TW509348U - Heat dissipation apparatus - Google Patents

Heat dissipation apparatus

Info

Publication number
TW509348U
TW509348U TW090210235U TW90210235U TW509348U TW 509348 U TW509348 U TW 509348U TW 090210235 U TW090210235 U TW 090210235U TW 90210235 U TW90210235 U TW 90210235U TW 509348 U TW509348 U TW 509348U
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation apparatus
heat
dissipation
Prior art date
Application number
TW090210235U
Other languages
English (en)
Inventor
Shih-Jen Lin
Original Assignee
Global Win Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Global Win Technology Co Ltd filed Critical Global Win Technology Co Ltd
Priority to TW090210235U priority Critical patent/TW509348U/zh
Priority to US10/067,246 priority patent/US6598666B2/en
Publication of TW509348U publication Critical patent/TW509348U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW090210235U 2001-06-18 2001-06-18 Heat dissipation apparatus TW509348U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW090210235U TW509348U (en) 2001-06-18 2001-06-18 Heat dissipation apparatus
US10/067,246 US6598666B2 (en) 2001-06-18 2002-02-07 CPU cooling arrangement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW090210235U TW509348U (en) 2001-06-18 2001-06-18 Heat dissipation apparatus

Publications (1)

Publication Number Publication Date
TW509348U true TW509348U (en) 2002-11-01

Family

ID=21684682

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090210235U TW509348U (en) 2001-06-18 2001-06-18 Heat dissipation apparatus

Country Status (2)

Country Link
US (1) US6598666B2 (zh)
TW (1) TW509348U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101841993A (zh) * 2009-03-19 2010-09-22 富准精密工业(深圳)有限公司 散热装置

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7121327B2 (en) * 2000-12-28 2006-10-17 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly
TW584260U (en) * 2002-06-28 2004-04-11 Hon Hai Prec Ind Co Ltd Heat sink device
TW577585U (en) * 2002-12-24 2004-02-21 Delta Electronics Inc Multi-level heat-dissipating device
US7111667B2 (en) * 2003-03-31 2006-09-26 Micro-Star Int'l Co., Ltd. Heat dissipating device
TW584275U (en) * 2003-06-25 2004-04-11 Hon Hai Prec Ind Co Ltd Heat sink assembly
EP1589401A1 (en) * 2004-04-19 2005-10-26 Shuttle Inc. Air circulating structure for heat dissipation device
US20060032616A1 (en) * 2004-08-11 2006-02-16 Giga-Byte Technology Co., Ltd. Compound heat-dissipating device
JP4554503B2 (ja) * 2005-12-14 2010-09-29 富士通株式会社 放熱装置および電子機器
WO2007102710A1 (en) * 2006-03-08 2007-09-13 Hyun-Jong Kim Heat-sink device
JP4998548B2 (ja) * 2007-02-27 2012-08-15 富士通株式会社 放熱部品
US20080296461A1 (en) * 2007-06-03 2008-12-04 Zhi-Wei Tao Secure device
US7639497B2 (en) * 2007-12-10 2009-12-29 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat dissipation device having a fan mounted thereon
US20090165997A1 (en) * 2007-12-27 2009-07-02 Hon Hai Precision Industry Co., Ltd. Heat sink
CN201248224Y (zh) * 2008-07-18 2009-05-27 鸿富锦精密工业（深圳）有限公司 散热装置
CN101861080A (zh) * 2009-04-10 2010-10-13 富准精密工业(深圳)有限公司 散热装置
EP2544518A1 (en) * 2011-07-07 2013-01-09 ABB Research Ltd. Cooling apparatus for cooling a power electronic device
EP2819279B1 (en) * 2013-06-27 2017-01-18 ABB Research Ltd. Cooling apparatus
EP2833081B1 (en) * 2013-07-30 2017-05-10 Caframo Limited Forced air heater
CN106155248A (zh) * 2016-08-31 2016-11-23 中山市拓电电子科技有限公司 一种cpu自动取放模组的散热装置
US10631436B1 (en) 2018-11-14 2020-04-21 International Business Machines Corporation Heat sink assembly
CN114673670B (zh) * 2020-12-24 2024-04-05 戴尔产品有限公司 具有纵列风扇封装的信息处理系统
BG113528A (bg) * 2022-04-29 2023-11-15 Емил Миланов Наноелектронна система за охлаждане на процесори и ram памети
US20240023283A1 (en) * 2022-07-15 2024-01-18 Dell Products L.P. Low-noise heat exchanger

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3611107A (en) * 1969-10-07 1971-10-05 Ite Imperial Corp Converter bus structure and stud-mounted diodes and fuses therefor with identical buses having threaded openings
US3766977A (en) * 1972-09-15 1973-10-23 M Pravda Heat sinks
JP2544497B2 (ja) * 1990-02-28 1996-10-16 株式会社日立製作所 コンピュ―タ冷却装置
JPH04294570A (ja) * 1991-03-25 1992-10-19 Toshiba Corp ヒートシンク
US5598322A (en) * 1994-09-27 1997-01-28 Watlow Winona, Inc. Power control system
US5509465A (en) * 1995-03-10 1996-04-23 Bioli Corporation Heat-dissipating device for a central processing unit chip
US5678627A (en) * 1996-01-03 1997-10-21 Lee; Richard CPU heat sink mounting structure
US6181556B1 (en) * 1999-07-21 2001-01-30 Richard K. Allman Thermally-coupled heat dissipation apparatus for electronic devices
TW458384U (en) * 2000-01-25 2001-10-01 Global Win Technology Co Ltd Fixing device of heat sink
TW479935U (en) * 2000-06-02 2002-03-11 Yau-Huei Lai Fastening apparatus of heat dissipation fan
US6407919B1 (en) * 2000-12-18 2002-06-18 Fargo Chou Structure of computer CPU heat dissipation module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101841993A (zh) * 2009-03-19 2010-09-22 富准精密工业(深圳)有限公司 散热装置
CN101841993B (zh) * 2009-03-19 2013-06-05 富准精密工业(深圳)有限公司 散热装置

Also Published As

Publication number Publication date
US20020189789A1 (en) 2002-12-19
US6598666B2 (en) 2003-07-29

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004