TW532059B - Manufacturing method of housing formation for both EMI shielding and surface decoration - Google Patents

Abstract

The present invention relates to a manufacturing method of housing formation for both EMI shielding and surface decoration. Specifically, the EMI shielding layer is integrally formed between the outer layer of plastic film and plastic inner layer through the following steps: (A) forming the plastic film; (B) forming the EMI shielding layer; (C) coating the adhesive layer and (D) forming the outer layer, etc. Thus, the EMI shielding layer is formed to have a good shielding effect, without wearing out, weather-endurance, medicine-resistance and nice outlook. Furthermore, a predetermined decoration surface can be directly formed on the plastic film, and the EMI shielding layer is associated with the decoration surface of plastic film all in once (form a predetermined pattern or color on the plastic film), so as to reduce the cost and manufacturing efficiency effectively, and meet the practical demanding of industry.

Description

532059 -------- 113003_ Article a. 5. Description of the invention (1) ----- The present invention relates to a method for manufacturing a shell with both EMI shielding and surface decoration. In other words, it refers to the shielding technology of enclosures EM I for electronics, communication, information and other related products. In the new generation of information and communication products, with the high requirements for the quality of audio and video transmission, there is a trend towards high-frequency development. Relative to the accompanying problems of mutual interference of electromagnetic wave signals and the harm of electromagnetic waves to humans, they are becoming more and more important. It is valued; therefore, how to shield electromagnetic waves has become an important issue for various related industries to be urgently solved. Electromagnetic interference is a kind of "non-free radiation", unlike the "free radiation" produced by Han Shewu, which has serious harm to the human body; electromagnetic interference is only a phenomenon formed by the movement of electrons in a conductor, and this interference does not remain inside the human body However, this "electromagnetic interference" is so small that it affects the quality of the audio reception, making it "rustle" during reception, as much as the car's control system and heart rate adjuster will also be disturbed and not function properly; electronic information, communication The shielding of EMI by related products, with the passing of laws by countries around the world, there will be a wave of mandatory requirements, such as the US FCC or international CE and CISPR regulations; among them, the competition for communication opportunities is due to the use relationship with users Most closely, it is expected to be the first after the EMI shielding decree is implemented. Among the technologies of EMI masking in mobile phones, 'appropriate conductive treatment of the casing is one of the more possible implementation methods at present, because it has less impact on the product itself and is easier to handle, so it has become The most preferred choice; and traditional electromagnetic shielding methods include, for example: (a) metal tape, (b) ionized cloth (IonizedPlating), (c) vacuum evaporation (VacuumPlating);

532059-Brewing 9011, which is the date of 1st, 5th, invention description (2) '" " " " " " 一 · " *-(4) flame spraying and arc spraying, (5) cathode sputtering (Sputtering), (6) spray conductive paint, (7) electroless plating, (8) conductive filling materials, etc. Among them, the EMi shielding methods often applied to mobile phone cases include: electroless plating, spraying Conductive paint and vacuum evaporation, etc. Among them: The advantages of this electroless electricity are: the thickness of the A coating is only 15 ~ 20 / zm, but the electromagnetic shielding effect is high, and the B plating solution can penetrate the slit portion of the casing, which is suitable for complex Shaped products, c, because the thickness of the plating layer is thin, so the combination of the finished product and other components is easy; its disadvantages are: a. Large-scale electroplating equipment with automatic concentration management (equipment costs usually need tens of millions of Taiwan dollars) Surface plating requires a lot of manpower and time-consuming shielding projects, c. The plastic substrate applicable is limited, d. If the surface layer is mineralized, it is painted to improve the appearance, and e. The problem of environmental pollution cannot be overcome; Conductive paint, its advantages are: A equipment investment Low, B operation method is simple, low technical, any kind of plastic substrate can be used, C has a number of cost advantages; and its disadvantages are: ^ easy to uneven finished coating layer of complex shapes, b coating layer is quite thick ( Generally it is 5 0 ~ 7 5 // m), c. Because the thickness of the conductive paint is thick, the finished shell of the shell is easy to join with other components or is not smooth. The spray pressure of the paint spray cloth must be adjusted at any time, and the shielding effect is poor ( Those with nickel paint are about 40 ~ 50dB, those with silver paint are about 80-90dB, but the price is about 5 times of the former), the environmental pollution problem of f spray paint cannot be overcome; the advantages of this vacuum evaporation are: A process Clean and no environmental pollution problem, B mineral film is quite thin (~ 2.5 // m), Clt film thickness is uniform, and the finished shell is connected

532059 ___ Case No. 90113003 _ year month day amendment __ 5. Description of the invention (3) " Easy to combine, good shielding effect (approximately 70 ~ 8OdB), etc .; its disadvantages are: easy to have dead corner plating for finished products with complex shapes No, equipment investment is expensive, and high professional operation ability is required. The above-mentioned three processing methods through electroless plating, conductive paint spraying and vacuum evaporation are mainly to achieve the effect of electromagnetic wave shielding and protection by conducting the plastic shell; however, it is worth noting that the metal shielding layer is directly The molding is exposed on the outer surface of the casing, so it is quite easy for various factors to cause the metal shielding layer to lose paint, local peeling, or even the entire piece of peeling, abrasion and other conditions, leading to the loss of electromagnetic wave shielding and protection effects; in addition, the metal shielding layer The appearance of the display often does not meet the design requirements. It can be seen that the traditional technical methods cannot meet the actual needs of the information and communication related product shells, such as: electromagnetic wave shielding, ergonomic modeling, wear resistance, scratch resistance, weather resistance. Properties, chemical resistance, beautiful appearance, multiple style changes, etc. The reason is that, in order to improve the overall competitiveness of the domestic mobile phone industry, the present invention aims at the actual needs of new-generation information and communication product housings, and has developed a method that simultaneously has electromagnetic wave shielding capabilities, beautiful appearance, and can be quickly transformed into multiple styles. The manufacturing method of the shell of information communication products; technically, the present invention must integrate three technologies, including: (a) plastic metallization and electromagnetic wave shielding technology; (b) three-dimensional plastic film forming technology; (c) mold Inner and outer shell forming technology. The main object of the present invention is to provide a method for forming a shell with both EM and surface decoration. Through the manufacturing method of the present invention, the EMI shielding layer can be integrally formed on the outer layer of a plastic film.

Page 6 305〇59 Yan 90,013,003, description of the invention (4) Wide, so as to form-EM! Better shielding, E m! The shielding layer will not wear out weather resistance, chemical resistance, beautiful appearance, etc. purpose. The purpose of this $ :: P is to provide a method for forming and shielding the surface of EM 1 with brocade, in which the Shu Hai plastic film can be directly formed into a predetermined decorative surface, and the decoration of the EMJ shielding layer Surface (predetermined pattern or color is formed on the plastic film; j times): together, it can effectively reduce costs and improve manufacturing efficiency, and truly meet the actual needs of the world. Regarding the present invention, in order to achieve the above purpose, the Techniques, means and effects: I will give a better and feasible embodiment in conjunction with the drawings to elaborate a. In relation to the above-mentioned objects, features and other advantages of the present invention, other industries such as #… ^ ~ _ Get a deep and specific understanding from it; first of all, please refer to the first. No, the embodiment of the present invention provides a method for forming a shell with both EM 丨 shielding and surface decoration, which mainly includes A · The step of forming a plastic film (10), the step of forming a EMI shielding layer (20 ° C), the step of applying a coating layer (3), and the step of forming an outer layer (4 households, of which: the step of forming a plastic film ( 10): The plastic The material of the film (11) can be taken from PC, PC \ BT, or other materials with ductility and heat resistance (> 100). The first surface (丄 丄 丄) of the plastic film is the outer side, and the plastic film ( 11) The second surface (1 1 2) (inside or metallized surface) can be formed by coating, screen printing 'laser engraving, pad printing, bronzing or thermal transfer techniques' to have any color, text, Decorative surfaces such as graphics, images, etc., and then thermoforming or high pressure molding 0

532059 V. Description of the invention (5) (High pressure forming) technology, the plastic film (1 1) is pre-formed into the desired appearance type; the step of forming the EMI masking layer (2 0) •• using metal plating to form Technology, such as vacuum aeration (Vacuum ρ 1 ating), vacuum base (Sputterng), ion vacuum plating (Ionized plating), chemical (Electroless plating) or traditional plating and other methods, in the plastic x The second surface (1 12) of the film (1 1) is coated with a metal EMI shielding layer (2 1) with a thickness of several m to several tens; of which, the material of the ΕμI shielding layer (2 1) It can be aluminum, copper, silver, nickel, chromium, or tin-lead alloy, etc .; the coating step (30): coating a layer with a thickness of The bonding layer (3!) Of the number # 瓜 =, ^ promotes the bonding between the above-mentioned metal EM r 敝 s (2 1) and the plastic material; the bonding layer (3 丄 f ΐ can be τ to have bonding Any polymer resin, which makes

Uane (Ethylaminocarbamate, Polyurethane, Carbamate) 糸 and Epoxy (epoxy resin) series resin are the outer layer forming step (40): the above-mentioned formed gold 'shielding layer (21) and The connection is ίο fetch & metal EMI .α ^ The plastic film car of the connector layer (31) is formed into a mouth, and is placed on the surface of the molded hibiscus and allowed to ^ ^）) The flat two surface (1 1 2 Κ ΓΓ is in the plastic thin The Λ λ order of (1 1) glue is injection-molded and formed on the second surface A 3 of the plastic and other amines. 1) A thick film (1 step can make the metal type; win | ("), this step builds Screw holes: product mechanical strength, can also be assembled in this mechanism at the same time, of which, in this step

Establish the thickness of the overall finished product to make up: Where all are covered and hidden, and 532059 ---- Mm-1 90i] 300fs Revised 5. Description of the invention (6)-Injection molding plastic used 'It can be any thermoplastic, the most commonly used is t-carbonate (PC, Polycarbonate), ABS or PC / ABS glue, etc .; according to this, a finished product containing a metal EM j shielding layer can be formed. The finished product formed by the method of the present invention can achieve at least the following multiple advantages; such as: '/,' This EMI shielding layer is implanted between the plastic film and the plastic outer layer, and the metal electromagnetic shielding layer will not be exposed at all, Therefore, it can effectively avoid problems such as abrasion, scratches, detachment, peeling, and paint peeling, and ensure the EMI shielding effect during product use, with a very high reliability. The first is that the metalized pre-formed plastic film required for the product is completed before injection molding of the outer layer of the plastic, so it can facilitate the screening and improvement of defective products to ensure the product yield and avoid other defective products in the EM process / The second 'metal EMI masking layer is based on the simple geometric shape of the plastic film Yu'. The metal EMI masking layer is formed through the mineral junction technology, and the second surface of the plastic film is shot out of the formed plastic. The outer layer, therefore, calls for avoiding the poor quality caused by other pores, dead corners, or uneven coatings that are common in other MEMS processes; 乂 ... Fourth, through the method of the present invention, the formed metal ^ "I shielding layer is known to work Contains various parts of the product, which is not prone to electromagnetic wave leakage; its five-metal EMI shielding layer must be combined with the decorative surface of the plastic film (predetermined pattern or color on the plastic film) in a single molding combination, which can effectively Reduce costs and improve manufacturing efficiency, and truly meet the actual needs of the industry.

532059 ^ 90113003

V. Description of the invention (7) In summary, the structure disclosed in the embodiment of the present invention can be used to form the EMI masking layer af on the outer layer of the plastic film and the inner layer of the plastic through the manufacturing method of the present invention during operation. In this way, the f-shielding is better, the EMI masking layer will not wear, weather resistance, beautiful appearance of drugs and drugs, and it has multiple purposes. Furthermore, the plastic film can be directly molded into The surface of the royal palace is shielded, and the EMI masking layer is combined with the forming surface of the plastic film at one time, which can effectively reduce the cost and improve the manufacturing efficiency, which really meets the actual needs of the industry. Therefore, the " Structure, doubting that the embodiment of the present invention has the effect of enhancing the above-mentioned effect. It is also used for public use. In addition, the "progressiveness" is also true. The "newness" of the present invention and please review it. He also filed an application for an invention patent as early as possible, and granted a quasi-patent at an early date.斫 532059 Case No. 90113003 Λ_η Revision (1 1) Plastic film (1 1 2) Second surface (2 1) Ε Μ I shielding layer (31) Adhesive layer (41) Plastic layer One figure is a block diagram of the process flow of the process of the present invention. The second figure is a schematic cross-sectional view of the finished product of the method of the present invention. Figure number: (1 0) forming a plastic film step (1 1 1). Forming a EMI shielding layer on the first surface (20). Step (3 0) coating step (4 0) forming outer layer step

Claims (1)

532059 Case No. 90113003 6. Scope of patent application 1. Forming a shell with both EMI shielding and surface decoration A. Forming plastic film Steps: The first surface of the plastic film is the outer side, and the second surface of the film can be transmitted through Printing technology, forming decorative surfaces with any color, text, graphics, images, etc .; and then using thermoforming technology to pre-shape the plastic film into the desired appearance; B · forming the EMI masking step · · Using the technology of metal plating to form a metal EMI masking layer with a thickness of several melons to several tens // m on the second surface of the above plastic film; A bonding layer of “M to several tens” n promotes the bonding between the above-mentioned metal EM I shielding layer and the plastic material; the material of the bonding layer may be a polymer resin having bonding properties; D. Forming the outer layer step: The plastic film semi-finished product of the above-mentioned metal EMI shielding layer and adhesive layer is put into a molding die, and plastic injection molding is performed on the second surface of the plastic film, and the The second surface of the adhesive film is integrally formed with a plastic layer. This step can completely hide the metal EM] shielding layer, and establish the thickness of the entire finished product to reinforce the mechanical strength of the product. Based on this, a metal EM j shielding can be formed 2 · According to the method for manufacturing an outer shell with both EM 丨 shielding and surface decoration described in item i of the patent application scope, in the step of forming a plastic film, the material of the plastic film can be taken from pc, PC \ BT has ductility and heat resistance. 3. Em I masking according to item i in the scope of patent application Case No. 90113003, patent application scope ^^ and method for manufacturing a shell with surface decoration. In this step, the second surface of the plastic film can also be: Xiu, the molded plastic has any color, text, picture%, and picture c technology. 'Molded with Λ clothing finish. 4. According to the method of manufacturing and forming the surface decoration of the shell according to the scope of the patent application, the molding is covered with any color, text, graphics, image and other technologies. A method for forming a shell with both EMI and mask decoration, in which a plastic film is formed, and the second surface of the plastic film can also be processed by laser engraving technology to produce any color, text, graphics, images, etc. Decorative surface. 6 · According to the method for forming a shell with both EMI shielding and surface decoration described in item 1 of the scope of the patent application, in the step of forming a plastic film, the second surface of the plastic film can also be formed by pad printing technology. Decorative surface with any color, text, graphics, images, etc. 7 · According to the manufacturing method of the shell with both EMI shielding and surface decoration described in item 1 of the scope of the patent application, in the step of forming the plastic film, 'the second surface of the far plastic film can also be formed by the lean metal technology' Decorative surface with any color, text, graphics, images, etc. 8 · According to the manufacturing method of the shell with both EMI shielding and surface decoration described in item 1 of the scope of the patent application, in the step of forming a plastic film, the plastic film can also be subjected to high-pressure forming technology to advance the plastic film. Shaped into the desired appearance. 9 · According to item 1 of the scope of the patent application Page 13 532059 _Case No. 9013003_ Years and Months Amendment_ VI. Method for manufacturing a shell for covering and surface decoration by applying for a patent. In the step of forming the EM I shielding layer, the technology of vacuum steam key forming can also be used. The second surface of the plastic film is plated with a metal E M I shielding layer with a thickness of several Am to several tens // m. 10. According to the method for forming a shell with both EMI shielding and surface decoration described in item 1 of the scope of the patent application, in the step of forming the EMI shielding layer, the technique of vacuum clock molding can also be used. The second surface of the plastic film is coated with a metal EMI shielding layer having a thickness of several tens of meters to several tens of meters. 1 1. According to the method for forming a shell with both EMI shielding and surface decoration described in item 1 of the scope of the patent application, in the step of forming the EMI shielding layer, the technique of ion vacuum evaporation molding can also be used in On the second clock of the plastic film, a metal EMI shielding layer having a thickness of several tens of meters to several tens of ten meters. 1 2. According to the method for forming a shell with both EM I shielding and surface decoration described in item 1 of the scope of the patent application, in the step of forming the EM I shielding layer, the technique of electroless plating can also be used in the above plastic film A metal E EMI masking layer having a thickness of several tens of tens of tens of tens of millimeters / zm is formed on the second side of the key. 1 3. According to the method for forming a shell with both EMI shielding and surface decoration described in item 1 of the scope of the patent application, in the step of forming the EMI shielding layer, traditional electroplating molding technology can also be used in the above plastics. The second side of the film is covered with a metal EMI shielding layer having a thickness of several tens of meters to several tens of meters. Page 14 532059 _Case No. 90013003_ Amendment _ Sixth, the scope of the patent application 1 4. According to the method of manufacturing the outer shell with both EMI shielding and surface decoration described in item 1 of the scope of patent application, wherein, the molding In the EM I shielding layer step, the constituent material of the metal EM I shielding layer may be i. 1 5. According to the method for forming a casing with both EMI shielding and surface decoration described in item 1 of the scope of the patent application, in the step of forming the EMI shielding layer, the constituent material of the metallic EM shielding layer may be For copper. 16. According to the method for forming a casing with both EMI shielding and surface decoration described in item 1 of the scope of the patent application, in the step of forming the EMI shielding layer, the constituent material of the metallic EMI shielding layer may be silver. 1 7. According to the method for forming a shell with both EMI shielding and surface decoration described in item 1 of the scope of the patent application, in the step of forming the EM I shielding layer, the constituent material of the metal EM I shielding layer may be For nickel. 1 8. According to the method for forming a shell with both EMI shielding and surface decoration described in item 1 of the scope of the patent application, in the step of forming the EM I shielding layer, the constituent material of the metal EM I shielding layer may be It is a tin alloy. 1 9. According to the method for forming a casing with both EM I shielding and surface decoration according to item 1 of the scope of the patent application, in the step of coating and adhering the layer, the polymer resin may be made of acrylic resin. 2 0. According to the method for forming a shell with both EMI shielding and surface decoration according to item 1 of the scope of the patent application, in the step of coating and bonding, the polymer resin may be Urethane (urethane, urethane, Polyurethane, urethane) resin. 2 1. Combined with EMI shielding according to item 1 of the scope of patent application Page 15 532059 _Case No. 90113003_Amendment of the month of the year _ 6. The method of manufacturing a cover for covering and surface decoration of a patent application method, wherein in the step of coating and bonding, the polymer resin may be Epoxy (epoxy resin) Resin composition 02. According to the method for manufacturing a shell with both EMI shielding and surface decoration as described in item 1 of the scope of the patent application, an assembly mechanism such as screw holes and inlay holes can be established at this step. ; Among them, the injection molding plastic used in the step of forming the outer layer can be polycarbonate, ABS or PC / ABS glue. Page 16