TW531816B - Semiconductor package substrate - Google Patents

Abstract

A semiconductor package substrate comprises a body, a plurality of metallic strips, and a solder mask. The body has a plurality of leads disposed on the body and electrically connected to a semiconductor chip attached on the substrate by the wire bonding process. The metallic strips are disposed on the corner of the body to serve as the ground or power contact of the substrate and dissipate the heat generated by the chip during operation. The solder mask covers and protects the body and metallic strips. The substrate provides well air-exhausting function to facilitate completely encapsulating the semiconductor chip with the molding compound during molding process.

Description

531816

[Field of the Invention] The present invention relates to a substrate for a semiconductor package structure, and more particularly to a substrate for a ball grid array (BGA) package, so that the plastic sealing branch does not cause pores or overflow during the process. Disadvantages and good heat dissipation. Ding Chou 1 、 Gen [Previous technology] In the industrial world, semiconductor packaging processing procedures can generally be roughly divided into wafer cutting, die bonding, wire bonding, sealing, printing, and packaging. Among them, the main purpose of the sealant (mo 1 d 1 ng) is to prevent moisture from invading from the outside, to mechanically support the wires, to effectively discharge the internally generated heat to the outside, and to provide a form that can be held by hand. Taking the ball grid array (BGA) package as an example, the process is generally placing a mold on a substrate, heating and melting a solid sealing plastic (Eρ〇π Molding Compound; EMC) into a liquid, and passing the plunger Apply pressure to enter the cavity of the mold, so that the sealant ^ plastic seals the wafer or electronic component on the substrate to form a completely airtight ^ colloid. After the sealant is hardened, it is demolded to complete the sealant. ^. For example, the substrate 10 of a conventional ball grid array (BGA) package structure, as shown in FIG. 1, typically has a main body 15, a plurality of wires 30 on the main body 15, and a copper planar metal sheet. 20 is arranged at the corner of the main body 15 and can be used for ground (ground) or power (power), and can be used to dissipate heat. As shown in FIG. 2, a layer of solder mask 40 covers the main body 15, the lead 30, and the metal sheet 20. The substrate 10 is used to place a semiconductor wafer (not shown in the figure) and is electrically connected to the pads 1111 1 n I 11KB iil_l ill U _ 11H of the wire on the substrate 10 by wire bonding. Page 531816

on. After that, the substrate is encapsulated with a plastic sealant to complete the ball grid array (BGA) package structure. However, during the molding process of the sealing plastic, such substrates easily lead to the formation of air holes in the sealing plastic or the defects that cannot completely fill the mold cavity. As shown in FIG. 2, above the plurality of wires 3 0, the upper surface 43 of the green paint 4 0 has a plurality of slightly concave recesses 50. Because the recess 50 provides a fairly good exhausting effect in the mold injection molding, the sealing material (not shown) can completely fill the mold eight space above the solder mask green paint surface 4: 'Positioned above the flat metal sheet 20 at the corner of the substrate 10 = solder mask green paint surface 42 does not have the above-mentioned recess 50, but forms a seal with the mold = state' makes the sealing plastic difficult to fill the mask Welding the space on the surface of the green paint surface 42 causes the surface of the sealant to be uneven or air bubbles, and even to the point that the line is bare. If it is removed as shown in the figure, the wire 30 will be required to dissipate heat due to overflow. To sum up, although there is no plastic 20, the substrate 10 is not in the process due to the solder mask at the base. In addition, the effect will be described below, providing a better method to completely fill but lose the original spilled glue. The green paint surface of the corner board 10 corners, due to the drop, and the flat soldering prevention surface 4 3 at the base where the heat dissipation is full of the mold cavity, so the lack of the plane cannot meet the corner effect of the board 10, but . Conversely, the superior surface metal sheet 20, such as the third green lacquer surface 42, is higher than the surface metal sheet 20 during the molding process. The substrate 10 is currently equipped with copper planar metal sheets that are radiating heat from IC products. If the flat metal sheet point is removed during the sealing process, it will also be injected before the sealing. In view of this, it is necessary to provide a substrate for a semiconductor package structure.

Page 6 531816 V. Description of the invention (3): The sealant plastic can completely fill the mold cavity during the molding and injection process, so that it will not produce the disadvantages of air bubbles or overflowing glue, and it also provides good heat dissipation. Effectiveness [Summary of the invention] The main purpose of the present invention is to shake the supply_Situn; all make the sealing plastic in the injection molding: JJJ-based: 'without the disadvantage of air bubbles. "The king fills the mold cavity. The secondary purpose of the present invention is to provide a substrate that semi-encapsulates the plastic to avoid overflow & during the injection process. 'I = another thing-the purpose is to provide a semiconductor package structure. Good heat dissipation, the chip soil plate can be effectively discharged. The heat generated by Baoshou Rishou can achieve the above purpose. The present invention provides a substrate including a main body with a plurality of 3 = + conductor packaging structures. It is used to connect the substrate ¥ f by a wire, and is arranged on the main body of a plurality of strip-shaped metal strips. The body permeation serves as the ground or power contact of the substrate, and the heat generated at the corner is discharged; 1 、 The main body and metal strip of the wafer during operation. It is known that ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, required to protect, the substrate according to the invention, :: Mould cavity, and the phenomenon of glue overflow will not occur. :: Helps the heat-seal effect of the plastic seal filling A 5 Hai semiconductor device during operation. The 5 Hai metal strip also has the purpose of allowing the above and other purposes of the present invention. , And advantages can be more clear 531816

The embodiments, together with the features shown in the accompanying drawings, are described in detail below with reference to the preferred embodiments of the present invention. [Explanation of the invention] As shown in Figs. 5 and 6, +% A &11; A plate 11 (1 # is recognized, it is not according to one of the substrate 11 of the present invention, the soil plate is used for ball grid array (BGA) package structure. Amami has a main body 115, which is a large rectangular plate with a soil plate m 0 ^] Ί u Feng. The main body 11 5 has a plurality of solder masks for soldering. Green paint (solder mask) 140. The wire 130 is wire bonding, and is electrically connected to two chips (not shown) added to the substrate 110. The solder resist green paint 14 〇 is the main body 115 and the wire 13G. The main body 115 is generally made of resin, jade, and dimensional reinforced BT (bismaieimide-triazine) resin, ceramic materials and other materials. One of the main body of the substrate 110, 15 on the other There are a plurality of strip-shaped metal strips 25 and surrounding metal strips 126, which are respectively arranged at the corners of the main body 115, under the solder-resistant green paint 140. The surrounding metal strips 126 and each of the _ strips = 5 The ^ ends are connected and surround the metal strip 125, so that the metal strip ^ ::. And the metal ητ 1 26 form a mesh shape. The individual metal strip 125 and the metal strip 26 are electrically connected. With this, the metal strip 1 2 5 and the metal strip 1 2 6 can be used as ground or power contacts to enhance the electrical properties of the substrate 110. Characteristics, and help to dissipate the heat generated during the operation of the ball grid array package construction. Of course, those skilled in the art should understand that the number of metal strips 1 2 5 and metal strips 1 2 6 can be reduced as needed, and That is, some corners of the substrate 110 do not have the metal strip 125 and the metal strip 126. Referring to FIG. 6 again, the green paint 140 is located at the plurality of wires 130.

531816 V. Description of the invention (5) " The upper surface 143 has a plurality of recesses 151 and is located at the metal strip 125, and the upper surface 142 of the green paint 140 has a plurality of recesses 150. Since the size and spacing of the metal strip 125 is substantially equal to the size and spacing of the plurality of wires 130 on the main body 115, the outer shape and size of the recess 151 at the upper surface 143 will be substantially equal to the upper surface The recess is 152 at 142. Of course, if it is desired, for example, to improve heat dissipation and electrical characteristics, the size and spacing of the metal strip 1 2 5 and the metal strip 126 may also be different from the size of the lead wire 130. As can be mentioned, during the injection process, the recesses 15 and 151 provide a relatively good venting effect 'so that the sealing plastic can be completely filled in the cavity. In addition, the metal strip 125 and the metal strip 126 are provided to make the thickness of the solder mask green paint surface 142 substantially the same as that of the wire 13 and the solder mask green paint surface 1 4 3 around it, so Mold and avoid spillage during the injection process. Furthermore, during the molding and injection molding process, the mold can evenly resist the upper surfaces 142 and 143 of the green paint 140, so that the sealant plastic will not cause ^^ or unfilled defects. % / Those skilled in the art will understand that the metal strip 125 and metal strip 126 of the present invention can be arranged on any area around the substrate without any wires, thereby making the green paint surface of the 4 substrate uniform. The recess is used to improve the venting effect of the main and main glue process and prevent the overflow of glue during the injection process. Figure 7 shows a semiconductor package 300 with a substrate according to the present invention. The metal strip 125 and the metal strip 126 are located on the substrate 110. Fig. 8 is a cross-sectional view taken along the section line 8_8 of Fig. 7. A chip 200 is mounted on the substrate 丨 丨 0, and a plurality of connecting lines are used.

00483.ptd Page 9 531816 V. Description of the invention (6) 2 2 2 is electrically connected to the plurality of wires 丨 3 on the substrate 1 丨 0 by wiring. A plurality of solder balls 160 are also provided on the substrate 110 to be electrically connected to the external substrate 110. After that, a colloid 2 2 0 encapsulates the semiconductor wafer 2000 to form the ball grid array semiconductor package structure. Please refer to Figs. 9 and 10, which shows a substrate 310 according to another embodiment of the present invention. Similar elements to the substrate U0 shown in Figs. 5 and 6 are indicated by the same drawing numbers. Compared to the substrate 11 0 shown in FIGS. 5 and 6, the substrate 3 10 has a metal block 320 to replace the metal strip 125 and the metal strip 126 of the substrate 110. The metal block 20 has a plurality of The strip-shaped protrusions 1 21 and the interval between each of the protrusions 1 21 are substantially equal to the interval between the plurality of wires 1 30 on the main body 5. In this way, the upper surface of the green paint 14 of the substrate 丨 〇 0 also has a plurality of recesses 501, and also provides a degassing effect. Stomach Although the present invention has been disclosed in the foregoing preferred embodiments, it is not intended to be used in the present invention. Any person skilled in the art can make various changes and modifications without departing from the spirit of the present invention. Therefore, the protection of the present invention shall be determined by the scope of the appended patent application.

00483.ptd Page 10 531816 Brief description of the drawings [Illustration] Figure 1: A front view of a substrate with a conventional flat metal sheet. FIG. 2 is a cross-sectional view of the substrate along section line 2-2 of FIG. 1. Fig. 3: A front view of a substrate without the conventional planar metal sheet. FIG. 4 is a cross-sectional view of the substrate along section line 4-4 of FIG. 3. Fig. 5 is a front view of a substrate having strip-shaped metal strips according to the present invention. FIG. 6 is a cross-sectional view of the substrate along section line 5-5 of FIG. 5. FIG. 7 is a cross-sectional view of a semiconductor package structure according to the present invention. Fig. 8: A cross-sectional view of the semiconductor package structure taken along section line 8-8 of Fig. 7. Fig. 9 is a front view of a substrate having a metal block according to another embodiment of the present invention.

Fig. 10: Sectional view of the substrate along the section line 10-10 of Fig. 9 [Illustration of the drawing number] 10 Substrate 15 Main body 20 Flat metal sheet 30 Lead 40 Anti-solder green paint 42 Anti-solder green paint surface 43 solder-resistant green paint surface 50 recess 110 substrate 115 main body 121 protrusion 125 metal strip 126 metal strip

00483.ptd Page 11 531816

Brief description of the drawing 130 wire 140 solder-resistant green paint 142 solder-resistant green paint surface 143 solder-resistant green paint surface 150 recess 151 recess 160 solder ball 200 chip 220 sealant 222 connection line 300 semiconductor package structure 310 substrate 320 metal block 321 00483.ptd Page 12

Claims (1)

The substrate body of a semiconductor package structure has a plurality of guides; a plurality of strip metal strips are provided on the body, and a solder-proof green paint is applied to the corners of the body at w and ° x; It is used to protect the main body and the metal strip. 2. According to the scope of the patent application, there is another surrounding metal strip surrounding the metal strip. The substrate of the semiconductor package structure of item 1 and the two ends of each of the metal bars;} 3 · According to the patent application 筮 9 tS of the plurality of metal stops & the semiconductor package structure of the base phase of the wire The ruler and the gap are roughly equal to the main body. Among them, the package is bundled, and the plural number is 4. According to the scope of the patent application, the semiconductor package structure is a +% body-cut base table grid array (BGA) package. The structure of the whole 5 is: the main system of the plate of item i of the Ming patent is made of glass fiber reinforced custom-made construction (bi smaleimide-trΐ… ullQe triazine) resin. 6. A semiconductor package structure comprising: a substrate having a :: body having a plurality of wires arranged on the main body; a plurality of strip-shaped metal bars arranged at a corner of the main body; 该 基 The base 531816 6. Scope of patent application: a solder-proof green paint covering and protecting the main substrate and metal strip; a semiconductor wafer is mounted on the substrate, and ^^^ is wrongly connected to the substrate by wiring The plurality of wires; and π π &% ^ 逆 # a colloid for encapsulating the semiconductor wafer. 7. According to the semiconductor seal structure of the patent application No. 6 structure, the certain plate in the bean also has a surrounding metal band, and each of them is for the sake of reason, "A 3 plate w ^ ^ H ^ The two ends are connected and surround the metal strip. 8. According to the semiconductor seal M ^ ^ ^ structure of the patent application, the size and spacing of the trend metal strips are roughly equal to the size of the main body. The dimensions and spacings of the plurality of wires above. 9 · According to the semiconductor package structure of item 6 of the patent application scope, the bean body package structure is a ball grid array (BGA) package structure ', 1 0 · According to the patent application scope of 6th The main system of the semiconductor package is made of glass fiber-reinforced BT (bismau ^ f, resin-triazine) resin. 11 · A substrate for a semiconductor package structure, including a main body with a plurality of The lead wire is arranged on at least one metal block of the main body, and has a plurality of stripe 4 '' corners; and the stripe is large and is arranged on the main body. 00483.ptd 531816 A solder-proof green paint covers and protects the main body and the metal block. The interval of the plurality of protrusions in the semiconductor package structure according to item n of the patent application scope is substantially equal to the interval of the substrate. … Is a plurality of wires on the main body 13. The substrate of the semiconductor package structure according to item u of the patent application scope, wherein the semiconductor package structure is a ball grid array (BGA) package structure. 14. The substrate of the semiconductor package structure according to item 丨 丨 of the scope of application for patent. The main system of the substrate is made of glass fiber reinforced B T (bismaleimide-triazine) resin. 1 5 · A semiconductor package structure comprising: a substrate having a body with a plurality of wires disposed on the body; at least one metal block having a plurality of strip-shaped protrusions disposed at a corner of the body ; And a solder-proof green paint covering and protecting the main body and the metal block; a semiconductor wafer mounted on the substrate and electrically connecting the plurality of wires on the substrate by wire bonding; and encapsulating the gel, Used to encapsulate the semiconductor wafer. 16 · The semiconductor package structure according to item 15 of the scope of patent application, wherein the 00483.Ptd Page 15 531 Magic 6 The number of ^ & intervals in this patent is substantially equal to the interval between a plurality of wires on the main body. The semiconductor encapsulation structure under the scope of patent application No. 15 in which the semiconductor package structure is a ball grid array (BGA) package structure. 1S · According to the 15th semiconductor package structure of the patent application scope, the second substrate is reinforced with glass fiber BT (bismaleimide_triazine) * 00483.ptd Page 16