TW517878U - Height detecting device for taped BGA solder ball - Google Patents

Height detecting device for taped BGA solder ball

Info

Publication number
TW517878U
TW517878U TW89222890U TW89222890U TW517878U TW 517878 U TW517878 U TW 517878U TW 89222890 U TW89222890 U TW 89222890U TW 89222890 U TW89222890 U TW 89222890U TW 517878 U TW517878 U TW 517878U
Authority
TW
Taiwan
Prior art keywords
taped
detecting device
solder ball
height detecting
bga solder
Prior art date
Application number
TW89222890U
Other languages
Chinese (zh)
Inventor
Shan-Peng Pan
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW89222890U priority Critical patent/TW517878U/en
Publication of TW517878U publication Critical patent/TW517878U/en

Links

TW89222890U 2000-12-30 2000-12-30 Height detecting device for taped BGA solder ball TW517878U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW89222890U TW517878U (en) 2000-12-30 2000-12-30 Height detecting device for taped BGA solder ball

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89222890U TW517878U (en) 2000-12-30 2000-12-30 Height detecting device for taped BGA solder ball

Publications (1)

Publication Number Publication Date
TW517878U true TW517878U (en) 2003-01-11

Family

ID=27801378

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89222890U TW517878U (en) 2000-12-30 2000-12-30 Height detecting device for taped BGA solder ball

Country Status (1)

Country Link
TW (1) TW517878U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004