TW529117B - Spiral inductor with high Q factor and its manufacturing method - Google Patents

Abstract

This invention provides a spiral inductor with high Q factor and its manufacturing method. The method comprises: (a) providing a substrate and forming a dielectric layer on the substrate; (b) forming a first groove with a spiral shape on the dielectric layer; (c) filling the first groove with a first metal to form a first metal layer as the inductor coil; and (d) performing a chemical mechanical polishing process, in which, after the step (b), the method can further comprises: forming a second groove with a predetermined shape at the central portion of the first groove with a spiral shape; and filling the second groove with a second metal to form a second metal layer as the inductor core. In addition, after the step (b), the method can further comprises: forming a third groove with a predetermined shape at the peripheral portion of the first groove with a spiral shape; and filling the third groove with a third metal to form a third metal layer as the interference shield barrier.

Description

529117 V. Description of the invention α) [Field of the invention] The present invention relates to an integrated circuit manufacturing process, and in particular, to a spiral inductor having a high quality factor (q Factor, referred to as Q value) and its manufacturing. method. [Knowledge technology] Inductors are generally composed of spirally wound wires ^……… Μ, Danshe Communication ’s unavailable radio frequency (radiofreqUency; rf) circuits are widely used, such as Can be used in mobile phones, wireless circuits, wireless modems and other communication equipment. With the advancement of integrated circuit technology, it is known that inductors can be manufactured using integrated circuit technology, and other elements are on single-crystal chips (chips, for example,

SlllCon) substrate, silicon on insulatr SOI substrate on the insulation layer or blue onyx boulder ·· ι · 'silicon on sapphire (sos) substrate To reduce the cost of manufacturing the circuit. The structure of the inductive state, which is suitable for the integrated circuit manufacturing process, is a convoluted metal layer.鈇 However, today's integrated circuit manufacturing process requires a reduction in size:

: Chemical = Vapor deposition method is integrated into the simplicity of integrated circuit manufacturing process: Rotation: J Diyi, 12 The method of adding inductance value and having to increase the inductance area, has been gradually unable to meet the modern integrated circuit shrinking, 7 The method has gradually been demanded with high quality factor Q. The formula for calculating the figure of merit Q is not reduced. Q = ωΐ / r where ω is the resonance frequency and ^ is the resistance. Therefore, if you want to increase the binary value of electricity: the inductor's electricity purchase factor Q, one research direction is to increase 529117 V. Description of the invention (2) Inductance value 'Another research direction is to reduce the resistance of the inductor itself. In related research, many methods have been disclosed, such as adjusting the aspect ratio of the inductor to reduce the resistance of the inductor itself, replacing the aluminum alloy with copper wires to reduce the resistance of the inductor itself, increasing The area of the inductance area is to raise the inductance value, form an inductance on the amorphous area to avoid coupling with the substrate to generate an eddy current, etc. In addition, it is also disclosed in US Patent No. 6054329. A method in which a ferrite magnetic material (ferromamag ^ ic material) is used to cover an inductor coil and a strip-shaped ferrite magnetic material is used as an inductor core. However, for further compliance with the miniaturization of integrated circuits, no clear and detailed disclosure has been found. [Objective of the Invention] In view of this, the present invention provides a method for manufacturing a convolute inductor with a high Q value, so as to effectively increase the inductance value (or quality factor) and avoid coupling interference of adjacent inductors (coupling noisy). ), And reduce the area of the inductance area to meet the requirements of integrated circuit reduction. Furthermore, the present invention provides a swirling inductor with a high Q value, so as to effectively increase the inductance (or quality factor) and avoid the coupling interference of adjacent inductors, and reduce the area of the inductor area to meet the requirements for the reduction of integrated circuits. . Therefore, the present invention provides a method for manufacturing a convolute inductor with a high Q value, including the following steps: (a) providing a substrate, and forming a dielectric layer on the substrate, (b) on the dielectric layer A circular first groove is formed (c) and a first metal is filled in the first groove to form a first metal layer to be used as an inductance coil; and (d) a chemical mechanical polishing process is performed

529117 V. Description of the invention (3). After the step (b), the following steps are further included: a second groove having a predetermined shape is formed at the center portion of the first groove in a convolute shape, and a second metal is filled in the second groove A second metal layer is formed inside, which is used as an inductor core. Furthermore, after the step (b), the method further includes the following steps: forming a third groove of a predetermined shape on a peripheral portion of the first groove of the convolution shape, and filling a third metal in the third groove; A third metal layer is formed to serve as a shielding barrier for adjacent inductive coupling interference. In addition, the present invention provides a convolute inductor having a high Q value, including the following structures: a substrate having a dielectric layer on the substrate, a first groove formed on the dielectric layer, and a first metal Layer formed in the first groove of the dielectric layer. The convolute inductor further includes the following structures: a second groove formed in a central portion of the first groove, and a second metal layer formed in the second groove. The convolute electro-determination structure: a third groove formed in the first groove, including: a third metal layer formed in the third groove. In order to make the above-mentioned objects, features, and advantages of the present invention more obvious: Wentex-preferred embodiment 'and the accompanying drawings are described in detail as I. [Simplified description of the drawings] Figure 1 is a drawing Figures 2 to 4 of the junctions of the invention of the convolute inductor are further diagrams according to the present invention. Top view of the inductor. Ear-shaped example of convolution [Symbol description] 10 ~ substrate; 1 dielectric layer;

$ 29il7

12 ~ first groove; 13 ~ second groove; 14 ~ third groove; 22 ~ first metal layer (inductive coil); 23 ~ second metal layer (inductive core); 33'42 ~ third Metal layer (interference shielding barrier). [Exemplary Embodiment] FIG. 1 is a cross-sectional view showing a structure of a swirling inductor of the present invention. Figures 2 to 4 are schematic top views of a whirling inductor according to a preferred embodiment of the present invention.

First, please refer to FIG. 1 and FIG. 2. The manufacturing method of the high-quality factor gyration ’inductor of the present invention includes the following steps: (a) providing a substrate 10,

Eight = forming 70 pieces and interconnects (not shown), and forming a dielectric layer on the substrate 10, a layer 11, 4 dielectric layer 丨 丨 formed by thermal oxidation or chemical vapor deposition A silicon oxide layer; (b) forming a convoluted first groove 12 on the dielectric layer 10 by photolithography = engraving; (c) filling the first metal into the first groove 12 The first metal layer 22 is formed to be used as an inductor coil, and the first metal, such as copper, titanium, titanium, gold, silver, or aluminum-copper alloy, which is filled by a chemical vapor deposition method, has high conductivity. Metal, in order to improve the resistance of the low-inductance coil itself and improve the quality factor Q; and j-line chemical mechanical polishing to remove the gold standing on the surface of the dielectric layer II. It can be any convoluted shape such as a square, a circle, or an ellipse. This embodiment takes a square convoluted shape as an example. Next, referring to FIGS. 1 and 2, the following steps are further included after the step (b). A second groove 13 of a predetermined shape is formed at the center portion of the first groove 12 in a convoluted shape; and Insert a second metal into the second groove

529117 Description of the invention (5) 13 to form a second metal layer 23, Tian,, For example, the metal is filled with a deposition method = to be used as an inductor, and the second ^ A. / A 1.,, Ferromagnetic materials, such as aluminum zinc # magnetically permeable alloys are here: Because the magnetic moments of the atoms in the ferrite magnetic materials are parallel and the same square ": non-aligned '⑨ has the coercive effect of spontaneous magnetization, filled with ferrite Magnetic # is located in the center of the convolute inductor (that is, the part with the largest magnetic flux), which can avoid the loss of electromagnetic energy and increase the permeability of the inductor (permeability), that is, increase the inductance L and improve the quality factor 卩. In addition, the formation of the second groove 13 of a predetermined shape means that the shape can be any shape and is not limited, but the important point is that the second groove 13 of the predetermined shape must include at least the center of the inductance (that is, it has the maximum magnetic flux Part) ° Furthermore, in order to ensure the avoidance of electromagnetic energy loss, the depth of the second groove 3 is deeper than that of the first groove 12. Please refer to FIGS. 1, 3 and 4, and after the step (b), the following steps are further included: a third groove 14 having a predetermined shape is formed on the peripheral portion of the first groove 12 in a spiral shape. ; And a third metal is filled in the third groove 14 to form the third metal layer 32 in FIG. 3 or the third metal layer 42 in FIG. 4, which is used as a shielding barrier for adjacent inductive coupling interference. The third metal is, for example, a ferrite magnetic material filled by a deposition method, such as an aluminum-nickel-cobalt alloy or a magnetically permeable alloy. It is emphasized here that the shape of the third fourth groove 14 of the predetermined shape may be continuous, and the third metal layer 32 as shown in FIG. 3 is formed. The shape of the third groove 14 of the predetermined shape may also be Discontinuously, a third metal layer 42 is formed as shown in FIG. 4. In other words, the shielding barrier surrounding the inductor is not limited to any shape, and the focus is on the reduced integrated circuit

529117

In order to prevent adjacent inductors from coupling and interfering with each other, the third layer of gold 4 used as an interference shielding barrier in the present invention can play the role of a barrier. In addition, referring to FIGS. 2, 3, and 4, the present invention provides a swing-type inductor having a high Q value, including the following structures: a substrate 1 () having a dielectric layer 11 on the substrate, the dielectric layer丨 丨 may be silicon dioxide; a first groove 12 is formed on the dielectric layer; and a first metal layer 22 is formed in the first groove 12 of the dielectric layer 11, and the The first metal may be a metal having high conductivity such as copper, aluminum, titanium, gold, silver, or an aluminum-copper alloy, so as to reduce the electric P of the inductor coil itself and improve the quality factor. The convolute inductor further includes the following structure: a second groove 13 formed in a center portion of the first groove 13; and a second metal layer 23 formed in the second groove 13 and The second metal may be a ferrite magnetic material, such as AlNiCo Alloy or Permalloy, to avoid electromagnetic energy loss and increase the inductance value and Q value. The convolute inductor further includes the following structures: a third groove 14 formed in a peripheral portion of the first groove 14 and a third metal layer 32 formed in the third groove 14, and the The second metal may be a ferrite magnetic material, such as an aluminum-nickel-cobalt alloy or a magnetically permeable alloy, which is used as a shielding barrier for adjacent inductive coupling interference. It is emphasized here that the shape of the third groove 14 of the predetermined shape may be continuous, and a third metal layer 32 as shown in FIG. 3 is formed; the shape of the second groove 14 of the predetermined shape may also be different. Continuously, a third metal layer 42 as shown in FIG. 4 is formed. Since the present invention utilizes ferromagnetic materials, such as aluminum-nickel-cobalt alloys and magnetically permeable alloys, on the one hand, the center of the inductor is filled (that is, the part with the largest magnetic flux)

0503-6151TW; TSMC2000-0947; Jacky.ptd 529117 V. Description of the invention (7) And in order to ensure the lightning protection magnetic inductance coil, make J inductance value: loss, the depth of the inductor core is higher than Cl f S ^ Λ I is known that the inductance value is high, that is to say, the Q factor of the π mouth quality factor; when the condition of another wind value, the present invention provides a chain surface view to provide the same inductance reduction In addition, in order to prevent the adjacent inductors from the integrated circuit from being reduced in size, an appropriate interference problem is provided. The present invention provides a method using ferromagnetic materials as adjacent lightning. Xianliang Baqian Xi said the method of making inductors with M barriers. Therefore, it ’s too respectful ^ The shielding screen of the electric vehicle ’s port interference is progressive. Therefore, the present invention has practicability and related features [effects and effects of the invention] In summary, the present invention provides at least the following advantages: h = use of ferromagnetic materials such as aluminum-nickel-cobalt alloy, magnetic permeability = branch (That is, the part with the largest magnetic flux) is taken as mi: In order to ensure that electromagnetic energy loss is avoided, the core of the inductor has improved the quality factor value. The inductance value is higher than the conventional value. In view of the other aspect of the above point 丨, under the condition that the same inductance is provided, the present invention provides a method of making an inductor that does not increase or even reduce the inductor area) , While people connect + ^ ^ trend. The 4 clothes rod is ^, and the "3 from 1" to reduce the integration circuit avoids the adjacent inductances caused by the reduction of the integration circuit. The present invention provides a kind of use of ferromagnetic material as the adjacent inductance. Coupling interference shielding barrier manufacturing method 4. The manufacturing method of high-Q inductor provided by the present invention, its manufacturing system 0503-6151TW; TSMC2000-0947; Jacky.ptd Page 10 529117 V. Description of the invention (8) It is simple and easy to be compatible with the current manufacturing process. It can be performed in-situ, and it can be achieved by the first, second, and third knowledge techniques. The method of metal deposition is also a practice. Although the present invention has been It is disclosed in a preferred embodiment that if the present invention is restricted, anyone who is familiar with this technique I can use changes and scope β without departing from the scope of the invention, because it is beyond the scope of the patent application attached to the essence of the invention The ones defined shall prevail. * The protection scope of Ming 0503-6151TWF: TSIC2000-0947; Jacky.ptd Page 11

Claims (1)

529117 f /, I this year "October-δ day_Amendment of this case number 901 Continental 110 VI. Patent application scope 1 · A convolution with a high quality factor includes the following steps: Electric manufacturing method, including providing a A substrate ”and a dielectric layer is formed on the substrate. In the dielectric layer, a convoluted first recess 4 is formed. A first metal is filled in the first groove. A first metal layer is formed in the first groove. For forming an inductive coil; forming a first-shaped metal layer of a predetermined shape for a central portion of the first groove in a convolute shape, and a second groove in the dielectric layer; filling the second metal in The second groove is formed to be used as an inductor core; and a surface of the dielectric layer is subjected to a chemical mechanical polishing process. 2 · The method for manufacturing a convolute inductor with a high quality factor as described in item 1 of the scope of the patent application, further comprising the following steps: forming a third concave of a predetermined shape on the peripheral portion of the convoluted first groove; A groove is formed in the dielectric layer; and a third metal is filled in the third groove to form a third metal layer, which is used as an interference shielding barrier. 3. The manufacturing method of a spiral inductor with a high quality factor as described in item 1 of the scope of the patent application, wherein the first metal layer is a highly conductive metal material, including copper, aluminum, titanium, gold, silver, or aluminum Copper alloy. 4. The method for manufacturing a spiral inductor with a southern quality factor, as described in item 1 of the patent scope of Shen Qing, wherein the second metal layer is a ferromagnetic material deposited including an aluminum-nickel-cobalt alloy and a magnetically permeable alloy. 5. The method for manufacturing a spiral inductor with a high quality factor as described in item 2 of the scope of the patent application, wherein the second metal layer is a deposited ferromagnetic material 529117 — --tffc 901291 1Π year ^ Ά-L Chromium positive ___ Sixth, the scope of patent application — ~ materials, including aluminum nickel cobalt alloy, magnetically permeable alloy. 6. · A swirling inductor with a high quality factor, the structure of which includes: a substrate having a dielectric layer on the substrate; a swirling first groove formed in the dielectric layer; a first metal A second groove is formed in the dielectric layer of the center portion of the first groove in the convolution; and a second metal layer is formed in the first groove Inside two grooves. 7. A spiral inductor with a high quality factor as described in item 6 of the scope of the patent application, further comprising the following structure: a third groove formed in the dielectric layer of the peripheral portion of the first groove; and A third metal layer is formed in the third groove. 8. The swirl inductor with a high quality factor as described in item 6 of the scope of the patent application, wherein the first metal layer is a highly conductive metal material, including copper, aluminum, titanium, gold, silver, or an aluminum-copper alloy. 9 · The spin inductor with high quality factor as described in item 6 of the scope of the patent application, wherein the second metal layer is a ferromagnetic material, including an aluminum-nickel alloy and a magnetically permeable alloy. 1 0. The spiral inductor with a high quality factor as described in item 7 of the scope of the patent application, wherein the third metal layer is a ferromagnetic material, including an aluminum-nickel alloy and a magnetically permeable alloy. 11. A method for manufacturing a spiral inductor with a high quality factor, comprising the following steps: providing a substrate, and forming a dielectric layer on the substrate; 529117 Amendment No. 90129110 6. Apply for a patent in the range of 4 7 丨 electrical layer to form a first groove in the shape of a circle; fill a conductive metal material in the first groove to form the first metal layer, It is used as an inductance coil; a second groove formed in a predetermined shape in the dielectric layer is formed in the center portion of the first groove formed in a spiral shape, wherein the depth of the second groove is greater than the first groove; The depth of the groove; a ferromagnetic material is filled in the second groove to form a second metal layer, which is used as an inductor core; a peripheral portion of the first groove is formed into a first shape of a predetermined shape Three grooves in the dielectric layer; and a ferromagnetic material is filled in the third groove to form a third metal layer for use as an interference shielding barrier, wherein the third metal layer is continuous or discontinuous shape. 12. A convolute inductor having a high quality factor, the structure of which includes: a substrate having a dielectric layer on the substrate; a convoluted first groove formed in the dielectric layer; a first metal A second groove formed in the dielectric layer of the center portion of the first groove in the convolution, wherein the depth of the second groove is greater than the first groove A depth of a groove; a second metal layer formed in the second groove; a third groove formed in the dielectric layer in a peripheral portion of the first groove; and a third metal layer, Formed in the third groove, wherein the third gold 0503-6151TWF1; TSMC2000-0947; Jacky.ptc Page 14 529117 Case No. 90129110 Amendment VI. Scope of patent application Continuous or discontinuous UBi page 15 0503-6151TWF1; TSMC2000-0947; Jacky.ptc