535266 Α7 Β7 五、發明説明（） 〈發明領域〉 本發明係有關於一種微型顯示器之製造方法，尤指一 種可篩選基層晶片及簡化刪除無效晶Η加工數量之微型顯 % 示器之製程技術。 〈發明背景及先前技藝〉 按，微型顯示器（MICRO-DISPLAY )泛用於如液晶投 影機、電腦顯示器、投影電視機等電氣投影顯示設備中， 其主要的作用是產生光學投射之原始影像，並藉由反射鏡 面的各個像素（PIXEL)間的反射功能啟（ON)或閉（OFF)控制 ，配合光學上的投射光源及鏡片組組成的光學投射機構，使 該原始影像可被放大投射於蠻幕或顯示幕上。因此，微型 顯示器的應用範_為廣泛，並且，其使用於電器或光學投 影設備之數量亦日益增加，故其量產製程相對地成為產品 中重要的一環。 然，在習知的微型顯示器的製程中，在用Μ作為基層 的晶圓片上的每個晶Μ外圍封Μ膨框，並在每個受膠框圍 覆的晶片方格中撒上間隔粒，再將像徵微型顯示器頂層的 I TO玻璃片上的每個對應每個晶Η方格的位置上打孔， 再將I Τ〇玻璃片組合於已封膠框之晶圓片上，再對每個 晶Η方格逐一施Μ抽真空、灌注液晶，並再逐一封口及加 Μ切割以形成微型顯示器之初步成品，而必需再經電路檢 驗及測試，Μ測試每個所製出之微型顯示器初步成品，其 晶片電路是否可正常動作，Μ篩選出最終之微型顯示器成 品。 一2 — 本纸烺尺度適用中國國家標準（CNS ) Λ4規格（210X297公苋） (請先閱讀背面之注意事項本頁) -裝- 、1Τ 經濟部中央標準局負工消費合作社印^ 535266 經濟部中央標準局員工消費合作社印製 A7 B7五、發明説明（） 故，由Μ上所述習知的微型顯示器程中，當明顯可知 ，該習知的製程技術中，對於晶圓上的所有晶Μ，無論合 格或無效，均對其逐一施Μ封膠、撒間隔粒、組合I Τ〇 玻璃片、抽真空、注入液晶、封口、切割及測試之製程’ 故將耗費及投入較多的材料、工時及人力，相對增添微型 顯示器的製程困難度，同時，對於產品初步製出後之後續 測試及檢驗人力及成本而言，亦是一大的考驗及阻礙’使 該微型顯示器在量產製程上遭致工時過長及產品成本偏高 之困擾，並且，徒增不必要且具高度污染物（液晶）的不 良品廢棄之機率，對於環境保護而言，實為另一大威脅及 破壞。 〈發明目的及概述〉 緣此，本發明之主要目的，即是在於提供一種微型顯 示器之製造方法，可藉由晶圓之測試資料，Μ篩選合格晶 片加工，進而大幅節省加工之材料、人力及成本。 本發明之再一目的，即是在於提供一種微型顯示器之 製造方法，可精節該晶圓中晶片的電氣測試過程，以大幅 降低產品之後續檢驗及測試之人力及成本。 本發明之又一^目的，即是在於提供一^種微型顯不器之 製造方法，可大幅降低包含高污染物（液晶）不良品及廢 料之庳生機率。 為達上述之各目的，本發明微型顯示器之製造方法， 係在於構成微型顯示器的基礎晶圓Μ上，先行測試其各別 之晶片，並在經測試為無效之晶片上作標記，Μ將該測試 一3 一 (請先閱讀背面之注意事 π本頁) -裝· 、1Τ 本纸張尺度適用中國國家標準（CNS ) Λ4規格（210X 297公釐） 535266 經濟部中央標準局員工消費合作社印製 A7 __B7 _五、發明説明（） 資料輸入一點膠機及雷射打孔機中，由點膠機於合格之晶 片外圍上先上膠框，並再由雷射打孔機於ITO玻璃片上相 對於上述合格之晶片位置打上一注入孔，並再將於已上膠 框的晶片方格內撒佈間隔粒，及將ITO玻璃片依晶圓測試 資料對位組合於晶圓片上，並經合格晶片上層之ITO玻璃 片上的注入孔注入液晶，Μ擴散至晶片與ITO玻璃間，再 經封口及切割處理，Μ精確製出具合格晶片電路之微型顯 示器產品，進而簡化微型顯示器之整體製程。 為使 貴審査委員得進一步具體瞭解本發明之具體技 術內容及發明內函，Μ下兹舉數個實施例子詳细說明之， 俾便於 貴審査委員之審理。其中： (一）圖式部份： 第一圖係本發明之製造流程圖； 第二圖係本發明中晶圓片測試標記之示意圖； 第三圖本發明中晶圓片中合格晶片周圍封Μ膠框製程 步驟之示意圖； 第四圖為本發明中ΙΤΟ玻璃片中相對於合格晶Η位置 % * 者周圍Μ雷射打孔處理之示意圖； 第五圖為一剖視圖，顯示本發明中該晶片方格中撒間 隔粒之製程步驟； 第六圖為一剖視圖，顯示本發明中該晶Μ與I Τ〇玻 璃片間對位組合之狀態； 第七圖為一剖視圖，顯示本發明中該晶Η與I Τ〇玻 璃片間經I Τ〇玻璃Η之注入孔注入液晶之製程 -4- 本&張尺度適用中國國家標準（CNS ) Λ4規格（210X 297公釐） (請先閲讀背面之注意事項 •本頁) -裝· 訂 535266 A7 ___B7_五、發明説明（） 步驟； 第八圖係製作完成的微型顯示器成品外觀圖 (二）圖號部份： 10取得晶圓測試資料 20 輸入資料至點 30 封膠處理 射打孔機 30 f 打孔處理 30A 校準層處理 40 間隔粒撒佈處理 50 對位組合處理 60 抽真空處理 70 晶^81注 80 封□處理 90 切割處理 100 晶圓 200 晶片 200 f晶片 210 膠框 211 缺口 220 玻璃球 300 ΙΤ0玻璃片 310 方框 320 注入孔 330 液晶 400 微型顯示器 (請先閲讀背面之注意事項v 裝-- P本頁) 經濟部中央標準局員工消費合作社印製 〈發明之詳细說明〉 首先，請參閱第一圖所示，第一圖及第二圖所顯示者 為本發明微型顯示器之製造流程，其中，在步驟1〇所顯 示者，係為取得晶圓測試資料，即作為基層電路的晶圓1 〇〇（如第二圖所示）中的每一個晶片200及20 的測試结果資料，這個資料來源可以由委託代工的晶圓製 造廠、測試廠或自行以晶圓測試設備測得，而其測試方式 皆是在針測台（PROBE STATION，圖未顯示）上進行，而針 測位置不論是以移動測試頭或是移動晶片方式測試，該晶 -5 — 本纸張尺度適用中國國家標準（CNS ) Λ4規格（2!0X297公釐） 經濟部中央標準局員工消費合作社印製 535266 A7 B7 五、發明説明（) 片2 Ο Ο及2 Ο Ο ’所在的X軸及Y軸座標資料及測試結 果，將會被--詳細地以磁帶、磁片或其他任何的資料型 態記錄，而在本發明中所揭示的晶圓1 〇〇為6吋、8吋 或1 2吋之規格，並且，在本發明中則是Μ晶片200為 測試结果“合格”者，而晶片2 00 f為測試結果“無效 ”者Μ資區別，其中，在晶Μ 2 0 0’上將有標記（MARK) 被打在表面，通常是Μ紅墨水印為主。 請再配合第三圖所示，步驟2 〇為輸入資料至點膠機 及雷射打孔機，即輸入上述的晶圓測試資料至點驟機（S E A L AN T/G L U )及雷射打孔機（L A S E R P U N C Η E R)中，該點膠機及雷射打孔機為由微電腦控 制及具X、γ平面座標自動移位控制之裝置，故可根據該 晶圓測試資料來控制其作動位置，如在第三圖則是顯示步 驟3 Ο的封膠處理製程*即該點膠機於上述晶圓1 〇〇中 經選為合格的晶片2 0 0之周圍逐一進行封膠處理，使每 一個晶片200周圍形成一膠框2 1 0,其構成的材料為 環氧樹脂且厚度不拘，通常該厚度則為產品之高度，而該 標示為無效的晶片2 0 0’周圍則不進行任何封膠處理， 且每一膠框2 1 Ο在封膠的過程中，則於一邊緣預留一缺 口211，它的作法可Μ由晶Η200的方格範圍大小來 設定該點膠機繞行的路徑長度。 請參閱圖四所示，上述在進行步驟3 Ο封膠處理製程 的同時，該雷射打孔機則同時執行步驟3 O’的打孔處理 流程，即將作為上層的I Τ〇玻璃片3 0 0，相對應於上 一6 一 本纸張尺度適用中國國家標準（CNS ) Λ4規格（210X 297公釐） (請先閲讀背面之注意事項再本頁) -裝. 訂 535266 Α7 Β7 經濟部中央標準局員工消費合作社印製 五、發明説明（) 述晶圓1 00中每一晶片200位置的方框3 1 Ο之一邊 緣上，Μ雷射打孔機打上一注入孔3 2 0,該注入孔3 2 〇的位置恰與上述晶片200周圍的膨框21◦之缺口2 1 1相為對應，因該雷射打孔機之位移位置，亦是根據上 述晶圓測試資料輸入後加以轉換而成，故其位置可相當精 確，並且該打完孔之I Τ〇玻璃片3 0 0，則必需再執行 步驟3 Ο Α的校準層處理（A L· I G NM E N T LAY E R )步驟，艮卩是用灘鑛（SPUTERING)或蒸鑛（EVAPORATIN G)之處理方式，把氧化矽糸列（SiOx)的玻璃材料偏斜一 角度鑛到IT0玻璃片300上。 請再參閲第五圖所示，步驟4 Ο為間隔粒撒佈處理製 程，即是藉由撒佈機（SPACER DISPENSO R)將間隔用的玻璃球2 2 Ο以隨機非定點撒佈方式，撒 佈在上述經膠框2 1 Ο膠封的晶Η 2 ΟΟ方格中，即如第 五圖所示，將該玻璃球2 2 Ο撒佈在經測試合格的晶片2 〇〇的方格内。 請再參閲第六圖所示，步驟5 Ο為對位組合處理製程 ，即將上述已作步驟3 Ο打孔處理的I Τ〇玻璃片3〇〇 對應組合至已封膠的晶圓1 〇〇上，使該I TO玻璃片3 〇〇壓合於該晶圓1 0 0上，並使每個有打上注入孔3 2 〇之方框3 1 Ο,分別對應該晶圓1〇0之每一個晶片2 〇〇上，並再Μ紫外線照射方式，使該膠框2 1 ◦硬化， 而達到該晶圓1 ΟΟ與I Τ〇玻璃片3〇0完全密合黏貼 之效果0 -7 一 (請先閲讀背面之注意事 本I) •裝· 訂 泉 本紙張尺度適用中國國家標準（CNS ) Λ4規格（210X 297公釐） 535266 經濟部中央標準局員工消費合作社印製 A7 B7五、發明説明（) 請再配合第七圖所示，步驟6 Ο為抽真空處理步驟， 即將上述步驟5 Ο已完成對位組合製程的晶圓1 ◦〇與I T〇玻璃片3 OO的組合體，放入真空室中抽真空，並再 進行步驟ΎΟ的液晶灌注製程，即使用液晶灌注機（LI QUID CRYSTAL FILLER)將液晶 33 〇滴在上述I TO玻璃片3 Ο Ο的各注入孔3 2 Ο上，並 於此時放開真空，使其回復到大氣壓力之環境，而該液晶 3 3 Ο則逐漸經注入孔3 2 Ο而被分別注入在各個晶片2 〇〇的方格中，並再於液晶3 3〇完全注入該晶片2 2〇 方格後，進行步驟8 Ο的封口處理製程步驟，即再藉由點 膠機將該對應晶片200的I TO玻璃片300上各注入 孔3 2 Ο及膠框2 1 Ο上之缺口 2 1 1予Μ膠封封閉，並 再以紫外線照射使其硬化完全封閉。 而在完成上述步驟8 Ο的封口處理製程步驟後，則再 進行步驟9 Ο的切割處理製程，即是以上、下分層切割處 理的作法，首先由於位在上層的I Τ〇玻璃片3 OO由於 質地較為脆弱，故採以雷射切割機（LASER CUT TER)來先行切割，而下層的晶圓1〇Ο則是Μ刮割機 (S C R I B E R )或据割機（S A W )來切割處理，進 而得到第八圖所示的微型顯示器4 Ο ◦之產品。 請再參閱第八圖所示，為經上述本發明之步驟1〇〜 步驟9 Ο製程所製得之微型顯示器4 0 0，於整個製造過 程上，則可有效地排除對該標示為無效的晶片2 OO ’的 加工製程，可大幅節省其製造時的工時、人力及成本，並 一 8 — (請先閱讀背面之注意事項 再 本頁) .裝· 訂 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） 535266 A? B7 五、發明説明（） 且，在另一方面，由於所製成的微型顯示器4 〇〇,於後 續的測試或檢驗過程中，可Μ有效地大幅節省對晶片2 Ο Ο逐一作繁瑣測試、檢驗之人力及工時，並進一步提高其 (請先閲讀背面之注意事項再填寫本頁) 產品的良率及品質穩定度，同時，由本發明製程所製得之 微型顯示器4 ΟΟ產品，不會如同習知微型顯示器製程中 產生大量含高污染物（如液晶330 )之廢料或不良品的缺 失及環保問題，可進一步地提昇及維護工業環境保護品質 ，誠為一極具產業利用價值之發明。 本發明的精神是在以最為精簡、快速及低成本的製程 ，來使微型顯示器產品於製造生產上，更具有低工時、人 力及成本的產品競爭力，同時，亦可大幅減少含高污染物 廢品之產生及提高環境保護效益。 Μ上第一圖〜第八圖所示本發明之微型顯示器之製造 方法，其中所揭示之各相關說明及圖式，僅為本發明為進 一步闡明其技術內容及技術手段，所列擧較佳實施例之一 隅，並不足以拘限本發明之範疇，並且，舉凡針對本發明 技術內容、手段之修飾及等效變更，當不脫離本發明之範 疇，其範圍標的將由以下之申請專利範圍來界定之。 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) Α4規格（2】0Χ297公釐）535266 Α7 Β7 V. Description of the Invention (Field of Invention) The present invention relates to a method for manufacturing a miniature display, and particularly to a process technology for a miniature display that can screen substrate wafers and simplify the process of deleting invalid crystal wafers. <Background of the Invention and Prior Art> According to the press, MICRO-DISPLAY is widely used in electrical projection display devices such as liquid crystal projectors, computer monitors, projection televisions, etc., and its main role is to generate the original image of optical projection, and By controlling the ON or OFF of the reflection function between each pixel (PIXEL) on the mirror surface, and combining with the optical projection light source and the optical projection mechanism composed of the lens group, the original image can be enlarged and projected on the frame. Screen or display. Therefore, the application scope of micro-displays is wide, and the number of micro-displays used in electrical appliances or optical projection equipment is also increasing. Therefore, its mass production process has become an important part of the product. Of course, in the conventional micro-display manufacturing process, each crystal M on the wafer using M as the base layer is sealed with an expanded frame, and spacers are sprinkled in each of the wafer squares surrounded by the plastic frame. Then, punch each of the I TO glass sheets on the top layer of the micro display corresponding to the position of each crystal lattice, and then combine the I TO glass sheet on the wafer with the sealed frame. Each of the crystal lattices is vacuumed and filled with liquid crystals one by one, and cut one by one and added with M to cut to form the initial finished product of the micro display, which must be tested and tested by the circuit, and each of the preliminary manufactured micro display is tested , Whether its chip circuit can operate normally, M screen out the final finished micro-display. 1 2 — The paper size is applicable to the Chinese National Standard (CNS) Λ4 specification (210X297 cm) (Please read the note on the back page first)-Installed-1T Printed by the Central Standards Bureau of the Ministry of Economic Affairs and Consumer Cooperatives ^ 535266 Economy Printed by A7 B7, Consumer Cooperatives of the Ministry of Standards and Standards of the People's Republic of China. 5. Description of Invention () Therefore, it is obvious from the conventional micro-display process described in M above that in the conventional process technology, all Crystal M, regardless of whether it is qualified or invalid, will be applied to M one by one for sealing, spraying spacers, combining I TO glass flakes, vacuuming, injecting liquid crystals, sealing, cutting, and testing. Materials, man-hours, and manpower have relatively increased the manufacturing difficulty of the micro display. At the same time, it is also a major test and obstacle for the subsequent testing and inspection of labor and costs after the initial production of the product. The production process was plagued by excessively long working hours and high product costs, and it increased the chance of discarding unnecessary products with unnecessary and high pollutants (liquid crystals). , In fact, another big threat and destruction. <Objective and Summary of the Invention> For this reason, the main object of the present invention is to provide a method for manufacturing a micro-display, which can use the test data of the wafer to screen qualified wafer processing, thereby greatly saving processing materials, labor and cost. Another object of the present invention is to provide a method for manufacturing a micro-display, which can refine the electrical test process of the wafers in the wafer, thereby greatly reducing the labor and cost of subsequent inspection and testing of the product. Another object of the present invention is to provide a method for manufacturing a miniature display device, which can greatly reduce the chance of generating high-contamination (liquid crystal) defective products and waste. In order to achieve the above-mentioned objects, the manufacturing method of the micro-display of the present invention is based on the basic wafer M constituting the micro-display, first testing each of the respective wafers, and marking the wafers that have been tested as invalid. Test 1 3 1 (please read the note on the back page first)-installed · 1T This paper size is applicable to the Chinese National Standard (CNS) Λ4 specification (210X 297 mm) 535266 Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs System A7 __B7 _V. Description of the invention () The data is input into the glue dispenser and the laser puncher. The glue dispenser applies the glue frame on the periphery of the qualified wafer, and then the laser puncher is applied to the ITO glass. An injection hole is placed on the wafer relative to the qualified wafer position, and spacers are scattered on the wafer frame of the glued frame, and the ITO glass wafer is aligned on the wafer according to the wafer test data, and The liquid crystal is injected through the injection hole in the ITO glass sheet on the upper layer of the qualified wafer, and M diffuses between the wafer and the ITO glass. After sealing and cutting, M accurately produces a micro-display product with a qualified wafer circuit. The overall process microdisplay. In order for your review committee to have a more detailed understanding of the specific technical content of the present invention and the letter of the invention, several implementation examples will be described in detail below to facilitate the review of your review committee. Among them: (1) Schematic part: The first figure is a manufacturing flowchart of the present invention; the second figure is a schematic diagram of a wafer test mark in the present invention; the third figure is a qualified wafer surrounding seal in a wafer in the present invention Schematic diagram of the process steps of the M plastic frame; The fourth diagram is a schematic diagram of the perforation treatment of the M laser in the ITO glass sheet relative to the qualified crystallites in the invention; The fifth diagram is a cross-sectional view showing the The process steps of spreading spacers in the wafer grid; Figure 6 is a cross-sectional view showing the state of the alignment combination between the crystal M and the I TO glass sheet in the present invention; Figure 7 is a cross-sectional view showing the The process of injecting liquid crystal between the crystal glass and I TO glass through the I TO glass injection hole -4- This & Zhang scale is applicable to China National Standard (CNS) Λ4 specification (210X 297 mm) (Please read the back first Precautions on this page)-Binding and binding 535266 A7 ___B7_ V. Description of the invention () Steps; Figure 8 is the finished appearance of the finished miniature display (2) Figure number part: 10 Obtain wafer test data 20 Enter data to point 30 Processing punching machine 30 f Punching processing 30A Calibration layer processing 40 Spacer spraying processing 50 Alignment processing 60 Vacuum processing 70 Crystal ^ 81 Note 80 Sealing processing 90 Cutting processing 100 Wafer 200 Wafer 200 f Wafer 210 Plastic frame 211 Notch 220 Glass ball 300 ITO glass sheet 310 Box 320 Fill hole 330 LCD 400 Micro-display (Please read the precautions on the back first v Installation-P page) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs Detailed description> First, please refer to the first figure. The first and second figures show the manufacturing process of the micro display of the present invention. Among them, the one shown in step 10 is to obtain wafer test. Data, that is, the test result data of each wafer 200 and 20 in the wafer 100 (as shown in the second figure) as the underlying circuit. This data source can be from a foundry wafer factory, a test factory, or Measured by wafer test equipment by yourself, and the test methods are all performed on a probe station (not shown). Mobile wafer method test, the crystal -5-This paper size applies to Chinese National Standard (CNS) Λ4 specification (2! 0X297 mm) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 535266 A7 B7 2 Ο Ο and 2 Ο Ο 'The X-axis and Y-axis coordinate data and test results will be recorded in detail in the form of magnetic tapes, magnetic disks or any other data types, as disclosed in the present invention Wafer 1000 is a 6-inch, 8-inch, or 12-inch specification, and in the present invention, M wafer 200 is a "pass" test result, and wafer 200 f is a "invalid" test result. The difference is that the MARK on the crystal M 2 0 ′ is marked on the surface, which is usually dominated by M red ink. Please cooperate with the third picture as shown in step 2. Enter the data to the dispenser and laser puncher, that is, input the wafer test data to the SEAL / T / GLU and laser puncher. In the machine (LASERPUNC Η ER), the dispenser and laser punch are controlled by a microcomputer and have automatic displacement control of X and γ plane coordinates. Therefore, the operating position can be controlled according to the wafer test data. As shown in the third figure, it shows the sealing processing process of step 30. That is, the dispenser performs sealing processing around the wafers that have been selected as qualified wafers 2000 in the above wafer 100, so that each one A plastic frame 2 1 0 is formed around the wafer 200. The material is epoxy resin and the thickness is not limited. Usually, the thickness is the height of the product, and no sealing is performed around the wafer 2 0 'marked as invalid. Processing, and during the sealing process of each glue frame, a gap 211 is reserved at an edge. Its method can set the path of the dispenser by the size of the grid of the crystal frame 200. length. Please refer to FIG. 4. At the same time as the sealing process of step 30 is performed, the laser punching machine performs the punching process of step 3 ′ at the same time, which is to be used as the upper layer ITO glass sheet 30. 0, corresponding to the previous 6 A paper size applies the Chinese National Standard (CNS) Λ4 specification (210X 297 mm) (Please read the precautions on the back before this page)-Binding. Order 535266 Α7 Β7 Central Ministry of Economic Affairs Printed by the Consumer Cooperative of the Bureau of Standards. V. Description of the invention (1) On the edge of one of the boxes 3 1 0 of the 200 position of each wafer in the wafer 100, the M laser punch punches an injection hole 3 2 0. The position of the injection hole 3 2 0 corresponds to the notch 2 1 1 of the expanded frame 21◦ around the wafer 200, because the displacement position of the laser punch is also converted based on the input of the wafer test data. Therefore, its position can be quite accurate, and the punched I TO glass sheet 3 0 0, it is necessary to perform the step of the calibration layer processing (AL · IG NM ENT LAY ER) of step 3 〇, that is, The processing method is SPUTERING or EVAPORATIN G. Si column a glass material silicon oxide (SiOx) a skew angle to the mine IT0 glass sheet 300. Please refer to the fifth figure again, step 4 〇 is a spacer spraying process, that is, the glass balls 2 2 〇 for random spacing are distributed by a spreader (SPACER DISPENSO R), Scattered in the above-mentioned grid of 2 0 〇 sealed by the plastic frame 2 1 0, that is, as shown in the fifth figure, the glass ball 2 2 0 is scattered in the grid of the qualified wafer 200 Inside. Please refer to the sixth figure again. Step 50 is the alignment and combination processing process, that is, the above-mentioned I TO glass sheet 300 which has been punched in step 30 is correspondingly assembled to the sealed wafer 1 〇 〇, the I TO glass sheet 300 is pressed on the wafer 100, and each of the boxes 3 1 0 with injection holes 3 2 0, corresponding to the wafer 100 respectively. Each wafer is placed on 2000, and the ultraviolet ray irradiation mode is used to harden the plastic frame 21, so that the wafer 100 and I TO glass plate 300 are completely adhered and adhered. 0 -7 1 (Please read the Notepad on the back first) • The size of the paper is bound to the Chinese National Standard (CNS) Λ4 specification (210X 297 mm). 535266 Printed by the Consumers Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Explanation () Please cooperate with the seventh figure, step 6 〇 is the vacuum processing step, that is, the above step 5 〇 has completed the alignment combination process wafer 1 ◦〇 and IT〇 glass sheet 3 OO combination, put Into the vacuum chamber to evacuate, and then perform the liquid crystal infusion process of step Ο, that is, using a liquid crystal infusion machine (LI QUID CRYSTAL FILLER) Drop the liquid crystal 33 〇 onto each injection hole 3 2 〇 of the above-mentioned I TO glass sheet 3 〇, and release the vacuum at this time to return it to the atmosphere of atmospheric pressure, and the liquid crystal 3 3 〇 Gradually inject into the squares of each wafer through the injection holes 3 2 0, and then completely inject the liquid crystals 3 2 0 into the 2 2 squares of the wafer, and then perform the sealing process step of step 8 0. That is, each injection hole 3 2 0 on the I TO glass sheet 300 corresponding to the wafer 200 and the notch 2 1 1 on the plastic frame 2 1 0 are sealed by a glue dispenser, and then sealed with UV glue, and then irradiated with ultraviolet rays to make it Hardened completely closed. After completing the sealing process of step 80, the cutting process of step 90 is performed, that is, the cutting process of the upper and lower layers is first performed due to the upper I Τ glass sheet 3 OO. Because the texture is relatively fragile, a laser cutter (LASER CUT TER) is used to cut in advance, and the lower wafer 100 is cut and processed by an M scraper (SCRIBER) or a cutting machine (SAW), and then The micro display 4 0 ◦ shown in the eighth figure is obtained. Please refer to the eighth figure again. The micro display 4 0 0 obtained through the above-mentioned steps 10 to 9 of the present invention can be effectively excluded in the entire manufacturing process. The wafer 2 OO 'processing process can greatly save man-hours, manpower and costs during manufacturing. (Please read the precautions on the back before this page) CNS) A4 specification (210X 297 mm) 535266 A? B7 V. Description of the invention () And, on the other hand, due to the manufactured micro display 400, it can be effective in the subsequent testing or inspection process It greatly saves manpower and man-hours for tedious testing and inspection of wafers 2 0 0 one by one, and further improves it (please read the precautions on the back before filling this page) product yield and quality stability. At the same time, the invention The micro-display 4 〇0 product produced in the manufacturing process will not produce a large amount of high-contamination (such as liquid crystal 330) waste or defective products and environmental issues in the conventional micro-display manufacturing process, which can further L environmental protection and maintenance of industrial quality, honesty is a great invention of the industrial use value. The spirit of the present invention is to use the most streamlined, fast and low-cost manufacturing process to make micro-display products more competitive in products with low man-hours, manpower, and cost in manufacturing. At the same time, it can also significantly reduce high pollution Production of waste products and improvement of environmental protection benefits. The manufacturing method of the microdisplay of the present invention shown in the first to eighth figures of the above. The related descriptions and drawings disclosed therein are only for the purpose of further clarifying the technical content and technical means of the present invention. One of the examples is not sufficient to limit the scope of the present invention, and for all modifications and equivalent changes to the technical content and means of the present invention, without departing from the scope of the present invention, the scope of the subject matter will be determined by the following patent application scope Define it. Printed by the Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is sized to the Chinese National Standard (CNS) Α4 (2) 0 × 297 mm