TW572251U - Improved structure of heat dissipating device - Google Patents

Improved structure of heat dissipating device

Info

Publication number
TW572251U
TW572251U TW91202208U TW91202208U TW572251U TW 572251 U TW572251 U TW 572251U TW 91202208 U TW91202208 U TW 91202208U TW 91202208 U TW91202208 U TW 91202208U TW 572251 U TW572251 U TW 572251U
Authority
TW
Taiwan
Prior art keywords
heat dissipating
improved structure
dissipating device
improved
heat
Prior art date
Application number
TW91202208U
Other languages
Chinese (zh)
Inventor
Tian-Lai Wang
Jen-Hua Jeng
Jr-Cheng Lin
Yi-Chau Ma
Original Assignee
Waffer Technology Corp
Tian-Lai Wang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Waffer Technology Corp, Tian-Lai Wang filed Critical Waffer Technology Corp
Priority to TW91202208U priority Critical patent/TW572251U/en
Publication of TW572251U publication Critical patent/TW572251U/en

Links

TW91202208U 2002-02-25 2002-02-25 Improved structure of heat dissipating device TW572251U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91202208U TW572251U (en) 2002-02-25 2002-02-25 Improved structure of heat dissipating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91202208U TW572251U (en) 2002-02-25 2002-02-25 Improved structure of heat dissipating device

Publications (1)

Publication Number Publication Date
TW572251U true TW572251U (en) 2004-01-11

Family

ID=32590678

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91202208U TW572251U (en) 2002-02-25 2002-02-25 Improved structure of heat dissipating device

Country Status (1)

Country Link
TW (1) TW572251U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004