TW521866U - Printing apparatus of wafer soldering paste - Google Patents

Printing apparatus of wafer soldering paste

Info

Publication number
TW521866U
TW521866U TW91201337U TW91201337U TW521866U TW 521866 U TW521866 U TW 521866U TW 91201337 U TW91201337 U TW 91201337U TW 91201337 U TW91201337 U TW 91201337U TW 521866 U TW521866 U TW 521866U
Authority
TW
Taiwan
Prior art keywords
printing apparatus
soldering paste
wafer soldering
wafer
paste
Prior art date
Application number
TW91201337U
Other languages
Chinese (zh)
Inventor
Jr-Shing Chen
Shr-Guang Chen
Yi-Ren Chen
Chi-Yu Wang
Yung-Teng Pan
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW91201337U priority Critical patent/TW521866U/en
Publication of TW521866U publication Critical patent/TW521866U/en

Links

TW91201337U 2002-02-05 2002-02-05 Printing apparatus of wafer soldering paste TW521866U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91201337U TW521866U (en) 2002-02-05 2002-02-05 Printing apparatus of wafer soldering paste

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91201337U TW521866U (en) 2002-02-05 2002-02-05 Printing apparatus of wafer soldering paste

Publications (1)

Publication Number Publication Date
TW521866U true TW521866U (en) 2003-02-21

Family

ID=28038002

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91201337U TW521866U (en) 2002-02-05 2002-02-05 Printing apparatus of wafer soldering paste

Country Status (1)

Country Link
TW (1) TW521866U (en)

Similar Documents

Publication Publication Date Title
GB2385533B (en) Mask apparatus
EP1547168A4 (en) Manually operable electronic apparatus
EP1509358A4 (en) Solder paste flux system
AU2003285140A8 (en) Apparatus for providing high quality power
EP1642670A4 (en) Solder paste
EP1550582A4 (en) Electronic apparatus
GB2396983B (en) Circuit apparatus operable under high voltage
EP1515524A4 (en) Electronic apparatus
TW558058U (en) Wafer carrying apparatus
TW521866U (en) Printing apparatus of wafer soldering paste
KR20050117604A (en) Apparatus for masssge using high frequency
GB2386574B (en) Solder paste stenciling apparatus
GB2388588B (en) Printing apparatus
GB2386096B (en) Solder paste stenciling apparatus for minimizing residue of solder paste
AU2003276697A8 (en) Paste ejection apparatus
GB2405124B (en) Paste container for screen printing and screen printing apparatus
AU2003273597A8 (en) Electrical apparatus
EP1557959A4 (en) Terminal apparatus
GB2391116B (en) Conductor paste,method of printing the conductor paste and method of fabricating ceramic circuit board
GB2393332B (en) Conductor paste, method of printing the conductor paste and method of fabricating ceramic circuit board
TW580965U (en) Auxiliary device for coating solder paste
TW497552U (en) Solder paste printing device easy utilizing active solder paste coming-off method
TW476447U (en) Soldering apparatus of semiconductor devices
PL358037A1 (en) Soldering paste feeder
TW498854U (en) Printing device for solder mass of wafer

Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model