TW523732B - Display device - Google Patents
Display device Download PDFInfo
- Publication number
- TW523732B TW523732B TW089105816A TW89105816A TW523732B TW 523732 B TW523732 B TW 523732B TW 089105816 A TW089105816 A TW 089105816A TW 89105816 A TW89105816 A TW 89105816A TW 523732 B TW523732 B TW 523732B
- Authority
- TW
- Taiwan
- Prior art keywords
- display device
- substrate
- conductor
- metal
- conductor pattern
- Prior art date
Links
- 239000004020 conductor Substances 0.000 claims abstract description 79
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 239000002184 metal Substances 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 26
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 17
- 229910052737 gold Inorganic materials 0.000 claims description 16
- 239000010931 gold Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 16
- 230000002079 cooperative effect Effects 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 230000005693 optoelectronics Effects 0.000 claims description 4
- 244000273928 Zingiber officinale Species 0.000 claims 1
- 235000006886 Zingiber officinale Nutrition 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- 239000000806 elastomer Substances 0.000 claims 1
- 235000008397 ginger Nutrition 0.000 claims 1
- 230000002452 interceptive effect Effects 0.000 claims 1
- 239000002699 waste material Substances 0.000 claims 1
- QUCZBHXJAUTYHE-UHFFFAOYSA-N gold Chemical compound [Au].[Au] QUCZBHXJAUTYHE-UHFFFAOYSA-N 0.000 abstract description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 11
- 239000010410 layer Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 206010052428 Wound Diseases 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP99200696 | 1999-03-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW523732B true TW523732B (en) | 2003-03-11 |
Family
ID=8239963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW089105816A TW523732B (en) | 1999-03-09 | 2000-03-29 | Display device |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20020013098A1 (de) |
| EP (1) | EP1078426B1 (de) |
| JP (1) | JP4597384B2 (de) |
| CN (1) | CN100355153C (de) |
| DE (1) | DE60016109T2 (de) |
| TW (1) | TW523732B (de) |
| WO (1) | WO2000054373A1 (de) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6998280B2 (en) * | 2004-02-10 | 2006-02-14 | Mei-Hung Hsu | Wafer packaging process of packaging light emitting diode |
| US20050227063A1 (en) * | 2004-03-26 | 2005-10-13 | Solaris Nanosciences, Inc. | Plasmon nanoparticles and pixels, displays and inks using them |
| WO2005103202A2 (en) * | 2004-03-31 | 2005-11-03 | Solaris Nanosciences, Inc. | Anisotropic nanoparticles and anisotropic nanostructures and pixels, displays and inks using them |
| JP2006003800A (ja) * | 2004-06-21 | 2006-01-05 | Optrex Corp | 表示パネル |
| CN109473797B (zh) * | 2017-09-07 | 2020-09-04 | 深圳市奥拓电子股份有限公司 | 一种led显示屏及显示装置 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3904934A (en) * | 1973-03-26 | 1975-09-09 | Massachusetts Inst Technology | Interconnection of planar electronic structures |
| US4012117A (en) * | 1974-07-29 | 1977-03-15 | Rca Corporation | Liquid crystal module |
| US4528500A (en) * | 1980-11-25 | 1985-07-09 | Lightbody James D | Apparatus and method for testing circuit boards |
| US5834753A (en) * | 1986-08-08 | 1998-11-10 | Norand Corporation | Laser scanner module having integral interface with hand-held data capture terminal proximity and label sensing, and enhanced sensitivity and power efficiency |
| JPH02100283U (de) * | 1989-01-30 | 1990-08-09 | ||
| JPH02239232A (ja) * | 1989-03-14 | 1990-09-21 | Alps Electric Co Ltd | 液晶表示素子の製造方法およびその装置 |
| US5066235A (en) * | 1989-07-21 | 1991-11-19 | Nec Corporation | Connector assembly for electronic devices |
| DE3927752A1 (de) * | 1989-08-23 | 1991-02-28 | Stocko Metallwarenfab Henkels | Displaykontaktierung mit einer leiterplatte |
| JPH04143732A (ja) * | 1990-10-05 | 1992-05-18 | Alps Electric Co Ltd | 液晶表示素子の接続構造 |
| CN1071778A (zh) * | 1991-10-09 | 1993-05-05 | 电子科技大学 | 一种场致发光屏产品及其制造方法 |
| US5579528A (en) * | 1991-12-31 | 1996-11-26 | Dell Usa, L.P. | Computer system employing docking bay with spring loaded connector pins and file coherency method |
| EP0797202B1 (de) * | 1992-08-14 | 1999-11-03 | Sony Corporation | Aufzeichnungs-/Wiedergabegerät |
| CN2150612Y (zh) * | 1993-03-31 | 1993-12-22 | 姚山平 | 车用电子显示器件 |
| GB2278947B (en) * | 1993-04-23 | 1996-04-17 | Clares Regisbrook Systems | Shelf label holder |
| US5455409A (en) * | 1993-08-16 | 1995-10-03 | Texas Digital Systems, Inc. | Apparatus and method for monitoring a plurality of coded articles and for identifying the location of selected articles |
| WO1995013625A1 (en) * | 1993-11-12 | 1995-05-18 | Seiko Epson Corporation | Structure and method for mounting semiconductor device and liquid crystal display device |
| CN1134702C (zh) * | 1994-09-16 | 2004-01-14 | 精工爱普生株式会社 | 液晶显示装置、其安装结构及电子设备 |
| EP0778959A1 (de) * | 1995-06-29 | 1997-06-18 | Koninklijke Philips Electronics N.V. | Anzeigevorrichtung |
| TW357332B (en) * | 1997-03-12 | 1999-05-01 | Seiko Epson Corp | Electronic parts module and the electronic machine |
| US6155844A (en) * | 1997-03-26 | 2000-12-05 | Berg Technology, Inc. | Electrical connector for mounting a panel-like device on a printed board |
-
2000
- 2000-02-14 CN CNB008003033A patent/CN100355153C/zh not_active Expired - Fee Related
- 2000-02-14 WO PCT/EP2000/001175 patent/WO2000054373A1/en active IP Right Grant
- 2000-02-14 JP JP2000604495A patent/JP4597384B2/ja not_active Expired - Fee Related
- 2000-02-14 EP EP00905061A patent/EP1078426B1/de not_active Expired - Lifetime
- 2000-02-14 DE DE60016109T patent/DE60016109T2/de not_active Expired - Lifetime
- 2000-03-06 US US09/519,547 patent/US20020013098A1/en not_active Abandoned
- 2000-03-29 TW TW089105816A patent/TW523732B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US20020013098A1 (en) | 2002-01-31 |
| EP1078426A1 (de) | 2001-02-28 |
| EP1078426B1 (de) | 2004-11-24 |
| JP4597384B2 (ja) | 2010-12-15 |
| CN1296652A (zh) | 2001-05-23 |
| CN100355153C (zh) | 2007-12-12 |
| JP2002539486A (ja) | 2002-11-19 |
| WO2000054373A1 (en) | 2000-09-14 |
| DE60016109D1 (de) | 2004-12-30 |
| DE60016109T2 (de) | 2006-02-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MM4A | Annulment or lapse of patent due to non-payment of fees |