TW546172B - Systems and methods for processing workpieces - Google Patents

Systems and methods for processing workpieces Download PDF

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Publication number
TW546172B
TW546172B TW091115828A TW91115828A TW546172B TW 546172 B TW546172 B TW 546172B TW 091115828 A TW091115828 A TW 091115828A TW 91115828 A TW91115828 A TW 91115828A TW 546172 B TW546172 B TW 546172B
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TW
Taiwan
Prior art keywords
chamber
workpiece
process chamber
liquid
scope
Prior art date
Application number
TW091115828A
Other languages
Chinese (zh)
Inventor
Dana R Scranton
Eric Bergman
Erik Lund
Joe Lanfrankie
Worm Lund
Original Assignee
Semitool Inc
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Filing date
Publication date
Priority claimed from US09/907,485 external-priority patent/US6691720B2/en
Priority claimed from US09/907,544 external-priority patent/US6668844B2/en
Priority claimed from US09/907,487 external-priority patent/US6427359B1/en
Application filed by Semitool Inc filed Critical Semitool Inc
Application granted granted Critical
Publication of TW546172B publication Critical patent/TW546172B/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02Devices for holding articles during cleaning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/045Cleaning involving contact with liquid using perforated containers, e.g. baskets, or racks immersed and agitated in a liquid bath
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/048Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/10Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/102Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/10Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • C11D2111/46

Abstract

Workpieces requiring low levels of contamination, such as semiconductor wafers, are loaded into a rotor or a fixed support within a process chamber. The process chamber has a horizontal drain opening in its cylindrical wall. The chamber is closed via a door. A process or rinsing liquid is introduced into the chamber. The liquid rises to a level so that the workpieces are immersed in the liquid. The chamber slowly pivots or rotates to move the drain opening down to the level of the liquid. The liquid drains out through the drain opening. The drain opening is kept near the surface of the liquid to drain off liquid at a uniform rate. An organic solvent vapor is introduced above the liquid to help prevent droplets of liquid from remaining on the workpieces as the liquid drains off. The rotor spins the workpieces to help to remove any remaining droplets by centrifugal force. Multiple process steps are performed within the single process chamber.

Description

五、發明説明( 發明範圍 本發明關於諸如半導體a 一 光學媒介、薄膜頭端之I “面板顯示ϋ、硬碟或 儲存元件或敷層,二4其他由微電子電路、資料 預借、加工及清潔。這^材之卫件的表面 件”。 二及類似文章共同在此稱為“工 表面預備、諸如清潔、為力丨η ^ ,,^ 4-i - ^ ^ '、蝕刻及剥除,係半導體晶圓及工 件之製程主要及重要的 四 素。表面預備步驟通常利用侵蝕 性、腐蝕性,或溶解的化 — 干裊卩口,或利用蒸氣性質學製品 來只仃。工件的表面預備之實行,用以箱锯$ π M 用於後續製程步驟。 衣曲 清潔在製造半導體及相同產品中係-標準步驟。清潔包 含使用化學配方來移除_,諸如氧化物、分子、金屬 或有機材料’而維持工件表面的清潔及完整性…液 體、氣體或蒸氣性質的化學製品當施加工件時,將導致表 面特性比其他者更易於受到污染。例#,施加氣氣醆(HF) 至工件表面,將切表面移除氧化物,其造成—活性表 面。工件一般而言’且特別為具有活性表面的工件,經常 地易於藉由空氣傳播分子受到污染。當液體製程媒介由該 工件表面移除時,污染也能產生於清潔程式。 如此,為減少工件的污染,在一受控制的環境内,其較 佳佔據相當小的製造設施空間及減少其曝露於污染源,實 行一順序的表面預備步驟係有利的。因此,本發明的目的 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) -4- 546172 A7V. Description of the invention (Scope of the invention The present invention relates to semiconductors, an optical medium, and a thin-film head-end I panel display panel, a hard disk, or a storage element or a cladding. The other 4 are microelectronic circuits, data advance borrowing, processing, and Cleaning. The surface parts of the guards of this material ". Two and similar articles are collectively referred to herein as" work surface preparation, such as cleaning, for power, etc. ^^ ,, ^ 4-i-^^ ', etching and peeling It is the main and important element of the semiconductor wafer and workpiece manufacturing process. The surface preparation step usually uses erosive, corrosive, or dissolved chemical-dry mouths, or uses vapor properties to stop the surface. The surface of the workpiece Preparatory implementation for box saw $ π M for subsequent process steps. Yiqu cleaning is a standard procedure in the manufacture of semiconductors and the same products. Cleaning involves the use of chemical formulas to remove _, such as oxides, molecules, metals or Organic materials' while maintaining the cleanliness and integrity of the workpiece surface ... Chemicals of liquid, gas or vapor nature, when applied to a workpiece, will result in surface characteristics that are more susceptible to contamination than others. Example # Applying air-gas radon (HF) to the surface of the workpiece removes the oxide from the cut surface, which results in an active surface. The workpiece is generally 'and particularly a workpiece with an active surface, and is often susceptible to contamination by airborne molecules. When the liquid process medium is removed from the surface of the workpiece, pollution can also occur in the cleaning program. Thus, in order to reduce the pollution of the workpiece, it is better to occupy a relatively small manufacturing facility space and reduce its exposure in a controlled environment. For pollution sources, it is advantageous to carry out a sequential surface preparation step. Therefore, the purpose of the present invention is to apply the Chinese National Standard (CNS) A4 specification (210X297 mm) -4- 546172 A7

係提供改良表面加工方法及裝置。 清潔工件而避免或減少污染長久以來一直為工程上的挑 戰。工件通常係由噴灑或解離子水池來清潔。然後移去水 份,通常使用有機溶劑蒸氣,諸如異丙醇,其降低水的表 面張力。這有助於避免水滴停留且污染工件。 各種清潔方法與系統及各種洗濯與乾燥方法及裝置已提 出且使用。在一典型系統中,晶圓浸入容器中。一機構係 提供握持該晶圓。另一機構係提供經下方將晶圓推動向上 使其提升離開液體。雖然此技術已使用,其會導致液體積 存於晶圓接觸之握持機構的空間中,如此將增加污染機 會。對於提升機構的需求也是很複雜的。在一變換系統 中,晶圓握持於固定位置,而該液體由下方排放。此技術 較不會使液體積存。然而,當液位下降時,高於液體的溶 劑蒸氣由液體所吸收。因此,晶圓上段曝露之液體不同於 晶圓下段的液體。這潛在性將造成非均勻性加工。於是, 雖然這些及其它技術已使用於不同程度的成功,其仍舊非 常需要改良的系統與方法用於清潔工件。 本發明的目的因此也提供一用於清潔工件之改良系統及 方法。 發明簡單說明 在一第一内容中,工件上之表面預備製程係於單一室内 所完成。該工件係由製程流體經噴灑或浸洗所接觸。該工 件可在該單一室内加工及/或洗濯與乾燥。這減少工件曝露 至污^物’且提供製程流體或媒介改良應用至工件。 -5- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐)Provides an improved surface processing method and device. Cleaning workpieces to avoid or reduce contamination has long been an engineering challenge. Workpieces are usually cleaned by spraying or deionizing pools. The water is then removed, usually using an organic solvent vapor, such as isopropanol, which reduces the surface tension of the water. This helps to prevent water droplets from staying and contaminating the workpiece. Various cleaning methods and systems and various washing and drying methods and devices have been proposed and used. In a typical system, a wafer is immersed in a container. A mechanism is provided to hold the wafer. Another mechanism is to push the wafer upwards from below to lift it away from the liquid. Although this technique has been used, it will cause the liquid volume to be stored in the space of the holding mechanism where the wafer is in contact, which will increase the chance of contamination. The need to raise institutions is also complex. In a conversion system, the wafer is held in a fixed position and the liquid is discharged from below. This technique is less prone to fluid storage. However, as the liquid level drops, solvent vapors above the liquid are absorbed by the liquid. Therefore, the liquid exposed at the upper part of the wafer is different from the liquid at the lower part of the wafer. This potential will cause non-uniform processing. Thus, although these and other technologies have been used to varying degrees of success, they still require improved systems and methods for cleaning workpieces. The object of the invention is therefore also to provide an improved system and method for cleaning workpieces. Brief description of the invention In a first aspect, the surface preparation process on the workpiece is performed in a single chamber. The workpiece is contacted by the process fluid by spraying or dipping. The workpiece can be processed and / or washed and dried in the single chamber. This reduces workpiece exposure to contaminants' and provides process fluids or media for improved application to the workpiece. -5- This paper size applies to China National Standard (CNS) A4 (210X 297 mm)

Order

線 546172 A7 五、發明説明(3 在 '一弟—内谷中,工杜作4P 丨 和 件仏握持於製程室中固定支架内或 轉子:。沿者轉子的製程室能拇轉’用以移動製程室中之 排放官出口向下至該室中 T W合納液體的位準。該液體接 由該室排放出去通過出口。4 m 如使用,透過轉子旋轉製程室 内的工件’能容許製程流體更均句地分配於工件上,且同 時容許利用離心力移除流體。 在一第三内容中,在製程室内或固定支架上的開口或噴 嘴供給:流體至1件上。此容許多樣性的加工。 、 曰在第四内令中’音連能量,諸如超音速或巨大音速能 量,較佳通過王件所浸洗的液體,施加至該工件。 在-第五内容中,_門外框當接合至該製程室時,由門 組件推開,用於容許該門外框隨製程室樞轉或旋轉。 在第/、内令中,該製程室具有一連續圓柱側壁面,且 該壁面包括-排放管開口或出口。當該室旋轉使排放管向 下士至中液體的位準時’製程室内的液體排放出去通過排 放S開口。製程至封閉工件的各側,為較佳控制製程 境。 在一第七内容中,提供清潔工件的特殊方法。這些方法 解决現在半導體製造工業所使用習知方法的問題。工件握 持於具排放管出口之製程室内的轉子或固定支架中。該工 件:洗於製程室内的液體,而該液體較佳地透過該室底部 之一或多入口來提供。液體較佳連續供給進入該室,使得 ㈣連續充滿且流出排放管出口。框轉製程室使其以控制 的動作向下移動排放管出Π,用以降低室中液體的位準。 裝 訂 6- 546172Line 546172 A7 V. Description of the invention (3 In 'One Brother-Neigu, Gongdu Zuo 4P 丨 and pieces 仏 are held in a fixed bracket or rotor in the process room: The process room of the rotor can be turned by thumb' Move the discharge official outlet in the process chamber down to the level of the TW-receiving liquid in the chamber. The liquid is discharged from the chamber and passed through the outlet. 4 m If used, the workpiece in the process chamber is rotated through the rotor, which allows the process fluid More evenly distributed on the workpiece, and at the same time allow the fluid to be removed using centrifugal force. In a third aspect, the opening or nozzle supply in the process chamber or on the fixed support: fluid to 1 piece. This allows for diverse processing In the fourth internal order, the sound energy, such as supersonic or huge sound energy, is preferably applied to the workpiece through the liquid immersed in the king piece. In the fifth content, the door frame should be engaged When reaching the process chamber, the door assembly is pushed open to allow the door frame to pivot or rotate with the process chamber. In the first and second orders, the process chamber has a continuous cylindrical side wall surface, and the wall surface includes-discharge Tube opening or out When the chamber is rotated, the discharge pipe is discharged to the level of the liquid to the bottom, and the liquid in the process chamber is discharged through the discharge S opening. The process is closed to each side of the workpiece to better control the process environment. In a seventh content, Provides special methods for cleaning workpieces. These methods solve the problems of conventional methods used in the semiconductor manufacturing industry now. The workpieces are held in a rotor or a fixed bracket in a process chamber with a discharge tube outlet. The workpiece: a liquid washed in the process chamber, The liquid is preferably provided through one or more inlets at the bottom of the chamber. The liquid is preferably continuously supplied into the chamber, so that the plutonium is continuously filled and flows out of the outlet of the discharge pipe. The frame-turning process chamber moves it down in a controlled motion. The drain pipe exits Π to lower the level of liquid in the chamber. Binding 6-546172

當該室旋轉且液體位準下降時,供給至室及溢出液體表面 的液體較佳繼續流動。此製程繼續直到液體位準低於工件 下方’且該室旋轉用以排放實際所有液體至室外。 經:隹持液體表面的溢出,且經維持固定流動朝向及流出 排放管出〇’液體表面的雜質由工件流動離開,因此減少 潛在性的污染。當溶劑蒸氣所溶入液體的表面固定由新鮮 液體所替換時,室内液體在所有的深度維持不變。在液體 由該室移除後,工件利於旋轉。在轉子之實施例中,留在 工件上的液滴或緊鄰裝置的組件以離心力移除。因此,清 潔具備均勻的液體池,且降低潛在的積存或剩餘的液體殘 留在工件上。現今所使用相關機械及方法的缺點,如上 述,遂以克服。 在一第八内容中,一内室具有一排放管開口,用以容許 製程流體由該内製程室移除。一驅動馬達以控制速率旋轉 該内製程室,使開口維持於或低於内室中流體的位準。流 體接著由該排放管開口排出。該驅動馬達可利用磁力移動 内製程室,而不需經一驅動軸實際穿透或連接進入該製程 環境。選擇性地,該内製程室可以一驅動軸連接至驅動馬 達’且以一軸封密封該軸開口進入該内製程室。 在一第九内容中,該内製程室形成密封室,而沒有任何 排放管開口。於至少一製程步驟期間,該工件維持固定, 且驅動馬達沿該固定工件旋轉内製程室。内製程室上的開 口或喷嘴供給流體至工件上。為由該室移除液體,該室轉 動或中斷至一停止位置,其間一或多排放埠在底部位置。 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 裝 訂As the chamber rotates and the liquid level drops, the liquid supplied to the chamber and the surface of the overflowing liquid preferably continues to flow. This process continues until the liquid level is below the workpiece ' and the chamber rotates to discharge virtually all liquid to the outside. Passage: The overflow on the surface of the liquid is held, and the fixed flow is maintained toward and out of the discharge pipe. The impurities on the surface of the liquid flow away from the workpiece, thus reducing potential pollution. When the surface of the liquid into which the solvent vapor is dissolved is fixedly replaced by fresh liquid, the liquid in the room remains unchanged at all depths. After the liquid is removed from the chamber, the workpiece is facilitated for rotation. In the embodiment of the rotor, the droplets left on the workpiece or components immediately adjacent to the device are removed by centrifugal force. As a result, cleaning has a homogeneous liquid reservoir and reduces potential accumulation or remaining liquid on the workpiece. The shortcomings of the related machinery and methods used today, as described above, were overcome. In an eighth aspect, an inner chamber has a drain opening for allowing process fluid to be removed from the inner process chamber. A drive motor rotates the internal process chamber at a controlled rate, maintaining the opening at or below the level of the fluid in the internal chamber. The fluid is then discharged through the discharge pipe opening. The drive motor can use magnetic force to move the internal process chamber without actually penetrating or connecting to the process environment through a drive shaft. Alternatively, the inner process chamber may be connected to the drive motor by a drive shaft and a shaft seal is used to seal the shaft opening into the inner process chamber. In a ninth aspect, the internal process chamber forms a sealed chamber without any discharge pipe openings. During at least one process step, the workpiece remains fixed, and a drive motor rotates the inner process chamber along the fixed workpiece. Openings or nozzles in the internal process chamber supply fluid to the workpiece. To remove liquid from the chamber, the chamber is turned or interrupted to a stop position during which one or more discharge ports are in the bottom position. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) binding

線 546172Line 546172

该排放埠接著打開且該液體利用重力透過其排出。於排放 氣期間,氣體可提供至内製程室,以避免產生真空緩慢或 停止液體流出。液體可變換藉由打開排放埠移除,且接著 經緩慢旋轉該内製程室定位及維持排放埠位於或低於液體 表面,如同上述之第三内容。這容許液體受控制的移除, 且造成較少潛在的工件污染。 在第十内谷中,該内室閉合或密封並維持固定,且該 ρ 裝 工件於該内室中旋轉。這減少工件曝露於污染物且提供製 程流體至工件的改良應用。 在一第十一内容中,該外部容納室以氣體及/或基氣洗 條’用以維持工件所須的環境。該氣體或蒸氣可為氮,或 氬,或氫氟酸(HF)。 上述發明内容提供重要之加工及清潔裝置及方法。這些 内容有助提供更可靠及有效的加工。 訂The drain port is then opened and the liquid is discharged through it using gravity. During venting, gas can be supplied to the internal process chamber to avoid creating a slow vacuum or stopping the flow of liquid. The liquid can be removed by opening the drain port, and then slowly rotating the internal process chamber to position and maintain the drain port at or below the liquid surface, as described in the third aspect above. This allows for controlled removal of the liquid and causes less potential contamination of the workpiece. In the tenth inner valley, the inner chamber is closed or sealed and remains fixed, and the ρ loading workpiece rotates in the inner chamber. This improves the application of reducing workpiece exposure to contaminants and providing process fluids to the workpiece. In an eleventh aspect, the external accommodating chamber is washed with a gas and / or base gas strip 'to maintain the environment required for the workpiece. The gas or vapor can be nitrogen, or argon, or hydrofluoric acid (HF). The above summary provides important processing and cleaning devices and methods. These contents help to provide more reliable and efficient processing. Order

線 本發明進一步實施例及修正、變化與改進將變得明白。 本發明同時存在於所示及敘述特性的副組合中。實施例^ 所示特性也可同時用於其他的實施例。 圖式簡簟敘沭 在圖式中,其中相同參考編號表示相同元件,幻函芸於 數種圖型: ’-、 圖1係一加工工件之系統透視圖。 圖2係一圖1所示之系統前視圖。 圖3係一圖1所示之系統側視圖。 圖4係一圖2所示之製程機台的側視圖。 • 8 - 546172 A7 B7 五 、發明説明(e 圖5係一圖2所示之製程機台的前視圖。 圖6係一處理器單元的戴面圖,該單元具有一轉子旋轉於 該製程室内。 圖7係-圖6所示製程室的分割透視圖。 圖8係一/〇圖6之線8·8所取的部份截面圖。 圖9係一圖6及7所示製程室的透視機架圖。 圖10係S1 7及9所示之製程室圓柱側壁面中排放槽的放 大戴面圖。 圖11係一圖6所示處理器單元後端的放大部份截面圖。 圖12係一圖6所示門組件的前視圖。 圖13係一圖12所示門組件特性之部份載面圖。 圖14係一表示圖12及13之門組件接合該製程室的頂部截 面圖。 圖15係一沿圖12之線15-15所取的戴面圖。 圖16係一轉子直接握持工件的透視圖。 圖17係一變換轉子用於握取托盤、載具或卡匣中所握持 工件的透視圖。 圖18係一變換轉子及載具的透視圖。 圖19係載具直接握持工件的透視圖,該工件係通過一 側壁面加載及卸載,且該載具握持於諸如圖Μ所示轉子的 轉子中。 圖20係一表面加工裝置用於圖i所示系統的透視圖,其具 有一内製程室移動至一位置,用以包含流體作為完全或部 份工件的浸洗加工。該流體由此圖省略為更清楚表示裝置 -9 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 裝 訂 546172 五、發明説明( 的組件。 圖21係一圖2〇所示+ 表面加工裝置的透視橫戴面圖。 圖22係一圖20裝置的携指 士 的透視圖,且該内室現在移動至排出 流體的位置,且同昧本一 门時表不一可移除蓋板用於圖丨-3裝置。 圖23係圖20-22梦番认泳、a r-i 曰^ 、置的透視圖,其安裝及關閉該内製程門與外部容納室門。 _一變換處理器的側視圖,其相同於圖4 固疋晶圓支架於該轉子的位置。 圖25係一圖24所示處理器或製程機台的前視圖。 圖26係一圖24及25所示處理器之部份透視圖。 圖27係一圖26所示處理器單元的部份截面圖。 圖28係一圖26及27所示工件支架的截面圖。 圖29係-圖26及27所示製程室的截面圖。 圖3〇係一圖26及27所示該室或绰件的載面圖。 圖3 1係一其後端視圖。 圖32係-圖27所示門組件的放大截面圖。 圖33係-圖32所示門組件的前視圖。 圖34係一其側視圖。 圖35係-變換實施例用於加工在載具、卡匿或托盤内 支援工件的截面圖。 圖36係-圖26或35所示處理器單元之部份透視圖,兑 该内製程或副室係位於直立或〇。的位置,且為圖示目的 除各種的組件。 圖37係一圖36所示處理器單元的透視圖,其中該製程 室 但表示 所 中移 室 -10 - 8 五、發明説明( 現在旋轉約30。,用以移除液體。 圖38係一其透視圖,其中該製程室旋轉約的。。 圖39係-其透視圖’其中該製程室 許所有流體流出。 用以谷 圖40係一圖36所示處理器單元的前截面圖。 圖41=一截面圖,其中該製程室以實線表示於〇。位 且。亥氣程室以虛線表示於圖39之完全旋轉位置。 程 這 或 有 件室轉二直Γ也或經握持包含工件的載具來握持工 “至…亥轉子提供且當閉合時適 繼供至製程室内,使得工件至少部份地浸洗 :柘轉或%轉’使排放管開口向下移動至液體的位準。 午液體由製程室移出。製程室繼續旋轉’直到大多數 ::液體由該室移除。下方所敘述之其他步驟及特性為 利的,但對於本發明並非主要的。 、圖2及3所不’工件加工系統10較佳具有-外殼12, 用乂,准持及控制清潔的氣流且減少工件的污染。系統10的 :方:輸入:輪出機台14容許工件60由該系統10加載及卸 、刀度益16或其他暫時工件儲存器係提供緊鄰於該輸 入/輸出機台14。 :系先10#乂佳分成一界面段24及一製程段%。這些段係 有開口之區段所分離。該界面段24包括輸入/輸出機 ° 刀度裔16或其他暫時工件儲存器。製程機台26包括 元 -或多製程機台30’其中各製程機台观括一處理器單 U0X297公釐) • 11 - 546172Lines Further embodiments of the present invention and modifications, changes and improvements will become apparent. The invention resides in a combination of the illustrated and described characteristics. The characteristics shown in Example ^ can also be used in other examples at the same time. Brief description of the drawings In the drawings, the same reference numbers indicate the same components, and magic functions are shown in several types of drawings: ′-, Figure 1 is a perspective view of a system for processing a workpiece. FIG. 2 is a front view of the system shown in FIG. 1. FIG. FIG. 3 is a side view of the system shown in FIG. 1. FIG. 4 is a side view of the process machine shown in FIG. 2. • 8-546172 A7 B7 V. Description of the invention (e Figure 5 is a front view of the process machine shown in Figure 2. Figure 6 is a wearing view of a processor unit with a rotor rotating in the process chamber Figure 7 is a divided perspective view of the process chamber shown in Figure 6-Figure 8 is a partial cross-sectional view taken along line 8 of Figure 1/0 Figure 6. Figure 9 is a view of the process chamber shown in Figures 6 and 7 Perspective frame view. Figure 10 is an enlarged wearing view of a drain groove in the cylindrical side wall of the process chamber shown in S1 7 and 9. Figure 11 is an enlarged partial cross-sectional view of the rear end of the processor unit shown in Figure 6. Figure 12 FIG. 13 is a front view of the door assembly shown in FIG. 6. FIG. 13 is a partial cross-sectional view of the characteristics of the door assembly shown in FIG. 12. FIG. 14 is a top sectional view showing the door assembly of FIGS. 12 and 13 joining the process chamber. Fig. 15 is a wearing view taken along line 15-15 of Fig. 12. Fig. 16 is a perspective view of a rotor directly holding a workpiece. Fig. 17 is a changing rotor for holding a tray, carrier or cassette. A perspective view of the workpiece held in Figure 18. Figure 18 is a perspective view of a changing rotor and carrier. Figure 19 is a perspective view of a workpiece directly holding the workpiece. The side wall is loaded and unloaded, and the carrier is held in a rotor such as the rotor shown in Figure M. Figure 20 is a perspective view of a surface processing device for the system shown in Figure i, which has an internal process chamber moved to a Position to contain the fluid as a complete or part of the immersion process. This fluid is omitted from this figure for a clearer indication of the device-9 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) binding 546172 V. Description of the components of the invention. Figure 21 is a perspective cross-sectional view of the surface processing device shown in Figure 20+. Figure 22 is a perspective view of the figure of the device shown in Figure 20, and the inner chamber is now moved. To the position where the fluid is discharged, and the same cover is used to remove the cover for the device of Figure 丨 -3. Figure 23 is a perspective view of Figure 20-22 Mengfan recognition, a ri, ^, and set It installs and closes the inner process door and the outer accommodation door. _ A side view of a conversion processor, which is the same as the position of the fixed wafer holder on the rotor in Fig. 4. Fig. 25 is a processor shown in Fig. 24 Or process machine front view. Figure 26 is a part of the processor shown in Figures 24 and 25 A perspective view. Figure 27 is a partial cross-sectional view of the processor unit shown in Figure 26. Figure 28 is a cross-sectional view of the workpiece holder shown in Figures 26 and 27. Figure 29 is a- Sectional view. Figure 30 is a sectional view of the chamber or piece shown in Figures 26 and 27. Figure 31 is a rear view of the chamber. Figure 32 is an enlarged sectional view of the door assembly shown in Figures 32 and 27. Figure Series 33-A front view of the door assembly shown in Figure 32. Figure 34 is a side view thereof. Figure 35 is a cross-sectional view of a modified embodiment for processing a supporting workpiece in a carrier, jam or pallet. Figure 36- A partial perspective view of the processor unit shown in FIG. 26 or 35, which is located in an upright or zero position relative to the internal process or auxiliary room. Position, and for illustration purposes except various components. Fig. 37 is a perspective view of the processor unit shown in Fig. 36, in which the process chamber but the moved chamber is shown -10-8 V. Description of the invention (now rotated about 30 ° to remove the liquid. Fig. 38 is a Its perspective view, in which the process chamber rotates approximately. Figure 39 series-its perspective view 'where the process chamber allows all the fluid to flow out. It is used to valley the front view of the processor unit shown in Figure 40 to Figure 36. 41 = A cross-sectional view, in which the process chamber is represented by a solid line at 0 ° and. The Hai gas process chamber is represented by a dashed line in the fully rotated position of FIG. 39. The process chamber can be turned straight or can be held. The carrier containing the workpiece to hold the work "to ... provided by the rotor and then supplied to the process chamber when closed, so that the workpiece is at least partially immersed: 柘 turn or% turn 'to move the drain pipe opening down to the liquid The liquid is removed from the process chamber. The process chamber continues to rotate until most of the liquid is removed from the chamber. The other steps and characteristics described below are beneficial, but are not essential to the present invention. 2 and 3 'workpiece processing system 10 preferably has-housing 12. Use 乂 to standardize and control the clean airflow and reduce the contamination of the workpiece. System 10: square: input: wheel exit machine 14 allows workpiece 60 to be loaded and unloaded by the system 10, knife degree 16 or other temporary workpiece The storage device is provided next to the input / output machine 14 .: The first 10 # 乂 佳 is divided into an interface section 24 and a process section%. These sections are separated by the opening section. The interface section 24 includes input / output Output machine ° Knife 16 or other temporary workpiece storage. Process machine 26 includes yuan- or multi-process machine 30 '(each process machine includes a processor single U0X297 mm) • 11-546172

)〇。該製程機台分別如圖3B&3C所示。 , 介面段24同時包括 一製程機器人22用於移動工件至及來自 οσ 一 ㈡刀度态16及處理器 早㈣面板28可提供於外㈣,心料指令或規 劃輸入至電腦控制器32用來控制系統丨〇。 工件60可提供於開放載具、卡£ '船形容器或托盤。變 換地’工件60可提供於密封箱或容器内,其係解 接機台上。 ') 〇. This process machine is shown in Figure 3B & 3C. The interface section 24 also includes a process robot 22 for moving the workpiece to and from οσ a knife position 16 and a processor early panel 28 can be provided to the outside, heartbeat instructions or planning input to the computer controller 32 for Control system 丨 〇. The workpiece 60 may be provided in an open carrier, a card container or a pallet. The ground-changing ' workpiece 60 may be provided in a sealed box or container, which is on a disassembly machine. '

處理器單元5〇係如圖4及5所示。處理器單元50可用於圖 Η所示之自動化系統1G,或其他自動化系統中,或用作獨 立單元。 裝The processor unit 50 is shown in Figs. The processor unit 50 may be used in the automation system 1G shown in Fig. ,, or other automation systems, or as a separate unit. Hold

線 參考圖6’在-變換處理器單元3⑽中,轉子綱或可旋轉 工件支架㈣置於製程室3_。—樞轉馬達或致動器· 連結至該製程室逝。純轉馬達3G6將製程室由該室能握 持液體的第-位置,樞轉至大多數或所有室内液體利用重 力流出的第二位置。該第—位置可為〇。或直立位置。該第 二位置由60。達至約180。,且典型與該第一位置成約1〇〇' 1,10°或120»的位置。旋轉馬達烟連接至轉子3〇4,用以旋轉 I私至302内的轉子304。Η、组件3 10由該製程室3〇2分離, 用於加載及卸載工件。該門組件31〇具有—可接合製程室 的門忙於加工期間用以關閉或密封製程室川2的開放 前端。溢流槽3丨2隨意地位於製程室3〇2開放前端下方,用 以收集釋放於製程室外側的任何液體。 因某些製程流體有腐蝕性,轉子3〇4及製程室3〇2可由抗 腐蝕材料,諸如特氟隆(含氟樹脂)所製成。當使用特氟隆 -12.Referring to FIG. 6 ', in the -shift processor unit 3', a rotor or a rotatable workpiece holder ㈣ is placed in the process chamber 3_. —Pivot motor or actuator · Link to the process room. The pure rotation motor 3G6 pivots the process chamber from the first position where the chamber can hold the liquid, and pivots to the second position where most or all of the indoor liquid flows out by gravity. The first position may be zero. Or upright position. The second position consists of 60. Reached about 180. And is typically at a position of about 100 ′, 10 ° or 120 »from the first position. A rotary motor is connected to the rotor 304 to rotate the rotor 304 in the rotor 302.组件 The component 3 10 is separated by the process chamber 30 2 for loading and unloading the workpiece. The door assembly 31 has a door that can be engaged with the process chamber to close or seal the open front end of the process chamber 2 during processing. The overflow tanks 3 and 2 are randomly located below the open front end of the process chamber 302 to collect any liquid released outside the process chamber. Because some process fluids are corrosive, the rotor 304 and the process chamber 302 may be made of a corrosion-resistant material such as Teflon (fluorinated resin). When using Teflon -12.

546172 A7 ____ B7 五、發明説明(1〇 ) 時,轉子及製程室可具有相當厚的壁面及段部用以提供適 當強度。此外,如圖6所示,一金屬室支架3 60可沿著製程 室302外側,提供於其不會曝露於製程流體的位置。支架 360加強製程室302。 回至圖7,製程室302具有一結合至後壁324之連續性較佳 為圓柱形的側壁320。因此,當製程室302的開放前端332由 一門框關閉,如下面所述,於加工期間,該製程室3 〇2包圍 及封閉工件各側面。 參考圖7-10,一排放管開口或槽326係提供於製程室3〇2 的圓柱形側壁面320。該排放管開口 326較佳為水平,且連 接至製程室3 02後端的排放埠3 3 0。切口 3 28有利於沿著排放 槽326内側緣形成。一可撓排放管線338由排放埠33〇行進至 系統或設施排放管或收集點,如圖9所示。 參考圖8及9, 一或多個下歧管34〇提供接近於該室3〇2的 底部。該底部係扇形區,其大致上對立(例如,+冬45。)於排 放官開口 326。上歧管342陣列提供接近於該室3〇2的頂部, 且於對立排放槽326之該室的側面上。該歧管34〇及342係藉 由可撓供給管線346及348由該歧管延伸至供給來源,以氣 體、蒸乳或液體來供給。該歧管具有開口或噴嘴354,用以 供給或噴灑氣體、蒸氣或液體向内朝向室3〇2内的工件。依 據所將完成的製程,額外的供給管線可使用。此外,一些歧 管342可提供一第一流體,諸如水及製程化學藥品,然而其 他歧管342可提供另一不同的流體,諸如氮氣或IpA蒸氣。該 供給官線具有十分鬆弛或上升迴路,用以當維持流體連接至 •13· 本紙張尺度適用中國國家標準(CNS) A4規格(21〇 X 297公爱)---- 546172546172 A7 ____ B7 5. In the description of the invention (10), the rotor and the process chamber may have a relatively thick wall surface and sections to provide proper strength. In addition, as shown in FIG. 6, a metal chamber holder 3 60 may be provided along the outside of the process chamber 302 and provided at a position where it will not be exposed to the process fluid. The bracket 360 reinforces the process chamber 302. Returning to Fig. 7, the process chamber 302 has a side wall 320, preferably a continuous cylinder, which is bonded to the back wall 324. Therefore, when the open front end 332 of the process chamber 302 is closed by a door frame, as described below, the process chamber 302 surrounds and closes each side of the workpiece during processing. 7-10, a discharge pipe opening or slot 326 is provided on the cylindrical side wall surface 320 of the process chamber 302. The drain pipe opening 326 is preferably horizontal and connected to a drain port 3 3 0 at the rear end of the process chamber 30 2. The cutouts 3 28 facilitate the formation along the inside edge of the discharge groove 326. A flexible discharge line 338 travels from the discharge port 33 to a system or facility discharge pipe or collection point, as shown in FIG. Referring to Figures 8 and 9, one or more lower manifolds 34o are provided close to the bottom of the chamber 302. The bottom is a fan-shaped area, which is substantially opposite (e.g., +45) to the discharge opening 326. The array of upper manifolds 342 is provided close to the top of the chamber 302, and on the side of the chamber of the opposite drain slot 326. The manifolds 34 and 342 are extended from the manifold to a supply source through flexible supply lines 346 and 348, and are supplied with gas, steamed milk, or liquid. The manifold has openings or nozzles 354 for supplying or spraying gas, vapor, or liquid inwardly toward the workpiece in chamber 302. Depending on the process to be completed, additional supply lines are available. In addition, some manifolds 342 may provide a first fluid, such as water and process chemicals, while other manifolds 342 may provide a different fluid, such as nitrogen or IpA vapor. The supply line has a very slack or rising loop for maintaining fluid connection to the paper. • This paper size is in accordance with China National Standard (CNS) A4 (21〇 X 297). 546172

該歧管時容許該室3 02樞轉。 回至圖11 , 一轉子軸35〇由該旋轉馬達3〇8延伸至轉子 304。該轉子軸35〇通過室3〇2後壁面324之軸開口 。密封 362及364沿該軸開口 322提供,用以避免流體洩漏通過軸開 口 3 22。轉子304係支撐於轉子軸350上。該樞轉馬達3〇6上 的至軸環352連結至製程室302的後壁面324。該製程室302 支撐於’且樞轉於由該樞轉馬達3〇6所驅動之室軸環352。 裝 回至圖12,該門組件310垂直地在門執道37〇上,由實線 所示的上方位置’移動至虛線所示的下方位置。延伸於該 軌道371間的門橋372支撐該門組件31〇。回至圖13,門組件 3 1〇包括一圓形板狀的閉合框架374,其包括連接至環形門 環382的環形門墊375。一窗口 376固定於襯墊375及環件382 間。當門組件310在閉合位置,如圖27所示,該門塾375係 夾持以抵住製程室302的前凸緣板334。凸緣板334中的密封 3 3 6沿該門墊3 75密封。The manifold allows the chamber 302 to pivot. Returning to FIG. 11, a rotor shaft 35 extends from the rotary motor 308 to the rotor 304. The rotor shaft 35 passes through the shaft opening of the rear wall surface 324 of the chamber 302. Seals 362 and 364 are provided along the shaft opening 322 to avoid fluid leakage through the shaft opening 322. The rotor 304 is supported on a rotor shaft 350. A to collar 352 on the pivot motor 306 is connected to a rear wall surface 324 of the process chamber 302. The process chamber 302 is supported on 'and pivoted on a chamber collar 352 driven by the pivot motor 306. Reinstalling it to Fig. 12, the door assembly 310 is vertically on the doorway 37o and moved from the upper position 'shown by the solid line to the lower position shown by the dotted line. A door bridge 372 extending between the rails 371 supports the door assembly 31. Returning to Fig. 13, the door assembly 3 10 includes a circular plate-like closed frame 374 including an annular door mat 375 connected to an annular door ring 382. A window 376 is fixed between the gasket 375 and the ring 382. When the door assembly 310 is in the closed position, as shown in FIG. 27, the lintel 375 is clamped against the front flange plate 334 of the process chamber 302. The seal 3 3 6 in the flange plate 334 is sealed along the door mat 3 75.

線 參考圖12-15,擺動致動器378徑向地沿該凸緣板334圓周 間隔。擺動致動器378上的凸輪桿380由致動器378向内轉 動’使夾持該門環382及襯墊375,以抵住製程室3〇2的&緣 板334。該擺動致動器378安裝在室支架36〇上,而該支架隨 室302移動。 參考圖13’支撐於門橋372上之手動切斷致動器384具有 撿拾器386。於加載及卸載工件進入製程室3〇2期間,兮致 動器384移動撿拾器386來接合及握取閉合框架374。於加工 期間,撿拾器386由閉合框架374釋放與分離。因此,於加 -14·Referring to Figures 12-15, the swing actuators 378 are spaced radially along the circumference of the flange plate 334. The cam lever 380 on the swing actuator 378 is turned inward by the actuator 378 'to hold the door ring 382 and the gasket 375 so as to abut the & edge plate 334 of the process chamber 302. The swing actuator 378 is mounted on a chamber support 36o, and the support moves with the chamber 302. Referring to FIG. 13 ', a manual cutting actuator 384 supported on a door bridge 372 has a pickup 386. During loading and unloading of the workpiece into the process chamber 300, the actuator 384 moves the picker 386 to engage and hold the closed frame 374. During processing, the picker 386 is released and separated by the closed frame 374. Therefore, Yuga -14 ·

546172 A7 B7 五、發明説明(i2 ) 工期間閉合框架374能自由地隨製程室302移動。如圖14及 15所示’門橋372連接至提升致動器371,其垂直地移動該 上及下位置間門框,如圖12所示。 該轉子304可具有各種形式。轉子3〇4可為握持工件的任 何裝置’且旋轉於製程室302内。圖16-19表示可使用之轉 子的範例。參考圖16,轉子400具有用於直接握持工件60的 梳件402。止動器404移動接合於工件邊緣,藉由製程機器 人將其握持於轉子内之定位。 如圖17所示,一變換轉子41〇適合於握持包含在托盤、卡 匣或載具中的工件。該托盤416或卡匣或載具418滑入一凹 槽412且例如經端緣414握持於轉子内之定位。 如圖18所示,一變換轉子42〇具有形成肋片424上的階級 422。選取階級422的尺寸用以容納或搭配載具426上對應的 凸耳432。圖19表示另一載具44〇 ,其可使用於轉子42〇,具 或不具凸耳432。載具440具有凹槽442用於容納及握持工件 60。工件60由載具側面中的開口 444載入該載具440。 上述製程至302也可使用於一固定載具支架,以替換轉子 304 ^在此設計中,旋轉馬達3〇8及驅動軸35〇可省略,其中 該工件支架支撐於一中心臂上,該臂延伸通過製程室3〇2中 的軸開口 322,且藉由底盤134結合或支撐。 在使用上,處理單元3〇〇操作如下。工件載入轉子 304。這可透過人工方式或製程機器人22來達成。工件可直 接載入轉子304中的梳件或凹槽。變換地,工件可握持於托 盤、卡匣或載具,其依序載入轉子3〇4。 • 15- ^紙張尺度適用中國國家標準(CNS) A4規格(210X 297公爱) -------546172 A7 B7 V. Description of the Invention (i2) The closed frame 374 can move freely with the process chamber 302 during construction. As shown in Figs. 14 and 15, the 'door bridge 372 is connected to a lifting actuator 371, which vertically moves the door frame between the upper and lower positions, as shown in Fig. 12. The rotor 304 may have various forms. The rotor 300 can be any device for holding a workpiece 'and rotates in the process chamber 302. Figure 16-19 shows examples of rotors that can be used. Referring to Fig. 16, the rotor 400 has a comb member 402 for directly holding the workpiece 60. The stopper 404 is moved and joined to the edge of the workpiece, and is held in the position of the rotor by the process robot. As shown in Fig. 17, a conversion rotor 41 is suitable for holding a workpiece contained in a pallet, a cassette, or a carrier. The tray 416 or cassette or carrier 418 slides into a recess 412 and is held in position in the rotor, for example, via an end edge 414. As shown in FIG. 18, a conversion rotor 42 has stages 422 formed on the ribs 424. The size of the stage 422 is selected to accommodate or match the corresponding lugs 432 on the carrier 426. Fig. 19 shows another carrier 44o, which can be used with the rotor 42o, with or without lugs 432. The carrier 440 has a recess 442 for receiving and holding the workpiece 60. The workpiece 60 is loaded into the carrier 440 through an opening 444 in the side of the carrier. The above process to 302 can also be used for a fixed carrier bracket to replace the rotor 304 ^ In this design, the rotary motor 308 and the drive shaft 35 can be omitted, where the workpiece support is supported on a center arm, the arm It extends through the shaft opening 322 in the process chamber 302 and is coupled or supported by a chassis 134. In use, the processing unit 300 operates as follows. The workpiece is loaded into the rotor 304. This can be achieved manually or by the process robot 22. The workpiece can be loaded directly into a comb or groove in the rotor 304. Alternatively, the workpiece can be held on a pallet, a cassette or a carrier, which is sequentially loaded into the rotor 304. • 15- ^ Paper size applies Chinese National Standard (CNS) A4 specification (210X 297 public love) -------

度器1”數:::=载具、卡s或托盤將载入,使得分 可具有梭-般來回的位::存位置被佔據。分度器16 地,固定或移^^ 作,如圖1及3所示。變換 至密封容機台可使用。工件60可變換地提供 體内,如㈣。如果工件60提供於密封箱 封及進出。考之專利範圍所敘述’該箱體可操作、拆 26=數製:::動,,川段2似 把…件動作可由電腦/控制器32,或由控制面 3其他遙控或設備電腦/控制器所控制。 於加載期間’門橋372係於如圖12之虛線所示的下方位 置因此’製程室302的前端為打開的。製程室302較佳在 直立或〇。位置,如圖7所示,該排放端位於或接近頂端。轉 子3〇4的旋轉純較佳為水平。製程室斯的槐軸ρ,如圖崎 示’也較佳為水平,且可與軸㈣心。該卫件較佳位於垂直 或接近垂直的方向。 門橋372係由門提升器371升高至圖12實線所示的上方位 置。當閉合框架374對齊製程室3〇2的開放前端332,該手動 關閉致動器384延伸用以閉合框架374抵住凸緣板334,如圖 13所不。擺動致動器378接著向内移動凸輪桿38〇。凸輪桿 3 80接合閉合框架374的門環382,藉此沿凸緣板334夾持閉 合框架374。手動關閉致動器接著由門環382釋放撿拾器 及縮回。閉合框架3 74現在關閉或密封製程室3〇2的開放前 端332。此外,閉合框架374被釋放或不受其餘門組件3 1〇的 -16- 本紙張尺度適用中國國家標準(CNS) Α4規格(210X297公釐) 546172 A71 ”number of scale :: == carrier, card or tray will be loaded, so that the minute can have shuttle-like back and forth position :: the storage position is occupied. The scale 16 is fixed or moved as shown in the figure. As shown in 1 and 3. It can be used by changing to a sealed container. The workpiece 60 can be provided inside the body, such as ㈣. If the workpiece 60 is provided in a sealed box and sealed in and out. The scope of the patent describes that the box can be operated 、 Remove 26 = number system ::: ,, the second section seems to be controlled by the computer / controller 32, or by other remote control or equipment computer / controller on the control surface 3. During loading 'gate bridge 372 It is tied to the lower position as shown by the dotted line in FIG. 12 so that the front end of the process chamber 302 is open. The process chamber 302 is preferably in an upright or 0 position, as shown in FIG. 7, the discharge end is at or near the top end. The rotor The rotation of 304 is preferably horizontal. The locomotive axis ρ of the process chamber is also preferably horizontal and can be centered with the axis as shown in the figure. The guard is preferably located in a vertical or near vertical direction. The door bridge 372 is raised by the door lifter 371 to the upper position shown by the solid line in Fig. 12. When the closed frame 374 is aligned With the open front end 332 of the process chamber 302, the manual closing actuator 384 extends to close the frame 374 against the flange plate 334, as shown in Fig. 13. The swing actuator 378 then moves the cam lever 38o inward. The cam lever 3 80 engages the door ring 382 of the closing frame 374, thereby holding the closing frame 374 along the flange plate 334. The manual closing actuator then releases the picker and retracts by the door ring 382. The closing frame 3 74 is now closed or sealed. The open front end 332 of the room 3202. In addition, the closed frame 374 is released or not affected by the remaining door components 3 1-10 -16- This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 546172 A7

影響’當製程室樞轉時,使其能隨製程室3G2移動。 參考圖9,製程液體、氣體,或蒸氣(共同稱為流體)係噴 潘或另外透過供給管線346及348引入製程室。暫時夫、 M9,轉子304有利地具有一開放框架結構。這容許來二 歧管340及342的流體將會被噴濃或另外供給通過轉子咖且 至工件6〇上》依據工件上所實行的特定製程,所使用流體 可包括侵蝕或腐蝕劑、溶劑、蒸氣狀態化學製品、酸,諸 如氫氟酸、臭氧、纟、臭氧水及其混合物。因多重流體可 透過多重供給管線提供至不同歧管,各種後續加工步驟可 實行於製程室302内,而不需由該室移除工件。當該室3〇2 封閉工件肖’外部污染工件的潛在性將㈣。對於後續加 工步驟同流體可藉由浸洗、喷灑或其他應用施加至工 件。清潔可實行於加工步驟間。 對於次洗或洗濯步驟,液體引入製程室3 〇2,直到液位升 高足以使工件被浸洗。該工件可停留於液體池中達一預定 量的時間。為移除該洗濯或浸洗液體,選擇性地經控制器/ 電細32致動樞轉馬達306。當室302樞轉時,排放管槽或開 口 326向下移動至液體位準。液體利用重力流入排放槽 326 ’且通過排放埠330及排放管線338流出。樞轉馬達306 繼續旋轉製程室302直到排放槽326由圖8之位置Α移至位置 B。這容許製程室302内的所有液體將利用重力過排放槽及 排放埠330排出。當製程室302樞轉時,供給管線346及 348(及其它,如有提供)經由為此目的所提供之上升迴路, 隨製程室302移動。此外,關閉或密封室302前端332之閉合 -17· 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐)Impact 'When the process room is pivoted, it can move with the process room 3G2. Referring to FIG. 9, the process liquid, gas, or vapor (collectively referred to as a fluid) is sprayed or otherwise introduced into the process chamber through supply lines 346 and 348. For the moment, M9, rotor 304 advantageously has an open frame structure. This allows the fluid from the two manifolds 340 and 342 to be sprayed or otherwise supplied through the rotor to the workpiece 60. Depending on the specific process performed on the workpiece, the fluid used may include corrosive or corrosive agents, solvents, vapors State chemicals, acids such as hydrofluoric acid, ozone, thallium, ozone water, and mixtures thereof. Since multiple fluids can be supplied to different manifolds through multiple supply lines, various subsequent processing steps can be performed in the process chamber 302 without the need to remove workpieces from the chamber. When the chamber 302 closes the workpiece, the potential of externally contaminated workpieces will be rampant. For subsequent processing steps the same fluid can be applied to the workpiece by dipping, spraying or other applications. Cleaning can be performed between processing steps. For the secondary washing or rinsing step, the liquid is introduced into the process chamber 300 until the liquid level rises enough to allow the workpiece to be immersed. The workpiece can remain in the liquid bath for a predetermined amount of time. To remove the washing or dipping liquid, the pivot motor 306 is selectively actuated via the controller / switch 32. When the chamber 302 is pivoted, the drain tube slot or opening 326 moves down to the liquid level. The liquid flows into the drain tank 326 'by gravity and flows out through the drain port 330 and the drain line 338. The pivot motor 306 continues to rotate the process chamber 302 until the discharge slot 326 moves from position A to position B in FIG. 8. This allows all the liquid in the process chamber 302 to be discharged through the discharge tank and the discharge port 330 using gravity. When the process chamber 302 is pivoted, the supply lines 346 and 348 (and others, if provided) move with the process chamber 302 via an ascending loop provided for this purpose. In addition, the front end 332 of the closed or sealed chamber 302 is closed. -17 · This paper size applies to China National Standard (CNS) A4 (210X 297 mm)

裝 訂Binding

線 546172 A7 ---------B7 五、發明説明(~) ' ' 一---— 框架3 74隨該室移動。為更快速移吟 砂咏夜體’或移除液體而不 改變歧管340及342的位置,一底邱如姑“ l & σ卩切換排放管325也可提供 於製程室302之圓柱側壁面320。 較佳地,轉動或樞轉該室,佶搵 ^ 便侍液體以約0,1-30或0.1-10 或 CM-5 或(M-2mm/sec,〇.5_1〇 或 〇& 或 〇 “或細/咖的 速率排放。排放或下降速率選擇像實際速率一樣快,而不 具有與工件表面分離的液體凹面。 對於清潔程式,水由下歧管34〇及/或上歧管Μ?引入製程 室302。該水可噴遴至工件上。變換地,該水可流經出口而 =會噴灑。當製程室302㈣水位上升時,卫件將浸洗及洗 濯。當液位上升時許多歧管342可沈入液體中。依據製程, 來自這些歧管的流動或噴灑可關閉,或其可繼續傳送液 肢、氣體或蒸氣進入室3〇2中的液體溶液。 工件浸洗於清潔液體中。較佳地,連續更新液體溶液提 供至室302。該液體透過下歧管34〇或其他入口噴灑或汲 入。該液體較佳連續地經過整個液體移除程式透過排放管 開口 326排出,直到工件不再與液體溶液接觸。音速能量能 經至或轉子上的傳送器333施加至工件60。傳送器333,諸 如巨大音速或超音速傳送器,係定位來透過室3〇2中的液 體’傳送音速能量至液體中所浸洗的工件。 樞轉製程室302用以容許洗濯液體排出通過排放槽326, 如上述。於洗濯液體或水位開始下降前,諸如IpA蒸氣之有 機溶劑蒸氣係透過一或多個歧管342,位於液位上方,引入 該製程室302 ^該有機溶劑蒸氣水在工件表面/水界面之表 -18 - 本紙張尺度適用中國國家標準(CNS) A4規格(21〇χ297公釐) 546172Line 546172 A7 --------- B7 V. Description of the invention (~) '' One ----- Frame 3 74 moves with the room. In order to move the sand chanting body faster or remove the liquid without changing the positions of the manifolds 340 and 342, a bottom Qiu Rugu "l & σ 卩 switching discharge pipe 325 can also be provided on the cylindrical side wall 320 of the process chamber 302 Preferably, the chamber is rotated or pivoted, and the liquid is at about 0,1-30 or 0.1-10 or CM-5 or (M-2mm / sec, 0.5_1-10 or 〇 & or 〇 "or fine / coffee rate discharge. The discharge or decline rate is selected as fast as the actual rate without having a liquid concave surface separated from the surface of the workpiece. For the cleaning program, water flows from the lower manifold 34o and / or the upper manifold M ? Introduce process chamber 302. The water can be sprayed onto the workpiece. Alternatively, the water can flow through the outlet and = spray. When the water level in the process chamber 302 rises, the guard will dip and wash. When the liquid level rises Many manifolds 342 can be submerged in liquid. Depending on the process, the flow or spray from these manifolds can be turned off, or they can continue to transfer liquid limbs, gases, or vapors into the liquid solution in chamber 30. The workpiece is immersed in cleaning Liquid. Preferably, a continuous renewal liquid solution is provided to the chamber 302. The liquid permeates Manifold 34 or other inlets are sprayed or drawn in. The liquid is preferably continuously discharged through the discharge tube opening 326 through the entire liquid removal program until the workpiece is no longer in contact with the liquid solution. Sonic energy can be transmitted to or on the rotor A device 333 is applied to the workpiece 60. A conveyor 333, such as a megasonic or supersonic transmitter, is positioned to transmit sonic energy through the liquid in the chamber 302 to the workpiece being immersed in the liquid. To allow the washing liquid to drain through the drain tank 326, as described above, before the washing liquid or water level begins to fall, organic solvent vapors such as IpA vapor pass through one or more manifolds 342, located above the liquid level, and are introduced into the process chamber 302. Table-18 of the organic solvent vapor water on the surface / water interface of the workpiece-This paper size applies to China National Standard (CNS) A4 specification (21 × 297 mm) 546172

發明説明 面張力。這減少或避免當水下降時水滴留在工件表面上, 而導致較少的污染。此蒸氣有助於由工件移除液體。諸如 氮或空氣的氣體或與該蒸氣也可透過一或多個歧管342引入 製程室3〇2。該氣體可加熱。當製程室3〇2繼續樞轉及液位 繼續下降時,提供額外的蒸氣及氣體(如使用)。該蒸氣可混 入氣體中。在液體完全地降低至工件位準下方後,關閉蒸 氣供給。氣體供給較佳地繼續除去任何來自室3〇2的剩餘蒸 氣。 在大多數或所有液體已藉由樞轉該室排出後,旋轉馬達 車乂佳在控制益/電腦3 2的控制下開啟,使轉子3 〇4旋轉。轉 子内工件的轉動有助於利用離心力移除工件任何剩餘的液 滴。氣體可當工件旋轉時噴灑至工件上,其有助於移除工 件任何剩餘的液體。在旋轉工件前或後,製程室旋轉回至 其原來的直立位置。 在製程室302内的工件完成後,手動關閉致動器3料重新 接合閉合框架374與撿拾器386。擺動致動器378向外移動凸 輪桿離開門環382。致動器384接著將閉合框架由製程室3〇2 的前端332拉開。門橋372移動回至下方位置。工件接著由 製程室302移除。雖然所敘述係用於批次的工件,本發明同 時應用於單一工件操作。 在一變換實施例中,轉子350可延伸且可經馬達3〇8或另 一致動器軸向向外伸縮,而沿著軸尺延伸轉子3〇4超出製程 至3 02外’為較易於加載及卸載。 一般而言,於浸洗加工期間,當製程室3〇2大量地充填液 • 19- I紙張尺度適财S S家標準(CNS) A4規格(210X297公爱)一 一 546172Description of the invention Face tension. This reduces or avoids water droplets remaining on the surface of the workpiece when the water drops, resulting in less contamination. This vapor helps to remove liquid from the workpiece. A gas, such as nitrogen or air, may also be introduced into the process chamber 302 through the one or more manifolds 342 with the vapor. The gas can be heated. When the process chamber 302 continues to pivot and the liquid level continues to drop, provide additional steam and gas (if used). This vapor can be mixed into the gas. After the liquid is completely lowered below the workpiece level, the steam supply is turned off. The gas supply preferably continues to remove any remaining vapor from chamber 302. After most or all of the liquid has been discharged by pivoting the chamber, the rotary motor Che Jia is turned on under the control of the control / computer 32 to rotate the rotor 300. The rotation of the workpiece in the rotor helps to remove any remaining droplets of the workpiece using centrifugal force. The gas can be sprayed onto the workpiece as it rotates, which helps remove any remaining liquid from the workpiece. Before or after rotating the workpiece, the process chamber is rotated back to its original upright position. After the workpiece in the process chamber 302 is completed, the actuator 3 is manually closed to re-engage the closed frame 374 and the picker 386. The swing actuator 378 moves the cam lever outward from the door knocker 382. The actuator 384 then pulls the closed frame away from the front end 332 of the process chamber 302. The gate bridge 372 moves back to the lower position. The workpiece is then removed from the process chamber 302. Although the description is for a batch of workpieces, the invention is also applicable to a single workpiece operation. In a modified embodiment, the rotor 350 can be extended and retracted axially by the motor 308 or another actuator, and the rotor 300 is extended along the shaft ruler beyond the process to 302, which is easier to load. And uninstall. Generally speaking, during the dipping process, when the process chamber 302 is filled with a large amount of liquid • 19- I paper size suitable for the family standard (CNS) A4 specifications (210X297 public love) one one 546172

體,轉子304將維持原位且不會旋轉。然而,對於某些製 粒轉子304可以低速旋轉,而轉子304及工件60浸洗於液 體中’用以攪動該液體或改良液體流動於工件表面。工件 I:換以例如5-15度與轉子垂直方向的傾斜角度握持,有助 於避免加工期間接觸於工件間。 現在回到第一變換系統,如圖20所示,一表面加工系統 511提供用於加工扁平工件,諸如半導體晶圓6〇。裝置或系 統511包括一製程室517,其選擇性地位於一外部容納室519 内。該外室5 19包含及配置製程流體,且將製程環境與周圍 壞境、操作人員,及緊鄰組件與設備隔離。該製程媒介可 包括清潔液體諸如氫氟酸(HF)、洗濯液體諸如水、氣體諸 如氮或氣體及有機蒸氣的混合物,或任何其組合。工件加 工係實行於製程室5 17中。 現在參考圖21,該室517具有一軸段525 ,其向後延伸通 過5 19的後段527。該軸段525經由直接機械連桿或經由磁性 連杯’連結至内室馬達或致動器529。該馬達529能以相當 緩慢連續及控制的動作樞轉該内室5丨7。馬達529也能旋轉 内室5 17。馬達529也能樞轉該内室517至所須角方位或位置 且握持該室517於其位置。該内室517如圖22所示具有圓柱 形側壁面,該側壁面具有排放管開口、凹槽,或窗口 5 5 5用 於移除來自該室的液體。一排放管邊緣557界定該開口 555 之下端。該排放管邊緣557較佳為水平的,且大致上行進通 過該内室517的整個長度。一突出部559可延伸位於排放管 邊緣的下方。樞轉在此意謂著少於360。的運動。相反地, •20- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)Body, the rotor 304 will remain in place and will not rotate. However, for some granulating rotors 304, it is possible to rotate at a low speed, and the rotor 304 and the workpiece 60 are immersed in a liquid 'to stir the liquid or improve the flow of the liquid on the surface of the workpiece. Workpiece I: Change to hold at an inclination angle of 5-15 degrees perpendicular to the rotor, to help avoid contact between the workpieces during processing. Returning now to the first conversion system, as shown in FIG. 20, a surface processing system 511 is provided for processing a flat workpiece such as a semiconductor wafer 60. The device or system 511 includes a process chamber 517 that is selectively located within an external receiving chamber 519. The outer chamber 5 19 contains and configures the process fluid, and isolates the process environment from the surrounding environment, operators, and immediate components and equipment. The process medium may include a cleaning liquid such as hydrofluoric acid (HF), a washing liquid such as water, a gas such as nitrogen or a mixture of gases and organic vapors, or any combination thereof. Workpiece machining is carried out in process room 5-17. Referring now to FIG. 21, the chamber 517 has a shaft section 525 that extends rearwardly through a rear section 527 of 519. This shaft segment 525 is connected to the inner chamber motor or actuator 529 via a direct mechanical link or via a magnetic coupling cup '. The motor 529 can pivot the inner chamber 5 丨 7 in a relatively slow continuous and controlled motion. The motor 529 can also rotate the inner chamber 5-17. The motor 529 can also pivot the inner chamber 517 to the required angular orientation or position and hold the chamber 517 in its position. The inner chamber 517 has a cylindrical side wall surface as shown in Fig. 22, which side wall has a discharge pipe opening, a groove, or a window 5 5 5 for removing liquid from the chamber. A discharge pipe edge 557 defines the lower end of the opening 555. The discharge pipe edge 557 is preferably horizontal and runs substantially the entire length through the inner chamber 517. A protrusion 559 may extend below the edge of the discharge pipe. Pivot here means less than 360. exercise. Conversely, • 20- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

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546172 A7 _________B7 五、發明説明(18^^ -~—— 迴轉或旋轉在此意謂著持續36〇。多的運動。 該内室517較佳包括至少一出口 531諸如喷嘴,用於藉由 噴灑或其他技術傳送製程流體521至工件515。噴嘴或出口 53 1可為上方或下方或至工件6〇之一側,使得製程流體Μ} 旎垂直上下或水平方向行進。至少一通道或管線533傳送製 程流體521至喷嘴或出口 531。一或多歧管53 5,各具有一出 口或噴嘴陣列可使用。在一内室5 17旋轉的實施例中,該管 線或底座533連接至如圖21所示中設備内或外側之一旋轉流 體聯結器537或相同裝置。 現在參考圖20及21,一用於握持工件6〇之轉子或工件支 架539係隨室517定位。較佳地,轉子539具有凹槽,典型地 均等間隔,用於握持該工件60。一轉子驅動馬達541連結至 轉子539的軸段543,其延伸通過内室517的軸段525。變換 地,轉子539可以磁性聯結器連結至馬達54i。 該轉子539變換地具有握持載具或卡匣内之工件6〇的特 性。在任一情形中,該轉子539具有止動器工件於定位。 如果使用,磁性聯結器藉由磁力分別地連接至轉子539及 轉子驅動器541,及該室致動器529及室5 17,而不需由一驅 動軸實際實體連接或穿透該室517。因此,該室54〇内之空 間可最佳關閉或密封以防污染。 再次參考圖21及23,室517具有一門547,用於容納室517 内的製程流體550。該外室519同樣地具有一外門549。當門 549關閉時,該外室519將工件60與外室519環境外側中的污 染物隔離。外室519具有一或多出口 551用於移除流體。 •21 - 本纸張尺度適用中國國家標準(CNS) A4规格(210 X 297公釐) 546172 A7 ________ B7 五、發明説明(—~) " 在使用上,5亥轉子5 3 9利用手或機器人,通過開放門延伸 至内室)17的外面。工件515可接著載入轉子539。當轉子載 有一或多個工件時,門547接著549關閉,較佳地但不必須 提供流體緊密及/或氣體緊密的密封。當門關閉時,較佳在 關閉或密封外室内的室517提供完整之關閉空間或環境。 各種製程步驟可接著完成。對於浸洗製程,製程流體由 一或多開口或噴嘴531,經供給管線533汲入室517。該内室 517能沿縱(前至後)軸經馬達29樞轉。這容許開口 555由位於 室:>17液位上方位置移動至下方位置,其間液體能通過口 555排出。在一實施例中,其間室517樞轉、但不旋轉或迴 轉,供給線路533能具備足夠的鬆弛用以容許其依循室517 的樞轉動作,且不需要旋轉聯結器537或其他流體傳送技 術。 於浸洗製程期間,流體提供進入室517,直到工件較佳完 成全地浸洗。定位室517使得開口 555接近如圖2〇所示之室 頂部,避免液體由室517排出。該轉子驅動馬達541可接著 在製程"it體内旋轉該馬達5 3 9及工件6 0。此技術經流體及工 件間的相對運動提供工件60上之混合及流體運動。該旋轉 速度可低以避免共度的飛濺及擾動。對於一些應用,轉子 539及室517二者可維持靜止,將工件浸洗於室517中所包含 的靜止製程流體,達一所須時間區間。 於加工期間在適當時間來移除液體,該室5 1 7藉由室驅動 器529樞轉’使得開口 555位於或低於液體521的位準。這容 許流體通過内製程室517之圓柱形側壁面中的開口 555充滿 •22- 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 546172 A7546172 A7 _________B7 V. Description of the invention (18 ^^-~ —— Rotation or rotation here means a continuous movement of more than 36 °. The inner chamber 517 preferably includes at least one outlet 531 such as a nozzle for spraying by spraying. Or other technology transfers the process fluid 521 to the workpiece 515. The nozzle or outlet 53 1 may be above or below or to one side of the workpiece 60, so that the process fluid M} 旎 travels vertically up or down or horizontally. At least one channel or line 533 transfers Process fluid 521 to nozzles or outlets 531. One or more manifolds 53 5, each with an outlet or nozzle array can be used. In an embodiment where an inner chamber 5 17 rotates, the line or base 533 is connected to as shown in Figure 21 One of the rotating fluid couplings 537 or the same is shown inside or outside the equipment. Referring now to Figures 20 and 21, a rotor or workpiece holder 539 for holding the workpiece 60 is positioned with the chamber 517. Preferably, the rotor 539 With grooves, typically equally spaced, for holding the workpiece 60. A rotor drive motor 541 is connected to the shaft section 543 of the rotor 539, which extends through the shaft section 525 of the inner chamber 517. Alternatively, the rotor 539 may be magnetically coupled Device It is connected to the motor 54i. The rotor 539 alternately has the characteristic of holding the workpiece 60 in the carrier or the cassette. In either case, the rotor 539 has a stopper workpiece for positioning. If used, the magnetic coupling is provided by The magnetic force is connected to the rotor 539 and the rotor driver 541, and the chamber actuator 529 and the chamber 517, respectively, without physically connecting or penetrating the chamber 517 by a drive shaft. Therefore, the space in the chamber 54 It can be optimally closed or sealed to prevent contamination. Referring again to Figures 21 and 23, the chamber 517 has a door 547 for receiving the process fluid 550 in the chamber 517. The outer chamber 519 also has an outer door 549. When the door 549 is closed At this time, the outer chamber 519 isolates the workpiece 60 from contaminants in the environment outside the outer chamber 519. The outer chamber 519 has one or more outlets 551 for removing fluids. • 21-This paper size applies to Chinese National Standards (CNS) A4 specifications (210 X 297 mm) 546172 A7 ________ B7 V. Description of the invention (— ~) " In use, the 5 helical rotor 5 3 9 extends to the inner room through the open door by hand or robot 5) 17. The workpiece 515 may then be loaded into the rotor 539. When the rotor is carrying one or more workpieces, the door 547 is then closed 549, preferably but not necessarily, providing a fluid-tight and / or gas-tight seal. When the door is closed, it is preferred to provide a complete closed space or environment in the closed or sealed chamber 517 in the outer chamber. Various process steps can then be completed. For the dipping process, the process fluid is drawn into the chamber 517 through one or more openings or nozzles 531 through a supply line 533. The inner chamber 517 can be pivoted by a motor 29 along a longitudinal (front to back) axis. This allows the opening 555 to be moved from a position above the liquid level of the chamber: > 17 to a lower position during which liquid can be discharged through the port 555. In an embodiment, the compartment 517 pivots, but does not rotate or rotate. The supply line 533 can have sufficient slack to allow it to follow the pivoting action of the compartment 517, and does not require a rotating coupling 537 or other fluid transfer technology. . During the dipping process, fluid is provided into the chamber 517 until the workpiece is preferably fully dipping. Position the chamber 517 so that the opening 555 is close to the top of the chamber as shown in Fig. 20 to prevent liquid from being discharged from the chamber 517. The rotor driving motor 541 can then rotate the motor 5 3 9 and the workpiece 60 in the process " it. This technique provides mixing and fluid motion on the workpiece 60 via relative motion between the fluid and the workpiece. This rotation speed can be low to avoid common splashes and disturbances. For some applications, both the rotor 539 and the chamber 517 can remain stationary, and the workpiece is immersed in the stationary process fluid contained in the chamber 517 for a required time interval. To remove the liquid at the appropriate time during processing, the chamber 5 1 7 is pivoted 'by the chamber driver 529 such that the opening 555 is at or below the level of the liquid 521. This allows the fluid to fill through the opening 555 in the cylindrical side wall surface of the inner process chamber 517. 22- This paper size applies to China National Standard (CNS) A4 (210X297 mm) 546172 A7.

氛排出,如圖22所示。開^ 5以& & 較佳以控制方式逐漸地向下 移動,利用連續樞轉室5 17,以快在丨 ^ 控制之速率移除流體。由内 至517移除的液體流入外室519,豆 田内 地經埠551沖洗通過或流出外室53〇。 —、擇 當移體移除(或如果沒有實杆读 只仃/又冼步驟)時,工件6〇係於 至5 17内之清潔氣體或空氣環诗由 一 孔衣土兄中。進一步的製程步驟可接 著實行。例如,工件5 15可以、、奋省沾# μ ,, /月珠的液體(例如水)將其噴灑 來清除。不論是否迴轉或樞轉室5n(室517上之噴嘴5川, 且不論是否旋轉該握持工件的趙不 .. 、 仟的轉子,或二者,選擇性加熱 之氣體可接著經噴嘴53 1嘖選力τ此ϊ* 本 只月μ T邐在工件上。為將離心液體移 除,轉子531可以高速旋轉。 對於後續加工步驟,不同液體、氣體或蒸氣(共同在此稱 為“流體”)媒體可由流體供給源581,藉由液態氣體或蒸 氣,經噴灑或其他應用施加至工件。洗濯及/或清潔可實行 於加工步驟間。然而,工件能隨時留在室5丨7内,藉此減少 污染的潛在性。 由内製程至5 17移除製程流體5 2 1,可變換地經容許流體 521透過内製程室517中切換室561逃逸來完成,該内製程室 大致地位於相對於排放邊緣557的位置。相同於流體管線 533 ’排放管561可經由外部磁性改變或由室5 17中氣壓或液 壓或電氣控制線路來切換。 對於經浸洗的加工工件,連續更新的液體溶液可提供於 内製程室517中,而當室517反時針樞轉於圖20及22時,同 時及連續地透過側壁面之排放邊緣5 5 7排出。對於某些應 -23- 本紙張尺度適用中國國家標準(CNS) Α4規格(210 X 297公釐) 546172 A7 _____B7 五、發明説明(~~) ' 用,室5 17中的製程液位僅可覆蓋部份的工件。工件能接著 旋轉於轉子539,使得所有工件表面至少暫時地浸洗。 在上述任何實施例或方法中,工件能旋轉於轉子中,以 提供製程流體均勻的分佈。 在由工件移除液體的製程中,能使用一降低製程的表面 張力梯度。一諸如解離子水之洗濯流體引入内製程室517, 用以移除任何剩餘製程化學藥品。諸如氮的氣體及諸如異 丙醇之有機蒸氣接著經歧管535,或經第二相同歧管引進, 使易於表面張力梯度由工件表面移除洗濯液體。 參考回至圖20,洗濯液體521利用有機蒸氣來移除,該有 機蒸氣減少液體-氣體界面565之表面張力。利用表面張力 效應,洗濯液體521能得由界面區域565向下移動至大部份 之洗濯液體521。 因此,透過内製程室517緩慢控制的旋轉,洗濯流體位準 能降低,藉此移除洗濯液體表面上留存之洗濯液體521及污 染物。此方法由工件60移除液體,藉由容許有機蒸氣所引 發之表面張力梯度,當洗濯液體退縮時維持於工件的表 面。吸入歧管567可提供緊鄰於排放管邊緣557,用以排出 室517中液體的表面。 於洗濯液體由内製程室517移除的製程室期間,新洗濯流 體能引入内製程室540,而製程室將樞轉排放流體。當液體 表面流動朝向排放槽時,新液體固定流入產生溢出。這將 容許移除由清潔及洗濯製程所造成,且易於留在流體表面 的分子及累積污染物。 -24- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) B7 五、發明説明(22 ) 产外部容納室519能經連接至沖洗埠587之沖洗氣體源583以 氣體或蒸氣沖洗,而維持所須環境。此氣體可為氮、氬, 或諸如氫氟酸(HF)之蒸氣或其組合。相同地,氣體或蒸氣 能引入内製程室517中,用以提供受控制的環境。 音速能量可經内室中的傳送器575(巨大音速或超音速傳 送器)施加至工件,如圖20所示。該傳送器575係定位用以 傳送音速能量過内室中的液體至液體中所浸洗的工件。該 音速傳送器也可提供於轉子上或接觸轉子所握持的工件。 不同型式開口 ’傳送可單獨使用或彼此組合。該音速傳 送器575經配置於或透過内室517之導線或經轉子539上的導 線’選擇地供電至系統或裝置5 11的後端的滑環。 在另一實施例中,除室517不具開口 555外,裝置相同上 述相關圖20-22之敘述。然而,内室具有連續圓柱形側壁 面’使其能由547關閉及密封。此外,流體供給管線533經 旋轉流體聯結器5 3 7連接至内室中的出口或噴嘴。當内室由 液體供給時,旋轉流體聯結器容許内室旋轉(不僅例如 100°,而連續地36(Γ多用於排放液體)。一相同旋轉接線(較 佳為電氣或氣動)連結該内室517中切換排放管開口 561至控 制器。由此設計,即使來自該外室5 19,該内室5 17為關閉 的(且較佳為密封的)。因此,污染進一步避免。外室519能 接著省略。具有排放官開口 555的實施例,藉由安裝圖22所 示的側壁板579覆蓋開口 555,可轉換成關閉的實施例。 對於某些製程步驟,夾持器或轉子539中之工件60能維持 固定,而該室517隨其旋轉。變換地,室517及轉子539二者 •25- 本紙張尺度適用中國國家標準(CNS) Α4規格(210 X 297公釐) 546172 A7 B7 五、發明説明(23 ) 中的工件515可迴轉或旋轉。又再者,在工件⑼隨時固定的 設計中,轉子539可結構為簡單連接至固定(非迴轉)之後方 結構的夾持器’且該室517隨其旋轉(例如,當排放液體或 喷灑或另外施加製程媒介至該工件上時)。此閉合實施例以 可實行浸洗加工。然而,當沒有開口 555時,液體的移除藉 由打開排放管561產生’利用該室之定位使排放管561位於 一低點。 在-變換處理器設計中,或直接地或由握持包含工件之 載具,工件支架握持工件。一副室或製程室沿著該室支架 提供且當閉合時,適合握持液體。液體提供進入製程室, 使得該工件至少部份地浸洗。製程室樞轉或旋轉,導致一 凹槽、排放管開口或溢流邊緣向下移動至該液體位準。這 容許液體由製程室流出。製程室繼續旋轉,直到大部份或 所有液體由該室移除。其他步驟及下述特性可能有其優 點’但對於本發明並非最主要的。 -使用於系統10之變換處理器單元65〇係如圖“所表示。 該處理器單S65G可使用於自動系統1(),如圖丨、24及如 示’或在其他自動系統,或其可單獨使用,使工件由處理 器單元650手動或由專用機器人來加載及卸載。如圖%所 示’處理器單元具有一工件支架656。工件支架咖固定於 定位且不移動。一製程室或副室654圍繞或關閉大三側面上 之工件支架656。打開室654的頂部。 工件支架656係如圖28表示為一分離組件或副組件。一前 -26- i紙張尺度適财@ s家標準_)織格(21GX297公爱 1---------- 546172 A7 B7 五、發明説明(24 ) 環672及後環或板674連接至支架臂670。梳件676或其他工 件邊緣支架(諸如桿或柱)延伸於該前環672及後環674間。位 於該支架臂670後端之連接轂678,連接至外室652之後壁或 其他固定結構。因此,該晶圓架656相對於室654及製程機 器人22固定於定位。該前環672中之前開口 684容許工件由 工件支架656加載或卸載。 參考圖27及28,一上歧管682提供接近於該工件支架656 的頂部。該上歧管682連接至製程液體或蒸氣供給,較佳為 異丙醇蒸氣(雖然也可使用其他液體及蒸氣)。一下方或第二 歧管680提供接近於該工件支架656的底部。該下歧管680連 接至製程或洗濯液體,較佳為解離水的供給。 圖29分別地表示室654。如圖29所示,該室654具有一連 接至該室654後端之後壁或板690之圓柱形壁面692。如圖26 所示,該圓柱壁面692係打開於頂端。該圓柱形壁面692(在 圖26的左側)之上緣之一形成排放邊緣696。在使用上,包 含在該室或缽件654内之液體流出覆蓋於排放邊緣696。切 口 700可提供於排放邊緣696用以改良液體流出特性。 該室654連接至及藉由軸698所支撐,該軸可旋轉支撐於 外室652(如有使用)或其他製程機台30之固定結構。參考圖 27及29,馬達或旋轉致動器704之驅動軸702延伸通過軸698 且接合至室654的後板690。馬達或致動器704可為電氣、液 壓、氣壓,等等。馬達704的致動導致室654的樞轉。在外 室652使用處,該驅動軸702可由磁性聯結器替換,用以避 -27- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐)The atmosphere is discharged as shown in FIG. 22. The opening 5 is gradually moved downward in a controlled manner, preferably using a continuous pivoting chamber 5 17 to remove the fluid at a fast controlled rate. The liquid removed from the inside to the 517 flows into the outer chamber 519, and the soybean field is flushed through the port 551 or flows out of the outer chamber 53. — 、 Selection When the body is removed (or if there is no real bar reading, only 仃 / 冼 steps), the workpiece 60 is tied to a clean gas or air ring within 5 to 17 by a Kongyi Tuxiong. Further process steps can then be implemented. For example, workpieces 5 and 15 can be removed by spraying with a liquid (such as water) from moon beads. Regardless of whether the chamber 5n is rotated or pivoted (nozzle 5 in the chamber 517), and whether or not the rotor that holds the workpiece is rotated or not, the selectively heated gas can then pass through the nozzle 53 1啧 选 力 τ 此 ϊ * This month μ T 逦 is on the workpiece. To remove the centrifugal liquid, the rotor 531 can rotate at high speed. For subsequent processing steps, different liquids, gases, or vapors (collectively referred to herein as "fluids" ) The medium can be applied to the workpiece from a fluid supply source 581 by means of liquid gas or vapor by spraying or other applications. Washing and / or cleaning can be performed between processing steps. However, the workpiece can be left in the chamber 5 丨 7 at any time, This reduces the potential for contamination. Removal of the process fluid 5 2 1 from the internal process to 5 17 is accomplished reversibly by allowing the fluid 521 to escape through the switching chamber 561 in the internal process chamber 517, which is located approximately relative to The location of the discharge edge 557. Same as the fluid line 533 'The discharge pipe 561 can be changed via external magnetism or switched by pneumatic or hydraulic or electrical control lines in chambers 5-17. For immersed processed workpieces, continuously updated The liquid solution can be provided in the inner process chamber 517, and when the chamber 517 is pivoted counterclockwise in FIGS. 20 and 22, it is simultaneously and continuously discharged through the discharge edge 5 5 7 of the side wall surface. Paper size applies to Chinese National Standard (CNS) A4 specification (210 X 297 mm) 546172 A7 _____B7 V. Description of the invention (~~) 'Use, the process level in chamber 5 17 can only cover part of the workpiece. The workpiece can It is then rotated on the rotor 539, so that all workpiece surfaces are at least temporarily immersed. In any of the above embodiments or methods, the workpiece can be rotated in the rotor to provide a uniform distribution of the process fluid. In the process of removing liquid from the workpiece, A surface tension gradient that reduces the process can be used. A cleaning fluid such as deionized water is introduced into the internal process chamber 517 to remove any remaining process chemicals. Gases such as nitrogen and organic vapors such as isopropanol are then passed through the manifold. 535, or introduced through the second same manifold, makes it easy to remove the washing liquid from the surface of the workpiece with a gradient of surface tension. Referring back to FIG. 20, the washing liquid 521 is removed using organic vapor, which is Reduce the surface tension of the liquid-gas interface 565. Using the surface tension effect, the washing liquid 521 can move down from the interface area 565 to most of the washing liquid 521. Therefore, the washing fluid is slowly rotated through the internal process chamber 517, The level can be lowered to remove the cleaning liquid 521 and contaminants remaining on the surface of the cleaning liquid. This method removes the liquid from the workpiece 60 and allows the surface tension gradient caused by the organic vapor to be maintained at the time when the cleaning liquid shrinks. The surface of the workpiece. The suction manifold 567 may provide a surface immediately adjacent to the edge 557 of the discharge pipe for discharging the liquid in the chamber 517. During the process chamber in which the washing liquid is removed from the inner process chamber 517, a new washing fluid can be introduced into the inner process chamber 540, and the process chamber will pivot to drain fluid. When the surface of the liquid flows toward the drain tank, new liquid flows in constantly and overflows. This will allow the removal of molecules and accumulated contaminants that are caused by the cleaning and washing processes and that are liable to remain on the surface of the fluid. -24- This paper size applies Chinese National Standard (CNS) A4 (210X 297mm) B7 V. Description of the invention (22) The external storage chamber 519 can be connected to the flushing gas source 583 of the flushing port 587 with a gas or vapor Rinse while maintaining the required environment. This gas may be nitrogen, argon, or a vapor such as hydrofluoric acid (HF) or a combination thereof. Similarly, gas or vapor can be introduced into the internal process chamber 517 to provide a controlled environment. Sonic energy can be applied to the workpiece via a transmitter 575 (huge sonic or supersonic transmitter) in the inner chamber, as shown in FIG. 20. The conveyor 575 is positioned to transfer sonic energy through the liquid in the inner chamber to the workpiece being immersed in the liquid. The sonic transmitter can also be provided on the rotor or in contact with the workpiece held by the rotor. Different types of openings can be used alone or in combination with each other. The sonic transmitter 575 is selectively powered to or from the slip ring at the rear end of the system or device 511 via a wire disposed in or through the inner chamber 517 or via a wire on the rotor 539. In another embodiment, the device is the same as described above in relation to Figures 20-22, except that the chamber 517 does not have an opening 555. However, the inner chamber has a continuous cylindrical side wall surface ' enabling it to be closed and sealed by 547. In addition, the fluid supply line 533 is connected to an outlet or a nozzle in the inner chamber via a rotary fluid coupling 5 3 7. When the inner chamber is supplied by liquid, the rotating fluid coupling allows the inner chamber to rotate (not only for example 100 °, but continuously 36 (Γ is mostly used to discharge liquid). An identical rotary wiring (preferably electrical or pneumatic) connects the inner chamber In 517, the discharge pipe opening 561 is switched to the controller. Thus, even from the outer chamber 5 19, the inner chamber 5 17 is closed (and preferably sealed). Therefore, pollution is further avoided. The outer chamber 519 can It will be omitted. The embodiment with the discharge opening 555 can be converted into a closed embodiment by installing the side wall plate 579 shown in FIG. 22 to cover the opening 555. For some process steps, the workpiece in the holder or the rotor 539 60 can remain fixed, while the chamber 517 rotates with it. In the alternative, both the chamber 517 and the rotor 539 • 25- This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 546172 A7 B7 V. Invention description (23) The workpiece 515 can be rotated or rotated. Furthermore, in the design where the workpiece ⑼ is fixed at any time, the rotor 539 can be structured as a clamp that is simply connected to a fixed (non-rotating) rear structure. Room 517 with Rotate (for example, when discharging liquid or spraying or otherwise applying process media to the workpiece). This closed embodiment enables dip processing. However, when there is no opening 555, the liquid is removed by opening the discharge tube 561 Production 'Using the positioning of the chamber, the discharge pipe 561 is located at a low point. In the design of the change-over processor, the workpiece is held directly or by holding the carrier containing the workpiece, and the workpiece holder holds the workpiece. An auxiliary room or process room The support is provided along the chamber and is suitable for holding liquid when closed. The liquid is supplied into the process chamber so that the workpiece is at least partially immersed. The process chamber pivots or rotates, resulting in a groove, drain opening or overflow The edge moves down to the liquid level. This allows liquid to flow out of the process chamber. The process chamber continues to rotate until most or all of the liquid is removed from the chamber. Other steps and the characteristics described below may have advantages. The invention is not the most important.-The conversion processor unit 65 used in the system 10 is shown in the figure ". The processor single S65G can be used in the automatic system 1 (), as shown in Figs. Other automatic systems, or it can be used alone, so that the workpiece is loaded and unloaded manually by the processor unit 650 or by a dedicated robot. As shown in the figure, the processor unit has a workpiece holder 656. The workpiece holder is fixed in position and does not Move. A process room or auxiliary room 654 surrounds or closes the workpiece holder 656 on the three sides. Opens the top of the chamber 654. The workpiece holder 656 is shown as a separate component or sub-assembly as shown in Figure 28. A front-26-i paper Scale suitable wealth @ s 家 标准 _) Zhige (21GX297 public love 1 ---------- 546172 A7 B7 V. Description of the invention (24) The ring 672 and the rear ring or plate 674 are connected to the bracket arm 670. A comb 676 or other workpiece edge bracket (such as a pole or post) extends between the front ring 672 and the rear ring 674. A connecting hub 678 at the rear end of the bracket arm 670 is connected to the rear wall of the outer chamber 652 or other fixing structure. Therefore, the wafer rack 656 is fixed in position relative to the chamber 654 and the process robot 22. The front opening 684 in the front ring 672 allows the workpiece to be loaded or unloaded by the workpiece holder 656. 27 and 28, an upper manifold 682 is provided close to the top of the workpiece holder 656. The upper manifold 682 is connected to a process liquid or vapor supply, preferably isopropanol vapor (although other liquids and vapors may be used). A lower or second manifold 680 provides access to the bottom of the workpiece holder 656. The lower manifold 680 is connected to a process or washing liquid, preferably a supply of dissociated water. FIG. 29 shows the chambers 654, respectively. As shown in FIG. 29, the chamber 654 has a cylindrical wall surface 692 connected to a rear wall or plate 690 of the rear end of the chamber 654. As shown in FIG. 26, the cylindrical wall surface 692 is opened at the top. One of the upper edges of the cylindrical wall surface 692 (on the left side of Fig. 26) forms a discharge edge 696. In use, the outflow of liquid contained in the chamber or bowl 654 covers the discharge edge 696. The notch 700 may be provided at the discharge edge 696 to improve liquid outflow characteristics. The chamber 654 is connected to and supported by a shaft 698, which is rotatably supported by the outer chamber 652 (if used) or other fixed structures of the process machine 30. 27 and 29, a drive shaft 702 of a motor or rotary actuator 704 extends through the shaft 698 and is coupled to a rear plate 690 of the chamber 654. The motor or actuator 704 may be electrical, hydraulic, pneumatic, and so on. Actuation of the motor 704 causes pivoting of the chamber 654. Where the outer chamber 652 is used, this drive shaft 702 can be replaced by a magnetic coupling to avoid

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線 546172 A7 B7 五、發明説明(25 ) 免沿該工件穿透進入該製程環境。 圖3 0及3 1表示該選擇性外室652為一分離組件,而為圖示 目的將各種組件移除。參考圖30,該外室652包括一接合至 後板722的圓柱形壁面720。一外室652底部之排放槽726係 提供用以收集液體及將其導引至排放出口 728。該排放出口 728連接至設施廢水排放管或其他排水系統。支撐外室652 的底板730依序連接至圖27所示之底盤734或製程機台30之 其他結構。該外室652之圓柱形壁面720連續地(360°)延伸。 打開外室652的前端732。 參考圖27,於加工期間,一門組件738提供用以關閉室 654之開放前端或前開口 684。這容許室654於加工期間裝載 液體。如圖27所示,一外室652使用處,該門組件738同時 關閉該外室652的開放前端。 參考圖27及32,該門組件738包括連接至一樞承742之室 門板740。該樞承742由樞軸球754固定於止動器744内。該 門板740及樞承742能相對於止動器744樞轉〇-形環752。這 容許該門板740隨室654樞轉,而門組件738的剩餘部份維持 定位。 該樞軸球754固定於一内圓柱體760内。該内圓柱體760裝 載於一外圓柱體762内。一滑動壓力密封764將該内圓柱體 760沿著外圓柱體762密封,而容許該内圓柱體滑動(以圖32 之左-右方向)於外圓柱體762内。壓縮空氣或流體埠772及 774提供於該外圓柱體762之外及内端,其位於該滑動壓力 -28 - 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐)Line 546172 A7 B7 V. Description of the invention (25) Avoid penetrating into the process environment along the workpiece. Figures 30 and 31 show the selective outer chamber 652 as a separate component, with various components removed for illustration purposes. Referring to FIG. 30, the outer chamber 652 includes a cylindrical wall surface 720 joined to a rear plate 722. A drain tank 726 at the bottom of an outer chamber 652 is provided to collect liquid and direct it to a drain outlet 728. The discharge outlet 728 is connected to a facility wastewater discharge pipe or other drainage system. The bottom plate 730 supporting the outer chamber 652 is sequentially connected to the chassis 734 shown in FIG. 27 or other structures of the process machine 30. The cylindrical wall surface 720 of the outer chamber 652 extends continuously (360 °). The front end 732 of the outer chamber 652 is opened. Referring to FIG. 27, during processing, a door assembly 738 provides an open front end or front opening 684 to close the chamber 654. This allows the chamber 654 to be filled with liquid during processing. As shown in FIG. 27, where an outer chamber 652 is used, the door assembly 738 closes the open front end of the outer chamber 652 at the same time. Referring to Figures 27 and 32, the door assembly 738 includes a room door panel 740 connected to a pivot bearing 742. The pivot bearing 742 is fixed in the stopper 744 by a pivot ball 754. The door panel 740 and the pivot bearing 742 can pivot the O-ring 752 relative to the stopper 744. This allows the door panel 740 to pivot with the chamber 654 while the remainder of the door assembly 738 remains in place. The pivot ball 754 is fixed in an inner cylinder 760. The inner cylinder 760 is housed in an outer cylinder 762. A sliding pressure seal 764 seals the inner cylinder 760 along the outer cylinder 762, while allowing the inner cylinder to slide (in the left-right direction of FIG. 32) within the outer cylinder 762. Compressed air or fluid ports 772 and 774 are provided outside and inside the outer cylinder 762, which is located at the sliding pressure -28-This paper size applies to China National Standard (CNS) A4 (210X 297 mm)

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線 546172 A7 —-------B7 五、發明説^~~) " *一 岔封764之對立側上。在壓力下經引入空氣或液體進入埠 772及774,該内圓柱體760移入或移出用以將該板74〇接合 或分離至室654。一連接至該外圓柱體762内側端之頂蓋乃8 補捉該内圓柱體760,且限制其移動至指定範圍。一密封止 動裔748握持一外室門密封746至該門板766上。 又參考圖27及32, 一門安裝板768支撐該外圓柱體762。 外罩770選擇性地提供覆蓋於該外圓柱體762的前表面。 暫時參考圖33及34,整個門組件738支撐於門軌道78〇 上,該軌道接合至處理器650的支撐結構或外殼。連接至門 安裝板768的套管782滑動於門軌道78〇上。致動器或馬達 776垂直地沿門執道移動整個門組件738。 工件60經製程機器人22載入處理器單元“ο,且藉面段24 移動至製程段26。製程參數及工件動作可由電腦/控制器 32 ’或由控制面板28 ’或由其他遙控或設施電腦/控制器來 控制。 於加載及卸載期間,門組件738係位於下方位置,如圖33 之雙虛線所示。製程機器人22移動工件通過外室652(如有 使用)的開放前端732、通過室654的放前端708 ,及通過工 件支架656的開放前端。製程機器人22配置工件6〇進入該梳 件676或工件支架660内其他支撐表面。製程機器人22接著 拍出。工件60握持於工件支架656使得其不會彼此接觸。一 般而言,工件位於直立或接近直立位置(例如,在垂直線之 +/- 5、10、15、20或30。内)。該梳件676可以例如5-15。的些 -29- 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公楚) 546172 A7 B7 五、發明説明(27 ) 微角度握持該工件,用以減少工件動作。 門組件73 8由向下位置,如圖3 3之雙虛線所示,移動至向 上位置,如圖33及34之實線所示。 門組件738由位於抽出或分離位置,而該内圓柱體760、 樞軸球754、門板766及室門板740向前移動且652及製程室 654離開,如圖32之虛線所示。一壓縮液體或氣體藉由外埠 774提供進入外圓柱體762。這驅動内圓柱體760及門板766 及740向後且進行接合該外室652及製程室654。特別地,當 内圓柱體760向内移動朝向外室652及該製程室654,沿著該 圓柱形壁面692之門板密封706經由室門板740接合。同時, 該外室門板766移動進行與門板766上之密封746接合,而門 板接合於外室圓柱形壁面720的前緣。 當門組件73 8位於接合位置,如圖27所示,該室654能包 含液體,且充填至一位準可達排放管邊緣696,使得該工件 60受到浸洗。在室654圓柱形壁面692之前端與室門板740間 密封的接觸可提供液體緊密的密封。然而,少量的洩漏大 上可接受。相同地,少量洩漏通過密封746也大致上可接 受。 當門組件73 8接合時,液體引入製程室654。液體可由噴 嘴或其簡單地可由下歧管680中的開口噴灑。液體較佳為解 離水。下歧管680經由延伸通過支架臂670及連接轂678之液 體供給管線686供給。這避免室654之樞轉動作及連接至工 件支架656上下歧管680之液體供給管線686間的干擾。梳件 -30- 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐)Line 546172 A7 —------- B7 V. Invention ^ ~~) " * 1 On the opposite side of Chafeng 764. Upon introduction of air or liquid under pressure into ports 772 and 774, the inner cylinder 760 is moved in or out to engage or separate the plate 740 into the chamber 654. A cap connected to the inner end of the outer cylinder 762 catches the inner cylinder 760 and restricts its movement to a specified range. A seal stop 748 holds an outer chamber door seal 746 to the door panel 766. Referring again to FIGS. 27 and 32, a door mounting plate 768 supports the outer cylinder 762. The cover 770 selectively provides a front surface covering the outer cylinder 762. Referring temporarily to FIGS. 33 and 34, the entire door assembly 738 is supported on a door rail 78o that is coupled to a support structure or housing of the processor 650. A sleeve 782 connected to the door mounting plate 768 slides on the door rail 78. An actuator or motor 776 moves the entire door assembly 738 vertically along the doorway. The workpiece 60 is loaded into the processor unit "ο by the processing robot 22, and is moved to the processing section 26 by the surface section 24. The process parameters and workpiece movements can be controlled by the computer / controller 32 'or the control panel 28' or by other remote control or facility computers / Controller to control. During loading and unloading, the door assembly 738 is located in the lower position, as shown by the double dashed line in Figure 33. The process robot 22 moves the workpiece through the open front end 732 of the outer chamber 652 (if used), the passage chamber The front end 708 of 654 and the open front end through the workpiece holder 656. The processing robot 22 configures the workpiece 60 to enter the comb 676 or other supporting surface in the workpiece holder 660. The processing robot 22 then shoots. The workpiece 60 is held on the workpiece holder 656 prevents them from touching each other. Generally, the workpieces are in an upright or near upright position (for example, within +/- 5, 10, 15, 20, or 30. of a vertical line). The comb 676 can be, for example, 5- 15. -29- This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X297 Gongchu) 546172 A7 B7 V. Description of the invention (27) The workpiece is held at a slight angle to reduce the movement of the workpiece. Door group The piece 73.8 is moved from the downward position, as shown by the double dotted line in Fig. 33, to the upward position, as shown by the solid line of Fig. 33 and 34. The door assembly 738 is located in the withdrawn or separated position, and the inner cylinder 760 , Pivot ball 754, door panel 766 and chamber door panel 740 move forward and 652 and process chamber 654 leave, as shown by the dashed line in Figure 32. A compressed liquid or gas is supplied into outer cylinder 762 through outer port 774. This drives the inner The cylinder 760 and the door panels 766 and 740 are rearwardly engaged with the outer chamber 652 and the process chamber 654. In particular, when the inner cylinder 760 moves inward toward the outer chamber 652 and the process chamber 654, along the cylindrical wall surface 692, The door panel seal 706 is joined via the chamber door panel 740. At the same time, the outer chamber door panel 766 moves to engage with the seal 746 on the door panel 766, and the door panel engages the leading edge of the cylindrical wall surface 720 of the outer chamber. When the door assembly 73.8 is in the engaged position, As shown in FIG. 27, the chamber 654 can contain liquid and is filled up to the edge of the discharge pipe 696 so that the workpiece 60 is immersed. The front end of the cylindrical wall surface 692 of the chamber 654 and the door panel 740 are sealed. Contact provides liquid tightness However, a small amount of leakage is generally acceptable. Similarly, a small amount of leakage is generally acceptable through the seal 746. When the door assembly 73.8 is engaged, the liquid is introduced into the process chamber 654. The liquid may be from the nozzle or simply from the lower manifold. The opening in 680 is sprayed. The liquid is preferably dissociated water. The lower manifold 680 is supplied via a liquid supply line 686 extending through the bracket arm 670 and the connection hub 678. This avoids the pivoting action of the chamber 654 and the upper and lower manifolds connected to the workpiece holder 656 Interference between liquid supply lines 686 of tube 680. Comb -30- This paper size applies to China National Standard (CNS) A4 (210X297 mm)

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線 546172 A7 B7 五、發明説明(28 ) 676較佳地提供多重工件用於批次,例如一批次5-50工件加 工的位置。下歧管680較佳地位於或接近工件支架的底部。 裝 水或其他液體經歧管680供給,而該室654位於直立或0° 的位置,如圖26及36所示。水供給進入室654,較佳直到工 件60完全地浸洗,如圖36所示。水供給接著停止。該排放 管邊緣696垂直位於工件頂部邊緣的上方。電腦/控制器32 透過量測流經供給管線686的容積流量表,或變換地由工件 支架656上之液位檢測器688,來決定何時工件被浸洗。Line 546172 A7 B7 V. Description of the invention (28) 676 It is preferable to provide multiple workpieces for a batch, for example, a batch of 5-50 workpiece processing locations. The lower manifold 680 is preferably located at or near the bottom of the workpiece holder. Water or other liquid is supplied through the manifold 680, and the chamber 654 is located upright or at 0 °, as shown in Figs. 26 and 36. Water is supplied into the chamber 654, preferably until the workpiece 60 is completely immersed, as shown in FIG. The water supply then stopped. The edge 696 of the discharge pipe is positioned vertically above the top edge of the workpiece. The computer / controller 32 determines when the workpiece is immersed by measuring the volumetric flow meter flowing through the supply line 686, or alternatively by the liquid level detector 688 on the workpiece holder 656.

線 當達到預定位準時,或在預定延遲區間後,控制器32激 發馬達或致動器704開始樞轉或轉動該室654。該室654接著 沿軸698樞轉,使得該排放管邊緣696向下移動。當此產生 時,水790流經排放管邊緣696且流出室654外。如果提供一 外室652,水收集於外室654底部,流入排放通孔726且經排 放管出口 728流出處理器單元650。控制器32及馬達或致動 器704較佳地以一角速率轉動室654,該角速率使得水或液 790位以大致固定線性的垂直率下降。較佳地,轉動或樞轉 該室使得液體以約0.1-3.0或0.1-10或0.1 -5或0.1 -2mm/sec、0.5-10 或 0.5-5 或 0.5-1 或 2mm/sec 的速率排出。選 取該排放或下降率像實際一樣的快,而不具有與工件表面 分離的凹面。當室654樞轉時,該排放管邊緣696沿著軸698 成一圓形移動,室654之正弦樞轉速度構型提供室654内液 位790呈固定或線性的減少。 圖36-39表示室54樞轉進入四種不同的位置,圖36表示起 • 31 - 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) A7 B7 546172 五、發明説明(29 ) 始位置,且圖3 9表示結束位置,並中 ^ 卉〒所有液體已移除。室 654由圖36所示位置務動$同 ^ 罝㈣至圖39所讀置較佳為平滑及連續 的。 在所有液體已藉由容許該液體流出通過排放管邊緣咖而 移除後’卫件6〇可由處理器單元65G移除。這係由反轉門组 件738的順序而達成。變換地,工件6G可維持於處理器單元 65〇内’及室654可轉動至其原來〇。位置,如圖%所示,用 以一或多次地重複該洗濯、喷灑或浸洗加工。 在清潔工件之變換製程中,遵循上述的順序。此外,諸 如異丙醇之有機溶液,經上歧管682中的噴嘴或開口引入室 654。諸如加熱氮之氣體與混入氣體之有機溶劑蒸氣也可提 供且引入該室654水位790的上方。該室654如上述樞轉或旋 轉。水排出通過排放管邊緣696。當此產生時,額外有機溶 劑蒸氣及氣體供給進入該室。有機溶劑蒸氣在工件表面/水, 界面處減少水的表面張力。這減少及避免水滴留在工件表 面上,而當水位降低時造成較少的污染。該氣體可由蒸氣 歧笞682並列之乾燥氣體歧管71〇提供,或其可由蒸氣歧 管,不論有無蒸氣來提供。在蒸氣供給停止後,該乾燥氣 體較佳地繼續移除任何來自室654的剩餘蒸氣。 外室652包含及排放液體流過排放管邊緣696 ,或茂漏通 過密封706。外室也有助於將工件與周圍環境、操作人員、 緊鄰組件及設備隔離。在外室654使用處,其可由氣體或蒸 氣沖洗用以維持所須環境。氣體例如可為氮、氬、臭氧咬 -32- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)When the predetermined level is reached, or after a predetermined delay interval, the controller 32 excites the motor or actuator 704 to begin pivoting or rotating the chamber 654. The chamber 654 then pivots along the axis 698, causing the edge 696 of the discharge tube to move downward. When this occurs, water 790 flows through the edge 696 of the discharge pipe and out of the chamber 654. If an outer chamber 652 is provided, water is collected at the bottom of the outer chamber 654, flows into the drain through hole 726, and flows out of the processor unit 650 through the drain pipe outlet 728. The controller 32 and the motor or actuator 704 preferably rotate the chamber 654 at an angular rate that causes the water or liquid 790 position to descend at a substantially constant linear vertical rate. Preferably, the chamber is rotated or pivoted such that liquid is discharged at a rate of about 0.1-3.0 or 0.1-10 or 0.1 -5 or 0.1 -2 mm / sec, 0.5-10 or 0.5-5 or 0.5-1 or 2 mm / sec . This rate of discharge or descent is selected as fast as it actually is, without having a concave surface that separates from the surface of the workpiece. When the chamber 654 pivots, the edge 696 of the discharge pipe moves in a circle along the axis 698. The sinusoidal pivot velocity configuration of the chamber 654 provides a fixed or linear decrease in the liquid level 790 in the chamber 654. Figure 36-39 shows that the chamber 54 is pivoted into four different positions, and Figure 36 shows from • 31-This paper size applies Chinese National Standard (CNS) A4 specifications (210X 297 mm) A7 B7 546172 V. Description of the invention (29 ) Start position, and Figure 3 9 shows the end position, and all liquids have been removed. The position of the chamber 654 from the position shown in FIG. 36 to the position shown in FIG. 39 is preferably smooth and continuous. After all the liquid has been removed by allowing the liquid to flow out through the edge of the discharge tube, the guard 60 can be removed by the processor unit 65G. This is achieved by reversing the order of the gate assembly 738. Alternatively, the workpiece 6G can be maintained within the processor unit 65 ° 'and the chamber 654 can be rotated to its original position. The position, as shown in Fig.%, Is used to repeat the washing, spraying or dipping process one or more times. In the conversion process of cleaning the workpiece, the above sequence is followed. In addition, an organic solution such as isopropanol is introduced into the chamber 654 through a nozzle or opening in the upper manifold 682. Organic solvent vapors such as heated nitrogen and mixed gases can also be provided and introduced above the water level 790 in the chamber 654. The chamber 654 pivots or rotates as described above. Water drains through the edge of the discharge pipe 696. When this occurs, additional organic solvent vapors and gases are supplied into the chamber. Organic solvent vapor reduces the surface tension of water at the surface / water and interface of the workpiece. This reduces and prevents water droplets from remaining on the surface of the workpiece, which causes less pollution when the water level drops. The gas may be provided by a dry gas manifold 71o, which is juxtaposed with steam manifold 682, or it may be supplied by a steam manifold with or without steam. After the vapor supply is stopped, the dry gas preferably continues to remove any remaining vapor from the chamber 654. The outer chamber 652 contains and discharges liquid through the edge 696 of the discharge pipe, or leaks through the seal 706. The outer chamber also helps to isolate the workpiece from the surrounding environment, operators, immediate components and equipment. Where the outer chamber 654 is used, it can be flushed with gas or steam to maintain the required environment. The gas can be, for example, nitrogen, argon, or ozone. -32- This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm).

546172 A7 B7 五、發明説明(30 ) 諸如HF的蒸氣,或其組合。然而,本發明可如上述來實行 而不用任何外室。雖然解離水較佳作為一洗濯液體,其它 液體或混合物包括氫氟酸(HF)也可使用。 對於後續加工步驟,不同液體、氣體或蒸氣(共同在此稱 為“流體”)媒介可藉由浸洗、噴灑,或其它應用施加至工 件。清潔,如上述,可實行於加工步驟間。上述歧管也可 用於引入其它製程流體。變換地,額外歧管可提供於此目 的。 特別在一外室652使用時,此後續加工容許工件隨時維持 封閉於該外室652内之位置,藉此減少污染的可能性。在工 件浸洗處,一連續新的液體溶液可提供進入室654。在此應 用中,液體可經下歧管680汲入且連續地排出通過排放邊緣 696,而該室654維持於0°或圖36所示之直立位置。 音速能量較佳地透過位於工件支架656上之傳送器712, 施加至工件60。傳送器712,諸如巨音速或超音速傳送器, 係定位用以傳送音速能量通過室654中的液體至該液體中所 浸洗的工件。 如圖36-41所示,工件支架656支撐於該臂670上,而該臂 係與工件60與旋轉軸或室654之軸698偏離。如圖40及41所 示,這容許室654以約100°樞轉,用以排放所有來自室654 的液體。所有液體、氣體或蒸氣供給管線,以及任何至感 測器之任何電氣連接,諸如液位感測器688,可循路徑通過 支撐臂670及連接轂678。這容許室654自由地沿工件支架 656樞轉而沒有干擾,且不需特別配件或連接線,用來調節 -33- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)546172 A7 B7 V. Description of the Invention (30) Vapor such as HF, or a combination thereof. However, the present invention can be carried out as described above without using any external chamber. Although dissociated water is preferred as a washing liquid, other liquids or mixtures including hydrofluoric acid (HF) may be used. For subsequent processing steps, different liquid, gas or vapor (collectively referred to herein as "fluid") media can be applied to the workpiece by dipping, spraying, or other applications. Cleaning, as described above, can be performed between processing steps. These manifolds can also be used to introduce other process fluids. Alternatively, additional manifolds can be provided for this purpose. Particularly when used in an outer chamber 652, this subsequent processing allows the workpiece to remain closed in the outer chamber 652 at any time, thereby reducing the possibility of contamination. At the workpiece dip, a continuous new liquid solution may be provided into the chamber 654. In this application, liquid can be drawn in through the lower manifold 680 and continuously discharged through the discharge edge 696, while the chamber 654 is maintained at 0 ° or the upright position shown in FIG. The sonic energy is preferably applied to the workpiece 60 through a conveyor 712 located on the workpiece support 656. A conveyor 712, such as a supersonic or supersonic transmitter, is positioned to transfer sonic energy through the liquid in the chamber 654 to the workpiece being immersed in the liquid. As shown in Figs. 36-41, the workpiece holder 656 is supported on the arm 670, and the arm is offset from the workpiece 60 and the axis 698 of the rotation axis or chamber 654. As shown in Figures 40 and 41, this allows the chamber 654 to pivot at about 100 ° to drain all liquid from the chamber 654. All liquid, gas or vapor supply lines, and any electrical connections to the sensor, such as the level sensor 688, can be routed through the support arm 670 and the connection hub 678. This allows the chamber 654 to pivot freely along the workpiece holder 656 without interference, and does not require special accessories or cables for adjustment. -33- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

裝 訂Binding

線 546172 A7 B7 五、發明説明(31 動作。 圖35相同於上述處理器單元650,表示一變換處理器單元 800。然而,如圖35所示之處理器單元800可適合容納載具 、卡匣或托盤804内所握持的工件60。因此,處理器單元 800具有一變換工件支架802,該工件支架具有一擱板806用 於握持載具804,而非如圖27所示之梳件676。如圖35所示 之處理器單元800之設計與操作在其它方面相同於上述之處 理器單元之設計與操作。 -34- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐)Line 546172 A7 B7 V. Description of the invention (31 actions. Figure 35 is the same as the above-mentioned processor unit 650, which represents a conversion processor unit 800. However, the processor unit 800 shown in FIG. 35 can be adapted to accommodate vehicles and cassettes Or the workpiece 60 held in the tray 804. Therefore, the processor unit 800 has a changing workpiece holder 802, which has a shelf 806 for holding the carrier 804 instead of the comb shown in FIG. 676. The design and operation of the processor unit 800 shown in Figure 35 are otherwise the same as the design and operation of the above-mentioned processor unit. -34- This paper size applies to the Chinese National Standard (CNS) A4 specification (210X 297 male) (Centimeter)

Claims (1)

546172546172 一種用於加工工件之系統,包含: 一界面段; 一製程段; 衣私機器人’可移動用以攜帶工件由該界面段至製 程段; 6 一製程段中的處理器單元,該處理器單元具有一製程 j,一排放管開口位於該製程室中,及一製程室驅動器 猎由向下移動排放管開口至製程室中的液位,用於樞轉 該製程室來排放液體流出製程室。 2·如申請專利範圍第丨項之系統,其中該製程室具有一曲形 側壁及该排放管開口位於該曲形側壁中。 3·如申請專利範圍第2項之系統,其中該排放管開口包含一 連接至排放埠之曲形側壁中的凹槽。 4. 如申請專利範圍第2項之系統,其中該製程室概呈圓柱形 且具有一中心軸,且該製程室驅動器沿平行於該概呈圓 柱形製程室中心軸之轴,樞轉該製程室。 5. 如申請專利範圍第旧之系統,其中該製程室沿—水平轴 6·如申請專利範圍第!項之系統,進—步包含至少一歧管於 製程室中,用於導引一流體進入該製程室。 、 7·如申請專利範圍第旧之系統,其中該製程室驅動器 該製程室由該排放管開口緊鄰製程室頂 M之一第一位置 至該排放管出口緊鄰製程室底部之一第二位置。 8.如申請專利範圍第1項之系統,進一步包含可旋轉支撐於 -35 -A system for processing a workpiece includes: an interface section; a process section; a clothing robot is movable to carry a workpiece from the interface section to the process section; 6 a processor unit in the process section, the processor unit There is a process j, a discharge pipe opening is located in the process chamber, and a process chamber driver hunts down the discharge pipe opening to the liquid level in the process chamber for pivoting the process chamber to discharge liquid out of the process chamber. 2. The system according to item 丨 of the patent application scope, wherein the process chamber has a curved side wall and the discharge pipe opening is located in the curved side wall. 3. The system according to item 2 of the patent application, wherein the discharge pipe opening includes a groove in a curved side wall connected to the discharge port. 4. If the system of claim 2 is applied, the process chamber is generally cylindrical and has a central axis, and the process chamber driver pivots the process along an axis parallel to the central axis of the generally cylindrical process chamber. room. 5. If the oldest system in the scope of patent application, the process room along the -horizontal axis The system of item further comprises at least one manifold in a process chamber for guiding a fluid into the process chamber. 7. If the system is the oldest in the scope of patent application, the process chamber driver drives the process chamber from the opening of the discharge pipe next to one of the top positions of the process chamber M to the second position of the discharge pipe close to the bottom of the process chamber. 8. The system according to item 1 of the patent application scope further comprises a rotatable support at -35- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) Μ衣枉至内 科丁 …n j六,捱符工仵之位置。 _ :二專利範圍第1項之系統,進一步包含-門組件, 、,且件包括可附接至製程室之閉合框架。 1〇· —種用於加工工件的系統,包含: 一界面段; 一製程段; -製程機器人,可移動用以攜帶工件由 程段; 叫仅芏 —製程段中的處理器單元’該處理器單元具有一製 室,包括: ^ 一排放管開口,位於該製程室中; -製程室驅動器,用於樞轉該製程室來排放液 製程室;及 一轉子,可旋轉支撐於製程室内。 u.如申請專利範圍第10項之系、絶,進一步包含至少一歧 於4製程至中,且一可撓供給管線接合至該歧管,而, 該製程室樞轉時,該可撓供給管線隨製程室移動。 12·如申請專利範圍第10項之“,進一步在與該排放管丨 ’ 口間隔的位置,包含一可切換排放管於該製程室中。 々申。月專利範圍第1 〇項之系、统,其中該製程室包含一 4 合至圓柱形側壁之後壁,該製程室具有一開放前端,」 進一步包含門裝置,用於關閉該製程室的開放前端。 Η·如申請專利範圍第旧之系統,進一步包含一第一歧管力 連接至有機溶劑蒸氣源之製程室中,及一第二歧管於土 -36 - 546172 A8 B8 C8M 衣 枉 to 内科丁 ... n j six, next to the position of Fu Gong. _: The system of item 2 of the second patent scope further includes a door assembly, and the part includes a closed frame that can be attached to the process room. 1〇 · —A system for processing workpieces, including: an interface section; a process section;-a process robot that can be moved to carry the workpiece by the process section; called only 芏-the processor unit in the process section 'this processing The processor unit has a process chamber including: ^ a discharge pipe opening located in the process chamber;-a process chamber driver for pivoting the process chamber to discharge a liquid process chamber; and a rotor rotatably supported in the process chamber. u. If the system of claim 10 is applied, it must further include at least one process that is in the 4th process, and a flexible supply line is connected to the manifold, and when the process chamber is pivoted, the flexible supply The pipeline moves with the process chamber. 12 · As described in item 10 of the scope of patent application, furthermore, a switchable discharge pipe is included in the process room at a position spaced from the mouth of the discharge pipe. 々 Apply. The scope of monthly patent scope No. 10, System, wherein the process chamber includes a rear wall that is closed to a cylindrical side wall, the process chamber has an open front end, and further includes a door device for closing the open front end of the process room.如 · If the oldest system in the scope of patent application, further includes a first manifold in the process chamber connected to the organic solvent vapor source, and a second manifold in the soil -36-546172 A8 B8 C8 接至水源之製程室中。 15·如申凊專利範圍第i項之系統,#中該製程室僅由製程室 驅動器所支撐。 16.如申請專利範圍第1〇項之系統,進一步包含一連接至該 轉子之旋轉馬達。 17· —種用於加工工件之方法 干之万去,包含以下步驟: 支樓該工件於一製程室内的支架上; 關閉該製程室; 以洗省液體充填該製程室,用以至少部份將該工件 浸入於該液體中;及 藉由移動該室來移除該室的液體,使得一該室中之排 放管開口移動進入一位置,其間該液體利用重力移動通 過該排放管開口,且排出製程室外。 18·:申請專利範圍第17項之方法,其中該排放管開口位於 :之側壁及该液體藉由樞轉該室來移除,且導引該排放 管開口至室中之液位。 19.如申請專利範圍第17項 、乏方法,進一步包括在移除該液 體後,妩轉該支架及製程室中工件之步驟。 20·如申請專利範圍第17項之 〆: ^ ^ ^ 忐進一步包括於以該洗濯 液體充填製程室前,噴灑流體至室 21.如申請專利範圍第2〇項之方 厂 水。 法 其中該洗濯液體包含 22· —種用於加工工件之方法, u S Μ下步驟· 支撐一製程室内轉子中之工件; · · -37- 546172Connected to the process room of the water source. 15. If applying for the system of item i of the patent scope, the process room in # is only supported by the process room driver. 16. The system of claim 10, further comprising a rotary motor connected to the rotor. 17 · — A method for processing workpieces can be done in a number of ways, including the following steps: supporting the workpiece on a support in a process chamber; closing the process chamber; filling the process chamber with washing-saving liquid for at least part Immersing the workpiece in the liquid; and removing the liquid in the chamber by moving the chamber so that a discharge pipe opening in the chamber moves into a position during which the liquid moves through the discharge pipe opening using gravity, and Discharge outside the process. 18 ·: The method of applying for item 17 of the patent scope, wherein the discharge pipe opening is located on the side wall of the: and the liquid is removed by pivoting the chamber, and the discharge pipe opening is guided to the liquid level in the chamber. 19. The method described in item 17 of the patent application scope further includes the step of turning the support and the workpiece in the process chamber after removing the liquid. 20. If the application of item 17 of the scope of the patent application: ^ ^ ^ 忐 further includes spraying fluid into the process chamber before filling the process chamber with the washing liquid 21. If the application of the scope of the patent application area 20 of the plant water. Method wherein the washing liquid contains 22 · —a method for processing a workpiece, the next step is to support the workpiece in a rotor in a process chamber; -37- 546172 '申請專利範圍 關閉該製程室; 以一洗濯液體充填該製裎 浸入於該液體中; 用Λ至少部份將該工件 藉由移動該室來移除該室 放管開口移動進入一位置夜=-該室中之排 過該排放管開口,且排出製程室=…重力移動通 旋轉該轉子及工件。 23·如申請專利範圍第22項 工件之步驟。 之方法,進-步包含以氣體喷激 24. -種用於清潔工件之方法,包含以下㈣: 支撐一製程室内轉子中之工件; 以一洗灌液體充填該製程宕5 你准 m ^ ^至至一位準,用以充份將該 工件浸入該液體中; 藉由移動該室來移除該室的液體,使得一該室中之排 放管開口移動進人_位置’其間該液體利用重力移動通 過該棑放管開口,且排出製程室外;及 引導一有機溶劑蒸氣進入該室。 進一步包含旋轉工件之 進一步包含將氣體引入 25. 如申請專利範圍第24項之方法, 步驟。 26·如申請專利範圍第24項之方法, 該室的步驟。 進一步包含當該工件被 27·如申請專利範圍第24項之方法, 浸入時,弓丨進音速能量進入製程室中 28· —種用於加工工件之處理器單元,包含 -38-'The scope of the patent application closed the process chamber; filled the process chamber with a washing liquid and immersed in the liquid; used Λ to remove the workpiece by moving the chamber at least partially by moving the chamber pipe opening into a position = -The discharge in the chamber passes through the opening of the discharge pipe, and the discharge process chamber = ... gravity movement rotates the rotor and the workpiece. 23. The procedure for applying for a workpiece in the scope of patent application No. 22. The method further includes gas spraying 24.-A method for cleaning the workpiece, including the following: Supporting the workpiece in the rotor of a process chamber; Filling the process with a washing and filling liquid. To the first level, to fully immerse the workpiece in the liquid; remove the liquid in the chamber by moving the chamber, so that a discharge pipe opening in the chamber is moved into a person_position 'during which the liquid is utilized Gravity moves through the opening of the discharge tube and is discharged outside the process chamber; and an organic solvent vapor is guided into the chamber. It further includes rotating the workpiece, further including introducing gas. 25. The method and step of claim 24 in the scope of patent application. 26. The method of claim 24, the steps of the chamber. It further includes that when the workpiece is immersed in the method according to item 24 of the patent application, the sonic energy enters the process chamber 28. A processor unit for processing the workpiece, including -38- 、申請專利範圍 一製程室; 工件,支樓於該製程室中; 一排放管開口,位於該製程室中; 製程室驅動器,用於樞韓 開口 m班 杞轉5亥製程室來移動該排放管 由第一位置至相對製程室汸舻夕心 以將液體排出製程室。 液體之一弟二位置, 29·如申請專利範圍第28項之處理覺 -可旋轉定位於該製程室内之慕中…支架包含 3〇· 一種用於加工工件之系統,包含产 一容納室; 一=至’位於該容納室内且具有一排放管開口; 率桐鏟%制^ + 芏至,用於以一控制速 羊_该製程室,以將液體排出製程室;及 一工件夾持器,位於該製程室内。 3 1.如申凊專利範圍第3 ^ , 器於該製程室卜、…進-步包括-音速傳送 32.如申請專利範圍第3〇項之系統 於該製程室上。 33·如申請專利範圍第30項之系統 一磁性聯結器連結至該製程室。 34.如申請專利範圍第3〇項之系統 進一步包括一可移除門 其中該製程室驅動器以 其中該製程室具有 柱形側壁,及該排放管開口位於圓柱形側壁中 圓 35·如申請專利範圍第3〇項之系統,其中該製程室可由一第 一位置,其間該製程室能以至少部份浸入該工件夾持器 -39· 本紙張尺度咖t S S家標準(CNS) A4規格(210X297公董)—The scope of the patent application is a process room. The workpiece is located in the process room. A discharge pipe opening is located in the process room. The drive of the process room is used to open the Hanban mbanqi to the 5hai process room to move the discharge. The tube is moved from the first position to the center of the process chamber to discharge liquid from the process chamber. The second position of the liquid, 29. If the treatment sense of the 28th scope of the patent application-can be rotated to be positioned in the chamber of the process ... The bracket contains 30. A system for processing workpieces, including a production chamber; A = to 'is located in the accommodating chamber and has a discharge pipe opening; rate Tong shovel% system ^ + 芏 to, for controlling a speed sheep _ the process chamber to discharge liquid from the process chamber; and a workpiece holder Located in the process room. 3 1. If applying for the patent scope No. 3 ^, it is in the process room, ... further-including the speed of sound 32. If the system for patent scope No. 30 is applied to the process room. 33. The system of claim 30, a magnetic coupling is connected to the process chamber. 34. The system according to item 30 of the patent application scope further includes a removable door in which the process chamber driver has a cylindrical side wall in which the process chamber has a cylindrical side wall, and the discharge pipe opening is located in a circular circle in the cylindrical side wall. The system of scope item 30, wherein the process chamber can have a first position, during which the process chamber can be at least partially immersed in the workpiece holder-39 · This paper standard coffee house standard (CNS) A4 specification ( 210X297 public director)- 所握持工件之位準來裝載液體樞轉,至一第二位置, =製程室内之液體能通過開口排出至完全低於工件 的位準。 4 2請專利範圍第35項之m —步包含一流體供給 轺L ’且該供給系統包括一流體供給管線延伸進入該製 权至。 37‘二申請專利範圍第36項之系、统,進—步包含至少一接合 至该流體供給管線之噴灑噴嘴。 38· =請專利範圍第叫之系統,進—步包含至少製程液 :、製程氣體源及製程蒸氣源其中之一,連接至該流 體供給糸統。 39.如申請專利範圍第3〇項之系統,進—步包含一工件夹持 ,伸裔’用於將該工件夾持器移出製程室,用於加載及 P载工件’及移動該工件夾持器進入製程室,用於加工 工件。 後如申請專利範圍第30項之系統,其中該製程室具有圓柱 形側壁及可沿著平行該圓柱形側壁之軸樞轉。 41.如申3月專利範圍第3〇項之系統,進一步包含一工件夹持 器驅動器,用於旋轉該工件夾持器。 申π專利粑圍第4 1項之系統,其中該工件夾持器驅動 器藉由一磁性聯結器連結至該工件夾持器。 士申叫專利轭圍第36項之系統,其中該流體供給管線隨 該製程室樞轉。 如申請專利範圍第30項之系統,進一步包含位於該工件 -40-The level of the workpiece to be held is pivoted to load the liquid, to a second position, = the liquid in the process chamber can be discharged through the opening to a level completely lower than the workpiece. 4 2 Please refer to the 35th m of the patent scope. The step includes a fluid supply 轺 L 'and the supply system includes a fluid supply line extending into the right to. The 37 ' two system of patent application No. 36, further comprising at least one spray nozzle connected to the fluid supply line. 38 · = Please call the system under the scope of the patent, which further includes at least one of a process fluid :, a process gas source, and a process vapor source, and is connected to the fluid supply system. 39. The system according to item 30 of the patent application, further comprising a workpiece holder, which is used to move the workpiece holder out of the process chamber for loading and loading the workpiece and moving the workpiece holder. The holder enters the process chamber and is used to process the workpiece. A system such as the one applying for the patent scope item 30, wherein the process chamber has a cylindrical side wall and can be pivoted along an axis parallel to the cylindrical side wall. 41. The system as claimed in item 30 of the March patent scope, further comprising a workpiece holder driver for rotating the workpiece holder. The system of claim 41, wherein the workpiece holder driver is connected to the workpiece holder by a magnetic coupling. Shishin calls the patented yoke system item 36, wherein the fluid supply line pivots with the process chamber. If the system of the scope of patent application No. 30, further includes the workpiece -40- 失持器上之梳件。 5·種用於加工工件之系統,包含: 一外室; 内至’可旋轉支樓於該外室内; 一内室驅動器,用於旋轉該内室; 一馬達,位於該内室内;及 一轉子驅動器,用於旋轉該轉子。 46·如申請專利範圍第料項之系統,進一步包含一流體傳送 系統,其具有一流體傳送管線延伸進入該内室。 4 7.如申凊專利範圍第4 6項之系統,進一步包含至少一開口 ’其位於接合至該流體傳送管線之内室中。 48.如申請專利範圍第47項之系統,其中該至少一開口包含 至少一噴灑噴嘴。 49·如申請專利範圍第45項之系統,進一步包括一内門於該 内室上,及一外門於該外室上。 50·如申請專利範圍第45項之系統,·進一步包括一排放管開 口於該内室中,由此導出該外室。 51.如申請專利範圍第45項之系統,進一步包括一可移除側 壁面板於該内室中。 52·如申請專利範圍第45項之系統,其間該内室及外室係圓 柱形的。 53. 如申請專利範圍第52項之系統,其間該轉子為圓柱形, 且與該内室及外室同心。 54. 如申請專利範圍第45項之系、統,進_步包含一沖洗氣體 -41 - 546172 λβ Β8 C8 D8 六、申請專利範圍 系統,其連接進入該内室及外室至少其中之一。 5 5. —種用於加工工件之方法,包含以下步驟: 配置該工件進入一工件支架; 關閉握持該工件之工件支架於一製程室内; 提供製程流體進入該製程室; 樞轉該製程室用以容許製程液體排出;及 旋轉該工件支架。 5 6 ·如申請專利範圍第5 5項之方法,其中該工件至少部份浸 入於製程液體中。 57.如申請專利範圍第55項之方法,進一步包含當該工件支 架至少部份浸入於製程液體中時,旋轉該工件支架的步 驟。 5 8.如申請專利範圍第55項之方法,進一步包含引導一製程 氣體或蒸氣進入該製程室之步驟。 5 9·如申請專利範圍第55項之方法,進一步包含關閉該製程 室於一外容納室之步驟。 60. 如申請專利範圍第55項之方法,其中該製程室以一控制 速率樞轉,用以移除來自該製程室的液體。 61. 如申請專利範圍第55項之方法,進一步包含透過真空抽 出該内室内之液體表面層之步驟。 62·如申請專利範圍第58項之方法,其間該氣體包含氮、空 氣、氬或HF。 63·如申請專利範圍第55項之方法,進一步包含提供音速能 量至工件的步驟。 -42- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 如申請專利範圍第59項 、 門密封該製程室的步.驟、。、,進一步包含以一製程室 .如申請專利範圍第& 、 濯液體進入該製程室,、之方=,進一步包含導引一洗 溶劑蒸氣進入製程^且接著引導一乾燥氣體及有機 的步驟。 至以有易於移除該工件洗濯液體 66. 2二於加工工件之方法,包含以 配置該工件進入一工件支竿· 乂驟· 關閉握持該工件之工進 沿著該工件支架旋轉該第_室;至内, 提供一製程流 67. 由該第一室上之至少一泣 體進入該第_室。 ⑽^開口 —種用於加工工件之系統,包含: 一外殼; 製程室,具有一排放管開口; 工件夾持器’位於該製程室内 殼之位置中; 且固疋於相對該外 一製程室驅動器,連結至該製程 室’且以一控制速率將液體排出該製程於框轉該製程 68.如申請專利範圍第㈣之系統,進—。 器於該工件夾持器上。 乂匕括一音速傳送 進—步包括一可接合宅 69·如申請專利範圍第”項之系統 製程室之門。 其中該製程室驅動器, 70·如申請專利範圍第67項之系統 546172 A8 B8Comb on displacer. 5. A system for processing a workpiece, comprising: an outer chamber; an inner to a rotatable branch house in the outer chamber; an inner chamber driver for rotating the inner chamber; a motor located in the inner chamber; and Rotor driver for rotating the rotor. 46. The system of claim 1 further comprising a fluid transfer system having a fluid transfer line extending into the inner chamber. 47. The system of claim 46, further comprising at least one opening, which is located in an inner chamber joined to the fluid transfer line. 48. The system of claim 47, wherein the at least one opening includes at least one spray nozzle. 49. The system of claim 45, further comprising an inner door on the inner room and an outer door on the outer room. 50. The system according to item 45 of the scope of patent application, further comprising a discharge pipe opening in the inner chamber, from which the outer chamber is derived. 51. The system of claim 45, further comprising a removable side wall panel in the inner chamber. 52. If the system according to item 45 of the patent application, the inner and outer chambers are cylindrical. 53. If the system of claim 52 is applied, the rotor is cylindrical and is concentric with the inner and outer chambers. 54. If the system and system of item 45 of the scope of patent application, further includes a flushing gas -41-546172 λβ Β8 C8 D8 6. The scope of patent application system, which is connected to at least one of the inner room and the outer room. 5 5. A method for processing a workpiece, including the following steps: configuring the workpiece into a workpiece holder; closing the workpiece holder holding the workpiece in a process chamber; providing process fluid into the process chamber; pivoting the process chamber To allow the process liquid to be discharged; and to rotate the workpiece holder. 56. The method of claim 55, wherein the workpiece is at least partially immersed in the process liquid. 57. The method of claim 55, further comprising the step of rotating the workpiece holder when the workpiece holder is at least partially immersed in a process liquid. 5 8. The method of claim 55, further comprising the step of directing a process gas or vapor into the process chamber. 5 9. The method of claim 55, further comprising the step of closing the process room in an external containment room. 60. The method of claim 55, wherein the process chamber is pivoted at a controlled rate to remove liquid from the process chamber. 61. The method of claim 55, further comprising the step of extracting the liquid surface layer in the inner chamber through a vacuum. 62. The method of claim 58 in which the gas contains nitrogen, air, argon, or HF. 63. The method of claim 55, further comprising the step of supplying sonic energy to the workpiece. -42- This paper size is in accordance with Chinese National Standard (CNS) A4 specification (210 X 297 mm). If the scope of the patent application is No. 59, the steps of the door sealing the process chamber. , And further includes a process chamber. For example, the scope of the patent application &, 濯 liquid enters the process chamber, the method =, further includes the steps of introducing a washing solvent vapor into the process ^, and then guiding a dry gas and organic . In order to facilitate the removal of the workpiece washing liquid 66. 2 method for processing the workpiece, including disposing the workpiece into a workpiece rod, step, closing, and holding the workpiece, the workpiece is rotated along the workpiece holder. To the inside, a process flow is provided. 67. At least one body on the first chamber enters the first chamber.开口 ^ Opening—a system for processing a workpiece, including: a housing; a processing chamber having a discharge pipe opening; a workpiece holder 'is located in a position within the housing of the processing chamber; and is fixed to the outer processing chamber The driver is connected to the process chamber 'and discharges the liquid at a controlled rate. The process transfers the process to the process 68. If the system of the scope of patent application No. ,, enter-. Is clamped on the workpiece holder. Step-by-step transmission of a sound speed-further includes a door that can be connected to the system 69. Such as the scope of the patent application, the door of the process chamber. Among them, the process chamber driver, 70. The system of the 67th scope of the patent application, 546172 A8 B8 磁性聯結器連結至該製程室。 71·如申請專利範圍第67項之系統,其中該製程室具有一圓 柱形側壁,及該排放管開口位於該圓柱形側壁中。 申明專利範圍第67項之系統,其中該製程室可由_第 一位置柩轉,其間該製程室能以至少部份浸入該工件夾 持器中所握持工件之位準來裝載液體,至一第二位置, 其間該製程室内之液體能通過開口排出至完全低於工件 的位準。 如申明專利範圍第72項之系統,進一步包含一流體供給 系統,該供給系統包括一流體供給管線延伸進入該製程 室。 < 74·如申請專利範圍第73項之系統,進一步包含至少一接合 至該流體供給管線之喷灑喷嘴。 75·如申請專利範圍第74項之系統,進一步包含至少製程液 體源、製程氣體源及製程蒸氣源其中之一,連接至該流 體供給系統。 & 76. 如申請專利範圍第67項之系統,其中該工件夾持器包括 具有握持工件之凹槽的梳件。 77. 如申請專利範圍第76項之系統,其中該工件夹持器支撐 於與該製程室中心偏離的支撐臂上。 78·如申請專利範圍第67項之系統,其中該製程室具有圓柱 形側壁,且可沿著平行該圓柱形側壁之軸樞轉。 79·如申請專利範圍第67項之系統,進一步包含一外室圍繞 該製程室,而該工件夾持器固定於相對該外室之位置。疋A magnetic coupling is connected to the process chamber. 71. The system of claim 67, wherein the process chamber has a cylindrical side wall, and the discharge pipe opening is located in the cylindrical side wall. The system claiming the scope of patent 67, wherein the process chamber can be turned from the first position, during which the process chamber can be loaded with liquid at a level of at least partially immersed in the workpiece held by the workpiece holder, to a The second position, during which the liquid in the process chamber can be discharged through the opening to a level completely lower than the workpiece. The system of claim 72, further including a fluid supply system, the supply system including a fluid supply line extending into the process chamber. < 74. The system of claim 73, further comprising at least one spray nozzle connected to the fluid supply line. 75. The system according to item 74 of the patent application scope, further comprising at least one of a process liquid source, a process gas source, and a process vapor source, connected to the fluid supply system. & 76. The system of claim 67, wherein the workpiece holder includes a comb having a groove for holding a workpiece. 77. The system of claim 76, wherein the workpiece holder is supported on a support arm that is offset from the center of the process chamber. 78. The system of claim 67, wherein the process chamber has a cylindrical side wall and is pivotable along an axis parallel to the cylindrical side wall. 79. The system of claim 67, further comprising an outer chamber surrounding the process chamber, and the workpiece holder is fixed at a position opposite to the outer chamber. Bolt of cloth 本紙張尺度適用中國國豕標準(CNS) Α4規格(21〇X 297公袭:) 546172This paper size applies to China National Standard (CNS) Α4 specification (21〇X 297 public attack :) 546172 8〇. 一種用於加工工件之系統,包含: 一外室; 一製程室,轉切於該外室内, -排放管開口,位於該製程室中; 二製:室驅動器,用於樞轉該製程室;及 室固-於分t &於' °亥製程室内,且該工件支架及該外 至固疋於彼此相對之位置中。 81·如申請專利範圍第8〇 ^ <糸統’其中該排放管開口包含 通過孩I程室之圓柱形側壁之凹槽。 82.:申請專利範圍第80項之系統,曰進-步包括一門組件, …组件具有—可接合於該製程室上之第一門,及可接合 於該外室上之第二門。 &如申請專利範圍第80項之系統,其中該製程室及外室為 圓柱形的。 84. -種用於加工工件之方法,包含以下步驟: 配置該工件進入一工件支架; 維持該工件於一固定位置; 關閉握持該工件之工件支架於一製程室内; 提供一製程液體進入該製程室;及 樞轉該製程室用以容許製程液體排出。 85. 如申凊專利範圍第84項之方法,其中該工件浸入於該製 程液體中。 86·如申請專利範圍第84項之方法,進一步包含引導一製程 氣體或蒸氣進入該製程室之步驟。 M617280. A system for processing a workpiece, comprising: an outer chamber; a process chamber that is switched to the outer chamber;-a discharge pipe opening located in the process chamber; a second system: a chamber driver for pivoting the Process chamber; and chamber solid-in the sub-t & in the process chamber, and the workpiece holder and the outer to fixed in a position opposite to each other. 81. According to the patent application No. 80 ^ < system, wherein the discharge pipe opening includes a groove passing through a cylindrical side wall of the process chamber. 82 .: The system for applying for the scope of patent application No. 80, which further includes a door assembly, ... the assembly has a first door that can be connected to the process chamber, and a second door that can be connected to the outer chamber. & The system of claim 80, wherein the process chamber and the outer chamber are cylindrical. 84. A method for processing a workpiece, comprising the following steps: configuring the workpiece into a workpiece holder; maintaining the workpiece in a fixed position; closing the workpiece holder holding the workpiece in a process chamber; providing a process liquid into the A process chamber; and pivoting the process chamber to allow process liquid to drain. 85. The method of claim 84, wherein the workpiece is immersed in the process liquid. 86. The method of claim 84, further comprising the step of directing a process gas or vapor into the process chamber. M6172 •如申請專利範圍第84項之古 宮私.. 、之方法,進一步包含關閉該製程 至於一外室内之步驟。 8·如申睛專利範圍第μ項 率樞轉該製程室,且::法,進一步包含以一控制速 M 一控制速率移除來自該製程室之 成體。 容9 ·如申請專利範圍第8 、 θ 項之方法,進一步包含提供音速能 置至工件之步驟。 9〇·如申請專利範圍第84 煩炙万法,進一步包含以一製程室 門關閉該製程室開放前端的步驟。 91. 如申請專利範圍第84項之方法,進—步包含導引一洗濯 :體進入該製程室,且接著導引一有機蒸氣進入該製程 至,以易於由工件移除洗濯液體的方法。 92. —種用於加工工件之方法,包含以下步驟·· 配置該工件進入一工件支架; 關閉握持該工件之工件支架進入一室; 維持該工件支架於一固定位置中; 沿著該工件支架樞轉該室;及 提供製程流體 由該第一室上之至少一流體供給開口 進入該室。 -46- 本紙張尺度適用中國國家標準(CNS) Α4規格(210 X 297公釐)• If the method of applying for the private palace in item 84 of the patent, the method further includes the step of closing the process as for an outdoor room. 8. The item μ of the patented scope of the patent application pivots the process chamber, and the method further includes removing the adult body from the process chamber at a controlled speed M-controlled rate. Content 9 · The method of item 8 and θ of the scope of patent application, further including the step of providing sound velocity to the workpiece. 90. If the patent application scope is 84, it further includes the step of closing the open front end of the process chamber with a process chamber door. 91. If the method according to item 84 of the patent application, the method further includes a method of directing a washing body into the process chamber, and then introducing an organic vapor into the process to facilitate removal of the washing liquid from the workpiece. 92. A method for processing a workpiece, comprising the following steps: configuring the workpiece into a workpiece holder; closing the workpiece holder holding the workpiece into a chamber; maintaining the workpiece holder in a fixed position; along the workpiece The support pivots the chamber; and provides process fluid into the chamber through at least one fluid supply opening on the first chamber. -46- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)
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US09/907,544 US6668844B2 (en) 2001-07-16 2001-07-16 Systems and methods for processing workpieces
US09/907,487 US6427359B1 (en) 2001-07-16 2001-07-16 Systems and methods for processing workpieces

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US6279724B1 (en) * 1997-12-19 2001-08-28 Semitoll Inc. Automated semiconductor processing system

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