TW501377B - Lighting apparatus with heat dissipation metal rod - Google Patents

Abstract

This invention utilizes a metal rod as heat conductor to dissipate the heat generated from light emitting chips such as light emitting diode or laser diode, one or more light emitting chips are mounted on cross section or side of the metal rod to form a high brightness illuminating device.

Description

J / / V. Description of the invention (1) 1 · Applicable field of this technique This technique uses a formula θ. ,,. More than one "light-emitting diode", diode, LD), jD) Or "laser diode" (lasei · fruit, group people and + · · special light-emitting chip, with metal heat sinks of today's & wood, and mouth-made lighting, 丄, know the heat radiation effect only Take "light-emitting diode gastric exempt lighting lamps. Taking the body" as the basic light source as an example. 2. Background Description The conventional lighting lamp is a filament, and another light-emitting chip is a high-brightness, low-consumption lamp. The amount cannot be effectively made into a lighting high-brightness light-emitting crystal problem, and developed such as household fluorescent materials, the basic light-emitting material power, and matching. The conventional heat dissipation, lamps, light-emitting crystal lamps or the like It is a fluorescent lamp that uses gold as the light-emitting material. This technology provides lighting materials for seeds. By using the rod-shaped heat-dissipating substrate of the light-emitting chip, the light-emitting chip is composed of heat generated by high brightness. Of First arts can not effectively contemplated to provide the metal substrate and the rod-shaped heat dissipation, we can resolve this question the basic sheet is a source of lighting. 3. The object of the present techniques of the art object to provide a high-brightness illumination lamp

(Page 4) υΐ377 V. Description of the invention (2) 4 · Detailed description of the technique Figure 1 · Embodiment 1 of the technique The first metal rod body 11 has a through hole 14 in the center axis and has a section m; more than one The light-emitting wafer 10 is placed on the section 1 and the second metal rod body

12 has a cross-section 121, and is disposed at the center through hole 14 of the metal rod body 111. A gap between the first metal rod body 11 and the second metal rod body 12 is placed in the local area or the entire area with an insulating material 1 43 so that the first metal rod body 11 and the second metal rod body 2 are electrically insulated from each other. The second metal rod body 11 and the second metal rod body 12 respectively serve as a first electrode and a second electrode, and one end is respectively coupled to an external power source (not shown), and the other end is electrically coupled to the light emitting chip 丨〇 the first electrode and the second electrode. It is shown in the figure that the first metal rod body 11 is electrically coupled to the bottom electrode of the light emitting chip 10, and the second metal rod body 2 is electrically connected to the surface electrode of the light emitting chip 10 by wiring. Can be designed as a boss 1 41, the light-emitting wafer Figure 2 · Embodiment 2 of this technology shows the bottom of the light-emitting wafer 10 〇 咼 '胄 high light scattering effect, the other principles are the same Figure 3 · Embodiment 3 of this technology

Page 5 501377 V. Description of the invention (3) The bottom of the light emitting chip 10 can be designed as a concave cup 1 4 2 and the light emitting chip 10 is placed in the concave cup 1 4 2 to improve the light condensing effect. The other principles are the same. Figure 4 · Embodiment 4 of the present technology The first metal material exists in the form of a metal rod body 21 with a central through hole 24 in the center axis and a first cross section 211 and a second cross section 212; On the second cross section 212, a second metal material exists in the form of a wire 22 'is disposed at the side wall of the central through hole 24 of the metal rod body 21, and an insulating material 243 is disposed between the wire 22 and the first metal rod body 21 The first metal rod body 11 and the second metal rod body 12 are electrically insulated from each other. The combination of the conductor 2 2 and the insulating material 2 4 3 can be a wire, an enameled wire, or a flat cable ... The metal rod body 21 and the metal wire 22 are respectively used as a first electrode and a second electrode, one end is respectively coupled to an external power source (not shown in the figure), and the other end is electrically coupled to the first electrode and the first electrode of the light emitting chip 10 respectively. Two electrodes. The figure shows that the metal rod body 21 is electrically coupled to the bottom electrode of the light emitting wafer 10, and the second metal rod body 22 is electrically coupled to the surface electrode of the light emitting wafer 10 by wiring 13. _ Fig. 5. The fifth embodiment of this technique is different from Fig. 4 in that it carries a second group of multiples at the first section 211

Page 6 501377 V. Description of the invention (4) ------ The light emitting chip 102 ′ and a second group of metal wires 222 ′ are arranged on the outer surface of the metal rod body 21 and are coupled to the chip 102 by wire 132. The surface electrode and the bottom electrode of the wafer 102 are electrically coupled to the metal rod body 21. An insulating material is disposed between the conductive wire 22 2 and the metal rod body 21 so that the edge of the metal rod body 21 and the second group of metal wires 222 are edged. The combination of the metal wire m and the insulating material 243 2 can be two, enameled wire, or flat cable. Figure 6 · Embodiment 6 of the present technology The first metal material exists in the form of a metal rod body 31 with an oblique 311;-more than 10 light-emitting wafers 10 are arranged on the section 3U, and the surface material exists in the form of a wire 32, which is arranged An insulating material 343 is arranged between the metal wire 32 and the metal rod body 31 between the metal wire body 32 and the metal rod body 31, so that the wall, the conductor 31 and the wire 32 are electrically insulated from each other. The wire 3 2 and the metal rod of the insulating material 1 may be a wire, an enameled wire, or a flat cable. A group of ^ 4 3 • Special materials. The metal rod body 31 and the metal wire 32 are respectively used as the first electrodes to ★

Pole, one end is respectively coupled to an external power source (not shown in the figure), and the other-the second electrode is electrically coupled to the first electrode and the second electrode terminal of the light emitting chip 10, respectively, the metal rod body 3 1 is electrically coupled to the light source The electrode 32 on the bottom surface of the wafer 10 is electrically coupled to the surface electrode of the light-emitting wafer 10 by wiring 13. wire

Page 7 501377 V. Description of the invention (5) Fig. 7 · Embodiment 7 of the technique Unlike Fig. 1, the cross section 411 shown in the figure is recessed to form a concave cup 442, and the concave cup 442 provides a light-gathering effect. The other principles are the same. The first metal rod body 41 has a through hole 44 in the center axis and a recessed cross section 411; one or more light emitting wafers 10 are disposed on the cross section, and the second metal rod body 42 is disposed on the first metal rod body 41. In the central through hole 44, an insulating material 443 is disposed in a part or all of the gap 'between the first metal rod body η and the second metal rod body 42, so that the third metal rod body 41 and the second metal rod body 41 The bodies 42 are electrically insulated from each other. The first metal rod body 41 and the second metal rod body 42 respectively serve as a first electrode and a second electrode, and one end is respectively coupled to an external power source (not shown), and the other end is electrically coupled to the light emitting chip 10 The first electrode and the second electrode. The figure shows that the first metal holder 4 is electrically coupled to the bottom electrode of the light emitting chip, and the second metal rod body 42 is electrically connected to the surface electrode of the light emitting chip 10 by wiring. Figure 8 · Eighth embodiment of the present technology The first metal material exists as a metal rod body 51 with a cross section 511, the center 1 of which is opened into two left and right halves; more than one light-emitting wafer 10 is placed on the cross section i. The second metal material is a metal plate. The 42 form exists, and the center of the metal rod body 51 is parallel to the metal rod body 51.

Page 8 501377

In the gap between the metal rod body 51 and the metal plate 52, an insulating material 543 is disposed in a local area or in the entire area, so that the metal rod body 51 and the metal plate 52 phase 3 are electrically insulated from each other. The combination of the metal plate 52 and the insulating material 543 may be a material such as enameled wire, electric wire, or flat cable. ^ The metal rod body 51 and the metal plate 52 are respectively used as the first electrode and the second electrode, and one end is respectively coupled to an external power source (not shown in the figure), and the other is electrically coupled to the light emitting chip. First electrode and second electrode. ^; It is shown that: the metal rod body 51 is electrically coupled to the bottom electrode of the light emitting wafer 10, and the metal plate 52 is electrically coupled to the surface electrode of the light emitting wafer 10 by wiring 13. Figure 9 · The ninth embodiment of this technology is different from Figure 8 in that the light-emitting wafer 10 in Figure 8 has one surface electrode and y bottom electrodes, and Figure 9 is a light-emitting wafer 20 with dual-surface electrodes, so it is wired for private use 1 3. Coupling its electrodes to the metal rod body 5 and the metal plate 52 respectively. Fig. 10. The tenth embodiment of the present technology is the same as the ninth embodiment. The light-emitting wafer 20 of Fig. 9 has a double-surface electrode. In the manner of the contact contact coupling a, the electrodes are turned to the metal rod body 51 and the metal plate 52.

501377 V. Description of the invention (7) Other principles

Figure 11 · The tenth embodiment of this technology The difference from Figure 8 is the shape of the rod body. Existing shapes, dihedrons, squares, rhombuses, and other polygons 憜 ® are also possible. The other principles are the same. Figure 12 · Twelfth embodiment of the present technology The first metal material exists as a metal rod body 61 with a cross section 611, the center of which is cut into two left and right halves; six light emitting wafers ^ 601 · 602 · 603 · 604 · 605 · 606 is placed on section 611, one on each side, the second metal material exists in the form of a metal plate 6 2 1 and the third metal material: also exists in the form of a metal plate 6 22, placed in the center of the metal rod 61 ^ Metal rod body 6 1. "" The gap between the metal rod body 61 and the metal plate 621 · 62 2 ·, a partial area

An insulating material 643 is arranged in the entire area so that the metal rod body 61 and the gold 3 are 6 2 1 · 6 2 2 · electrically insulated from each other. Between the metal plates 6 2 1 · 6 2 2 ·, the two plates are separated by a dielectric plate to electrically isolate the two. Other specific insulation materials can also be used. You can use metal plates 62 1. 62 2 between Insulation barrier. Metal plate 621 fish milk & ^ I. Seven edge village boat 6 4 3 combination, can also be enameled wire, electric wire, or flat row of green, good looking material

501377 V. Description of the invention (8) material. The combination of the metal plate 6 22 and the insulating material 6 43 may also be a material such as enameled wire, electric wire, or flat cable. The picture shows ... The first group of light-emitting wafers 601, 6〇2, 6〇3 are those with double-surface electrodes. The three on the left side are connected with wires to form a series connection. The light-emitting wafer 6 0 1 is wired 1 3 1 electrically couples one of the surface electrodes to the metal plate 6 2 2, and the light-emitting wafer 6 0 3 electrically couples one of the surface electrodes to the metal plate 6 2 1. The principle of the second group of light emitting chips 60 4 · 605 · 60 6 · is the same.

Fig. 13 · The thirteenth embodiment of the technique differs from Fig. 12 in that the metal rod body 6 in Fig. 12 is cut away in the center, and Fig. 3 is that the two rods are in the center 61 and are in the axial direction. The through holes respectively accommodate metal f 211 · 622 1 ·. An insulating material 6 4 3 1 is disposed between the metal plate 6211 and the metal rod body 611. The other principles are the same. Figure 1 4. The fourteenth embodiment of this technique

It is in the form of a bottom, and has a section 711 that respectively accommodates a metal plate. The surface 711 of the metal rod body 71 in the shape of a cymbal has a notch at the upper and lower ends of the center.

501377 V. Description of the invention (9) 72 1. 7 22. Dikun ^ Metal materials exist in the form of metal plate 721, the first: r all: wood_metal plate 722, which is placed on the metal rod body 72-up-down The two known openings are parallel to the metal rod body 71.巧 = 71 and the metal plate 72 1 72 2. The gap between the local area or τη 7; 2 ίϊί; '^ ## 743? = 1.:22. Mutual electrical insulation. 7 sets of metal plate 721 and insulating material 5 'may also be materials such as enameled wire, electric wire, or flat wire. The combination of metal, 22 and insulating material 743 can also be enameled wire, electric wire, or 疋 flat cable. / / The display electrode in the figure is partially bare or ductilely coupled under the light wafer for wire bonding; the gold light wafer can not be used. The first group of light-emitting chips 70 1. 702 · 703 · are those with a surface and a bottom electrode, insulated The pad 74 is placed between the section 711 and the hair 701.7 7 02 · 70 3 ·. The metal pad 7 71 is placed on the light-emitting chip, 7 " 〇1 and is electrically coupled to the bottom electrode of the light-emitting chip 701. The gold f-pad 771 is provided with a bonding area for wire coupling to another light-emitting chip extension electrode; the metal pad 7 72 is placed on Light-emitting chip 702 is electrically connected to the bottom electrode of light-emitting chip 702. The metal pad 772 partially exposes the lifted area for wire coupling to another light-emitting chip or extends the electric pad 7 73. It is placed below the light-emitting chip 703 and electrically It is sexually turned on the bottom electrode of the 703, and the metal pad 7 7 3 is partially exposed to provide the wiring area wire 1¾ to another light emitting chip or an extension electrode. ασ Three light-emitting wafers on the left 701 · 7 02. 703 · The electrode structures are coupled by wire bonding

Page 12 501377 V. Description of the invention (ίο) In series connection, the light emitting chip 701 is electrically connected to the metal plate 722 with a wire 73 1; the metal pad 773 is electrically coupled to the metal plate with a wire 732. 721 ° The second group of light emitting chips 70 4 · 7 0 5 · 7 0 6. The principle is the same. Figure 15 · The fifteenth embodiment of this technology differs from Figure 14 in terms of the electrodes of the light emitting chip. The light emitting chip of Figure μ has a series connection of a bottom electrode and a surface electrode, while the light emitting chip of Figure 15 has Double-surface electrode series connection design. The first metal material exists in the form of a cymbal-shaped metal rod body 81 having a cross section 8 11 ′ at the upper and lower ends of the center thereof, each having a notch to accommodate a metal plate 821 · 822 ·; the second metal material is a metal plate 821 It exists in the form, and the third metal material also exists in the form of a metal plate 8 22, which is arranged on the upper and lower ends of the metal rod body 81 and is parallel to the metal rod body 81. A gap between the metal rod body 81 and the metal plate 821 · 8 22 · is provided with an insulating material 8 4 3 in a partial area or the entire area, so that the metal rod body 81 and the metal plate 821 · 822 · are electrically insulated from each other. The combination of the metal plate 821 and the insulating material 84 3 may be a material such as enameled wire, electric wire, or flat cable. The combination of the metal plate 82 2 and the insulating material 843 may also be a material such as enameled wire, electric wire, or flat cable. The figure shows: the first group of light-emitting wafers 801. 802.80 3 · is a double-sided electric

Page 13 501377 V. Description of the invention (11) The pole 'insulation pad 84 is disposed between the cross section 8U and the light-emitting chip 801 · 8〇2. 8〇3. Metal pads 871 · 872 · 8 73. 874 · 875 · 876 · are placed between the wafer toilet insulation pads 84. The metal pads 8 7 1 · 8 7 2 · are placed under the light-emitting wafer 8 〇 丨 and are electrically coupled to the double bottom electrodes of the light-emitting wafer 801, respectively. The metal pad 871 is partially exposed to provide contact coupling for the wafer 80 6 and the metal pad The lower part of 871 is also contact-coupled to the metal plate 822. The metal pads 872 · 873 · are placed under the light emitting chip 802 and electrically coupled to the double bottom electrodes of the light emitting chip 802. The metal pad 872 is partially exposed to provide contact coupling for the wafer 803. The metal pad 873874 is placed under the light emitting chip 803 and is electrically coupled to the double bottom electrodes of the light emitting chip 803. The metal pad 874 is partially exposed to provide contact coupling for the wafer 804 and the metal pad 8 74 The lower part is also contact-coupled to the metal plate 82] L. The metal pad 874.875 is placed under the light emitting chip 804 and is electrically coupled to the double bottom electrode of the light emitting chip 804; the metal pad is 8.876. It is placed under the light emitting chip 805 and is electrically coupled to The double bottom electrode of the light emitting chip 805; the metal pad 876 · 871 · is placed under the light emitting chip 806 and the double bottom electrode of the light emitting chip 806 is electrically connected to the knife. Fig. 16 _ Embodiment 16 of this technology f The previous example is different from the light emitting chip placement position. The previous example mainly 主要 The light emitting chip is placed on the cross section, oblique section, or concave section of the metal rod.

Page 14 501377

Fifth, the invention description (12) face 'and Figure 16 is the light-emitting chip is placed on the side wall of the metal rod body. The figure shows that the first metal material exists in the form of the metal rod body 9 1. On the outer wall, the second gold house follows, '-a genus material exists in the form of the road g, and is arranged around the outer wall of the metal rod body 91. An insulation material 943 is disposed between the eight Mv line 92 and the metal wire 92, so that the metal rod body 91 and the metal wire 92 are electrically insulated from each other. The combination of metal wire 9 2 and insulating material 9 4 3 can be replaced by enameled wire, electric wire, flat cable ...

The metal rod body 91 and the metal wire 92 are respectively used as the first electrode and the second electrode. One end is respectively coupled to an external power source (not shown in the figure), and the other end is electrically lightly closed to the first of the light emitting chip 90. An electrode and a second electrode. The figure shows that the metal rod body 91 is electrically coupled to the bottom electrode of the light emitting chip 90, and the metal wire 92 is electrically coupled to the surface electrode of the light emitting chip 90 with a wire 9 3. Fig. 17 · Seventeenth embodiment of the present technology—additional heat dissipation fins == metal rod body 1 0 1 The outer wall can be wrapped with a circle of heat dissipation fins 〇〇 丨, must ^ J 在 政 热 Binding piece 1 0 0 1 and A layer of material 1 00 4 may be disposed between the metal rod bodies 101, so that the heat dissipation fin 1001 and the metal rod body 101 are electrically insulated. Figure 18. Eighteenth Embodiment of the Technique-Concentrating Cup

Page 501 501377

V. Description of the invention (13) Shows the design of the additional condenser cup 103 as shown in the previous figure. The rest of the structure is the same. Figure 19 · 19th embodiment of the technology-cross-section view of protective glue and condenser cup

Different from the previous illustration, the protective colloid 1 0 5 package is added to protect the light emitting chip 1 0 0 and the wiring 13. X Figure 2 0 · Twenty Embodiment of the present technology—The additional rotating base is different from FIG. 17 in that a light-transmitting light bulb-shaped cover 100 is added to protect the light-emitting chip 100 and the wire 13 and the metal rod 1 01 · 1 021 · 1 〇22 · 's extension & extension electrode is made into a rotating head 1 0 06 shape, in conjunction with existing household lamp holders, it is convenient to directly install this product without changing the lamp holder in the home. Figure 21 · Embodiment 21 of this technology _Combination of four groups of light-emitting devices

Shows four groups of luminous lamps of this technology, which are placed in a combination of heat sink 1 0 01. Fig. 22 · AA 'cross-sectional view of the twenty-first embodiment of the present technique. Fig. 21 is a cross-sectional view according to AA'.

501377

This technique uses a fluorescent lamp I, ^, which is similar to a bulb shape, as an example. The strip principle 'flattenes a metal rod-shaped material 2 :: ...; = The description of the technique example is omitted, but, It does not depart from part I of this technique, that is, the scope of rights of the person in this specification. y. In the middle of the month, it is still the right of the art and the oblique section. The section of the metal rod shown in the previous figure is flat. In actual production, a concave section can also be used. The actual manufacturing industry shows that when the light-emitting chip is connected in series or in parallel, it is also possible to design a series-parallel connection, which can be easily changed by taxis.疋 α The foregoing description discloses the preferred embodiment and design of the present invention, and the implementation examples and design drawings are merely examples: ::: ί: 权 之 ”口 巧 艺 方法 = and ㈣, without departing from the invention 501377; Simple illustration of the diagram 5. Simple illustration of the diagram Figure 1. Embodiment 1 of the technique Figure 2. Embodiment 2 of the technique Figure 3. Embodiment 3 of the technique Figure 4. This technique Example 4 Figure 5. Example 5 of the technology Figure 6. Example 6 of the technology Figure 7 Example 7 of the technology Figure 8 Example 8 of the technology Figure 9 Example 9 of the technology 1 0. This technology Embodiment 10 Figure 11. Embodiment 11 of this technique Figure 1 2. Embodiment 12 of this technique Figure 13. Embodiment 13 of this technique Figure 1 4 · Embodiment 14 of this technique Figure 1 5. Embodiment 10 of this technique Five Figures 1 6. Sixteenth embodiment of this technique Figure 1 7. Seventeenth embodiment of this technique _ plus heat dissipation fins Figure 1 8 Eighteenth embodiment of this technique _ plus condenser cup _ Figure 1 9. An embodiment of this technique Nineteen_ cross-sectional view of the addition of protective glue and condenser cup Figure 20 0. Embodiment 20 of the present technology_External rotation base Figure 2 1 · Embodiment 21 of the present technology— Binding group of the light emitting device

Page 18 501377 Brief description of the drawing Figure 22 · AA of the twenty-first embodiment of the technology, cross-sectional view 6 · Component number table metal rod body 11. 12.21. 31.41.42. 51. 61.6111.71.81. 91.101. 1 02 1 1 022. Metal wire 22. 222. 3 2. 92. Metal plate 52. 621. 622. 6211. 6221. 721. 722. 821 · 822 · Section 111 · 211 · 212.311.411 · 511. 611. 711.811. 91. Light-emitting chip · 10.20. 30.601.602.603. 604. 605.606.701.702. 703.704.7 05.706. 80 1. 80 2. 803. 80 4. 805. 8 06. 90. 1 00. Wire 13.131.132.731.732. 93. Through hole 1 4. 24.44. Slot 143, insulating material 143.243 · 2432 · 343.443.543. 643. 6431.743.843. 943.1004 boss 1 4 1. concave cup 142.442.1003. · Protective colloid 1 0 0 5. insulation塾 7 4. 8 4. Metal pad 771.7772.773.871.872.873.874 · Radiating fin 1 0 0 1.

Page 19

Claims (1)

501377 t. Application for patent scope 1. A lighting fixture having a metal heat sink rod includes: at least one light emitting chip, which provides a light source for light emission, having a first electrode and a second electrode; a metal heat sink rod, which carries the aforementioned light emission by hand in section. The chip provides heat dissipation function; metal material is placed parallel to the axial direction of the aforementioned metal heat dissipation rod, and is electrically connected to the first electrode of the wafer as described above, and the insulating material is placed in the aforementioned metal heat dissipation rod and the aforementioned Provides electrical insulation between metallic materials. 2. The lighting fixture with a metal heat sink as described in item 1 of the scope of the patent application, wherein the metal heat sink is electrically coupled to the second electrode of the aforementioned wafer. 3. The lighting fixture with a metal heat sink as described in item 1 of the scope of the patent application, further comprising: a second metal material disposed in parallel to the axial direction of the aforementioned metal heat sink and electrically coupled to the first Two electrodes; and a second insulating material disposed between the aforementioned metal heat dissipating rod and the aforementioned second metal material to provide electrical insulation. ' Page 20 501377 6. Scope of patent application 4. The lighting fixture with metal heat sink as described in item 1 of the scope of patent application, wherein the metal material is placed on the outer wall of the aforementioned metal heat sink. 5. The lighting fixture with a metal heat dissipation rod as described in item 1 of the scope of the patent application, wherein the metal heat dissipation rod further includes an axial direction through hole in the interior. 6. The lighting fixture with a metal heat dissipation rod as described in item 5 of the scope of patent application, wherein the metal material is placed on the side wall of the aforementioned through hole. 7. The lighting fixture with a metal heat sink as described in item 1 of the scope of the patent application, where the term "combination" refers to wire bonding. 8. The lighting fixture with a metal heat sink as described in item 1 of the scope of the patent application, where _he refers to contact-type hehe. 9. The lighting fixture with a metal heat sink as described in item 1 of the scope of the patent application, wherein the cross section refers to a flat cross section, an oblique cross section, or a concave cross section. 10. Lighting with metal heat sink as described in item 1 of the scope of patent application 501377 6. Scope of patent application The metal heat-dissipating rods described above further include: side slits, which are arranged along the axial direction of the aforementioned metal heat-dissipating rods to accommodate the aforementioned metal materials. r: 11. The lighting fixture with a metal heat dissipation rod as described in item 1 of the scope of the patent application, wherein the metal heat dissipation rod further comprises: an internal through hole disposed along the axial direction of the foregoing metal heat dissipation rod, To accommodate the aforementioned metal materials. 12. The lighting fixture with a metal heat sink as described in item 1 of the scope of the patent application, wherein at least one of the chips is arranged in series, parallel, or series-parallel. 13. The lighting fixture with a metal heat sink as described in item 1 of the scope of the patent application, wherein the shape of the cross section of the metal heat sink refers to: circular, oval, triangular, square, diamond, Other polygons. 14. The lighting fixture with a metal heat dissipation rod as described in item 1 of the scope of the patent application, wherein the metal heat dissipation rod further comprises: at least one concave cup, each containing one or more of the aforementioned wafers. Page 22 501377 VI. Application for patent scope 15. The lighting fixture with metal heat sink as described in item 1 of the scope of patent application, wherein the metal heat sink further includes: at least one boss, each carrying a piece or It is a plurality of the aforementioned wafers. 1 6. The lighting fixture with a metal heat sink as described in item 1 of the scope of the patent application, wherein the combination of the metal material and the insulating material refers to a combination of wires covered with an insulating material such as an enameled wire, a wire, or It's a cable. 17. The lighting fixture with a metal heat sink as described in item 1 of the scope of the patent application, wherein the combination of the metal material and the insulating material refers to: a printing technique made of an insulating material and a conductive material. 18. The lighting fixture with a metal heat sink as described in item 1 of the scope of the patent application, further comprising: a heat sink fin, which is wrapped around the outer wall of the metal heat sink to provide heat dissipation. 19. The lighting fixture with a metal heat sink as described in item 1 of the scope of the patent application, further comprising: a light-concentrating cover, which is arranged on the periphery of the aforementioned light-emitting chip and provides a light-concentrating function. 20. Lighting with metal heat sink as described in item 1 of the scope of patent application Page 23 501377 6. Scope of patent application The lamp also includes: protective colloid, wrapped in the aforementioned light-emitting chip and peripheral components to improve product reliability. 21 types of lighting fixtures with metal heat dissipation rods, including: at least one light emitting chip, which provides a light source with light, having a first electrode and a second electrode; a metal heat dissipation rod, which carries the aforementioned light emitting chip on an outer peripheral wall to provide a heat dissipation function; at least A metal material is disposed parallel to the axial direction of the peripheral wall outside the aforementioned metal heat sink rod, respectively corresponding to the aforementioned wafer, and is electrically coupled to the first electrode of the aforementioned wafer; and an insulating material is disposed on the aforementioned metal heat sink. Electrical insulation is provided between the rod and the aforementioned metal material.