1 J JUO 1 J JUO 丨 經濟部中央標準局員工消費合作社印裂 、發明説明（i 【發明領域】 本發明是關於—插a 方# 、種Βθ片型電子零件包裝載料帶之製造 ::成品，特別是指一種利用切割分條與捲收成型之 且利用沖壓設孔的加工方法以製得可節省成本 及1k時間的載料帶成品。 【習知技藝說明】 般電子零組件產業中之被動元件廠用來輸送晶片型 ::件的載料帶成品大抵是由處女紙漿製成之多層式紙 厂、帶’大部份為8層貼合而成，但因此種成品製程複 雜成本較南，於是乃有業者試著開發出如第一圖所示， 種由塑膠材料製成的載料帶成品i，該載料帶成品丄表 面具有-排間隔序列之定位孔u，以及一排間隔序列且與 定位孔11相間隔之置料孔12，其中，每一定位孔η是勾 連於圖中未示之-輸送機的輸送帶上，藉以t輸送機之輸 送帶移動時能牽連載料帶成品i 一併移動，該置料孔12 即可供晶片型電子零件插置，而習知包裝載料帶在製造 時，乃先將77%之聚丙烯塑膠粒、2〇%之聚丙烯彈性體與 1%之原料色母混合於料筒中，續以壓出機壓出並經熱風烘 吹，延伸定型成規格之帶狀，經冷卻水冷卻後，以輪式壓 延機作第一次壓輪輾壓，之後，將其置入熱水槽加溫，再 以輪式壓延機作第二次壓輪輾壓使載料帶形成需求之厚 度，再經一高溫密閉烘箱加熱使載料帶收縮成型，續再捲 收成捆捅狀，最後，欲將載料帶加工成載料帶成品丨時乃 以沖壓技術在載料帶本體上沖孔以形成所需之定位孔i j 第 本紙張尺度適用中國國家標毕（CNS ) A4規格（210 X 297公髮 (請先閲讀背面之注意事項再填寫本頁) 頁 丄 丄 2 五、發明説明（ 與置料孔1 2即可。 上述習知載料帶成品1雖然可供晶片型電子零件插番 且藉由輸送機輸送而移動 零件插置 y ^ λ ^ 但該載料帶成品1之置料 孔12在置入電子零〜夏料 、 电卞+仵刖為了防止電子零件掉落， :料帶成1之下表面貼合一層膠帶作封底，待 植入置料孔12後’再於載料帶成品！之上表面貼合-層^ Ε.Τ.膠帶封合並捲收成盤狀即可，故由上述可知製1 J JUO 1 J JUO 丨 Printed and Invented by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (Field of the Invention) The present invention is related to the manufacture of a carrier tape for inserting a square #, a type of βθ sheet electronic parts :: Finished products, in particular, refers to a processing method that uses cutting and slitting and rolling and uses punching to set holes to produce cost-effective and 1k-time carrier tape finished products. [Description of Known Skills] In the general electronic component industry The passive component factory is used to convey wafer type :: The finished product of the carrier tape is mostly a multi-layer paper factory made of virgin pulp. The belt is mostly laminated with 8 layers, but the production process of such a finished product is complicated and costly. South, so some industry players have tried to develop a finished product carrier tape i made of plastic material, as shown in the first figure, the surface of the carrier tape product has a row of positioning holes u in a spaced sequence, and a The feed holes 12 arranged in a series of intervals and spaced from the positioning holes 11, wherein each positioning hole η is hooked on a conveyor belt of a conveyor (not shown), so that the conveyor belt of the t conveyor can be pulled when the conveyor belt moves. Finished product i The loading hole 12 can be used for the insertion of chip-type electronic parts. When the conventional packaging carrier tape is manufactured, 77% of polypropylene plastic pellets, 20% of polypropylene elastomer and 1% of raw materials are firstly used. The color masterbatch is mixed in a barrel, continued to be extruded by an extruder, and then blown by hot air to extend the shape into a standard belt shape. After cooling with cooling water, the roller calender is used for the first roller rolling. After that, Put it into a hot water tank to warm it, and then use a wheel calender for the second roller rolling to form the carrier tape to the required thickness, and then heat it through a high-temperature closed oven to shrink the carrier tape. Bundle-shaped. Finally, when the carrier tape is to be processed into a carrier tape finished product, punching is carried out on the carrier tape body by stamping technology to form the required positioning holes. ) A4 size (210 X 297) (please read the precautions on the back before filling out this page) Page 丄 丄 2 5. Description of the invention (and the loading hole 12 can be used. Although the above-mentioned conventional carrier tape product 1 is available For inserting wafer-type electronic parts and moving parts by conveyor to insert y ^ λ ^ However, the loading hole 12 of the carrier tape finished product 1 is filled with electronic zero ~ summer material, electric 卞 + 仵 刖 in order to prevent the electronic parts from falling: a layer of tape is attached to the bottom surface of the tape 1 as a back cover, which is to be planted. After entering the material feeding hole 12 ', the product is then finished on the carrier tape! The upper surface is bonded-layer ^ Ε.Τ. The tape can be sealed and rolled into a disc shape, so it can be made from the above.
造程序不僅繁雜且費時，再去丹I ^丹者欲加工以將晶片型電子愛 件放置在載料帶成品1上之晉祖 Λ ^ 1上之置枓孔12時，亦必須先在載料 帶成品1下表面上貼合一層膠帶…，如何改善載料帶 的構造及製造方法以減少載料帶之製造時間及流程， 本發明所欲改良之處β 【發明概要】 因此，本發明之目的即在提供一種可減少製造流程之 晶片型電子零件包裝載料帶的製造方法，並提供一種可節 省製造時間，亦可節省成本之載料帶成品。 經濟部中央標準局員工消費合作社印製 於是，本發明晶片型電子零件包裝載料帶之製造方 法，可被加工而用以插置並輸送晶片式電子零件，其製造 過程包含：原料混合、加熱壓出成型、冷卻壓延輾平、微 孔表面處理、南溫退火處理、切割分條，及捲收成型等步 驟，其中： 該原料混合步驟··先準備用以成型該載料帶之原料， 包括60〜80%之基料、15〜25%之改質劑，以及5〜15% 之填充劑，其中，該填充劑是由吸熱發泡劑、抗靜電劑及 第 頁 本紙張尺度適用中國國家標率（CNS ) Α4規格（210X29*7公釐） 513368 A7 B7 經 部 中 央 標 準 扁 Μ 工 消 合 作 社 印 製 五、發明説明（3 ) 溶膠所組成，之後，利用攪拌機將上述之原料充分攪拌混 合； 該加熱壓出成型步驟：將混合後之原料放入平板壓出 機並同時施以20 0〜420eC之溫度加熱融合，再利用一螺桿 將融合後之原料壓出成型而成一預定規格之塑料； 該冷卻壓延輾平步驟：將該塑料經過輪式壓延機壓延 輾平，並同時施以40〜80 °C之冷卻處理後，即可製造成一 厚度均一之塑性平板； 該微孔表面處理步驟：利用高壓靜電機於塑性平板之 表面實施高密度之微孔表面處理，以填平表面之微小毛 孔，使該塑性平板形成粗糙表面； 該高溫退火處理步驟：利用高溫加熱技術在塑性平板 上加熱以實施退火處理； 該切割分條步驟：以並列式圓刀分條機在退火處理後 但尚未完全冷卻之平板上切割，即可將平板分切成數預定 寬度尺寸規格的載料帶；及 該捲收成型步驟：係運用捲取機分別將該等載料帶捲 收在數圓形紙管上以形成數圓筒型成品。 完成上述步驟後’再於載料帶上實施一沖壓設孔的加 工步驟即可形成一可供晶片型電子零件放置的包裝載料 帶’其中’該加工步驟乃是在捲收成型之後的每一載料帶 上沖壓形成一排間隔序列且鏤空之定位孔，以及一排與定 位孔相間隔且可供晶片型電子零件放置之置料槽。 而本發明之晶片型電子零件包裝載料帶，即可被捲繞 裝 訂 線 (請先閲讀背面之注意事項再填寫本頁}The manufacturing process is not only complicated and time-consuming. When Dan I ^ wants to process to place a wafer-type electronic love piece on Jinzu Λ ^ 1 on the carrier tape finished product 1, the hole 12 must be loaded first. A layer of tape is affixed to the lower surface of the finished product 1 ... How to improve the structure and manufacturing method of the carrier tape to reduce the manufacturing time and process of the carrier tape? [Invention Summary] Therefore, the present invention The purpose is to provide a manufacturing method of a wafer-type electronic component packaging carrier tape that can reduce the manufacturing process, and provide a finished carrier tape product that can save manufacturing time and cost. Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. Therefore, the manufacturing method of the wafer-type electronic component packaging carrier tape of the present invention can be processed to insert and transport the wafer-type electronic components. The manufacturing process includes: mixing of raw materials, heating Extrusion molding, cooling and calendering, microporous surface treatment, South temperature annealing treatment, cutting and slitting, and roll forming, etc., among which: the raw material mixing step ·· prepare the raw materials for forming the carrier tape first, Including 60 to 80% of the base material, 15 to 25% of the modifier, and 5 to 15% of the filler, where the filler is an endothermic foaming agent, antistatic agent National Standard (CNS) A4 Specification (210X29 * 7mm) 513368 A7 B7 Printed by the Ministry of Standards and Standards of the People's Republic of China Industrial and Commercial Cooperatives 5. V. Description of the Invention (3) Composed of sol, and then using a mixer to fully stir the above raw materials Mixing; the heating and extrusion molding step: put the mixed raw materials into a flat plate extruder and simultaneously apply a temperature of 200 ~ 420eC to heat and fuse, and then use a screw to fuse the raw materials after fusion The material is extruded and formed into a plastic of a predetermined specification. The cooling and calendering and rolling steps: The plastic is calendered and rolled by a wheel calender, and simultaneously subjected to a cooling treatment of 40 ~ 80 ° C, and then can be manufactured into a uniform thickness. The plastic slab surface treatment step: using a high-voltage electrostatic machine to perform a high-density microporous surface treatment on the surface of the plastic slab to fill the tiny pores on the surface so that the plastic slab forms a rough surface; the high-temperature annealing treatment step : Use high-temperature heating technology to heat the plastic plate to perform the annealing treatment. The cutting and slitting step: Use a side-by-side circular knife slitter to cut on the plate after annealing but not completely cooled, and then cut the plate into several pieces. A carrier tape of a predetermined width and size; and the rolling forming step: the carrier tape is rolled up on a number of circular paper tubes using a winder to form a number of cylindrical finished products. After the above steps are completed, 'a stamping and hole-forming processing step can be performed on the carrier tape to form a packaging carrier tape for wafer-type electronic parts.' 'This processing step is performed after each roll forming process. A carrier tape is punched to form a row of spaced series and hollow positioning holes, and a row of storage slots spaced from the positioning holes and capable of placing chip-type electronic components. The wafer-type electronic component packaging carrier tape of the present invention can be wound and bound. (Please read the precautions on the back before filling this page}
A7 B7 經濟部中央標準局員工消費合作社印製 頁 五、發明説明u 並用以輸送晶片式電子零件以供加工， 共包含一上其 -下基面、-排間隔序列且沿載料帶長度 、 孔，以及-排與該等定位孔間隔 位 -定位孔均是貫穿該上、下基面而可勾：輸：：之: 送帶上並與輸送帶-同連動，而每_置料槽 ^ 向下基面方向凹設所形成且可供 上基面 【圖式之簡單說明】 令忏孜置。 本發明之其他特徵及優點’在以下配合參考 佳實施例的詳細說明中，將可清楚的明白，在圖式中· 第-圖是-種習知晶片型電子零件包裝載：帶之局部 立體示意圖； 第二圖是本發明晶片型電子零件包裝載料帶之—較佳 實施例的製造流程圖； 第二圖是第二圖中該包裝載料帶之立體示意圖； 第四圖是本發明晶片型電子零件包裝載料帶成品之一 較佳實施例的局部立體示意圖；及 第五圖U i圖中之包裝載料帶成口口口的局部組合剖視 圖，同時並顯示一沖壓機之模具的部分立體示意圖。 【較佳實施例之詳細說明】 參閱第二、三圖，本發明晶片型電子零件包裝載料帶 之製造方法2依序包含有：原料混合21、加熱壓出成型22、 冷卻壓延輾平23、微孔表面處理24、高溫退火處理25、 切割分條26，及捲收成型等步驟27，其中： 第一步驟：原料混合21步驟乃是先準備用以成型該載 第 本紙張尺度適用中國國家標準（CNS ) Aj規格（210X29^^" (請先閲讀背面之注意事項再填寫本頁}A7 B7 Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of the Invention u and used to transport wafer-type electronic parts for processing, including a top-bottom surface, a row-spaced sequence and along the length of the carrier tape, The holes, as well as the space between the rows and the positioning holes-the positioning holes can be hooked through the upper and lower base surfaces: lose :: of: the conveyor belt is linked with the conveyor belt-and each _ feeding slot ^ It is formed by being recessed downward to the base surface and can be used for the upper base surface. Other features and advantages of the present invention 'will be clearly understood in the following detailed description with reference to the preferred embodiment. In the drawings, Figure-is a conventional wafer-type electronic component packaging carrier: a partial three-dimensional tape Schematic diagram; The second diagram is a manufacturing flowchart of the preferred embodiment of the wafer-type electronic component packaging carrier tape of the present invention; the second diagram is a perspective view of the packaging carrier tape of the second diagram; the fourth diagram is the present invention A partial perspective view of a preferred embodiment of a finished product of a carrier tape of a wafer-type electronic component; and a partially combined cross-sectional view of the packing carrier tape in the fifth figure U i, and showing a die of a punching machine Partial stereo schematic. [Detailed description of the preferred embodiment] Referring to the second and third figures, the manufacturing method 2 of the wafer-type electronic component packaging carrier tape of the present invention includes, in order: raw material mixing 21, heating and extrusion molding 22, cooling and rolling flattening 23 , Microporous surface treatment 24, high-temperature annealing treatment 25, cutting slitting 26, and roll forming steps 27, of which: The first step: raw material mixing 21 step is first prepared to form the paper size applicable to China National Standard (CNS) Aj Specification (210X29 ^^ " (Please read the precautions on the back before filling this page}
M3368 A7 B7 經 濟 部 t 央 標 準 員 消 費 合 作 社 印 製 五、發明説明（5 ) 料帶3之原料，包括6〇〜8〇%之基料、15〜25%之改質劑， 以及5〜15%之填充劑，其中，該基料是可選自pc、聚 笨乙烯（P S ) 、LDPE、LLDPE、HDPE等塑性材質，該 改質劑則可選自（A S )，而該填充劑是由吸熱發泡劑、 抗靜電劑及溶膠或乙烯-乙酸乙烯共聚物（EVA)所組 成’將上述原料同時加入攪拌機之後，利用攪拌機將上述 之原料充分攪拌混合。 第二步驟：加熱壓出成型22步驟：是將上述混合後之 原料放入一平板壓出機内並同時施以2〇〇〜42〇 °c之溫度 加熱’待其融合後再利用一高溫螺桿將融合後之原料壓出 成型而形成一預定規格之塑料。 第二步驟：冷卻壓延輾平23步驟：係將該塑料經過一 二輪式壓延機壓延輾平，並同時施以4〇〜8 〇β(：之冷卻處理 後’即可製造形成一厚度均一之塑性平板。 第四步驟：微孔表面處理24步驟：乃是利用高壓靜電 _機於該塑性平板之表面上實施高密度之微孔表面處理，使 該塑性平板形成粗糙表面，而易於貼合加工。 第五步驟：高溫退火處理25步驟：係將平板放入一高 溫烤箱内’藉由高溫加熱技術在塑性平板上加熱以實施退 火處理’而使平板具有較佳的延展性。 第六步驟：切割分條2 6步驟：再以並列式圓刀分條機 在退火處理後但尚未完全冷卻之平板上切割，即可將平板 分切成數預定寬度尺寸規格的載料帶3，當然，該分條機 之該等並列式圓刀間的距離亦可隨業者所需來作調整。 第 7 頁 本紙張尺度適用) A4規格（210x297公 ---------辦衣------IT------# (請先閲讀背面之注意事項再填寫本頁) 513368 A7 B7 經濟部中央標準局員工消費合作社印製 頁 五、發明説明（6 第七步驟：捲收成型27步驟：係運用捲取機分別將該 等載料帶3捲收在數圓形紙管上以形成數圓筒狀製品。 因此’本發明成型該載料帶3之製造過程不僅較習知 簡便而可達到降低成本與製造時間的功效，再者，本發明 所採用之填充劑係由碳酸氫鈉（NaHCo3)等吸熱發泡劑、抗 靜電劑與乙烯-乙酸乙烯共聚物（EVA)所組成，故載料 帶3更具有較佳伸縮撓性與延展性的另一功效。 又’當業者欲將該載料帶3加工成可供晶片型電子零 件插置的載料帶成品4時，該製造方法2更包含有一沖壓 設孔28的加工步驟，該加工步驟是在捲收成型27之後， 利用沖壓技術在每一載料帶3上沖壓形成一排間隔序列且 鏤空之定位孔43，以及一排與定位孔43相間隔且可供晶 片型電子零件放置之置料槽44，其中： 參閱第四、五圖，該載料帶成品4是可被捲繞並用以 輸送晶片式電子零件以供加工，其包含一上基面41、一下 基面42、一排間隔序列且沿載料帶長度方向設置之定位孔 43，以及一排與該等定位孔43間隔設置之置料槽44，每 疋位孔43均是貫穿該上、下基面41、42而可勾設在一 圖中未示之輸送機的輸送帶上並與輸送帶一同連動，而每 一置料槽44均是藉由一預設形狀之沖壓治具5 ㈡工％面 41向下基面4 2方向沖壓，1由於本發明的載料帶3 φ 泡劑成份，當沖壓治具5沖壓載料帶3後，被沖壓的部份 將會受擠壓而形成凹陷狀的置料槽44,該等不鏤* 乃 π工π罝料 槽44即可供晶片式電子零件放置。 第 本紙張尺度適用中國國家標準（CNS ) A4規格（21〇χ297公釐 (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部中央標準局員工消費合作社印製 、發明説明（7 ▲晶片型電子零件由一工且地里 ^ ^ ^ ^ α 由 具機置入置料槽44後，只要 在載枓帶成品4之上基面41上貼 後:: 合，並捲收成盤狀即可，由上叮4 .ε.τ.膠帶封 成品4藉由該等置料 34可知，本發明之載料帶c 乂寻罝枓槽44之凹設，即不需像 防止電子零件掉落而m 个I像S知-般為了 令忏猝洛而必須在上、下基 層膠帶，而只要在上其^ 以上各貼合一 要在上基面41貼膠帶即可，故 面42貼膠帶的步驟，故 ^ 在下基 u 例之包裳載料帶成口口口 4可達 到郎4製造時間與成本的創作目的。 運 、不〇上述，可知本實施例藉由載料帶成品4上凹設有 一排置料槽44，可供電 ,^ 冤子零件插置而不需像習知一樣必須M3368 A7 B7 Printed by the Central Standards Consumer Cooperative of the Ministry of Economic Affairs 5. Description of the invention (5) Raw materials for strip 3, including 60 to 80% of the base material, 15 to 25% of the modifier, and 5 to 15 % Filler, where the base material can be selected from plastic materials such as pc, polystyrene (PS), LDPE, LLDPE, HDPE, etc. The modifier can be selected from (AS), and the filler is made of Composed of an endothermic foaming agent, an antistatic agent, and a sol or an ethylene-vinyl acetate copolymer (EVA). After the above raw materials are simultaneously added to a blender, the above raw materials are fully stirred and mixed with the blender. The second step: heating and extrusion molding 22 steps: Put the mixed raw materials into a flat plate extruder and apply a temperature of 2000 ~ 42 ° C at the same time, and use a high temperature screw after it is fused The fused raw materials are extruded to form a plastic of a predetermined specification. The second step: cooling and calendering and rolling 23 steps: The plastic is calendered and rolled through a two-wheel calender, and at the same time, it is subjected to a cooling treatment of 40 ～ 80 β (:) to form a uniform thickness. The fourth step is microporous surface treatment. The 24th step is to use a high-voltage electrostatic machine to perform a high-density microporous surface treatment on the surface of the plastic plate, so that the plastic plate forms a rough surface and is easy to fit. Processing. Fifth step: high-temperature annealing treatment. Step 25: Put the plate into a high-temperature oven 'heat the plastic plate by high-temperature heating technology to perform the annealing treatment' to make the plate have better ductility. The sixth step : Cutting and slitting 2 6 steps: Then cut on the parallel circular knife slitter on the flat plate after annealing treatment but not completely cooled, then the flat plate can be cut into a number of carrier tapes 3 with a predetermined width and size. Of course, The distance between the side-by-side circular knives of the slitting machine can also be adjusted according to the needs of the operator. Page 7 This paper size is applicable) A4 size (210x297 male --------- handling clothes- ---- IT ------ # (please first Read the notes on the back and fill in this page again) 513368 A7 B7 Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (6 Step 7: Rewinding and forming 27 Step: Rewinders are used to load these The material strip 3 is rolled up on a number of circular paper tubes to form a number of cylindrical products. Therefore, the manufacturing process of forming the material strip 3 according to the present invention is not only simpler and more convenient than conventional, but also can reduce the cost and manufacturing time. The filler used in the present invention is composed of an endothermic foaming agent such as sodium bicarbonate (NaHCo3), an antistatic agent, and an ethylene-vinyl acetate copolymer (EVA), so the carrier tape 3 has better flexibility. Another effect of flexibility and ductility. When the industry wants to process the carrier tape 3 into a carrier tape finished product 4 that can be inserted into a wafer-type electronic part, the manufacturing method 2 further includes a punching hole 28 A processing step of forming a row of spaced-apart series and hollow positioning holes 43 on each carrier tape 3 by using a punching technique after the roll forming 27, and a row spaced from the positioning holes 43 and available Chip-type electronic parts The material placing slot 44 is placed therein. Referring to the fourth and fifth figures, the finished carrier tape product 4 can be wound and used to transport wafer-type electronic parts for processing. The carrier tape includes an upper base surface 41 and a lower base surface 42. A row of spaced-apart series of positioning holes 43 arranged along the length of the carrier tape, and a row of spaced-apart slots 44 spaced from these positioning holes 43. Each of the positioning holes 43 runs through the upper and lower base surfaces 41. , 42 can be hooked on a conveyor belt of a conveyor not shown in the figure and linked with the conveyor belt, and each of the storage slots 44 is made of a preset shape by a stamping jig. 41 is punched down to the base surface 4 in the 2 direction, 1 due to the carrier tape 3 φ foaming agent composition of the present invention, when the punching jig 5 punches the carrier tape 3, the punched part will be squeezed to form a depression The material slot 44 which is not engraved * can be used for placing chip-type electronic parts. This paper size applies the Chinese National Standard (CNS) A4 specification (21 × 297 mm (please read the precautions on the back before filling this page). Order printed by the Central Consumers Bureau of the Ministry of Economic Affairs, and a description of the invention (7 ▲ Wafer) Type electronic parts are placed in the material tank 44 by a machine and in the ground ^ ^ ^ ^ α After being placed on the base surface 41 on the carrier tape finished product 4: Yes, from the upper bite 4 .ε.τ. Tape seal finished product 4 It can be known from the materials 34 that the carrier tape c of the present invention is recessed in the groove 44, that is, it is not necessary to prevent the electronic parts from falling. The m I's like S must be taped on the upper and lower bases in order to make the bursts, and as long as they are attached to each of them, you need to put tape on the upper base surface 41, so the surface 42 is taped. Therefore, the creation of the production time and cost of the Lang 4 can be achieved in the opening of the package carrier tape in the following example. By the above, it can be seen that the finished product 4 is carried on the carrier tape 4 in this embodiment. The recess is provided with a row of storage slots 44 for power supply.
先以膠帶密封一基面，故、 ^ yI 具有減〆製以&程及節省時間的 …？ 發明包裝載料帶3的製造方法較簡便而不 一般需要兩次壓輪輾壓’且原料中添加有使載料 :3更具延展性與伸縮性的填充劑，更可使包裝載料帶3 實施沖壓設孔時不會有破裂損壞之不良現象發生，而可 減少不良品，故可達到發明之創作目的。 歸納上述，本發明載料帶成品利用置料槽之設置，可 節省製造步驟與製造時間，χ藉由切割分條的創新技術， 不僅可適合於大量生產’更可節省製造成纟再者，本發 明之載料帶亦可因應消費者的需求而調整載料帶寬廋，故 確實能達到發明之目的。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明書内容所作之簡單的等效變化與修飾，皆 ____ 第 53 貝 本紙張尺度適用中國國家) Μ規格（‘撕公楚） 装------、玎------0 (請先閱讀背面之注意事項再填寫本頁) 513368 A7 B7五、發明説明（8 ) 應仍屬本發明專利涵蓋之範圍内。 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 第10頁 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 513368 A7 B7 經濟部中央標隼局員工消費合作社印製 五、發明説明（9 ) 【元件標號對照】 2 載 料 帶 之 製造方法 28 沖 壓 設 孔 21 原 料 混 合 3 載 料 帶 22 加 熱 壓 出 成型 4 載 料 帶 成品 23 冷卻 壓 延 輾平 41 上 基 面 24 微 孔 表 面 處理 42 下 基 面 25 1¾ 溫 退 火 處理 43 定 位 孔 26 切 割 分條 44 置 料 槽 27 捲 收 成 型 5 模 具 頁 τ --·*· 1X 第 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（-CNS ) A4規格（210X297公釐）First, a base surface is sealed with tape, so ^ yI has a reduction process and saves time ...? The manufacturing method of the packaging carrier tape 3 of the invention is relatively simple, and does not generally require two rollers to be rolled. And the raw material is added with a filler that makes the carrier: 3 more ductile and stretchable, which can also make the packaging carrier tape 3 When punching holes is implemented, no bad phenomenon of cracking and damage will occur, and the defective products can be reduced, so the creative purpose of the invention can be achieved. To sum up, the finished product of the carrier tape of the present invention utilizes the setting of a feeding slot, which can save manufacturing steps and manufacturing time. With the innovative technology of cutting and slitting, χ is not only suitable for mass production, but also saves manufacturing. The carrier tape of the present invention can also adjust the carrier bandwidth 廋 according to the needs of consumers, so it can indeed achieve the purpose of the invention. However, the above are only the preferred embodiments of the present invention. When the scope of implementation of the present invention cannot be limited by this, that is, the simple equivalent changes and modifications made according to the scope of the patent application and the content of the invention specification, Both ____ The 53th paper size is applicable to Chinese countries) Μ specifications ('Tear the public Chu') ------, 玎 ------ 0 (Please read the precautions on the back before filling this page) 513368 A7 B7 V. The description of the invention (8) should still fall within the scope of the invention patent. (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs Page 10 This paper is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) 513368 A7 B7 Central Standard of the Ministry of Economic Affairs Printed by the Bureau ’s Consumer Cooperatives V. Description of the invention (9) [Comparison of component numbers] 2 Manufacturing method of carrier tape 28 Punching holes 21 Raw material mixing 3 Carrier tape 22 Heating and extrusion molding 4 Carrier tape finished product 23 Cooling and calendering Rolling out 41 Upper base surface 24 Micro-hole surface treatment 42 Lower base surface 25 1¾ Warm annealing treatment 43 Positioning hole 26 Cutting strip 44 Feed slot 27 Roll forming 5 Mold page τ-** 1X No. (Please read first Note on the back, please fill in this page again) This paper size is applicable to Chinese National Standard (-CNS) A4 specification (210X297 mm)