TW507264B - Wet bench for removing photoresist and residue - Google Patents

Abstract

This invention provides a wet bench for removing photoresist and residue applicable to at least one wafer, which consists of a clean tank containing chemical solution for cleaning, a rotation mechanism having a rotation member which is installed inside of the clean tank, and a carrier member connected to the rotation member to carry the wafer to soak in the chemical solution for cleaning through the rotation of the rotation member. The use of the above-mentioned wet bench can significantly improve effectiveness of removing photoresist and residue, and thus achieve the goal to complete clean away excessive photoresist residing between bumps and residue materials remaining at the pattern corner.

Description

[Field of the invention] In particular, there are related to wet benches, wet benches in a type for removing photoresist and residue [Background of the invention] Known, bump formation 2 2: 彡 for the photoresist removal step of the wafer 'especially in the photoresist removal step of the photoresist process, this is sandwiched between the bump and the: block: gate (= 120 // m) In addition, the thin photoresist layer is often not easy to remove the photoresist: Net two b, often when the excess photoresist is removed, a step or an etching step of the interstitial hole :: elephant. In addition, it is very difficult to finish the metal etching after the implementation. f. The treatment method of the side food (sidewa11) is to use: 2 The above phenomenon, currently the industry most often adopts the full moon to impregnate the wet worktable of the "de-lighting" wafer to move the aa photoresist and Residues. I'll work when the mixture and cleaning solvents or solutions come and go: 4 == This picture shows the wet residues used in the conventional technology. '10 is the wafer and 12 is the removal. Photoresistor or washing tank, 20 is used to generate power ^ ί is used to hold the clean power of the chemical solution 12 above, and 22 is used to transfer the y produced by the cylinder 20 to carry the crystal and 2 Θ1 舲 # Said that the relative motion of the circle 10 surface is limited to the y universal shown in the figure. Although it can remove the risk Arr ", most of the photoresist or residue is not removed, but the 507264 (2) The photoresist sandwiched between the bumps and the bumps or the residue left in the corners of the pattern are often not completely removed, and the result will be shown in Figure 1b. Figure 1b shows the use The schematic diagram of the result after the photoresist removal step is performed on the wafer surface by the wet table shown in Fig. 1a. In the figure, 10 is Circle, 6 is a bump, and 18 is a residual photoresistor. In addition, the wet worktable used in the known practice also has an action in the z direction shown in the above figure, but the effect is still the same as the one described above. It is impossible to completely remove the photoresist sandwiched between the bumps and the bumps or the residue remaining in the corners of the pattern. In addition, referring to Figures 2a and 2b, these two figures show

The operation sound diagrams of the other two types of conventional wet worktables. The arrows in the figure indicate the moving direction of the wafer 10 in the chemical solution 12. "The wet worktable described in Fig. 2a, The multiple wafers are moved around the chemical solution 12 around a fixed axis, and the wet type I described in the above is on the surface of the chemical solution 1 2 in such a way that the wafer 10 itself rotates. The two types of table-type table movement methods can only make the table: "block" Gen chemical solution relative movement in a fixed relative direction 'so it can not completely solve the photoresistance in the clear room or the pattern corners [Residential Gate] & Toshi's [Summary of Invention] ~ Difficult.

In view of this, the main purpose of the present invention is to provide a wet work table for recording Takimoto's wide photoresistors and residues, suitable for use up to 3 times = except-cleaning tank 'the above cleaning tank has: 囫' included. A rotating mechanism has a rotating part, and the upper part is: Luoye, in the cleaning tank; and the suspected rotating part is provided in

V. Description of the invention ^ 3) — · ~ " '-~ PRODUCT # —The mounting part is pivotally connected to the rotating part, and is used to carry the wafer immersed in the cleaning chemistry in consideration of the rotation of the rotating part. In solution. By using the above-mentioned wet worktable, the wafer surface (bumps and chemical solutions can be moved in all directions relative to each other, so each corner of the wafer surface and bumps) can flow through the chemical solution. It is fully cleaned, so it can effectively improve the effect of removing photoresist and residues, and achieve the conventional photoresistance, such as excess photoresistance between bumps and bumps, or residues in pattern corners, which are difficult to remove. Purpose of partial removal. [Simplified description of the drawing] Figure 1a shows the structure of the wet workbench used in the conventional technology: Figure '1b shows the use of the wet workbench shown in Figure 丨 a Schematic diagram of the results after a photoresist removal step is performed on a round surface. Figures 2a and 2b are schematic diagrams showing the operation of wet work used in the conventional technology. Fig. 3a is a schematic view showing the structure of a wet workbench according to Embodiment 1 of the present invention; Fig. 3b is a front view of the wet workbench shown in Fig. 3a. Ό | 物, Figure 4 is a schematic diagram showing the situation where the bumps are cleaned by the learning solution at each position shown in Figure 3b. ^ Fig. 5a is a schematic view showing the structure of a wet workbench according to Embodiment 2 of the present invention; Fig. 5b is a front view of the wet work shown in Fig. 5a " 71 ". 4 copies of p-value center Fig. 6a shows the eighth structure of the wet workbench in Embodiment 3 of the present invention; Fig. 6b shows the parts of the wet workbench shown in Fig. 6a ^

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Explanation of View Symbols] Figure 7a before is the intention of robbers and soldiers; Town ® 7 ^ The present example of the fourth embodiment of the present invention, Figure 7b is the table ", and the formula JL is the current picture. ', The structure of thirst I shown in Fig. 7a is shown as a part of the platform ^ In order to make the present invention easy, only the following aims, characteristics, and detailed descriptions are as follows: Cooperate with attached 10 ~ wafer; 14 ~ cleaning tank; 1 8 residual photoresist; 22 ~ transmission member; 30 ~ wafer; 3 2 ~ chemical solution; 4 2 a ~ rotating part; 4 2 b ~ drive shaft; 4 4 ~ Wafer mounting section, detailed description] 1 2 ~ Chemical solution; 16 ~ Bump; 20 ~ Cylinder; 24 ~ Crystal 0 mounting section; 31 ~ Cleaning tank; 34 ~ Bump; 42a ' ~ Rod part; 42c ~ Pivot joint part; 50 ~ Power part. Advantages can be more clearly illustrated, detailed [illustration] of the company's diagram 'It shows the structure of the first embodiment of the present invention. Figure 30 is a wafer; 31 is a chemical solution for cleaning > moon cleaning; 32a is a rotary and has a table for holding the pivot joint 4 2 c

507264 V. Description of the invention (5)-"'4 2b is a transmission shaft, one end of which is connected to the power section 50 and the other end is connected to the center of the above-mentioned rotating section 42a; 44 is a wafer mounting section. When the transmission shaft 42b is rotated by the power from the power section 50, the rotation section 42a will be rotated at the same time. At this time, it is pivotally connected to the wafer mounting section 44 of the pivot section "ο" of the rotation section 42a. That is, the wafer 30 is mounted and moved in the chemical solution 32 as the rotating part 42a rotates. The first figure shows a front view of the rotating part 42a shown in Figure 3a ^, and the figure 34 shows The bumps formed on the surface of 30, and the arrows indicate the rotation directions of the rotating portion 42a at the positions A to Η. From the figure 3b, it can be seen that the wafer mounting portion 44 is like a "ferris wheel" It is pivotally connected to the pivoting portion 42c and moves in accordance with the rotation of the rotating portion 42a in a general manner. Therefore, during the movement, the surroundings of the bumps 34 on the surface of the wafer 30 can be subjected to the above chemical dissolution. The symbols A to H shown in Figure 3b are shown in Figure 4. Refer to Figure 4 for details of the flow of the chemical solution 32 around the bumps 34. Figure 4-Figure 4 shows the bumps shown in Figure 3b. Schematic diagram of the condition of each position being cleaned by chemical f liquid. In the figure, the arrows indicate Shows the chemical solution "movement direction of hunger. From FIG. 4, it can be clearly seen that when the wafer 30 mounted on the wafer mounting portion 44 is immersed in the chemical solution 3 2 with the rotation of the rotating portion 42 & and sequentially moves to FIG. 3 b When the positions A to Η are shown, the surroundings of the bumps 34 formed on the surface of the wafer 30 will be washed by the chemical solution 32 from different directions due to the relative movement with the chemical solution 3, in other words: All around the bumps 34 are cleaned. Therefore, by using the wet workbench described in the embodiment of the present invention,

V. Description of the invention (6) A stomach b can effectively improve the effect of removing photoresist and residues, and the excess between the bumps and the bumps "resistance or residual == to reach the place where it is difficult to remove clean conventionally. The purpose of the removal of the remnants of Jiao Luo = shake; description: = For example: motors, etc., but also the disk part is better, in addition, the J part 4ja can be used, for example: round Example 2 and also T use Polygonal disc section and so on. & & Fig. 53 is a schematic diagram showing the structure of the second embodiment of the present invention. The name of the articulated part 42c of the "type" table is changed to plural. ^^ In addition to the remaining structure of the rotating part 42a, the above-mentioned implementation of the second = plural wafer mounting part 44, the front view of the turn 42a Therefore, in the figure, the cymbal mounting portion 44 follows the rotation portion 42c with a pivoting portion 42c like a "ferris wheel": Do not: = In the process of moving, say _ surface The bumps will be as a whole because of the washing of the chemical solution 32 in the shifted range. Therefore, by using the wet work of the second embodiment of the present invention, the same removal as that of the first embodiment can be achieved. Photoresistance and # the advantages of short overall process time. Progress has a reduced embodiment 3 Refer to Figure 6a, which is a schematic diagram showing the structure of the embodiment 3 of the present invention. In this embodiment 3, in addition to changing the rotating part to loose Pole

Page 10 507264 V. Description of the Invention (7) Except for the part 42a ', the rest of the structure is the same as that of the embodiment j described above. Figure 6b is a front view of the lever portion 42a shown in Figure 6a. From the second figure, it can be seen that the wafer mounting portion 44 is pivotally connected to the pivot portion 42c and moves along the rotation of the lever portion 42a in a manner like a "ferris wheel". Therefore, during the movement process, The bumps on the surface of the wafer 30 will be as described in the above embodiment j, and the surroundings may be washed by the chemical solution 32 to achieve the effect of being cleaned in all directions. ^ Therefore 'By using the above-mentioned wet workbench of Embodiment 3 of the present invention, the effect of removing the photoresist and residue can be effectively improved, and the excess photoresist or residue sandwiched between the bumps and the bumps can be achieved. Residues at the corners of the pattern exist for the purpose of completely removing the hard-to-remove parts. Embodiment 4 Referring to Fig. 7a, the structure of a wet workbench according to Embodiment 4 of the present invention is not intended. In the fourth embodiment, the structure is the same as that of the third embodiment except that the lever portion 42a is changed to a plurality and each pivot portion 42a is provided with a pivoting portion 42c to pivotally connect the plurality of wafer mounting portions 44. . The first plan is a front view of the plurality of lever portions 42a shown in FIG. 7a. From this figure in Fig. 7b, it can be seen that the plurality of wafer mounting portions 44 are each pivotally connected to the plurality of pivotal portions 42c in a manner like a "Ferris wheel" and move along the rods to rotate. Therefore, the moving During the process, the bumps on the surface of the wafer 30 are as described in the above embodiment 1, and the surroundings can be washed by the chemical solution to achieve the effect of being cleaned in all directions. Therefore, by using the wet process of Example 4 of the present invention, the same effect as that of Example 3 can be achieved to remove the photoresist and residue.

Page 11 507264 V. Description of the invention (8) In addition, it can clean a larger number of wafers at the same time, which has the advantage of shortening the overall process time. Although the present invention has been disclosed in the preferred embodiment as above, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and retouches without departing from the spirit and scope of the present invention. The scope of protection shall be determined by the scope of the attached patent application.

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Claims (1)

Chuan / 264 / 、 Applicable patent scope A method for removing optical wafers, including: a cleaning tank, the above-mentioned cleaning and a rotating mechanism, with the above cleaning tank; and a mounting part, which is pivotally connected with the rotating part Rotate 2 · As a patent-type wet workbench, of which · As a patent-applicable scope workbench, of which 4. · As a patent-applied wet-table work bench, of which 5 · As a patent-applicable wet-table workbench Type workbench, such as a patented wet workbench, which has at least the resistance of the object and the residue of the wet workbench, which is suitable for the washing tank with a cleaning chemical solution; a rotating part, and the rotating part is The rotating part is provided for mounting the wafer and immersing the wafer in the cleaning chemical solution. The first item for removing photoresist and residue includes a power part. Item 2 is used to remove photoresist and residue. The power unit is a motor. The use and removal of photoresistance and residues mentioned in item 1 The above rotating part is a circular disk part. Item 1 is used to remove photoresist and residue. The rotating part is a polygonal disk part. Item 1 is used to remove photoresist and residue. The rotating part is a rod part. 0503-6977tw; TSMC2001-0835; peterliou.ptd page 13