TW523134U - Improved structure of dual-fan heat dissipation device - Google Patents

Improved structure of dual-fan heat dissipation device

Info

Publication number
TW523134U
TW523134U TW90220760U TW90220760U TW523134U TW 523134 U TW523134 U TW 523134U TW 90220760 U TW90220760 U TW 90220760U TW 90220760 U TW90220760 U TW 90220760U TW 523134 U TW523134 U TW 523134U
Authority
TW
Taiwan
Prior art keywords
dual
heat dissipation
dissipation device
improved structure
fan heat
Prior art date
Application number
TW90220760U
Other languages
Chinese (zh)
Inventor
Guo-Jen Ju
Original Assignee
Kolink Internat Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kolink Internat Corp filed Critical Kolink Internat Corp
Priority to TW90220760U priority Critical patent/TW523134U/en
Publication of TW523134U publication Critical patent/TW523134U/en

Links

TW90220760U 2001-11-30 2001-11-30 Improved structure of dual-fan heat dissipation device TW523134U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW90220760U TW523134U (en) 2001-11-30 2001-11-30 Improved structure of dual-fan heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW90220760U TW523134U (en) 2001-11-30 2001-11-30 Improved structure of dual-fan heat dissipation device

Publications (1)

Publication Number Publication Date
TW523134U true TW523134U (en) 2003-03-01

Family

ID=28037629

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90220760U TW523134U (en) 2001-11-30 2001-11-30 Improved structure of dual-fan heat dissipation device

Country Status (1)

Country Link
TW (1) TW523134U (en)

Similar Documents

Publication Publication Date Title
GB2379266B (en) Heat dissipating device
TW534371U (en) CPU heat dissipation assembly part device
TW523134U (en) Improved structure of dual-fan heat dissipation device
TW558032U (en) Improved structure of heat dissipation device
TW516801U (en) Improved structure of heat dissipating device
TW526949U (en) An innovative structure of heat dissipation piece
TW534370U (en) CPU heat dissipation device
TW595752U (en) Heat dissipating device
TW549793U (en) Heat dissipating device
TW534368U (en) Double heat dissipation fan device
TW547700U (en) Heat dissipation device structure
TW511877U (en) Heat dissipation apparatus capable of increasing heat dissipation efficiency
TW511878U (en) Heat dissipation apparatus capable of increasing heat dissipation efficiency
TW572251U (en) Improved structure of heat dissipating device
TW516663U (en) Fastening structure of CPU heat dissipating device
TW532510U (en) Improved heat dissipation structure of CPU
TW521955U (en) Heat dissipation device
TW521956U (en) Heat dissipation device
TW506689U (en) Heat dissipation device
TW547917U (en) Improved heat dissipating device
TW547704U (en) Base structure of heat dissipating device
TW573758U (en) Heat dissipating device
TW570229U (en) Heat dissipating device
TW595871U (en) Heat dissipating device
TW532737U (en) Heat dissipating device

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees