CN102004359A - Method for making LCOS (Liquid Crystal On Silicon) liquid crystal display - Google Patents

Method for making LCOS (Liquid Crystal On Silicon) liquid crystal display Download PDF

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Publication number
CN102004359A
CN102004359A CN 201010520661 CN201010520661A CN102004359A CN 102004359 A CN102004359 A CN 102004359A CN 201010520661 CN201010520661 CN 201010520661 CN 201010520661 A CN201010520661 A CN 201010520661A CN 102004359 A CN102004359 A CN 102004359A
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liquid crystal
lcos
silicon chip
crystal display
ito glass
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CN102004359B (en
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马仁祥
叶红卫
仲凯
姚振罡
丁科学
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Jilin Ju Hong Intelligent Technology Co ltd
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Abstract

The invention discloses a method for making an LCOS (Liquid Crystal On Silicon) liquid crystal display, and the LCOS liquid crystal display is produced by using a conventional production line of liquid crystal displays. In the invention, a gasket material is not distributed in a display space of the LCOS display, and gasket material inexistence in the display space and the control of box thickness are realized by mixing a proper amount of gasket materials with certain grain diameter in sealed frame glue. The problem of the difficult control of the uniformity of box thickness due to the design of ultrathin box thickness for increasing the response speed of the liquid crystal display and the problem caused by a hetero structure are solved by the following methods of: carrying out low-temperature treatment on the liquid crystal display after liquid crystals are injected and then sealing; eliminating the stress of the display by carrying out high-temperature treatment at 110 centigrade degrees before display cutting.

Description

A kind of LCOS liquid crystal display method for making
Technical field
The present invention discloses a kind of LCOS liquid crystal display method for making, be a kind ofly to utilize conventional liquid crystal production line and taked some technical measures and new process at some characteristics of LCOS, produce this more conventional liquid crystal display at structure, performance, the very big LCOS screen products of processing technology difference, belong to LCD manufacturing technology field.
Background technology
LCOS LCD (being Liquid Crystal on Silicon) is the new product of market release in recent years, and it is applied to projector equipment, glasses decline and look display, has particularly obtained widespread use on the portable minisize projector.But because the liquid crystal display of its structure and performance and routine has bigger difference, therefore, LCOS shields on manufacture craft also to be had more differently with conventional liquid crystal display, and manufacture difficulty is big a lot.
The conventional screen of LCOS can run into following problem on making:
1, heterojunction structure, accompany liquid crystal between the glass that conventional liquid crystal display agent structure is two homogeneities, and the structure of LCOS is to accompany liquid crystal between glass and the silicon chip, be heterojunction structure, because the physical property of glass and silicon chip differs greatly, the screen of this structure of matter is easy to generate structural stress and makes screen that deformation take place in process.
2, the thick generation subtle change of the box of liquid crystal display (as 0.1 micron) can cause display performance generation significant change, in order to make the accuracy control of the thick energy of box and to have good homogeneity, conventional liquid crystal display is must wadding by certain Density Distribution between two blocks of glass, with this control enclosure.But because LCOS is the Display projector enlarged image, can show wadding clearly, influence image quality, therefore can not as conventional screen, place wadding in the viewing area of LCOS.The situation of this linerless bedding and padding, if calculate by dimension scale, this cans be compared to does not have a shore supports at 15 kilometers square hall faces of a length of side.Therefore linerless bedding and padding very easily cause " box collapses ", the thick very difficult control of box.
3, mostly LCOS is to be used to show dynamic video image, thick being generally about 6 microns of box of conventional screen, the streaking phenomenon appears easily for fear of the routine screen, the present invention adopts screen ultra-thin box thick structure (about 1.8~2.8 microns), avoided streaking so effectively, but ultra-thin box manufacture difficulty is bigger.
4, circular silicon chip can run into silicon chip on production line and glass transmits and the contraposition problem with the rectangle glass combination.The available liquid crystal production line is not suitable for the smooth transport of circular silicon chip all by the design of rectangle glass.
Summary of the invention
The present invention discloses a kind of LCOS liquid crystal display method for making, utilizes conventional liquid crystal display production line to produce the LCOS LCDs.
It is that main heat-curable glue is that the epoxy glue of assisting substitutes that conventional heat-curable glue solves LCOS because heterojunction structure causes the method for screen distortion when the sealing glue solidifying with optic-solidified adhesive that the present invention discloses a kind of.
The present invention discloses a kind of viewing area at LCOS screen wadding that do not distribute, and the method by mix an amount of wadding of certain particle diameter in envelope frame glue realizes the linerless bedding and padding in viewing area and the thick method of box of controlling well.
The present invention discloses and a kind ofly carries out sealing after the sub zero treatment after liquid crystal injects by liquid crystal display again, and carries out the measures such as stress that 110 ℃ pyroprocessing is eliminated screen before the screen cutting earlier.Solve owing to liquid crystal display designs difficult control of the thick homogeneity of the thick box that brings of ultra-thin box and because the problem that heterojunction structure brought in order to improve response speed.
The present invention disclose a kind of adopt supporting plate carrying chip transmission and transmission method of on each station, processing and secondary contraposition to method for position.
Concrete technical solution is, with the thick production line standard size of 1.1mm (ito glass of 370mm * 470mm) for example, the method by photoetching carves two cover alignment marks as supporting plate, wherein a cover alignment mark is that supporting plate and silicon chip carry out contraposition usefulness; Another set of is that piece ito glass contraposition of supporting plate and liquid crystal display is carried out contraposition and used.Aligning accuracy will be controlled at ± 2 microns in.Supporting plate can recycle.
The main technique step is as follows:
1) at the supporting plate groove that is provided with on glass, silicon chip is placed in the groove, and four angles of supporting plate glass and the marginal position of groove are provided with alignment mark, are provided with on silicon chip and the corresponding alignment mark of supporting plate glass groove register guide;
2) ito glass and silicon chip are cleaned respectively, dry, and with its surface-coated photoresists, exposure, development, oven dry;
3) with nitric acid and hydrochloric acid mixed solution the ITO layer on the ito glass is corroded, the proportioning of etching liquid is: hydrochloric acid: nitric acid: water=100: 8: 123 (volume ratio);
4) with liquid parting the photoresists on the ito glass are removed, and cleaning, drying;
5) apply the PI layer on ito glass surface and silicon chip surface, oven dry;
6) the PI layer is carried out friction orientation;
7) be printed with the envelope frame glue that mixes spherical wadding on the ito glass surface; Described wadding is 2.8 ~ 3 microns a silicon ball, mixes with the ratio of glue in (1.8 ~ 2.2) ratio 100;
8) ito glass and silicon chip to be undertaken box by alignment mark, the image aligning accuracy is less than ± and 2 microns;
9) UV-irradiation makes the adhesive curing of envelope frame;
10) cut into slices according to product specification and make liquid crystal cell;
11) inject liquid crystal in the liquid crystal cell;
12) low temperature (0 ℃~4 ℃) is placed down liquid crystal is shunk;
13) seal; 110 ℃ of bakings were solidified 120 minutes, eliminated the stress between ito glass and silicon chip, promptly got the LCOS liquid crystal display.
Be wadding particle diameter, density and the molding process condition of adding in the envelope frame glue of viewing area outside to be adjusted control enclosure is thick that it is met the demands in the present invention.The present invention also provides a kind of supporting plate glass carrying chip transmission specially and has processed to each station.The operation that has two ITO figures on glass to carry out contraposition in the liquid crystal display manufacturing process, and the precision that requires contraposition is in 2~3 microns, yet because silicon chip is circle and opaque, can't realize contraposition according to a conventional method, what the present invention adopted is the secondary contraposition method, promptly processes two cover alignment marks on supporting plate.Utilize a cover mark and a silicon chip contraposition at supporting plate middle part earlier; And then with the supporting plate contraposition between that cover mark and ito glass substrate of edge of keeping to the side.
Though foregoing heterojunction structure, linerless bedding and padding, ultra-thin box are three independently problems, but wanting the ancestor closing on technology comes together to consider, so this technology in envelope frame glue, add wadding, research improve carry out sealing again after low temperature (0 ℃~4 ℃) is placed after having adopted liquid crystal to inject on the basis of pressing cassette method and shield cutting before under 110 ℃ of temperature, place the methods such as stress that were used for eliminating screen in 120 minutes, obtained good effect.
The present invention is with respect to the good effect that prior art has: be a kind ofly to utilize conventional liquid crystal production line and taked some technical measures and new process at some characteristics of LCOS, produce this more conventional liquid crystal display at structure, performance, the very big LCOS screen products of processing technology difference, because the physical property difference of silicon chip and ito glass is bigger, therefore, can occur some unconformable problems of LCD screen technology to routine in the LCOS manufacturing process, these problems that The present invention be directed to appearance have been taked solution.Use this method to make the LCOS display screen smoothly at the liquid crystal production line of routine, this enters the LCOS product scope to existing LCD enterprise strong help is provided.
Description of drawings
Fig. 1, LCOS liquid crystal display structural representation of the present invention;
Fig. 2, silicon chip supporting plate synoptic diagram of the present invention;
Among the figure: 1, silicon chip; 2, ito glass; 3, liquid crystal; 4, wadding; 5, ITO layer; 6, PI layer; 7, envelope frame glue; 8, mark; 9, supporting plate glass.
Embodiment
By following examples the present invention is described for example further, and do not limit the present invention in any way, under the prerequisite that does not deviate from technical solution of the present invention, any change or change that those of ordinary skills that the present invention did are realized easily all will fall within the claim scope of the present invention.
Embodiment 1:
Little glasses is made of the LCOS liquid crystal display.This LCOS liquid crystal display is of a size of 0.7 inch, and display resolution is 600 * 800.With 0.5mm thick ito glass and the thick silicon wafer to manufacture of 0.7mm.The whole manufacturing process of LCOS must be carried out (cleanliness factor of decontamination chamber is≤1000 grades, device interior≤100 grade) under superelevation level purification condition.
1) be provided with groove on supporting plate glass 9, silicon chip 1 is placed in the groove, and four angles of supporting plate glass 9 and the marginal position of groove are provided with alignment mark 8, also are provided with on silicon chip 1 and the corresponding alignment mark 10 of the groove register guide of supporting plate glass 9;
Carry out contraposition between silicon chip 1 and the supporting plate glass 9 at 500 times microscopicallies, aligning accuracy is controlled at ± 2 microns in;
2) silicon chip 1 and ito glass 2 clean through clean-out system, ultrasound wave, pure water respectively, at test under microscope, (conventional criteria is 0.15mm~0.2mm) not allow the dirty point of diameter 〉=0.01mm, apply photoresist, thick 0.8 micron of glued membrane, do not allow the pin hole of diameter 〉=0.01mm,, in 3% NaOH solution, develop 105 ℃ of oven dry down;
3) in etching liquid, etch the ITO figure; , the proportioning of etching liquid is: hydrochloric acid: nitric acid: water=100: 8: 123 (volume ratio);
4) with liquid parting the photoresists on the ito glass 2 are removed, and cleaning, drying;
5) at ito glass 2 surface and silicon chip 1 surface-coated PI layers 6 (alignment agent), the PI film thickness monitoring is solidified in 250 ℃ curing tunnel at 500 dusts;
6) PI layer 6 is carried out friction orientation;
7) be printed with the envelope frame glue 7 that mixes spherical wadding 4 on ito glass 2 surfaces; Described wadding 4 is 2.8 microns a silicon ball, mixes 2.8 microns waddings of particle diameter of (1.8 ~ 2.2) % in envelope frame glue 7, stirs 30 minutes before using.Seal frame collodion silk reticulated printing, the frame offset printing is having the on glass of ITO figure, aligning accuracy is controlled at ± 0.1mm in, the glue height is 0.28mm;
8) ito glass 2 and silicon chip 1 to be undertaken box by alignment mark, the image aligning accuracy is less than ± and 2 microns; The silicon chip 1 that supporting plate glass 9 is arranged as following sheet, figure arranged ito glass 2 as last slice, contraposition is that the submarginal mark of upper and lower plates is aligned with each other, aligning accuracy is controlled at ± 2 microns in;
9) envelope frame glue 7 solidifies; Carry out the UV photocuring at uv oven and handled 3 minutes, enter infrared heating furnace then, 115 ℃ solidified 25 minutes;
10) cut into slices according to product specification and make liquid crystal cell;
11) inject liquid crystal 3 in the liquid crystal cell;
12) low temperature (0 ℃~4 ℃) is placed down liquid crystal 3 is shunk;
13) seal; 110 ℃ of bakings were solidified 120 minutes, eliminated the stress of 1 of ito glass 2 and silicon chip, promptly got the LCOS liquid crystal display.
Through test response time: 12mS, contrast: 180:1, show well, produce a desired effect.
Embodiment 2:
Make the LCOS display screen that micro projector is used, it is of a size of 0.9 inch display resolution is 680 * 1024, and ito glass thickness is 0.7mm.
1) be provided with groove on supporting plate glass 9, silicon chip 1 is placed in the groove, and four angles of supporting plate glass 9 and the marginal position of groove are provided with alignment mark 8, also are provided with on silicon chip 1 and the corresponding alignment mark 10 of the groove register guide of supporting plate glass 9;
2) ito glass 2 and silicon chip 1 are cleaned respectively, dry, and with its surface-coated photoresists, exposure, development, oven dry;
3) use hydrochloric acid: nitric acid: the etching liquid of water=100: 8: 123 (volume ratio) corrodes the ITO layer 5 on the ito glass 2;
4) with liquid parting the photoresists on the ito glass 2 are removed, and cleaning, drying;
5) in ito glass 2 surface and silicon chip 1 surface-coated PI layers 6, oven dry;
6) the PI layer is carried out friction orientation;
7) be printed with the envelope frame glue 7 that mixes spherical wadding 4 on ito glass 2 surfaces; Described wadding 4 is 2.8
The silicon ball of micron mixes than 100 by (1.8 ~ 2.2) with glue;
8) ito glass 2 and silicon chip 1 to be undertaken box by alignment mark, the image aligning accuracy is less than ± and 2 microns;
9) UV-irradiation makes adhesive curing;
10) cut into slices according to product specification and make liquid crystal cell;
11) inject liquid crystal 3 in the liquid crystal cell;
12) low temperature (0 ℃~4 ℃) is placed down liquid crystal 3 is shunk;
13) seal; 110 ℃ of bakings were solidified 120 minutes, eliminated the stress of 1 of ito glass 2 and silicon chip, promptly got the LCOS liquid crystal display.

Claims (1)

1. LCOS liquid crystal display method for making may further comprise the steps:
1) on supporting plate glass (4), is provided with groove, silicon chip (1) is placed in the groove, four angles of supporting plate glass (4) and the marginal position of groove are provided with alignment mark (8), are provided with on silicon chip (1) and the corresponding alignment mark of supporting plate glass (4) groove register guide (10);
2) ito glass (2) and silicon chip (1) are cleaned respectively, dry, and with its surface-coated photoresists, exposure, development, oven dry;
3) with nitric acid and hydrochloric acid mixed solution the ITO layer (5) on the ito glass (2) is corroded;
4) with liquid parting the photoresists on the ito glass (2) are removed, and cleaning, drying;
5) in ito glass (2) surface and silicon chip (1) surface-coated PI layer (6), oven dry;
6) PI layer (6) is carried out friction orientation;
7) be printed with the envelope frame glue (7) that mixes spherical wadding (4) on ito glass (2) surface; Described wadding (4) is 2.8 ~ 3 microns a silicon ball, mixes with the ratio of glue in (1.8 ~ 2.2) ratio 100;
8) ito glass (2) and silicon chip (1) to be undertaken box by alignment mark, the image aligning accuracy is less than ± and 2 microns;
9) UV-irradiation is solidified envelope frame glue (7);
10) cut into slices according to product specification and make liquid crystal cell;
11) inject liquid crystal (3) in the liquid crystal cell;
12) low temperature (0 ℃~4 ℃) is placed down liquid crystal (3) is shunk:
13) seal; 110 ℃ of bakings were solidified 120 minutes, eliminated the stress between ito glass (2) and silicon chip (1), promptly got the LCOS liquid crystal display.
CN2010105206619A 2010-10-27 2010-10-27 Method for making LCOS (Liquid Crystal On Silicon) liquid crystal display Expired - Fee Related CN102004359B (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102289092A (en) * 2011-08-31 2011-12-21 深圳市长江力伟股份有限公司 Method for jointing and solidifying silicon-based liquid crystal display screen
CN103698947A (en) * 2013-12-20 2014-04-02 合肥京东方光电科技有限公司 TN (twisted nematic) type liquid crystal display panel, TN type liquid crystal display panel preparation method and liquid crystal display device
CN104238254A (en) * 2013-06-20 2014-12-24 北京丰信达科技有限公司 Display screen manufacturing method
CN104330909A (en) * 2013-07-22 2015-02-04 上海长城计算机网络工程有限公司 Liquid crystal box structure of LCOS (Liquid Crystal on Silicon) micro display device and manufacturing method of liquid crystal box structure
CN104679339A (en) * 2015-01-19 2015-06-03 欧浦登(顺昌)光学有限公司 Integrated fully-sealed liquid crystal screen and manufacturing process for same
CN106681061A (en) * 2017-03-17 2017-05-17 武汉华星光电技术有限公司 Liquid crystal display panel, preparation method thereof and liquid crystal display device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6891592B2 (en) * 2002-07-26 2005-05-10 Intel Corporation Wafer level electro-optical sort testing and wafer level assembly of micro liquid crystal-on silicon (LCOS) devices
CN1965262A (en) * 2004-10-05 2007-05-16 矽感成像有限公司 Carbon nanotube technology in liquid crystal on silicon micro-display
CN101344690A (en) * 2007-07-10 2009-01-14 中华映管股份有限公司 Production method of silicon based liquid crystal panel

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6891592B2 (en) * 2002-07-26 2005-05-10 Intel Corporation Wafer level electro-optical sort testing and wafer level assembly of micro liquid crystal-on silicon (LCOS) devices
CN1965262A (en) * 2004-10-05 2007-05-16 矽感成像有限公司 Carbon nanotube technology in liquid crystal on silicon micro-display
CN101344690A (en) * 2007-07-10 2009-01-14 中华映管股份有限公司 Production method of silicon based liquid crystal panel

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102289092A (en) * 2011-08-31 2011-12-21 深圳市长江力伟股份有限公司 Method for jointing and solidifying silicon-based liquid crystal display screen
CN104238254A (en) * 2013-06-20 2014-12-24 北京丰信达科技有限公司 Display screen manufacturing method
CN104238254B (en) * 2013-06-20 2016-08-17 北京丰信达科技有限公司 A kind of display screen manufacture method
CN104330909A (en) * 2013-07-22 2015-02-04 上海长城计算机网络工程有限公司 Liquid crystal box structure of LCOS (Liquid Crystal on Silicon) micro display device and manufacturing method of liquid crystal box structure
CN104330909B (en) * 2013-07-22 2017-04-19 上海长城计算机网络工程有限公司 Liquid crystal box structure of LCOS (Liquid Crystal on Silicon) micro display device and manufacturing method of liquid crystal box structure
CN103698947A (en) * 2013-12-20 2014-04-02 合肥京东方光电科技有限公司 TN (twisted nematic) type liquid crystal display panel, TN type liquid crystal display panel preparation method and liquid crystal display device
CN103698947B (en) * 2013-12-20 2016-03-30 合肥京东方光电科技有限公司 A kind of TN type liquid crystal panel and preparation method thereof and liquid crystal indicator
CN104679339A (en) * 2015-01-19 2015-06-03 欧浦登(顺昌)光学有限公司 Integrated fully-sealed liquid crystal screen and manufacturing process for same
CN106681061A (en) * 2017-03-17 2017-05-17 武汉华星光电技术有限公司 Liquid crystal display panel, preparation method thereof and liquid crystal display device

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