527257 A7 __ _B7 _ 五、發明説明（》 【發明的技術領域】 本發明係有關切割半導体晶圓等被加工物切削裝置的 切削刀具安裝機構。 【先行技術】 半導体圖案（device)的製程中，將1C、LSI等電路形成於 約圓板形半導体晶圓表面上，配列成格子'狀的多數領域， 將形成有該電路的各領域，沿預定的所謂街道（street)的切 割線予以分割（dicing)，以製造一個個半導体晶片。如此分 割的半導体晶片，經包裝後廣泛利用於行動電話和個人電 腦等電子產品。 沿切割線分割半導体晶圓的分割裝.置，係將安裝於旋 轉軸的圓形切削刀具，以30000 rpm旋轉，沿上述切割線相 對移動，將半導体晶圓按照所需予以切割。雖然切削刀具 一般可採用僅由環狀刀刃構成的所謂墊圈型刀具（washer blade)，及由基台和配設於該基台外周部的刀刃構成的所謂 輪轂型刀具（hub blade)，惟因輪轂型刀具容易使用而被廣泛 利用。將此輪轂型刀具安裝於旋轉軸的安裝機構，係由安 裝於旋轉軸而備有嵌合於設在輪轂型刀具基台的嵌合孔的 支撐部的固定凸緣，及備有螺合於形成在該固定凸緣端部 的雄螺絲的雌螺絲所構成，將設於輪轂型刀具基台的嵌合 孔，嵌合於固定凸緣的支撐部後，再將挾持凸緣的雌螺絲 螺合於形成在固定凸緣端部的雄螺絲，而成爲由固定凸緣 和挾持凸緣將輪轂型刀具挾持的結構。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ---------0_丨 (請先閲讀背面之注意事項再填寫本頁) 訂 —Λ. 經濟部智慧財4局員工消費合作社印製 -4 - 527257 ____B7 五、發明説明（$ 【發明所欲解決的課題】 然而，上述以往使用的切削刀具安裝機構有下列的問 題。 (1) 要將挾持凸緣的雌螺絲螺合於形成在固定凸緣端部 的雄螺絲，需要有使挾持凸緣和固定凸緣亦即旋轉軸相對 旋轉的專用工具，專用工具遺失時，不能更換切削刀具。 (2) 旋緊挾持凸緣的力量有個人差異，旋緊力太大時， 會使切削刀具變形，於切削時會有使被加工物產生間距而 降低品質之虞，故旋緊挾持凸緣需要熟練。 (3) 爲防止切削作業時因旋轉軸的旋轉而使挾持凸緣產 生鬆弛，形成於挾持凸緣和固定凸緣的螺絲，一般係作成 與旋轉軸的旋轉方向相反的逆螺絲，但爲配合被加工物的 特性而需要讓旋轉軸的旋轉方向對應正旋轉或逆旋轉時， 如挾持凸緣的螺合方向與旋轉軸的旋轉方向一致，則挾持 凸緣的旋緊力會鬆弛，而有切削刀具脫落的問題。 本發明乃係有鑒於上述事實而硏發，其主要技術課題 在於提供’切削刀具的裝拆不需專用工具也不需熟練，而 且’不拘旋轉軸的旋轉方向能確保切削刀具的保持力，能 防範其脫落於未然的切削刀具安裝機構。 【用以解決課題的手段】 爲解決上述主要技術課題，依照本發明可提供的切削 刀具安裝機構爲，將具備有嵌合孔於中心部的基台和具有 本紙張尺度制中酬家標準（CNS ) A4規格（210X297公楚) ~ ' -5- (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 527257 A7 _____B7_ 五、發明説明（$ (請先閲讀背面之注意事項再填寫本頁) 配設於該基台外週的刀刃的切削刀具，安裝於旋轉軸的安 裝機構，其特徵爲：具備有配設於該旋轉軸前端部而嵌合 於該基台的該嵌合孔的支撐部，及從該支撐部後端向徑方 向突出形成而其前面備有安裝面的凸緣部的裝載凸緣，而 該裝載凸緣設有開口於該安裝面並且連通吸引手段的吸引 通路。 上述吸引通路，係由形成於上述凸緣部而開口於上述 安裝面的環狀溝，及連通該環狀溝與上述吸引手段的連通 路..所構成。 【發明的實施形態】 以下，參考附圖詳細說明依照本發明所構成的切削刀 具安裝機構的最佳實施形態。 第1圖表示具備有依照本發明所構成的切削刀具安裝機 構作爲加工裝置的分割裝置的立体圖。 經濟部智慧財4局員工消費合作社印製 圖示的實施形態的分割裝置，具備有約長方体狀的裝 置箱殼2。此裝置箱殻2內配設有保持被加工物的吸盤台3， 能夠向切削移送方向即箭頭X所示方向移動。吸盤台3具備 有吸附盤支撐台3 1，及安裝於吸附盤支撐台3 1上的吸附盤 3.2，在該吸附盤3 2表面即載置面上以未予圖示的吸引手段 保持著被加工物，例如圓盤狀的半導体板。又，吸盤台3係 由未予圖示的旋轉機構使其能夠旋轉。 圖示的實施形態的分割裝置，具備有作爲切削手段的 主軸單元4。主軸單元4具備有，未予圖示的安裝於移動基 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -6- 527257 Α7 Β7 五、發明説明（j 台而受調節移動於割出方向即箭頭γ所示方向及切入方向即 箭頭Z所示方向的主軸箱4 1，旋轉自如地支撐於該主軸箱4 1 而由未予圖示的旋轉驅動機構旋轉驅動的旋轉軸4 2，及安 裝於該旋轉軸42的切削刀具43。 在此，參考第2圖說明切削刀具43及安裝該切削刀具43 於旋轉軸42的安裝機構5。 切削刀具43係由圓盤狀基台431及配設於該基台431的一 側面外周部的刀刃432所構成。基台43 1係由鋁材形成而中 心部設有嵌合孔433，該嵌合孔433會嵌合於後述的裝載凸 緣的支撐部。刀刃432係電焊著例如1〇μ程度的鑽石磨粒所 形成。 圖示的實施形態的切削刀具安裝機構5，具備有安裝於 旋轉軸42前端部（第2圖中的左端部）的裝載凸緣50。此裝載 凸緣50係由嵌合於設在上述切削刀具43基台43 1的嵌合孔433 的支撐部51，及從該支撐部51後端（第2圖中的右端）向徑方 向突出形成的凸緣部52所形成，而凸緣部52前面（第2圖中的 左側面）構成安裝面521。裝載凸緣50中心部設有內側面形成 錐狀的嵌合孔53。一方面，上述旋轉軸42前端部（第2圖中的 左端部）設有裝載凸緣安裝部420，此裝載凸緣安裝部420的 外周面，作成對應於設在上述裝載凸緣50的錐狀嵌合孔53 的錐狀，使裝載凸緣50的嵌合孔53嵌合於該裝載凸緣安裝 部420，又，旋轉軸42自裝載凸緣安裝部420的前端部（第2圖 中的左端部）作成小徑，其外周面形成有雄螺絲421。將螺帽 55螺合於此雄螺絲421，以旋緊固定嵌合於裝載凸緣安裝部 本纸張尺度適用中國國家標準（CNS ) Α4規格（210Χ 297公釐） (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 527257 A7 B7 五、發明説明（g 420的裝載凸緣50。 (請先閱讀背面之注意事項再填寫本頁) 上述裝載凸緣50，形成有開口於凸緣部52安裝面521的 環狀溝501，及連通該環狀溝501的連通路502和連通形成於 嵌合孔53內周面的連通路502的環狀連通路503。一方面，上 述旋轉軸42形成有連通上述環狀連通路503的連通路422，此 連通路422係與形成於轉軸42外週面的環狀連通路423連通。 又，主軸箱41在與環狀連通路423相向的位置形成有環狀連 通路411，並且形成有與該環狀連通路411連通的連通路412 ，該連通路41 2連通到未於圖示的吸引手段。因此，上述環 狀溝501、連通路502、環狀連通路503、連通路422、環狀連 通路423、環狀連通路411、連通路412係開口於安裝面521， 並且構成連通吸引手段的吸引通路。再者，第/2圖中的56係 \ 塞入形成於旋轉軸42前端部，（第2圖中的左端部）而與上述連 通路422連通的栓塞孔424，以封住連通路422的栓塞。 圖示的實施形態的切削刀具安裝機構5係構成如以上所 述的結構，茲說明有關切削刀具43的裝拆。 經濟部智慧財產局工消費合作社印製 要安裝切削刀具43於裝載凸緣50時，首先將設在切削 刀具43基台431的嵌合孔433嵌合於裝載凸緣50的支撐部51。 然後操動未予圖示的吸引手段，則通過連通路41 2、環狀連 通路411、環狀連通路423、連通路422、環狀連通路50.3及連 通路502，會有負壓作用於環狀漭501。結果，切削刀具43係 嵌合於裝載凸緣50的支撐部5 L的基台431會被吸引，而吸附 保持於裝載凸緣50的安裝面521。再者，由吸引手段作用於 環狀溝501的吸引氣壓，以自大氣壓減去0.3氣壓之値以下（ 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -8- 經濟部智慧財產局Μ工消費合作社印製 527257 A7 B7 五、發明説明（3 吸引氣壓大氣壓-0.3氣壓））爲宜。又，上述支撐部51外周 面與嵌合孔433內周面的間隙係作成5μιη程度。要拆下安裝 於裝載凸緣50安裝面521的切削刀具43時，則停止未予圖示 的吸引手段的操動以切斷上述吸引作用，就可容易地從裝 載凸緣50拆下切削刀具43。像這樣，裝拆切削刀具43時， 只要將設在切削刀具43基台43 1的嵌合孔433嵌合於裝載凸緣 50的支撐部51，或從裝載凸緣50拔出即可，因此不需專用 工具也不需熟練就能容易地作業。又，圖示的實施形態的 切削刀具安裝機構5，因係將切削刀具43吸附保持，故保持 力不會因旋轉軸42的旋轉方向而改變。 圖示的實施形態的分割裝置，具備有攝影保持在構成 上述吸盤台3的吸附盤32表面的被加工物表面，檢測上述切 削刀具43應切削的領域，和確認切削溝狀態的攝影機構6。 此攝影機構6係由顯微鏡和CCD攝影機等的光學手段所構成 。又，分割裝置具備有顯不攝影機構6所攝影像的顯不手段 Ί。 圖示的實施形態的分割裝置’具備有儲存被加工物半 導体晶圓9的匣盒8。半導体晶圓9，係以膠帶11支撐在不鏽 鋼等金屬材料作成的環狀支撐框架1 〇，以支撐於支撐框架 10的狀態收容於上述匣盒8。再者，匣盒8 ’係載置於由未 予圖示的升降手段配設成可上下移動的匣盒台81上。 圖示的實施形態的分割裝置，具備有將收容於匣盒8的 被加工物半導体晶圓9(以膠帶11支撐於支撐框架1〇的狀態） 運出到被加工物載置領域1 2,的被加工物運出手段1 3 ’將該 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐） ---------Φ------1Τ------0 (請先閱讀背面之注意事項再填寫本頁) -9 - 527257 A7 B7 五、發明説明（i (請先閲讀背面之注意事項再填寫本頁) 被加工物運出手段13運出的半導体晶圓9運送到上述吸盤台 3上的被加工物運送手段14，將在吸盤台3上切削加工的半 導体晶圓9洗淨的洗淨手段1 5，及將在吸盤台3上切削加工 過的半導体晶圓9運送到洗淨手段1 5的洗淨運送手段1 6。 以下簡單說明上述分割裝置的加工處理動作。 經濟部智慧財產^7員工消費合作社印製 收容在匣盒8的預定位置介由膠帶11支撐於支撐框架1〇 的狀態的半導体晶圓9(以下，介由膠帶11支撐於支撐框架1〇 的狀態的半導体晶圓9簡稱半導体晶圓9)，係由未予圖示的 升降手段使匣盒台81上下移動予以定位於運出位置。然後 ，被加工物運出手段1 3會進退動作而將定位於運出位置的 半導体晶圓9運出到被加工物載置領域1 2。運出在被加工物 載置領域12的半導体晶圓9，由被加工物運送手段14的迴轉 動作，運送到構成上述吸盤台3的吸附盤32的載置面，以未 予圖示的吸引手段的吸引作用吸引保持於吸附盤32。如此 將半導体晶圓9吸引保持的吸盤台3，會被移送到攝影機構6 的正下方。當吸盤台3被定位在攝影機構6正下方時，由攝 影機構6檢測出形成於半導体晶圓9的切割線，並..在主軸單 元4的割出方向即箭頭γ方向移動調節，以進行精確對位。 然後，將切削刀具43以箭頭Z所示的方向送入預定切入 量並以預定方向旋轉，將吸引保持著半導体晶圓9的吸盤台 3 ’向送切方向即箭頭X所示的方向（與切削刀具43旋轉軸直 交的方向）以預定的送切速度移送，讓保持於吸盤台3的半 導体晶圓9由切削刀具43沿預定的切割線（街道）予以切割。 亦、即，因切削刀具43係安裝於以割出方向即箭頭Y所示的方 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -10- 527257 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（3 向及切入方向即箭頭Z所示的方向移動調節予以定位的主軸 單元4，而被旋轉驅動著，因此將吸盤台3沿切削刀具43下 面以送切方向移送，保持於吸盤台3的半導体晶圓9就會被 切削刀具43沿預定的切割線予以切削。沿切割線切斷，半 導体晶圓9就被分割爲一個個半導体晶片。被分割的半導体 晶片，由於膠帶1 1的作用而不會散開，而維持著支撐於支 撐框架10的半導体晶圓9的狀態。如此將半導体晶圓9切割 完成後，保持半導体晶圓9的吸盤台3被送回最初吸引保持 半導体晶圓9的位置，在此將未予圖示的吸引手段的吸引作 用切斷，以解除半導体晶圓9的吸引保持。然後，半導体晶 圓9由洗淨運送手段16運送到洗淨手段15予以洗淨。如此洗 淨的半導体晶圓9由被加工物運送手段1 4運送到被加工物載 學領域12。然後，半導体晶圓9由被加工物運出手段13運出 ，收容於匣盒8的預定位..置。 【發明的效果】 因依照本發明的切削刀具安裝機構爲如以上所述的結 構，故可達到下述的作用效果。 即，依照本發明的切削刀具安裝機構，因具備有配設 於旋轉軸前端部而嵌合於設在切削刀具基台的嵌合孔的支 撐部，及從該支撐部後端向徑方向突出形成而其前面備有 安裝面的凸緣部的裝載凸緣，而該裝載凸緣設有開口於該 安裝面並且連通吸引手段的吸引通路，故裝拆切削刀具時 ，只要將設在基台的嵌合孔嵌合於支撐部，或從支撐部拔 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐） 、1τ (請先閲讀背面之注意事項再填寫本頁) -11 - 527257 A7 B7 五、發明説明（3 出即可，而不需專用工具也不需熟練就能容易地作業。因 此，切削刀具的更換作業能夠在短時間內進行而提升生產 效率。又，依照本發明的切削刀具安裝機構，因係將切削 刀具吸引保持，所以保持力不會因旋轉軸的旋轉方向而改 ..變。因此，對肇因於旋轉軸的旋轉方向而發生切削刀具脫 落能防範於未然。 【圖面的簡單說明】 第1圖：具備有本發明的切削刀具安裝機構的切削裝 置- dice裝置的立体圖。 第2圖：本發明的切削刀具安裝機構的主要部分放大剖 面圖。 【圖號說明】 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 2 裝置箱殻 3 吸盤台 31 吸附盤支撐台 32 吸附盤 4 主軸單元 41 主軸箱 411 環狀連通路 412 連通路 42 旋轉軸 420 裝載凸緣安裝 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -12- 527257 A7 B7 五、發明説明（ 經濟部智惡財產局員工消費合作社印製 422 連通路 423 環狀連通路 43 切削刀具 431 切削刀具基台 432 切削刀具刀刃 433 切削刀具嵌合孔 5 切削刀具安裝機 50 裝載凸緣 501 環狀溝 502 連通路 503 環狀連通路 51 裝載凸緣支撐部 52 裝載凸緣凸緣部 521 安裝面 55 螺帽 56 栓塞 6 攝影機構 7 顯示手段 8 匣盒 81 匣盒台 9 半導体晶圓 10 支撐框架 11 膠帶 12 被加工物載置領. (請先閱讀背面之注意事項再填寫本頁) 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -13- 527257 A7 B7 五、發明説明（^ 13 被加工物運出手段 14 被加工物運送手段 15 洗淨手段 16 洗淨運送手段。 ----------- (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -14-527257 A7 __ _B7 _ 5. Explanation of the invention ("Technical Field of the Invention" The present invention relates to a cutting tool mounting mechanism for cutting a cutting device for a workpiece such as a semiconductor wafer. [Preceding Technology] In the manufacturing process of a semiconductor pattern, Circuits such as 1C and LSI are formed on the surface of an approximately circular plate-shaped semiconductor wafer, and are arranged in a grid-like shape. Each area in which the circuit is formed is divided along a predetermined so-called street cutting line ( dicing) to manufacture individual semiconductor wafers. The thus-divided semiconductor wafers are packaged and widely used in electronic products such as mobile phones and personal computers. The semiconductor wafer is divided along the dicing line. It will be mounted on a rotating shaft. The circular cutting tool rotates at 30,000 rpm and moves relative to the above-mentioned cutting line to cut the semiconductor wafer as required. Although the cutting tool can generally be a so-called washer blade consisting of only an annular blade, And a hub blade made up of a base and a blade disposed on the outer periphery of the base, but the hub This tool is easy to use and widely used. The mounting mechanism for mounting this hub-type tool on a rotating shaft is fixed by a support portion that is mounted on the rotary shaft and fits into a fitting hole provided in the hub-type tool base. A flange and a female screw provided with a male screw screwed to an end portion of the fixing flange, and a fitting hole provided in the hub-type tool base is fitted into a supporting portion of the fixing flange. The female screw holding the flange is screwed to the male screw formed at the end of the fixing flange, so that the hub-type cutter is held by the fixing flange and the holding flange. The paper size applies to the Chinese National Standard (CNS) A4 specification (210X297 mm) --------- 0_ 丨 (Please read the precautions on the back before filling this page) Order—Λ. Printed by the Staff Consumer Cooperative of the 4th Bureau of Smart Finance of the Ministry of Economic Affairs-4- 527257 ____B7 5. Description of the invention ($ [Problems to be solved by the invention] However, the cutting tool mounting mechanism used in the past has the following problems. (1) The female screw holding the flange is screwed to the fixed flange. Male screw at the end The flange and the fixed flange are special tools for relative rotation of the rotating shaft, and the cutting tool cannot be replaced when the special tool is lost. (2) There is a personal difference in the strength of the tightening and holding flange. When the tightening force is too large, it will cause cutting. Deformation of the tool may cause gaps in the workpiece during cutting and reduce quality, so it is necessary to be skilled in tightening the clamping flange. (3) In order to prevent the clamping flange from being loosened due to the rotation of the rotary shaft during cutting operations, Generally, the screws formed on the holding flange and the fixing flange are counter screws that are opposite to the rotation direction of the rotation shaft. However, in order to match the characteristics of the workpiece, it is necessary to make the rotation direction of the rotation shaft correspond to the normal rotation or the reverse rotation. If the screwing direction of the holding flange is consistent with the rotation direction of the rotation shaft, the tightening force of the holding flange will be loosened, and there will be a problem that the cutting tool will fall off. The present invention has been developed in view of the above-mentioned facts, and its main technical problem is to provide "the installation and disassembly of cutting tools does not require special tools or proficiency, and" regardless of the direction of rotation of the rotating shaft, the holding force of the cutting tools can be ensured, and Prevent it from falling out of the cutting tool mounting mechanism. [Means to Solve the Problems] In order to solve the above-mentioned main technical problems, a cutting tool mounting mechanism that can be provided according to the present invention includes a base with a fitting hole in the center and a standard of domestic paper ( CNS) A4 specification (210X297), ~ '-5- (Please read the notes on the back before filling this page) Order printed by the Intellectual Property Bureau Employee Consumer Cooperative of the Ministry of Economic Affairs 527257 A7 _____B7_ V. Description of the invention ($ (please first (Please read the precautions on the back and fill in this page again.) The cutting tool provided on the outer periphery of the abutment is mounted on the rotating shaft. It is characterized by having a front end of the rotating shaft and fitting it. A support portion of the fitting hole of the abutment, and a loading flange formed by protruding from a rear end of the support portion in a radial direction and provided with a flange portion on a front surface thereof, and the loading flange is provided with an opening in the loading portion. The mounting surface is a suction passage that communicates with the suction means. The suction passage is an annular groove formed in the flange portion and opening to the mounting surface, and a communication path connecting the annular groove and the suction means .. [Embodiment of the invention] Hereinafter, a preferred embodiment of a cutting tool mounting mechanism configured in accordance with the present invention will be described in detail with reference to the drawings. FIG. 1 shows a cutting tool mounting mechanism provided in accordance with the present invention as a processing device. A three-dimensional view of the split device. The split device of the embodiment printed by the employee co-operative cooperative of the 4th Bureau of Wisdom and Finance of the Ministry of Economic Affairs is provided with an approximately rectangular parallelepiped device case 2. The device case 2 is provided with holding The chuck table 3 of the workpiece can be moved in the cutting and conveying direction, which is indicated by arrow X. The chuck table 3 is provided with a chuck support table 31 and a chuck 3.2 mounted on the chuck table 31. The surface of the suction pad 32, that is, the mounting surface, holds an object to be processed, such as a disc-shaped semiconductor plate, by a suction means (not shown). The suction pad stage 3 is rotated by a rotation mechanism (not shown). The dividing device of the illustrated embodiment is provided with a spindle unit 4 as a cutting means. The spindle unit 4 is provided, and is not shown in the figure. It is mounted on a mobile basic paper. Standard (CNS) A4 specification (210X 297 mm) -6- 527257 Α7 Β7 V. Description of the invention (j units are adjusted to move in the cut-out direction, that is, the direction shown by arrow γ, and the cut-in direction, that is, the direction shown by arrow Z. A case 41 is a rotation shaft 4 2 which is rotatably supported by the headstock 4 1 and is rotationally driven by a rotation driving mechanism (not shown), and a cutting tool 43 attached to the rotation shaft 42. Here, refer to the second The drawing illustrates a cutting tool 43 and a mounting mechanism 5 for mounting the cutting tool 43 on a rotating shaft 42. The cutting tool 43 is composed of a disc-shaped base 431 and a cutting edge 432 disposed on an outer peripheral portion of one side surface of the base 431. The abutment 43 1 is formed of an aluminum material and is provided with a fitting hole 433 at a central portion thereof, and the fitting hole 433 is fitted into a support portion of a loading flange described later. The blade 432 is formed by welding, for example, diamond abrasive grains having a size of about 10 µ. The cutting tool mounting mechanism 5 of the illustrated embodiment is provided with a mounting flange 50 mounted on a front end portion (left end portion in the second figure) of the rotary shaft 42. The loading flange 50 is formed by a support portion 51 fitted in a fitting hole 433 provided in the cutting tool 43 base 43 1 and protruding in a radial direction from a rear end (right end in the second figure) of the support portion 51. The formed flange portion 52 is formed, and the front surface (left side surface in FIG. 2) of the flange portion 52 constitutes a mounting surface 521. The mounting flange 50 is provided at its center with a fitting hole 53 having a tapered inner surface. On the one hand, the front end portion (left end portion in the second figure) of the rotation shaft 42 is provided with a mounting flange mounting portion 420, and an outer peripheral surface of the mounting flange mounting portion 420 is formed in a cone corresponding to the mounting flange 50. The fitting hole 53 is tapered, and the fitting hole 53 of the loading flange 50 is fitted into the loading flange mounting portion 420. The rotation shaft 42 is also mounted on the front end portion of the loading flange mounting portion 420 (see FIG. 2). (The left end portion) is made into a small diameter, and a male screw 421 is formed on the outer peripheral surface thereof. The nut 55 is screwed into this male screw 421, and it is fastened and fitted to the mounting flange mounting part. The paper size is applicable to the Chinese National Standard (CNS) Α4 specification (210 × 297 mm) (please read the note on the back first) Please fill in this page again) Order printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and the Consumer Cooperatives printed 527257 A7 B7 V. Description of the invention (g 420 loading flange 50. (Please read the precautions on the back before filling this page) The above loading flange 50. An annular groove 501 that opens into the mounting surface 521 of the flange portion 52 and an annular communication passage that communicates with the communication passage 502 communicating with the annular groove 501 and the communication passage 502 formed in the inner peripheral surface of the fitting hole 53 are formed. 503. On the one hand, the rotation shaft 42 is formed with a communication passage 422 communicating with the annular communication passage 503, and this communication passage 422 communicates with an annular communication passage 423 formed on the outer peripheral surface of the rotation shaft 42. The headstock 41 is at A ring-shaped communication path 411 is formed at a position facing the ring-shaped communication path 423, and a communication path 412 connected to the ring-shaped communication path 411 is formed, and the communication path 412 communicates with a suction means (not shown). Therefore, The annular groove 501, the communication path 502, The ring-shaped communication path 503, the communication path 422, the ring-shaped communication path 423, the ring-shaped communication path 411, and the communication path 412 are opened on the mounting surface 521, and constitute a suction path that connects the suction means. Further, the The 56 series is inserted into a plug hole 424 formed at the front end of the rotating shaft 42 (the left end in the second figure) and communicating with the communication path 422 to seal the plug of the communication path 422. Cutting in the embodiment shown in the figure The tool mounting mechanism 5 is structured as described above, and the mounting and disassembly of the cutting tool 43 will be described. When printed by the Industrial and Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the cutting tool 43 will be installed on the cutting flange 50. The fitting hole 433 of the tool 43 abutment 431 is fitted into the support portion 51 of the loading flange 50. Then, a suction means (not shown) is operated to pass through the communication path 41 2, the annular communication path 411, and the annular communication path. 423, the communication path 422, the ring communication path 50.3, and the communication path 502, a negative pressure acts on the ring 漭 501. As a result, the cutting tool 43 is fitted on the abutment 5L of the support portion 5L of the mounting flange 50. Attracted and held by the mounting flange 50 521. Furthermore, the suction pressure acting on the annular groove 501 by the suction means is reduced by less than 0.3 pressure from the atmospheric pressure (this paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -8- Economy Printed by the Intellectual Property Bureau of the Ministry of Intellectual Property, 527257 A7, B7 5. The description of the invention (3 suction pressure-atmospheric pressure-0.3 pressure) is appropriate. In addition, the gap between the outer peripheral surface of the support portion 51 and the inner peripheral surface of the fitting hole 433 is made. 5 μm. When removing the cutting tool 43 attached to the mounting surface 521 of the mounting flange 50, the operation of the suction means (not shown) is stopped to cut off the suction effect, and the mounting flange 50 can be easily removed. Lower cutting tool 43. In this way, when the cutting tool 43 is detached, the fitting hole 433 provided in the cutting tool 43 abutment 43 1 can be fitted into the support portion 51 of the loading flange 50 or pulled out from the loading flange 50. It can be easily operated without special tools or skill. In the cutting tool mounting mechanism 5 of the illustrated embodiment, the cutting tool 43 is held by suction, so that the holding force is not changed by the rotation direction of the rotary shaft 42. The division device of the embodiment shown in the figure is provided with a photographing mechanism 6 that photographs the surface of the workpiece held on the surface of the suction plate 32 constituting the suction table 3, detects the area where the cutting tool 43 should cut, and confirms the state of the cutting groove. This photographing mechanism 6 is composed of optical means such as a microscope and a CCD camera. The division device is provided with display means 显 for displaying an image captured by the image capturing means 6. The dividing device 'according to the illustrated embodiment includes a cassette 8 for storing a semiconductor wafer 9 to be processed. The semiconductor wafer 9 is supported by a ring-shaped support frame 10 made of a metallic material such as stainless steel with an adhesive tape 11 and is housed in the cassette 8 in a state of being supported by the support frame 10. Further, the cassette 8 'is placed on a cassette table 81 which is arranged to be movable up and down by a lifting means (not shown). The dividing device of the embodiment shown in the figure includes a semiconductor wafer 9 to be processed (a state supported by an adhesive tape 11 on a support frame 10) housed in a cassette 8 and carried out to the processing object placement area 1 2, The method of transporting the processed products 1 3 'Apply the paper size to the Chinese National Standard (CNS) A4 specification (210X 297 mm) --------- Φ ------ 1T --- --- 0 (Please read the notes on the back before filling this page) -9-527257 A7 B7 V. Description of the invention (i (Please read the notes on the back before filling this page) The semiconductor wafer 9 is transported to the processing means 14 on the chuck table 3, the cleaning means 15 for cleaning the semiconductor wafer 9 cut and processed on the chuck table 3, and the chuck table 3 The processed semiconductor wafer 9 is conveyed to the cleaning means 15 and the cleaning and conveying means 16 are described below. The processing operation of the above-mentioned dividing device will be briefly described below. Intellectual property of the Ministry of Economic Affairs ^ 7 Printed and stored in the box 8 The semiconductor wafer 9 (hereinafter, referred to as a The semiconductor wafer 9 in a state where the adhesive tape 11 is supported on the support frame 10 is referred to as a semiconductor wafer 9), and the cassette table 81 is moved up and down to position the unloaded position by a lifting mechanism (not shown). The unloading means 13 moves forward and backward to transport the semiconductor wafer 9 positioned at the unloading position to the processed object mounting area 12. The unprocessed semiconductor wafer 9 in the processed object mounting area 12 is transferred by the The turning operation of the processed object conveying means 14 is conveyed to the mounting surface of the suction plate 32 constituting the above-mentioned suction table 3, and is sucked and held on the suction plate 32 by the suction action of a suction means (not shown). In this way, the semiconductor wafer 9 is suctioned The held chuck table 3 is moved directly below the photographing mechanism 6. When the chuck table 3 is positioned directly under the photographing mechanism 6, the cutting line formed on the semiconductor wafer 9 is detected by the photographing mechanism 6, and ... Move and adjust in the cutting direction of the spindle unit 4, that is, the direction of the arrow γ for precise alignment. Then, the cutting tool 43 is fed into the predetermined cutting amount in the direction shown by the arrow Z and rotated in the predetermined direction, which will attract and hold the semiconductor crystal The chuck table 3 ′ of the circle 9 is moved at a predetermined cutting speed in a direction indicated by an arrow X (a direction orthogonal to the rotation axis of the cutting tool 43), and the semiconductor wafer 9 held on the chuck table 3 is cut by cutting. The cutter 43 cuts along a predetermined cutting line (street). That is, because the cutting tool 43 is installed on a paper sheet whose cutting direction is indicated by an arrow Y, the Chinese National Standard (CNS) A4 specification (210X297) is applied. (10%) -10- 527257 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (3 directions and the cutting direction, that is, the direction indicated by the arrow Z, the spindle unit 4 is positioned and adjusted, and is driven by rotation, Therefore, the chuck table 3 is moved along the cutting direction under the cutting tool 43 and the semiconductor wafer 9 held by the chuck table 3 is cut by the cutting tool 43 along a predetermined cutting line. By cutting along the dicing line, the semiconductor wafer 9 is divided into individual semiconductor wafers. The divided semiconductor wafer does not spread out due to the action of the adhesive tape 11 and maintains the state of the semiconductor wafer 9 supported by the support frame 10. After the dicing of the semiconductor wafer 9 is completed in this way, the chuck table 3 holding the semiconductor wafer 9 is returned to the position where the semiconductor wafer 9 was initially attracted and held, and the suction effect of the suction means (not shown) is cut off to release The attraction of the semiconductor wafer 9 is maintained. Then, the semiconductor wafer 9 is conveyed by the cleaning conveying means 16 to the cleaning means 15 and cleaned. The semiconductor wafer 9 thus cleaned is transported to the processing object field 12 by the processing means 14 for the processing. Then, the semiconductor wafer 9 is unloaded by the processed object unloading means 13 and stored in a predetermined position of the cassette 8. [Effects of the Invention] Since the cutting tool mounting mechanism according to the present invention has the structure described above, the following effects can be achieved. That is, the cutting tool mounting mechanism according to the present invention includes a support portion that is disposed at the front end portion of the rotary shaft and is fitted in a fitting hole provided in the cutting tool base, and projects radially from the rear end of the support portion. The loading flange is formed with a flange portion on the front surface of the mounting surface, and the loading flange is provided with a suction passage opening in the mounting surface and communicating with the suction means. Therefore, when the cutting tool is attached and detached, the The fitting hole is fitted into the support part, or the paper size is pulled out from the support part. The paper size applies the Chinese National Standard (CNS) Α4 specification (210X297 mm), 1τ (Please read the precautions on the back before filling this page) -11- 527257 A7 B7 V. Description of the invention (3 can be used, and it can be easily operated without special tools or skills. Therefore, the replacement of cutting tools can be performed in a short period of time to improve production efficiency. In addition, according to this The cutting tool mounting mechanism of the present invention attracts and holds the cutting tool, so the holding force does not change due to the rotation direction of the rotation shaft. Therefore, cutting occurs due to the rotation direction of the rotation shaft. It can be prevented before it comes off. [Brief description of the drawing] Fig. 1: A perspective view of a cutting device-dice device provided with a cutting tool mounting mechanism of the present invention. Fig. 2: Main parts of the cutting tool mounting mechanism of the present invention Partially enlarged sectional view. [Illustration of drawing number] (Please read the precautions on the back before filling in this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 2 Device box 3 Suction table 31 Suction table support table 32 Suction plate 4 Spindle Unit 41 Spindle box 411 Ring-shaped communication path 412 Communication path 42 Rotary shaft 420 Loading flange mounting This paper size applies Chinese National Standard (CNS) A4 specification (210X 297 mm) -12- 527257 A7 B7 V. Description of the invention (Economic Printed by the Ministry of Intellectual Property and Welfare Bureau's Consumer Cooperatives 422 Link Road 423 Ring Link Road 43 Cutting Tool 431 Cutting Tool Abutment 432 Cutting Tool Edge 433 Cutting Tool Fitting Hole 5 Cutting Tool Mounting Machine 50 Loading Flange 501 Ring Groove 502 Communication path 503 Ring communication path 51 Loading flange support portion 52 Loading flange flange portion 521 Mounting surface 55 Nut 56 Stopper 6 Photographic mechanism 7 Display means 8 Cassette box 81 Cassette table 9 Semiconductor wafer 10 Support frame 11 Adhesive tape 12 Collar to be processed. (Please read the precautions on the back before filling out this page) This paper size applies China National Standard (CNS) A4 specification (210X297 mm) -13- 527257 A7 B7 V. Description of the invention (^ 13 Processed material transport means 14 Processed object transport means 15 Washing means 16 Washing and transport means. ----------- (Please read the notes on the back before filling out this page) Order printed by the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economic Affairs This paper applies Chinese National Standard (CNS) A4 specifications (210X 297 Mm) -14-