TW517423B - Transient over-voltage protection device structure - Google Patents

Abstract

There is provided a transient over-voltage protection device structure. The structure utilizes an insulating layer to prevent the contact between the edge of the signal electrode layer and the variable impedance material layer, so as to eliminate the tip discharge effect existed at the edge of the signal electrode layer, and further increase the transient over-voltage capable of being sustained by the transient over-voltage protection device.

Description

517423 V. Description of the invention (l) The present invention relates to a transient overvoltage protection element clock. Second = relates to a structure of a transient overdust protection element that uses an insulating layer to isolate a signal-side functional material from contact. Therefore, the end of the table and the over-voltage protection element in the design state are the conductive impedance of the variable impedance material: Ϊ: The variable impedance material is used to change the resistance of the signal conductive layer and the electrical connection. The characteristic of the: rk resistance t material is that its impedance value can be adjusted at an appropriate level.苴 Φ When the enterprise layer (signal eiectrode) is at the usual Gongtian Λ number, the 'variable impedance material is in a high impedance state, so at first: the voltage and current on the signal conductive layer within the fence can work normally; The electrical range is grounded. The ground conductive layer (ground electrwe). If, = when there is no abnormal surge (pu〗 se) on the conductive layer, the variable resistance * signal conduction will change to a low impedance state. At this time, the characteristic layer of the energy material of the surge will temporarily wait. The overvoltage protection element is introduced into the grounded conductive layer, and the number is conductive, and the voltage of the conductive layer will be limited to the allowable range-so the characteristics of the impedance material to achieve the purpose of protecting the circuit. There are various forms of transient overvoltages that can be produced by using variable impedance materials. One of them is a single-layer structure (single ia, distant pieces = widely used in the market. Pass; r): n, the advantage is that it can withstand a large amount of energy flash: jt species is a laminated structure (multl_laye ", the laminated structure flashes second-class 7L pieces of volume and 70 pieces are surface adhesion type丨 The figure shows the main structure of the overvoltage protection element γ γ. The soil plate 100 is the main body, and a signal conductive layer 2 is arranged on the substrate 100.

517423 V. Description of the invention (2) Material layer 104 and a ground conductive layer 202b. Among them, a part of the variable impedance material layer 104 is covered on the substrate 100, and the other # xifl 摩 帝 麻 ο η 〇, "丨 the knife is covered on the top" and the conductive layer 22b is partially covered * On the substrate yoo, the other part is covered on the variable impedance material layer 104, showing a stacked structure. Please refer to Figure 2, US Patent No. 6, 0 1 3, 3 58 The disclosed overvoltage protection element structure is mainly made of a glass or ceramic substrate. The density of the glass or ceramic substrate 2000 is greater than 3.5 g / cm3, and the glass or ceramic substrate 2000 is provided with a The conductive layer 202 includes a signal conductive layer 202a and a ground conductive layer 202b, and a signal impedance layer 202a and a ground conductive ^ 2 0 2b are further provided with a variable impedance material layer 204, The electrical resistive material covers the substrate 100 and a part of the signal conductive layer 202a and the ground conductive layer 2 0 2 b 'to conduct an overvoltage on the signal conductive layer 2 2 a to the ground. The lightning layer 202b is discharged. Please refer to FIG. 3, when the signal conductive layer 1 02a is formed, whether it is thin film technology or thick Technical production, the thickness of the edge of the conductive layer of the signal 02a will gradually become thinner, and the conductive layer of the signal appears at the outermost edge. The angle between the tangent line and the horizontal line is an acute angle. The situation of tip discharge is easy to occur and the energy will be concentrated here to discharge, so the transient overvoltage that the component can withstand will be limited, which will affect the overall performance of the component. Therefore, the object of the present invention is to propose a transient overvoltage protection. Element structure uses insulators to isolate the edge of the conductive layer of the signal from the layer of variable impedance material 'improves the phenomenon of discharge at the tip of the conductive layer of the signal in transient overvoltage protection components

517423 V. Description of the invention (3) Protecting the structural elements, protecting the high voltage, increasing the voltage, over-electricity, over-transient, and temporarily out of the category, the person who will be promoted to the available items will be sent to the face of this situation, The layer of layered material that touches the material and the material is separated from the material. The cocoa edge and the electrical conductivity of the edge layer layer and the edge layer layer are small. Divide the physical energy into the wave without the edge, and use the Mingfa Benda on the description of the upper damage M to protect the piezoelectric transient state. The lead signal is separated by the consumption and the edge is layered. The contact is used to make the layer structure material resistant. The resistance to structural change and the film will be thin. The edges of the edges are ^ ¾ ^ Guide = 口 = 口 在 在 而 ，. As the effect of the electrical technology, the thick end of the film or the sharp voltage at the tip of the technical line, the current layer of the voltage when the line is cut and the line is cut, the signal state is temporarily out of the sharp edge of the corner. It is sharp at the corner, and it is now thin and the angle is gradually declining. The absolute reason is that the monthly release is clearly in the book. The assembly will be limited to a level that can withstand and release the over-electricity state of the electrical stress. The end-to-end information can be structured. The high resistance to isolation and electrical isolation of the material and the temporary resistance of the material can be changed. The cocoa and the edge protection of the edge element can be temporarily overlaid. Youtu and Attachment, the special combination of the levy, and the combination of the examples, Jiaming Shi, Shi Ming, issued a series of actions to make special features: The following, such as clearly stated that the type of the electric circuit board

Page 6 517423 V. Description of the invention (4) 102a, 202a, 102b, 202b, 300, 300, 302, 304, 304, 306, 306, 308, ..., <preferred embodiment> Ground conductive layer Signal conductive layer Substrate Ground conductive layer Variable impedance material layer Insulating layer Signal conductive layer

The transient overvoltage protection element is mainly used to protect electronic equipment from sudden j-wave damage. Due to the large instantaneous energy of a sudden $, the general electronic equipment cannot withstand such a large shock of X, so transient overvoltage protection is needed. Protection of components. Therefore, the main characteristic of a transient overvoltage protection element is that it must be able to withstand the shock of a surge ’. Therefore, the design of a transient overvoltage protection element must be designed for this characteristic. Please refer to FIGS. 4 to 7, which are schematic diagrams showing a manufacturing process of a transient overvoltage protection element according to a preferred embodiment of the present invention. First, referring to FIG. 4, a substrate 300 is provided, and the substrate 300D is, for example, a glass substrate or a ceramic substrate. At least one ground conductive layer 3 002 is formed on the substrate 300. The ground electrode 3 02 is formed, for example, by deposition or sputtering, and then patterned by lithography and etching (φ 11 erning). Formed. Next, referring to FIG. 5, a variable impedance material layer 3 0 4 is formed on one end of the ground conductive layer 3 02. The material of the variable impedance material layer 3 0 4 is, for example, uniformly mixed with a conductive powder and a semiconductor powder. Materials containing binders, which

Page 7 517423 V. Description of the invention (5) '~ materials have been published in many U.S. patents, and their patent numbers are 3,685,026, 3,685,028, 4,977,357, 5,068,634, 5, 2, 6 0-, 84 8, 5 , 2 94,374, 5, 3, 9 3, 5 9 6 and 5, 8 0 7, 5 0 9 and so on. Next, referring to FIG. 6, an insulating layer 3 06 is formed to cover the edge portion of the variable impedance material layer 304, so that the insulating layer 3 06 has a box structure, but the structure of the insulating layer 3 06 is not It is limited to a box structure, but will change with the contour of the variable impedance material layer 304. In addition, the insulating layer 3⑽ will expose the central portion ▲ of the variable impedance material layer 304 for electrical connection with the subsequent formation of the signal conductive layer 3 0 (see FIG. 7). . Then please follow the same steps as Figure 7 and Figure 8 to form a signal conductive layer 3 0 8 on the variable impedance material layer 3 0 4 / control its edge to be on the insulating layer 3 0 6 &gt; The signal conductive layer 300 extends outward from the contact portion with the variable impedance material layer 304 to the substrate 300. It can be clearly seen from FIG. 8 that the lithographic and money engraving process can accurately control the edge of the signal conductive layer 308 on the insulating layer 3 06, so that the edge portion of the signal conductive layer 308 will not be affected. The phenomenon of tip discharge occurs, and the discharge is performed through the contact surface of the signal conductive layer 308 and the variable impedance material layer 304, so the problem of edge tip discharge of the signal conductive layer 308 can be effectively eliminated. Finally, please refer to FIG. 9, which is a schematic structural diagram of a transient overvoltage protection element according to another preferred embodiment of the present invention. The transient overvoltage protection 4 components mainly include a substrate 300, a ground electrode 3 02, a variable impedance material layer 3 0 4, an insulating layer 3 06, and a signal conductive layer 3 08. Among them, the ground conductive layer 302 and the signal conductive layer 308 are disposed on the substrate 300, and the insulating layer 3 06 is provided on the substrate between the signal conductive layer 308 and the ground conductive layer 302.

Page 7 W7423 ^ Description ⑹ 3 0 〇, the ground guide "and the variable impedance material layer 3 0 4 is disposed between the signal conductive layer 3 〇 08 and the insulation layer between 3 〇 4 and the electrical layer 3 〇 2 Above 3〇6 'and the variable impedance material layer ^ ^ I conductive layer 3 0 8 and the ground conductive layer 3 0 2 are electrically connected. The edge ^ sample 凊 = according to Figure 8, the insulating layer 3 0 6 covers the signal The conductive layer 308 is grounded and connected to the signal conductive layer 308 and the conductive layer i through the variable impedance material layer 304, so that the transient overvoltage protection element can be protected and protected. == The problem of discharge at the edge of the V electric layer, which can avoid permanent damage to the material. The electric ΐ: drawing and / 敫 ”The structure of the transient over-electric dust protection element can be shocked with various types of waves, Make J: 22i i protect the component itself from being able to withstand higher sudden electronic components; now? The protection of the components is even better, which not only increases the service life. it ormance) can further improve the formation of the element by the insulation layer;:; variable impedance materials also take advantage of the characteristics ;: so Γ-second protection element has the following 'excellent, the transient overvoltage protection element of the present invention The structure has at least the structure: W :, when the second voltage protection element encounters a surge, the signal conductive layer Ιί :; edge to the insulation layer, so it will not discharge through the contact surface of the material layer, so it can have ^ = S and discharge problems with variable impedance edge tips. &gt; Elimination of the conductive layer of the signal 2. The transient overvoltage protection element of the present invention. Excessive concentration on the edge of the conductive layer of the signal :::: Permanent damage to the material due to surge energy flying

Page 9 517423 V. Description of the invention (7) Material loss #Layer resistance material resistance can be resisted and the variable layer can be electrically connected to the guided wave. The signal burst can be lowered but not impossible. The measuring surface-·, can touch the wave of the 'layer with the essence of the non-existent and clearly shows that it is naturally off. If you do n’t reveal it, the actual technical pieces of the waver are suddenly better than Xi Shengyi. When the time is up, ^ Invention, but the machine is limited, but the limit is bad. . This criterion is due to the fact that the person who has set up the Runjie and the more general interests should be attached to the application, and the internal scope and scope of the fan protection

Page 517423 Brief description of the diagrams Figures 1 and 2 show the structural cross section of the conventional transient overvoltage protection element, respectively, and Figure 3 shows the edges of the signal conductive layer in Figure 1 and the variable A partial enlarged view of the contact of the resistive material; FIGS. 4 to 7 are schematic diagrams of a manufacturing process of a transient overvoltage protection element according to a preferred embodiment of the present invention; and FIG. 8 is a conductive layer of the signal in FIG. 7 A partially enlarged view of the edge in contact with the variable resistance material; and FIG. 9 shows the structure of the transient overvoltage protection element according to another preferred embodiment of the present invention is not intended.

Claims (1)

517423 6. Scope of patent application 1. A transient overvoltage protection element structure suitable for an electronic component, the transient overvoltage protection element structure includes: a substrate; a grounded conductive layer, the grounded conductive layer is disposed on the substrate A variable impedance material layer disposed on one end of the grounded conductive layer and electrically connected to the grounded conductive layer; an insulating layer disposed on the variable impedance material layer And a central portion of the variable impedance material layer is exposed; and a signal conductive layer, one end of the signal conductive layer is disposed on the insulation layer and the exposed variable impedance material layer, and is in contact with the variable impedance material. Layers are electrically connected, and the edges of the signal conductive layer are located on the insulating layer. 2. The transient overvoltage protection element structure described in item 1 of the scope of patent application, wherein the substrate includes a glass substrate and a ceramic substrate. 3. The transient overvoltage protection element structure according to item 1 of the scope of patent application, wherein a contact surface is provided between the variable impedance material layer and the signal conductive layer to conduct a transient overvoltage to the ground Conductive layer. 4. The transient overvoltage protection element structure described in item 1 of the scope of patent application, wherein the insulating layer can avoid the tip discharge effect of the edge of the conductive layer of the signal. 5. The transient overvoltage protection element structure described in item 1 of the scope of the patent application, wherein the material of the insulating layer includes low-dielectric constant materials such as silicon oxide and nitrogen oxide. 6. The transient over-voltage protection element structure described in item 1 of the scope of patent application, wherein the insulation layer is a box structure. Page 12 517423 6. Scope of patent application 7. —A kind of transient overvoltage protection element structure suitable for an electronic component 5 The transient overvoltage protection element structure includes: a substrate; a signal conductive layer and a ground conductive layer, The first conductive layer and the ground conductive layer are disposed on the substrate; an insulating layer disposed on the substrate between the signal conductive layer and the ground conductive layer; and a variable impedance material layer, The variable impedance material layer is disposed on the insulating layer between the signal conductive layer and the ground conductive layer, and is electrically connected to the signal conductive layer and the ground conductive layer through the variable impedance material layer. φ 8. The transient overvoltage protection element structure described in item 7 of the scope of patent application, wherein the substrate includes a glass substrate and a ceramic substrate. 9. The transient overvoltage protection element structure according to item 7 of the scope of the patent application, wherein the variable impedance material layer and the signal conductive layer have a contact surface for conducting a transient overvoltage to the ground Conductive layer. 10. The transient overvoltage protection element structure described in claim 7 of the patent application, wherein the insulating layer covers the edge of the signal conductive layer to avoid the tip discharge effect of the edge of the signal conductive layer. 1 1. The transient overvoltage protection element structure described in item 7 of the scope of patent application, wherein the material of the insulating layer includes silicon oxide, metal oxide, etc. # Low dielectric constant materials. 1 2. —A transient overvoltage protection element structure suitable for an electronic component. The transient overvoltage protection element structure includes a substrate, a signal conductive layer and a ground conductive layer disposed on the substrate, and a Signal conductive Page 13 517423 VI. The insulating layer between the patent application layer and the ground conductive layer, and a variable impedance material layer disposed between the signal conductive layer and the ground conductive layer, which is characterized by using the insulating layer The edge of the signal conductive layer is covered, and a transient overvoltage is conducted to the ground conductive layer through a contact surface between the variable impedance material layer and the signal conductive layer. 13. The transient overvoltage protection element structure according to item 12 of the scope of the patent application, wherein the variable impedance material layer is disposed on one end of the ground conductive layer, and the insulating layer is disposed on the variable impedance material. And the central portion of the variable impedance material layer is exposed, and one end of the signal conductive layer is disposed on the insulation layer and the exposed variable impedance material layer. 14. The structure of the transient overvoltage protection element according to item 12 or item 13 of the scope of patent application, wherein the insulating layer has a box structure. 15. The structure of the transient over-voltage protection element according to item 12 or item 13 of the scope of the patent application, wherein the structure of the insulating layer is consistent with the contour of the variable impedance material layer. 16. The transient over-voltage protection element structure described in item 12 of the scope of patent application ^ wherein the insulating layer is disposed on the substrate between the signal conductive layer and the ground conductive layer to conduct the signal conductively And the variable impedance material layer is disposed on the insulating layer between the signal conductive layer and the ground conductive layer, and is electrically connected to the signal conductive layer and the ground conductive layer. 17. The structure of a transient overvoltage protection device as described in item 12 of the scope of patent application, wherein the substrate includes a glass substrate and a ceramic substrate. 18. Transient overvoltage protection element as described in item 12 of the scope of patent application Page 14 517423 VI. Scope of patent application Component structure, in which the material of the insulation layer includes silicon oxide, metal oxide and other low dielectric constant materials. ί Page 15