TW542405U - Improved buckling structure of heat dissipating device for IC - Google Patents

Improved buckling structure of heat dissipating device for IC

Info

Publication number
TW542405U
TW542405U TW91214479U TW91214479U TW542405U TW 542405 U TW542405 U TW 542405U TW 91214479 U TW91214479 U TW 91214479U TW 91214479 U TW91214479 U TW 91214479U TW 542405 U TW542405 U TW 542405U
Authority
TW
Taiwan
Prior art keywords
heat dissipating
dissipating device
buckling structure
improved buckling
improved
Prior art date
Application number
TW91214479U
Other languages
Chinese (zh)
Inventor
Huei-Jia Huang
Original Assignee
Thermaltake Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermaltake Technology Co Ltd filed Critical Thermaltake Technology Co Ltd
Priority to TW91214479U priority Critical patent/TW542405U/en
Publication of TW542405U publication Critical patent/TW542405U/en

Links

TW91214479U 2002-09-13 2002-09-13 Improved buckling structure of heat dissipating device for IC TW542405U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91214479U TW542405U (en) 2002-09-13 2002-09-13 Improved buckling structure of heat dissipating device for IC

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91214479U TW542405U (en) 2002-09-13 2002-09-13 Improved buckling structure of heat dissipating device for IC

Publications (1)

Publication Number Publication Date
TW542405U true TW542405U (en) 2003-07-11

Family

ID=29581410

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91214479U TW542405U (en) 2002-09-13 2002-09-13 Improved buckling structure of heat dissipating device for IC

Country Status (1)

Country Link
TW (1) TW542405U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101902892A (en) * 2009-05-26 2010-12-01 鸿富锦精密工业（深圳）有限公司 Heat radiator fixing device
CN105813448A (en) * 2016-04-13 2016-07-27 广东欧珀移动通信有限公司 Assembling system and assembling method for fingerprint recognition module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101902892A (en) * 2009-05-26 2010-12-01 鸿富锦精密工业（深圳）有限公司 Heat radiator fixing device
CN105813448A (en) * 2016-04-13 2016-07-27 广东欧珀移动通信有限公司 Assembling system and assembling method for fingerprint recognition module
CN105813448B (en) * 2016-04-13 2019-02-05 Oppo广东移动通信有限公司 The package system and assemble method of fingerprint recognition mould group

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees