of u to c. The inclined surface of the stomach downwards == plate joint面 66。 /, the base of the cover joint The cover 64 is joined or adhered to the substrate joint surface 66 or the adhesive surface 66 includes a facing surface of the raised peripheral portion 65 of the resin substrate 62, so the resin substrate 62 and the cover 64 jointly define the contents ^ ' 18 的 孔 24. ㉟void also helps to reduce, '. ==: the plate-shaped body 67 and-the bulging peripheral portion 69, the ring ^ ⑽ includes-the surrounding ring extends. The dish-shaped body 67 is generally shaped as the main body 67 The towel brother is ten and thin. The uplift week

Page 30 556330 V. Description of the invention (27) The surrounding portion 69 is downward and protrudes toward the resin substrate 62. The bulging peripheral portion 69 includes an inner wall, an outer wall opposite to the inner wall, and an outwardly inclined surface. The prerequisite is that the cover 64 is connected to the resin substrate 62 with the inner wall facing downward. The outwardly and downwardly inclined surface is joined between the inner and outer walls. The outward-downward inclined surface extends between the outside of the inner wall and the inside of the outer wall. In a bottom view, the outwardly downwardly inclined surface is in the shape of a circular band. From a geometric point of view, the three-dimensional shape of the outwardly downwardly sloping surface corresponds to the inner surface of a part of a circular cone, in other words, the inner surface of a truncated cone. The outwardly downwardly inclined surface of the cover 64 provides a cover engaging surface 68 which is aligned with and engages with the substrate engaging surface 66 of the resin substrate 62. The cover joint surface 68 has a uniform inclination angle, which is the same as the uniform inclination angle of the above-mentioned substrate joint surface ⑽. Therefore, the cover joint surface 68 and the substrate joint surface 66 are in close contact with each other. As shown in the detailed diagram, the joint surface 6 6 is narrow. In other words, the inside of the face 66 is outside, and the inside of the face 66 is outside. It may be more selective than the substrate. The periphery of the substrate is located on the substrate. The width of the cover interface 68 is the same as that of the cover surface 68. The above package 60 provides the following advantages. The thickness-reduced hollow portion 63 contributes to the formation of the semiconductor wafer 1 8: hollow ▲ cavity 24 ′. At the same time, the height or thickness of the resin substrate 62 and the cover 64: small, so the total height or thickness of the package becomes smaller. The upper surface of the thickness-reduced hollow portion 半导体 on which the semiconductor wafer 18 is mounted is the uppermost portion of the raised peripheral portion 65 of the resin substrate 62. This structural characteristic helps to prevent the flux from entering the cavity 24. The surrounding area 65 is used as a barrier, which surrounds the semiconductor wafer.

P.31 556330 V. Description of the invention (28) Degree of reduction of hollow part 63. The solder barriers around the ridges 65 prevent the solder from entering the cavities 24. In this way, the electrical characteristics and performance of the packaged semiconductor device are not impaired. In addition, the width of the cover bonding surface 68 may be narrower than that of the substrate bonding surface 66. In other words, the outer periphery of the lid joint surface 68 is inside the outer periphery of the substrate joint surface 66, and the inner periphery of the lid joint surface 68 is outside the inner periphery of the substrate joint surface 66. This structural feature enhances the automatic alignment function. If the cover 64 is placed on the resin substrate 62 out of alignment, the wide substrate joining surface 66 will abut against the cover joining surface 68 and automatically align the cover 64 with the resin substrate 62. μ

The above structural characteristics also help to effectively reduce the thickness and thickness of the hollow portion 63, so that the distance between the upper and lower surfaces of the thickness-reduced hollow portion 63 becomes ^, so that it can be shortened from the upper surface of the thickness-reduced hollow portion 63 to the tree moon purpose 62 The length of the lead 14 around the bottom. The shortened length of the lead wire will reduce its inductance. The reduced inductance of the lead wire 14 makes it easy to suppress the bad high frequency loss of the high frequency and half. The cavity 24 of the body wafer 18. This can effectively reduce the above structural characteristics while ensuring sufficient space to accommodate the semiconductor. Then, the height of the cover 64 is further lowered to lower the total height of the package.

And the cover is in contact with the mating surface 68 and the substrate bonding surface 66, which are closely meshed with each other. The cover 64: the plate bonding surfaces 66 each include the inclined surface or the non-water plate. The two-action alignment function of the quasi-cover 64 and Shuyue moving assembly machine makes it possible to achieve accuracy. on? "Automatic assembly method" 丨 needs any person who is too high J, L alignment function makes the package 60 external shape without defects,

Page 32 556330 V. Description of the invention (29) The defect-free external shape of the package 60 prevents the metal wire from causing any undesirable disconnection. The above-mentioned automatic alignment function can also be used for mass production, and it can change the yield of the final product. In addition, the substrate bonding surface 66 has an inner extension region, which further extends from the inner periphery of the cover bonding surface 68 in an upward direction. The sloping outwardly inclined plane provides that maximum height outside the solder barrier. It is assumed that due to the capillary phenomenon, a part of the flux passes through the interface between the substrate joint surface 66 and the cover joint surface M. The internal extension area of the substrate joint surface 66 makes it difficult for the portion to climb inward along the internal extension area. a

24th Embodiment: A fourth embodiment according to the present invention will be described in detail with reference to the drawings. Temple 5 is an enlarged cross-sectional view of the internal structure of a novel seal having a cavity structure according to a fourth embodiment of the present invention. The difference in the package of the " example " of this fourth embodiment is that the substrate and the cover are bonded to each other. The package 70 having a cavity structure includes a chip 18 and a cover 74. A group of leads 14. The ring-shaped flattening with the perimeter portion 75 of the hollow portion 73 is lower than the perimeter of the ridge as a solder barrier, so that the perimeter portion of the ridge, the perimeter portion of the ridge 75 is resin-based, the resin substrate 72 further includes a resin substrate 72, and includes a thickness. The perimeter of the bulge 75 is extended. The thickness-reduced hollow portion 75 is the uppermost portion. The bulge flux does not enter the thickness reduction section 75. It surrounds the perimeter of the bulge including the inner wall, and the crystal pads 12 and four reduced hollow sections are formed around the upper surface of the thickness reduction section 73. The hollow section 73 surrounds the inner wall. Inner division 7 3 annular extension to outer wall as well

556330

Round groove. The circular groove is circular. The plan view of the circular groove is circular and arched. From the geometric point of view, the lower half of the f-ring. The circular concave surface 7 6. Between the outside of the inner wall and the inside of the outer wall. Ribbon. A cross-sectional view of the circular groove. The three-dimensional shape of the circular groove is equivalent to that of the groove. The substrate is provided for joining with the cover 74. The cover 74 includes a resin substrate 72. The cavity also has a bulge-shaped extension. The 79 points are bulged to a circular bulge, and the inner wall faces up. The sloping surface is attached. The substrate joint surface 7 6 is a circular groove, so the cavity 24 of the tree wafer 18. The dish-shaped body 77 and the ring surrounding the dish-shaped body 77 are thinner. The inner wall of the bulging peripheral portion is bonded to the outer wall and the base plate 72, and is bonded to each other. Looking at the circular bulge,

The substrate 74 is bonded to or adhered to the bulging peripheral portion 75 of the substrate 72, and the cover 74 defines the accommodating semiconductor to help reduce parasitic inductance. The cover 74 covers the portion 79, and the perimeter of the bulge is generally flat and downward and bulges toward the resin substrate 72. The surrounding portion 79 includes an inner wall, and its preconditions are covered 74 and under the tree. The side-circle bulges are in the shape of circular bands on the inner and outer walls. From a geometric point of view, the volume corresponds to the lower half of the ring

The circular protrusion of the cover 74 provides a cover engaging surface 78 which is aligned with and engages with the substrate engaging surface 76 of the resin substrate 72. The lid joint surface 78 has a curvature which is substantially the same as the central region of the above-mentioned substrate joint surface 76, so that the lid joint surface 78 and the substrate joint surface 76 are in close contact and engaged with each other. As illustrated in detail, the width of the lid bonding surface 78 is narrower than that of the substrate bonding surface 76. The substrate bonding surface 76 has an internal extension region which extends from the inside of the cover bonding surface 78 so as to further extend inward and upward. Suppose that due to capillary phenomena,

Page 34 556330 V. Description of the invention (31) A part of the flux passes through the internal extension area of the substrate joint surface 76 and the cover joint surface 78. The substrate joint surface 76 causes the part of the flux to report on the f side, and the partial extension area climbs up. In this way, it is ensured that the solder does not enter the dielectric / σ? The aforementioned package 70 provides the following advantages. Within twenty-eight. The thickness-reduced hollow portion 73 helps to form the cavity 24 to be accommodated, and at the same time, the height of the resin substrate 72 and the cover 74 or the sheet 18 is reduced, thus reducing the total height or thickness of the package. The thickness of the female semiconductor wafer 18 is reduced by reducing the thickness of the hollow portion μ, which is lower than the raised peripheral portion 75 f2 of the resin substrate 72, and the surface water = the surrounding portion 75 is a barrier for the agent, which surrounds the barrier It is possible to prevent the flux from entering the cavity 24. For example, the electrical characteristics and performance of the conductor device are weakened. /, Half wave In addition, the circular concave shape of the substrate joint surface 76 merges from above and the excessive portion of the adhesive used keeps the excessive portion of the flux from entering, and is adhered with the adhesive. Adhesion of the light to the + conductor wafer 1 8 The above structural characteristics can also effectively reduce the thickness of the pseudo-pigment & thus shorten the thickness reduction and reduce the loss, so that the hollow portion is reduced from the thickness. The length from the lead 14 around the bottom is shortened ^ Line 14: $ ⑷ 日 Substrate 72 2 High = The inductance is reduced to make it easy to suppress the high

Page 35 556330 V. Description of the invention (32) The right ΐ ΐ structural characteristics can ensure that the cavity 24 "two 1 I 'of the semiconductor wafer 18 is further reduced to further reduce the height of the cover 74. This can effectively reduce the overall height of the package ^ ^ ^ The lid joint surface 78 and the substrate joint surface 76 are closely meshed with each other, and the base joint surface 76 includes a circular hump and a circular groove. ^ Automatic f + ia weight causes the lid 74 to automatically align with the resin Substrate 72 This automatic alignment function makes it possible to use an automatic assembly machine for the automatic assembly method, without any need for excessive manual precision. The alignment function makes the package 7 ° external shape without defects. "Upper:;, = The external shape does not cause any bad breaks in the metal wire: i; the automatic alignment function can also be used for mass production, and improve the width of the final product-surface = right cover helical surface 78 It is narrower than the substrate joint surface 76. The substrate joint extension area 2 extends from the inner periphery of the cover joint surface 78 by Qi Baqi and i °. Without a capillary phenomenon, the flux passes through the substrate joint surface with a trowel. The interface between 76 and the cover joint surface 78, the beauty;: 7 向 延Zone so that the part of the flux does not climb along the direction of the extension "°". This ensures that the flux does not enter the cavity. Fifth Embodiment 2 The second embodiment of the present invention will be described in detail with reference to the drawings. The fifth embodiment. The figure is an enlarged cross-sectional view of a novel internal structure with a cavity structure according to the fifth embodiment of the present invention. The difference between the package of the fifth embodiment and the package of the first and the embodiment is that the substrate and the cover are joined surface.

556330 V. Description of the invention (33) The package 80 having a cavity structure includes a resin substrate g2, a semiconductor wafer 18, and a cover 84. The resin substrate 82 further includes a die pad 12 and four sets of leads 14. The resin substrate 8 2 includes a reduced thickness hollow portion 8 3 and a raised peripheral portion 85. The raised peripheral portion 85 extends annularly around the thickness-reduced hollow portion 83. The level of the upper surface of the thickness-reduced hollow portion 8 3 is lower than the uppermost portion of the raised peripheral portion 85. The raised peripheral portion 85 serves as a solder barrier so that the solder does not enter the thickness-reduced hollow portion 83.

The raised peripheral portion 85 extends annularly around the raised peripheral portion 83. The helical perimeter 85 includes an inner wall, an outer wall opposite to the inner wall, and a V-shaped groove. The V-shaped groove is joined between the inner and outer walls. The v-shaped groove extends outside the inner wall and inside the outer wall. The plan view of the V-shaped groove is a circular band. The cross section of the V-shaped groove is V-shaped. The v-shaped groove provides a substrate-engaging surface 86 to which the cover 84 is engaged. The cover 84 is bonded or adhered to the substrate bonding surface 86, which includes the V-shaped groove of the bulged surrounding portion 85 of the resin substrate 82. Therefore, the resin substrate 82 and the cover 84 jointly define the cavity 24 for receiving the semiconductor wafer 18 28 also helps to reduce parasitic inductance. The cover 84 includes a dish-shaped body M and: a raised peripheral portion 89 that extends in a ring around the dish-shaped body 87. The dish-shaped body 87 is generally flat and Thinner. The raised perimeter portion 89 is downward and bulged toward the resin substrate 82. A raised perimeter portion 89 includes an inner wall, an outer wall opposite to the inner wall, and a > v-shaped bulge, and its prerequisite is that the cover 84 is engaged with the resin substrate 82. And: the inner wall of the hay is facing down. The v-shaped ridge is connected between the inner and outer walls. The V-shaped ridge is located outside the inner wall and inside the outer wall U. The bottom view of the V-shaped ridge is round

Page 37 556330 V. Description of the invention (34) Band-shaped. The V-shaped ridge of the cover 84 provides a cover engaging surface 88 which is aligned with and engages with the substrate engaging surface 86 of the resin substrate 82. The cover bonding surface 88 has an angle which is substantially the same as the angle of the above-mentioned substrate bonding surface 86, so that the cover bonding surface 88 is in close contact with the substrate bonding surface 86 and is engaged. As illustrated in detail, the width of the lid bonding surface 88 is narrower than that of the substrate bonding surface 86. The substrate bonding surface 86 has an internal extension region which extends from the inside of the cover bonding surface 88 so as to further extend inward and upward. It is assumed that due to the capillary phenomenon, a part of the flux passes through the interface between the substrate bonding surface 86 and the cover bonding surface 88, and the internal extension of the substrate bonding surface 86 makes it difficult for the solder to climb along the internal extension. This ensures that the flux does not enter the cavity. The aforementioned package 80 provides the following advantages. The thickness of the cavity 24 is reduced, so the mounting level can be lower than the tree, and there can be bumps around the body wafer. The agent barrier can be a conductive device. In addition, the height and thickness of the resin substrate 82 and the cover 84 are reduced, respectively. Total height or thickness. The thickness of the semiconductor wafer 18 is reduced to the upper surface of the raised peripheral portion 85 of the upper surface of the hollow substrate 83. Advantageously, the flux is prevented from improperly entering the cavity 24. change! : Structure: The part 85 is used as the barrier f of the flux, and its ring;: The thickness is reduced to the hollow part 83. The J has 2 to prevent the flux from entering the cavity 24. So disagreeable] The electrical characteristics and performance of the 2: 8 weld are weakened. 40% of the package half of the substrate, the V-shaped groove of the substrate bonding surface 86 will intercept the excessive use of adhesive, '" hold the flux to avoid the adhesive and the adhesive used

Page 556 330

Excessive part of the agent enters the cavity 0 and avoids sticking to the semiconductor wafer 1 8

The thickness Ϊ = Ϊ can also effectively reduce the separation of the thickness reduction hollow portion, centimeter = the distance between the upper and lower surfaces of the thickness reduction hollow portion 83 from the bottom circumference: m wide reduction middle portion 83 upper surface extends to the resin substrate 8: Introduction 1 4 "4 The length is short. Shortening the length of the lead 14 will reduce 1 Defective high = lower inductance makes it easy to suppress the holes 24 of the high-frequency semiconductor package D body wafer 18. This effectively reduces

The above structural characteristics can further reduce the height of the cover 84 and the total height of the package while ensuring a sufficient space for accommodating the semiconductor. #Additionally, the cover joint surface 8 8 and the substrate joint surface 86 are closely meshed with each other, and the cover joint surface 88 and the substrate joint surface 86 include a ν-shaped protrusion and a ν-shaped groove, which is caused by the weight of the cover 84 itself. The cover 84 automatically aligns with the automatic alignment function of the resin substrate 82. This automatic alignment function makes it possible to use an automatic assembly machine for an automatic assembly method without any need for excessive manual precision. The automatic alignment function described above makes the package 80 free from defects in external shape. The defect-free external shape of the package 80 allows the metal wire to not cause any undesirable disconnection.

The automatic alignment function described above can also be used for mass production and improve the yield of the final product. The width of the lid bonding surface 88 is narrower than that of the substrate bonding surface 86. The substrate joint surface 86 has an inner extension region extending from the inner periphery of the cover joint surface 88 inwardly and upwardly. It is assumed that due to the capillary phenomenon, the flux partially passes through the interface between the substrate bonding surface 86 and the cover bonding surface 88, and the substrate bonding

Page 39 556330 V. Description of the invention (36) The internal extension area of the joint surface 86 makes this part of tincture not compatible with the VL — area to climb the well inward 5 = 1 丨 not seven of which the internal extension rises. This mouth protects the solder flux from entering the cavity. The sixth effect will be explained in detail with reference to the drawings. According to the 7th series, according to the present invention, the first and second embodiments of the present invention will be described. In the example of the novel package with an enlarged cross-section of the internal structure, the seal is recognized as m / z. The package of the embodiment differs from the first embodiment in the joint surface of the substrate and the cover. The package of η space 2 structure 9 ° includes a resin substrate 92, -Semiconductor: Group lead: 1 2 4 This resin substrate 92 further includes a die pad 12 and four ridges _ ® substrate 92 includes-thickness reduction hollow The portion 93 is hollow H ^ t The perimeter portion 95 of the hump extends around the thickness-reduced Deng knife 93 in a U-shape. The upper surface water of the thickness-reduced hollow portion 93 rises to the top of the surrounding portion 95. The perimeter portion 95 of the hump is a barrier for the flux so that the flux does not enter the thickness-reduced hollow portion. ^ The perimeter portion 95 of the hump extends annularly around the perimeter portion 93 of the hump. Opposite the outer wall and a trapezoidal groove. The trapezoidal groove is joined between the inner and outer walls. The trapezoidal groove extends outside the inner wall and the inner wall of the outer wall. The plan view of the trapezoidal groove is a circular band. The trapezoidal groove The cross-sectional view of the groove is trapezoidal. The trapezoidal groove provides a substrate joint surface 96 that is engaged with the cover 94. The trapezoidal groove as the substrate joint surface 96 further includes an inwardly inclined surface, a flat bottom surface, and an outwardly downwardly inclined surface. The inward downward slope is joined between the outer wall and the flat bottom surface. The inward downward slope is located on the flat surface

Page 40 556330 V. Description of the invention (37) Between the outside of the bottom surface and the inside of the outer wall. The inward tilting mask has a uniform tilt angle. The flat bottom surface is joined between the inwardly downwardly inclined surface and the outwardly downwardly inclined surface. The flat bottom surface is located between the outside of the outwardly downwardly inclined surface and the inside of the inwardly downwardly inclined surface. The flat bottom mask has a horizontal plane. The outwardly sloping surface engages between the inner wall and the flat bottom surface. The outward downward slope is located between the inside of the flat bottom surface and the outside of the inner wall. The $ outside tilting mask has a uniform tilting angle. This inwardly and downwardly inclined surface provides a first substrate bonding surface 96a. This flat bottom surface provides a second substrate bonding surface 96b. The outwardly downwardly inclined surface provides a third substrate bonding surface 96ε. Above

The substrate bonding surface 96 further includes first to third substrate bonding surfaces 96 &, 96b and 96c. ', F 94 is bonded or adhered to the substrate bonding surface 96, which includes the trapezoidal groove of the bulging surrounding portion 95 of the resin substrate 92, so the tree = the substrate 92 and the cover 94 together define the space for accommodating the semiconductor wafer 18.孔 24。 24 holes. This hole also helps reduce parasitic inductance. The cover 94 includes a dish-shaped body 97 and a raised peripheral portion 99, and the raised peripheral portion is looped = extended around the dish-shaped body 97. The dish-shaped body 97 is generally both flat and thin. The bulging peripheral portion 99 is bulged downward and toward the resin substrate 92. The bulging peripheral portion 99 includes an inner wall, an outer wall opposite to the inner wall, and a f-step f bulge, and its precondition is that the cover 94 is joined to the resin substrate 92 with the inner wall facing downward. The trapezoidal ridges are joined between the inner and outer walls. The trapezoidal ridge is located between the outside of the inner wall and the inside of the outer wall. The bottom view of the trapezoidal hump is a circular band. The trapezoidal elevation of the cover 94 provides a cover joint surface 98, which is in contact with the resin substrate "

556330 V. Description of the invention (38) The substrate joint surface 96 is aligned and engaged. The cover bonding surface 98 has an angle which is substantially the same as the angle of the above-mentioned substrate bonding surface 96, so that the cover bonding surface 98 is in close contact with the substrate bonding surface 96 and engages. The trapezoidal protrusion as the cover engaging surface 98 further includes an inwardly inclined surface, a flat bottom surface, and an outwardly inclined surface. The inwardly and downwardly inclined surface joins between the outer wall and the flat bottom surface. The inward downward slope is located between the outside of the flat bottom surface and the inside of the outer wall. The inwardly and downwardly inclined mask has a uniform inclination angle, which is the same as the inwardly and downwardly inclined surface of the trapezoidal groove 96. The flat bottom surface is joined between the inwardly downwardly inclined surface and the outwardly downwardly inclined surface. The flat bottom surface is located between the outside of the outwardly downwardly inclined surface and the inside of the inwardly downwardly inclined surface. The flat bottom mask has a horizontal plane. The outwardly sloping surface engages between the inner wall and the flat bottom surface. The outward downward slope is located between the inside of the flat bottom surface and the outside of the inner wall. The tilting mask outwardly and downwardly has a uniform tilting angle, which is the same as the tilting angle of the trapezoidal groove 96. This inwardly and downwardly inclined surface provides a first cover engaging surface 98a. This flat bottom surface provides a second cover engaging surface 98b. The outwardly downwardly sloping surface provides a third cover engaging surface 98c. The cover engaging surface 98 further includes first to third cover engaging surfaces 98a, 98b, and 98c. The first cover joint surface 98a is engaged with the first substrate joint surface 96a. The second cover joint surface 98b is engaged with the second substrate joint surface 96b. The third cover bonding surface 98c is coupled to the third substrate bonding surface 96c. As illustrated in detail, the width of the lid bonding surface 98 is narrower than the substrate bonding surface 96. The substrate bonding surface 96 has an internal extension region which extends from the inside of the cover bonding surface 98 to extend inwardly and upwardly. Suppose that due to capillary phenomena,

556330 V. Description of the invention (39) A part of the flux passes through the internal extension area of the substrate joining surface 9 and the substrate joining surface 96 so that the interface between the joining surfaces 98 is partially extended. This ensures that 4 = it is difficult for the sub-flux to provide the following along the above package 90; it will not enter the cavity. The thickness of the hollow portion 9 3 is reduced to the right 24, while the resin substrate 92 and the cover $ ::: 5 are reduced by 8 ”, so that the total height or thickness of the package is reduced by 2 to 5 mm. The thickness of the semiconductor wafer 18 is lower than the height of the resin substrate 92, which can prevent the flux from entering the cavity 24 improperly. Changshi = ^ Weibu Guang 95 is used as a barrier to the flux, which surrounds the thickness of the "half; ::: 18 to reduce the hollow portion 93. The surrounding part of the bulge: Mouth: two; flux-free into the cavity 24. So It will not cause the electrical characteristics and performance of the package to be broken. The trapezoidal grooves of the dry 1 and 2 I 'substrate junction surface 96 will intercept or retain the flux = = = part of the flux and used = on. It can also reduce the thickness of the hollow portion 9 3 Ϊ, which can effectively reduce the thickness of the hollow portion 9 3 述, and avoid the adhesion to the semiconductor wafer 1 8 ^ The structural characteristics can also reduce the distance between the upper and lower surfaces of the hollow portion 93. Reducing the length of the upper surface of the hollow portion 93 extending to the resin-based lead wire 14 is shortened. The shortened length of the lead wire 14 will reduce its ^^ The reduction in the inductance of the lead wire 14 makes it easy to suppress the high frequency semiconductor loss. Page 43 556330

The above-mentioned structural characteristics can further reduce the overall height of the package 94 lower than the package 94 while ensuring sufficient space for accommodation. Cavities 24 of the semiconducting ancient body wafer 18. This effectively reduces the accuracy of the cover assembly slot, of which the plate 92 is automatically assembled. Open circuit on package 90. The production surface 98 of the above product: The surface 98 and the substrate joint surface 96 are closely meshed with each other, and the = 2 plate connection surface 96 includes a trapezoidal ridge and a trapezoidal concave moving cake. It is heavy *, which causes the cover 94 to automatically align with the resin base , Alignment function. This automatic alignment function makes it possible to use

The automatic assembly method of the device does not require any overly manual manual elaboration of the automatic alignment function, so that the package 90 has no defect in the external shape. The non-defective external shape enables the metal wire to be produced without any undesirable features. The auto-alignment function can also be used for mass production and improve the final rate. In addition, the width of the lid joint surface 98 is narrower than that of the substrate joint surface 96. The substrate joint surface 96 has an inner extension region extending from the inner periphery of the cover joint surface 98 inwardly and upwardly. It is assumed that due to the capillary phenomenon, a part of the flux passes through the interface between the substrate bonding surface 96 and the cover bonding surface 98, and the internal extension area of the substrate bonding surface 96 prevents the part of the flux from going along the internal extension area to the Climb inward. This ensures that the flux does not enter the cavity.

In addition, the combination of the second substrate bonding surface 96b and the second cover bonding surface 98b makes it easy to apply an adhesive to at least one of the second substrate bonding surface 96b and the second cover bonding surface 98b to bond the cover 94 and the resin substrate 92. . This helps to improve the productivity of the package 90. Seventh embodiment:

Page 556 330

A seventh embodiment according to the present invention will be described in detail with reference to the drawings. Fig. 8 is an enlarged cross-sectional view of the internal structure of a novel package having a cavity structure according to a seventh embodiment of the present invention. The difference between the package of the seventh embodiment and the package of the first embodiment is the joint surface of the substrate and the cover.

A package 100 having a cavity structure includes a resin substrate 102, a half of the conductor wafer 18, and a cover 104. The resin substrate 002 further includes a die pad 12 t and four sets of leads 14. The resin substrate 02 includes a thickness reduction medium = Deng Wei 103 and a portion around the bulge 105. The perimeter of the hump 105 surrounds f. The thickness of the hollow portion is reduced to 103 in a ring shape. The upper surface level of the thickness-reduced hollow portion 103 is lower than the uppermost portion of the raised peripheral portion 105. The perimeter of the bulge 105 serves as a solder barrier so that the solder does not enter the thickness-reduced hollow portion 103. The raised peripheral portion 105 surrounds the raised peripheral portion 103 in an annular extension 4, and the raised peripheral portion 105 includes an inner wall, an outer wall opposite to the inner wall, and a circular raised portion. The circular bulge is joined between the inner and outer walls. The circular bulge is located between the outside of the inner wall and the inside of the outer wall. The cross section of J = ... is 梹 -shaped. The circular bump k is a substrate bonding surface 106 for bonding to the lid 104. The 10R spoon lid has a substrate joint surface 106 that is bonded or adhered. The substrate joint surface is a round bulge of the perimeter 105 of the ridge of the tree / beauty H plate 102. Because of the joint definition with the cover 104, the semiconductor wafer 18 is contained. Zhikong Post 4. The cover 104 includes a dish-shaped body 107 and a raised peripheral portion 109 ^ 07 〇 i ^ ^ ^ ^ ^ ^ The side-release body 107 is generally flat and relatively flat.

556330 V. Description of the invention (42) Thin. The bulging peripheral portion 109 is bulged downward and toward the resin substrate 102. The peripheral portion 109 of the groove includes an inner wall, an outer wall opposite to the inner wall, and a circular groove. The prerequisite is that the cover 104 is engaged with the resin substrate 1002, and the inner wall faces downward. The circular groove is joined between the inner and outer walls. The circular groove is located between the outside of the inner wall and the inside of the outer wall. The bottom view of the circular groove is a circular band. The circular groove of the cover 104 provides a cover joint surface 08, which is aligned with and engages with the substrate joint surface 106 of the resin substrate 102. The cover joint surface 108 has a curve 2 which is substantially the same as the central region of the above-mentioned substrate joint surface 106, so that the cover joint surface 08 and the substrate joint surface 106 are in close contact and mesh with each other. As illustrated in detail, the width of the lid joint surface 108 is narrower than the substrate joint surface 106. The substrate ⑽ has an internal extension region, which is further extended from the inside of the cover to the inside. The above package 100 provides the following advantages. The β-thickness reduction of the hollow portion 103 contributes to the formation of the resin accommodating the semiconductor wafer m ′ and the resin The height or thickness of the substrate m and the cover 104 are reduced, respectively, so that the overall height or thickness of the package is reduced. The thickness of the semiconductor wafer 18 is reduced, and the hollow portion 10 is reduced. It can be advantageously avoided that the flux improperly enters the cavity 24. Dragging π is the thickness of the dry conductor plate 18 and reducing the solder barrier of the hollow portion m can prevent the flux from entering the second: the electrical characteristics of the packaged semiconductor device caused by the surrounding With performance so not

556330 V. Description of the invention (43) The above-mentioned j-structure characteristics can also effectively reduce the thickness of the thickness-reduced hollow portion 103 '. Therefore, the distance between the upper and lower surfaces of the thickness-reduced hollow portion 103 is shortened, and the thickness-reduced hollow portion 103 is reduced. The length of the lead 14 extending from the upper surface to the periphery of the bottom of the resin substrate 102 is shortened. The shortening of the length of the lead wire 14 leads to a reduction in the inductance of the lead wire 14 and makes it easy to suppress the low frequency loss of the high-frequency semiconductor device. The cavity 24 of the wafer 18 is thus effective. The above structural characteristics can further reduce the height of the cover 04 while ensuring a sufficient space to accommodate the semiconductor. Reduce the overall height of the package.

In addition, the lid joint surface 108 and the substrate joint surface 106 are closely meshed with each other, and the lid joint surface 108 and the substrate joint surface 106 include circular grooves and circular bulges, which are caused by the weight of the lid itself. Cover 丨 〇4 Automatic alignment function of resin substrate 102. This automatic alignment function makes it possible to use an automatic assembly machine for an automatic assembly method, without requiring any excessively high human accuracy. The above-mentioned automatic alignment function makes the package shape free of defects. The defect-free external shape of the package 100 prevents the metal wire from causing any undesirable disconnection. The automatic alignment function described above can also be used for mass production and improve the yield of the final product. Chapter Eight Implementation The eighth embodiment according to the present invention will be described in detail with reference to the drawings. Fig. 9 is an enlarged cross-sectional view of the internal structure of a novel package having a cavity structure according to an eighth embodiment of the present invention. The difference between the package of the eighth embodiment and the package of the first embodiment is the joint surface of the substrate and the cover.

556330 V. Description of the invention (44) The package 1 1 0 having a cavity structure includes a resin substrate 1 1 2, a half of the semiconductor wafer 18 and a cover 114. The resin substrate 112 further includes a crystal grain 12 and four sets of leads 14. The resin substrate 112 includes a thickness reduction central office portion 113 and a raised peripheral portion 115. The raised peripheral portion 115 surrounds the thickness-reduced hollow portion 1 1 3 and extends in a ring shape. The level of the upper surface of the thickness-reduced hollow portion 113 is lower than that of the uppermost bulge-peripheral portion 115 of the bulge-surrounding portion 115 as a flux barrier, so that the flux does not enter the thick-reduction hollow portion 113. n The perimeter of the ridge 11 5 extends in a ring shape around the perimeter of the ridge 3. The raised peripheral portion 115 includes an inner wall, an outer wall opposite to the inner wall, and a V-shaped raised. The v-shaped ridges are joined between the inner and outer walls. The v-shaped ridge is located between the outside of the inner wall and the inside of the outer wall. The plan view of the V-shaped hump is a circular band. The cross section of the V-shaped hump is V-shaped. The v-shape provides a substrate bonding surface 116 to which the cover 114 is bonded. The cover 11 4 is bonded or adhered to the substrate joint surface 1 丨 6, and the substrate joint 116 includes a ¥ -shaped groove of the bulging and surrounding portion 115 of the resin substrate 112. The resin substrate 112 and the cover 114 jointly define a space for accommodating the semiconductor wafer 18 * ^ 24. This hole also helps reduce parasitic inductance. The cover 114 includes a dish-shaped = eight-body U 7 and a bulging surrounding portion! !! 9. The perimeter of the hump extends annularly around the main body 117. The dish-shaped body 117 is generally flat and relatively flat, and the raised peripheral portion 119 is raised downward toward the resin substrate 112. /. The groove surrounding part 119 includes an inner wall, an outer wall opposite to the inner wall, and a v-shaped groove. The prerequisite is that the cover 114 is joined to the resin substrate 556. 5. Description of the invention (45) and the inner wall faces downward. The V-shaped groove is joined between the inner and outer walls. The v-shaped groove is located between the outside of the inner wall and the inside of the outer wall. The bottom view of the V-shaped groove is a circular band. The V-shaped ridge of the cover 1 1 4 provides a cover joint surface 1 1 8 which is aligned with and engages with the substrate joint surface 116 of the resin substrate 丨] 2. The cover bonding surface 118 has an angle which is substantially the same as the central region of the above-mentioned substrate bonding surface 116, so that the cover bonding surface 1 1 8 is in close contact with and meshes with the substrate bonding surface 丨 6. As illustrated in detail, the width of the lid bonding surface 118 is narrower than that of the substrate bonding surface 116. The substrate bonding surface 116 has an internal extension region extending from the inner periphery of the cover bonding surface 118 to extend inwardly and downwardly. The above package 1 10 provides the following advantages. The thickness of the hollow portion 113 is reduced to help form the cavity 24 for accommodating the semiconductor wafer, and the height or thickness of the resin substrate 112 and the cover 114 are reduced, thereby reducing the total height or thickness of the package. The upper surface of the hollow portion 113 in which the thickness of the semiconductor wafer 18 is reduced L = the raised peripheral portion 1 1 5 of the resin substrate 1 1 2 is the uppermost. Such a structure can advantageously prevent the flux from improperly entering the cavity 24. In other words, F has the surrounding portion 11 5 as a barrier of the flux, which surrounds the thickness of the thin portion 18 and reduces the hollow portion 113. The formation of a wall around the bump prevents the flux from entering the cavity 24. This is not the case; the electrical characteristics and performance of semiconductor devices are reduced. The in // structural properties of in can also effectively reduce the thickness and reduce the distance of the hollow portion, so that the distance between the upper and lower surfaces of the hollow portion 113 is shortened due to the shortness / degree, and the upper surface of the hollow portion 113 is extended to the resin base.

V. Description of the invention (46) ί; Second bottom mine: The lead 14 of Λ is shortened in length. The shortening of the length of the lead wire will reduce the inductance of the device with a high m4, which makes it easy to suppress high-frequency semiconductor charging. The structural characteristics can further reduce the height of the cover 114 while ensuring that the cavity of the semiconductor wafer is 24 = ΐ1. This effectively reduces the overall height of the package. This cover-engaging surface 118 and the substrate-engaging surface 11 6 are closely meshed with each other, and: == 118 and the base "combining surface 116 includes a v-shaped groove and a white cover 2 of the shape-shaped Α 2 2 which weighs I ' * Cover 11 4 Automatic alignment function for automatic alignment of the resin clay plate. This automatic alignment function ^ The machine for automatic assembly method 1 requires any manual accuracy that is too high. The above automatic alignment function makes the package 11 〇The external shape is defect-free. § The package's 110-dimensional defect-free external shape prevents the metal wire from producing any defects. The above-mentioned automatic alignment function can also be used for large-scale manufacturing and improve the yield of the final product. Examples such as the preferred implementation are only used to illustrate the present invention. After the case, 'familiar persons skilled in the art can easily change it, which is an application example accompanying the present invention to describe the present invention, but it must be understood that it has no limitative meaning. Read this application to understand It is within the scope of any patent made in accordance with the present invention. 556330 Brief Description of Drawings Figure 1 is an enlarged cross-sectional view of the internal structure of a novel package with a cavity structure according to the first embodiment of the present invention. Show Figure 3 is a plan view of a newly constructed package. Figure 3 is a cross-section of an internal structure with a package according to a second embodiment of the present invention. Figure 4 is a cross-section of the internal structure of a package with a cavity structure according to a third embodiment of the present invention. Enlarged view. Fig. 5 is an enlarged cross-sectional view of the internal structure of a package with a cavity structure according to a fourth embodiment of the present invention. Fig. 6 is a cross-sectional view of the internal structure of a novel package with a cavity structure according to a fifth embodiment of the present invention. 7 is an enlarged cross-sectional view of an internal structure of a novel package having a cavity structure according to a sixth embodiment of the present invention. FIG. 8 is a diagram of a novel package having a cavity structure according to a seventh embodiment of the present invention. Cross-sectional enlarged view of the internal structure. FIG. 9 is an enlarged cross-sectional view of the internal structure of a novel package having a cavity structure according to an eighth embodiment of the present invention.

[Notation] 10 seals 10 0 packages 102 resin substrates 10 3 hollow parts 104 covers

P.51 556330 Brief description of drawings 105 Raised peripheral part 106 Substrate joint surface 107 Dish-shaped body 108 Cover joint surface 109 Peripheral section 110 Package 112 Resin substrate 113 Hollow section 114 Cover 115 Raised peripheral section 116 Substrate joint surface 117 Dish-shaped body 118 Cover joint surface 119 Peripheral part 12 Die pad 14 Lead 16 Substrate 18 Semiconductor wafer 20 Cover 21 Hollow part 22 Raised peripheral part 23 Dish-shaped body 24 Air-six 25 Raised peripheral part

Page 52 556330 Brief description of the drawing 26 Cover joint surface 2 8 Joint surface 3 0 Upper exposed surface 32 Lower exposed surface 40 Package 42 Resin substrate 43 Hollow portion 44 Cover 45 Bulging surrounding portion 46 First substrate joining surface 47 Dish-shaped body 48 Second substrate joint surface 49 Raised peripheral portion 50 First lid joint surface 52 Second lid joint surface 60 Package 62 Resin substrate 63 Hollow portion 64 Cover 65 Raised peripheral portion 66 Substrate joint surface 67 Dish body 6 8 Lid joint surface 69 Raised Surrounding part

Page 53 556330 Brief description of the diagram 70 Package 72 Resin substrate 73 Hollow portion 74 Cover 75 Swell surrounding portion 76 Substrate bonding surface 77 Dish body 78 Cover joint surface 79 Swell surrounding portion 80 Package 82 Resin substrate 83 Hollow portion 84 Cover 85 Swell Peripheral section 86 Substrate joint surface 87 Dish-shaped body 88 Cover joint surface 89 Swell peripheral section 90 Package 92 Resin substrate 93 Hollow section 94 Cover 95 Swell peripheral section 96 Substrate joint surface

Page 54 556330 Brief description of the drawings 9 6a First substrate joining surface 96b Second substrate joining surface 96c Third substrate joining surface 97 Dish body 98 Cover joining surface 98a First cover joining surface 98b Second cover joining surface 98c Third Cover joint surface 99 around the bulge _

Page 55

Claims (1)

556330 _Case No. 91109650 Amendment_ Sixth, the scope of patent application Even tilt the plane outwards and downwards. 7. For a resin molded package with a cavity structure, such as in claim 3, wherein the first of the cover bonding surface and the substrate bonding surface includes at least one annularly extending convex surface, and the second one includes an annular shape A concave surface that extends and conforms to the convex surface σ. 8. The resin molded package with a cavity structure as claimed in item 7 of the scope of the patent application, wherein the convex surface includes a circular protrusion extending in a ring shape, and the concave surface includes a circle extending in a circle and conforming to the circular protrusion σ.形 槽。 Shaped groove. 9. The resin-molded package having a cavity structure as claimed in claim 8, wherein the cover joint surface includes the circular bulge, and the substrate joint surface includes the circular groove. 10. The resin-molded package having a cavity structure according to item 8 of the application, wherein the cover joint surface includes the circular groove, and the substrate joint surface includes the circular bump. 11. The resin-molded package with a cavity structure as claimed in claim 7 in which the convex surface includes a circularly extending conical ridge, and the concave surface includes a circularly extending cone that engages with the conical ridge. Groove. 1 2. The resin-molded package having a cavity structure according to item 11 of the application, wherein the cover joint surface includes the tapered bump, and the substrate joint surface includes the tapered groove. 13. The resin-molded package having a cavity structure as described in claim 11 in the patent application range, wherein the cover joint surface includes the tapered groove and the substrate joint surface includes the tapered ridge. Page 57 556330 Case No. 91109650 Amendment VI. Patent application scope 14 4. A resin-molded package with a cavity structure such as item 11 of the patent application scope, wherein the tapered ridge includes a V-shaped ridge, and The tapered groove includes a V-shaped groove. 15. The resin-molded package having a cavity structure according to item 11 of the application, wherein the tapered protrusion includes a trapezoidal protrusion, and the tapered groove includes a trapezoidal groove. 16. The resin-molded package having a cavity structure as described in the first item of the patent application scope, wherein the leads are inclined from the upper surface of the central portion to around the bottom of the substrate. 17. The resin-molded package having a cavity structure as described in claim 1, wherein the cover includes a flat body and a surrounding portion having a cover joint surface. 18. A resin molded package having a cavity structure, comprising: a substrate having a surrounding portion and a hollow portion, the hollow portion being defined by the surrounding portion, and the level of the hollow portion being lower than the surrounding portion Topmost; a semiconductor wafer 'mounted on the upper surface of the hollow portion, A plurality of leads that are electrically coupled with the semiconductor wafer, and that the leads penetrate the substrate and are inclined from the upper surface of the hollow portion to around the bottom of the substrate; and a cover that defines a cavity that houses the semiconductor wafer, The cover includes a flat body and a peripheral portion, and the cover has a cover engaging surface that is engaged with the substrate engaging surface of the raised peripheral portion, and the level of the cover engaging surface and the substrate engaging surface is higher than the upper surface of the hollow portion. Cover joint surface and the substrate P.58 556330 _Case No. 91109650_ Year Month Amendment_ 6. Scope of patent application The joint surfaces are engaged with each other, and the cover joint surface and the substrate joint surface each include at least one non-horizontal plane. 19. The resin-molded package with a cavity structure as described in claim 18, wherein the cover joint surface and the substrate joint surface each include an inwardly inclined downward plane extending in a ring shape. 20. The resin-molded package having a cavity structure as described in claim 18, wherein the cover joint surface and the substrate joint surface each include a combination of an inclined plane and a horizontal and flat surface extending in a ring shape. 2 1. The resin-molded package having a cavity structure as described in claim 18, wherein the cover joint surface and the substrate joint surface each include an annularly extending connecting surface that slopes downward and outward. 2 2. The resin-molded package with a cavity structure as described in claim 18, wherein the first of the cover joint surface and the substrate joint surface includes at least one annularly extending convex surface, and the second one includes A concave surface extending annularly and engaging the convex surface. 2 3. The resin-molded package with a cavity structure as described in claim 22, wherein the convex surface includes a circular protrusion extending in a ring shape, and the concave surface includes a circle extending into the ring shape and meshing with the circular protrusion.形 槽。 Shaped groove. 24. The resin-molded package having a cavity structure as claimed in claim 23, wherein the cover joint surface includes the circular bump, and the substrate joint surface includes the circular groove. 25. The package with a cavity structure as described in the patent application No. 23, wherein the cover bonding surface includes the circular groove, and the substrate is bonded Page 59 556330 _Case No. 91109650_ Year Month Amendment_ Sixth, the scope of patent application The surface includes the circular bulge. 26. The resin-molded package having a cavity structure as described in claim 22, wherein the convex surface includes a circularly extending conical ridge, and the concave surface includes a circularly extending and meshing with the conical ridge. Conical groove. 27. The resin-molded package having a cavity structure according to item 26 of the patent application, wherein the cover joint surface includes the tapered bump, and the substrate joint surface includes the tapered groove. 28. The resin-molded package having a cavity structure according to item 26 of the patent application, wherein the cover joint surface includes the tapered groove, and the substrate joint surface includes the tapered bump. 29. The resin-molded package with a cavity structure according to item 26 of the patent application, wherein the tapered protrusion includes a V-shaped protrusion, and the tapered groove includes a V-shaped groove. 30. The resin-molded package having a cavity structure as described in claim 26, wherein the tapered protrusion includes a trapezoidal protrusion, and the tapered groove includes a trapezoidal groove. Page 60